Advanced Techniques US Inc.

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1 Information Technology Solutions AT-GDP Series BGA Rework Systems

2 Product Overview Key Feature s Single Axis Placement and Reflow Split Vision Optics with LED lighting Forced Air/N2 Convection Top heater and Quartz IR Preheater Adjustable placement force Computer control with comprehensive software package Closed Loop process control Automated Z axis movement Precision board holder with vacuum locking base, X-Y micrometers, underside support Compressed air cooling bypassing the heater yields strong, quality joints Six thermocouple inputs The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA s, CSP s, QFN s, Flip Chips, and other SMD s are reworked with ease and high quality results. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. Rigid design enables ultra precise placement to within 5 microns. Split Vision Optics allows simultaneous top of the PCB / bottom of the component viewing to superimpose and align both images. Split Imaging creates diagonal corner viewing for alignment of larger packages at high magnification. Absents of mirrors in the optics system ensure a clear and distortion free image quality. Precise closed loop reflow process control enables mimicking the original production profile. Software contains a database of predefined profiles which the user selects based on the package and PCB being reworked. Profiles may be easily modified, optimized, and stored for future use. Settings can be adjusted onthe-fly while the profile is running. Software controls reflow via forced air convection top heater and large area Quartz IR preheater. Airflow at the top heater is monitored by the software as well and delivers unsurpassed temperature uniformity. This guarantees very gentle flow which cannot disturb even the smallest adjacent components. Like other machines that our company has been producing for over the past 20 years, AT-GDP was designed to be very easy to use and capable of handling both today s and tomorrow s rework requirements. AT-GDP series offers unparalleled performance aimed at applications where precision and consistently high quality rework matters.

3 Operation Key F eature s c on t. At the click of an icon, the system automatically places the component onto the Library of predefined profiles PCB, shuts off the vacuum to the pick up tube, lifts the pick up nozzle away from the package Software controlled process sequencing with safety interlocks body, executes a reflow profile, and raises the reflow head at the completion of a cycle. Removal features the same automation only now, the component is pulled off the board at Plug and Operate Configuration Minimal operator involvement Maintenance Free the completion of a cycle. Software Profiles are developed, stored, and recalled in the AT-GDP s software package. It controls Lead Free Compatible the reflow cycle, automation of process sequences, and automatic execution of safety Designed and Manufactured in USA checks before every profile run. Real-Time process graphing Profile development with up to 6 thermocouples Library with predefined profiles On-The-fly settings adjustment Real time data recording for documentation and analysis Password Protected Access Unlimited profile storage User friendly environment Designed for Windows Vista OS

4 Features Comparison There are three configurations of the AT-GDP series. All of which share the same rigid platform and principle of operation. Below is a comparison matrix indicating features of each model. X - Included O - Optional N/A - Not Available

5 Options / Accessories Nozzle (Part: NZ-ATGDP) Nozzle Kit (Part: NZK-ATGDP) Split Imaging Alignment (Part: SIA-ATGDP) Positioning Plate (Part: PP-ATGDP) Flux Transfer Plate Kit (Part: FTP-ATGDP) Paste Transfer Stencil (Part: STN-ATGDP) BGA / CSP Reballing Kit (Part: BRK-ATGDP) 0201 Rework Module (Part: 0201-ATGDP) Process Monitoring Camera (Part: PMC-ATGDP) Specifications

2008 Advanced Techniques US, Inc. All rights reserved. Specifications subject to change without notice.

Automating Thermal Stress Reflow Simulation on PCBs

Automating Thermal Stress Reflow Simulation on PCBs Introduction The purpose of this paper is to demonstrate the reflow process of thermal stress reflow simulation on bare PCB s per IPC-TM-650 Test Method