Vi Technology 3D Solder Paste Inspection Solutions
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1 VER MAR 2008 Vi Technology 3D Solder Paste Inspection Solutions New Opportunities for Solder Paste Inspection
2 Demands of 3D SPI Smaller and finer-pitch components like and flip-chip Higher popularity of components with invisible joints like CSP and BGA Higher opportunity of defect occurrence by lead-free solder paste (low wetting force, poor self-align characteristics, different aperture to pad ratio etc) Higher soldering quality required in mobile and security industry Approx. 70~80% of PCBA defects result from solder paste Repair cost reduction Defect prevention by process control 70-80% X 10 Repair cost per defect X % 0-10% Defect portion of total process Screen printing Component mounting Reflow soldering
3 Effects of 3D SPI Through 3D measurement of paste volume, height, area and position (Providing important predictor of good quality and long-term reliability of solder joints) PRINTER Root causes Detecting solder paste level defects before reflow Preventing defects by feed-back to printer REFLOW OVEN Final defects Excess Insufficient Scraping Tailing Bridge Joint crack Smearing 3D SOLDER PASTE INSPECTION Solder bead Saving repair cost by earlier defect detection Preventing defects by feed-back & control of screen printing process Increasing long-term reliability of solder joint by solder volume control Tomb stone & Skew
4 Flying Absolute Height Profilometry (FAHP) Laser Triangulation FAHP Moire Interferometry Laser Diode CCD CCD White Light Slit Beam Grating Viewing Lens Viewing Lens Projection Lens PCB PCB Agilent Technology GSI Lumonics Orbotech Koh Young Cyber Optics CKD FAHP
5 FAHP PRINCIPLE (Absolute Height Measurement) Ø=f ( I ) (I= Intensity, Ø=Phase) Intensity I 6,000 um Ø Phase 2. Ø absolute = Ø + n 2π (0< Ø < 2π) PHASE 2 ((Ø 2) PHASE 1 (Ø 1) Intensity I n Ø Ø+ 2π Ø+ 4π Ø+ n 2π Phase n times wider measurement range without degrading resolution. h absolute = f (Ø absolute) Ø absolute = Ø + n 2π (0< Ø < 2π) 0 3. n = f (Ø1, Ø2) Intensity I Ø Ø+ 2π Ø+ 4π Ø+ n 2π Phase
6 SURFACE PLANE WITH SLOPE ALGORITHM COMPRISON W./W.O SLOPE Solder Paste Reference PCB Solder Paste WITHOUT SLOPE COMPENSATION Reference PCB WITH SLOPE COMPENSATION
7 INSPECTION SPEED SOLUTION FAHP (FLYING ABSOLUTE HEIGHT PROFILOMETRY) PSMI (PHASE SHIFT MOIRE INTERFEROMETRY) Move HEAD Capture Image STOP HEAD MOVE GRATING STOP GRATING N TIMES? no yes Calculate Phase Calculate Height ON THE FLY REPEATED MOVE & STOP
8 No Shadow effect Zero % shadow effect by structured double light sources No volume measurement error apart from pad orientation Detector Light source 1 Light source 2 1 ST SCAN 2 nd SCAN Shadow effect (5-40% of Volume) 0% Shadow effect
9 Shadow s Contribution to Volume Error Assumption I. QFP BUMP CASE. (Parallelepiped Bump Shape) L=2mm, W=0.5mm, H=0.12mm Assumption II. CSP BUMP CASE. (Cylindrical Bump Shape) D=0.3mm, W=0.5mm, H=0.12mm L W (1) Angle 0 2mm 0.5mm Light source Detector 0.12mm 0.3mm H Shadow Area :0.18mm² (18%) α (2) Angle mm 2mm (3) Angle 90 2mm Shadow 0.3mm 0.5mm Object Shadow Area :0.16mm² (16%) Shadow Area :0.45mm² (4.5%) Shadow Area :0.027mm² (38%)
10 True Volume Measurement 1. 3D bare board measurement. 2. 3D total measurement of ROI. 3. Extraction of bare board geometry. 4. Solder paste volume only.
11 Measurement Description (1) Item Measurement object Reference value Measurement Equation Area Stencil Area from Gerber File One pixel dimension X SUM of Total pixel number of solder paste area Summing all pixels of solder paste area. Volume Height Stencil Area X Stencil thickness Summing each pixel s volume of solder paste area. SUM ( X ) Top 50% (Selectable range) Top 50% (Selectable range) Averaging Top 50% height (AHR 50%) Stencil thickness Measurement unit : 0.1 Height One pixel dimension Height of pixel area h( i, j) ( i, j) Solder Area = Average( h( i, j) )( i, j) Solder Area
12 Measurement Description (2) Item Measurement object Reference value Measurement Equation Bridge Bridge Length Connectivity between neighboring solders Shape Ratio= Volume (Measured) Volume (Convexhull) Convex solder Volume ratio of measured solder and convex solder
13 Operation flow Gerber based pad programming Teach & edit Inspection Off-line SPC Defect review
14 3D Solder Volume Functionalities Inspection tests Insufficient or excessive height and volume Position shift Area Abnormal shape Bridge Offline conversion of Gerber and CAD Data On-machine defect review Real-time process monitoring and alarm signal generation Real-time SPC software for process monitoring and defect analysis
15 3D Solder Volume Performances Typical inspection zero shadow effect mode Satisfying most line cycle times in the market 20 zero shadow effect mode Perfect shadow effect elimination Structured dual light source inspection mechanism No volume measurement errors due to pad orientation High repeatability < 10% GR&R for every solder pastes with 30-50% tolerance Height < 1.5µm (3σ ) on standard certification target High accuracy Height < 3µm on standard certification target Height Resolution : 0.1µm PCB warp measurement & measurement compensation Upward 3.0mm / downward 3.0mm without z-axis control
16 PCB Warp Measurement Note: Data collected from PDP PCB of S company
17 Fast Programming from Gerber & CAD PAD LEVEL PROGRAMMING. (Typically 5 minutes) COMPONENT LEVEL PROGRAMMING. (Typically 30 minutes) Gerber file import CAD file import. Automatic pad information input Semi-automatic component information input Link pads with component Inspection parameters input Debug & Automatic training OK? Start production
18 Off-line SPC Station Chart Samples X-bar / R Chart. Scatter Chart. Raw Data List. Capability Chart. X-bar / S Chart. Trend Chart. Raw Data Expert. X-bar Distribution Map Other Chart Etc.
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