NASA Miniature Inspection LADAR
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1 NASA Miniature Inspection LADAR Bradley Sallee SPEC 1
2 SPEC s Multi-Dimensional Imaging Programs NASA HD6D NRO HD6D AFRL LGSS Army 3D Change AFRL MST Army Imaging SAL DARPA AIRSS DARPA SUAVTL NASA Inspection LADAR Army Explosive Detection OSLI LIDAR Army Wind Detection Navy Wind Detection NASA Wind Detection 2
3 3.0 aperture Scanner SPEC LADAR Family RGB Camera, 4Mpixel 3DPlus 25mm Scanner, Telescope & Laser Collimator Spectral Splitter Laser EYDFA & Seed 15cm sq Laser / Motor Control board Receiver Module Virtex 5 & 8 RCV boards Power Supply Module & Ultra Cap Bank 10cm sq Inspection LADAR, Geo, Raman & 3D, 12.8Mpps, 6km Long Range Geo LADAR, 12.8Mpps, 35km Scanner / Receive Optics Electronics Stack and Laser Transceiver dia TEC Control Board Motor Control Board Scanner Motors Scanner LADAR Con Micro LADAR, 3 cu inch, 1.6Mpps, 2km With all modules Wind LADAR, Coherent, 400kpps, 6km 3
4 NASA Inspection LADAR 4
5 Inspection LIDAR Assembly RGB Camera, 4Mpixel 3DPlus 25mm Scanner, Telescope & Laser Collimator Spectral Splitter Laser EYDFA & Seed Laser / Motor Control board Receiver Module Virtex 5 & 8 RCV boards Power Supply Module & Ultra Cap Bank 10cm sq 15cm sq Inspection Modes: Raman Spectra: Impact ejecta chemicals Leak detection Micro range detection: crater detection depth and second layer mapping 3D imaging with RGB overlay: stitched image 3D mapping 5
6 Inspection LADAR Raman Spectral Bands Transmission wavelength 455nm, 96 Raman receive bands 455.0nm to 1nm spacing 511nm to 2nm spacing Resulting wavenumbers cm-1 to nominally 33 cm-1 increments cm-1 to nominally 52 cm-1 increments For initial demonstration, 32 channels will be used from cm-1 to cm-1 Spectral splitter, blazed 1200 line/mm splitter, 9mm illumination spot, 70% efficiency 6
7 RAMAN Detection LIDAR Spectra of Explosives Demonstration Windows Nitrate Line Raman Spectra of Nitroglycerin film, Single pixel, Single laser flash, Raman LIDAR (555 to 575nm) (611 to 623nm) 7
8 High Range Resolution Micro-meteor Damage Inspection Range resolution pixel to pixel goal is 50 microns Standoff range is 2 to 6 meters Barker 13 pulse compression code is used. Implemented in the receiver FPGA. Dual coding,169 pulse waveform, used for fine resolution Virtex 5 board modified to include Atomic Clock module for increased clock accuracy and decreased jitter Cross range resolution variable from.7mr to.16mr to allow multiple pixels across smallest hole or quick imaging. 8
9 Scanned Inspection Beam Detail, High Range Accuracy Mode inch Laser Spot Size 0.16mr receiver pixel FOV, feet standoff Size of inch hole at 6 feet Range Accuracy of Individual pixel =.0028 inch 9
10 Test Target for Inspection Evaluation, High Range Accuracy Mode Translating LIDAR 6 to 9 foot standoff inch Al 30 degree FOV Scan inch diameter 1.50 inch 1.50 inch diameter 0.25 inch Composite 1.50 inch inch Al 10
11 High Range Resolution Processing Phase encoded Barker 13 Pulse Compression used. Real time decoded at 400Msps Threshold sample after decoding, samples 1 before, 3 after threshold to capture waveform for phase decoding. Threshold trip triggers time stamp. High range resolution mode sends 13 sets of a Barker 13 sequence in a master phase encoded Barker overlay pulses total. Two stage phase encoded Barker 13 compression increases signal to noise ratio by 13x. Double encoded two stage Barker 13 increases signal to noise ratio by 169x, increasing phase accuracy proportionally. Atomic clock allows extremely low phase jitter over the long transmit period. 11
12 Scanner/ Telescope Top Level Block Diagram Seed Driver Pump Driver TEC Driver LASER 1 Fiber Raman Input Digital Receiver Board Virtex 6 Board (8) ADC (32) Heat Sink 32 Fiber Range Analog Receiver Board 4 Channel (8) Motor Driver/ Resolver Reader Board Daughter Board (2) Digital Receiver Board Virtex 4 Board (24) ADC (96) Spectral Splitter Analog Receiver Board 4 Channel (24) 96 Fiber Raman Virtex 5 (1) Virtex 5 Board (1) 3D Receiver, 32 Channel RGB Camera, 3MP USB3 PCIe 4x1 Computer PCIe 4x1 Virtex 5 (1) Daughter/Multipler Board (2) Virtex 5 Board (1) Raman Receiver, 96 Channel 12
13 Raman Spectral Assemblies Trippler, nm to nm 96 Channel Spectral Splitter 13
14 Pipeline Processing Receiver Assembly Analog Receiver Card With Sensors & Fiber mounted Analog Receiver Cards (8) Digital Receiver Cards (8) Daughter Cards (2) Virtex 5 Card interface plane Heat pipe location (9) Virtex 5 Card 14
15 Barker 13 Phase Pulse Compression Code Transmitted Pulse Waveform Receive Sample Binning 15
16 Pulse Compression Results in Heavy Noise Pulse Compressed Signal Transmitted Signal, 3/1 S/N /1 Improvement in S/N Amplitude Time, ADC samples, 3.33ns 16
17 Receiver FPGA Firmware 400Msps ADC Input 200Msps Barker Decoder A Barker Decoder B Threshold Detector Waveform Sampling 1 before, 3 after Peak Detection, Phase Calc. Phase Correction Time Stamp Full Resolution Time Calc Time (Range) Amplitude 4 Channels / FPGA 17
18 Receiver Performance 3D Imaging Receiver, 1550nm, 50x gain InGaAs APD 21 photon noise level Raman Receiver, 1.7e6 gain, SiPM sensor 1800/1 S/N on single photon, 31% chance of 1 photon Geiger tick 30 Range Accuracy, Short pulse train 25 Range Accuracy, mm Percent Maximum Range 18
19 Telescope and Focal Plane Zoom Lens Assys Zoom Lens & focal Plane Assy Telescope (Nose on) 19
20 25mm Aperture Scanner Fiber optic pickup at focal plane Laser Collimator & Periscope to optic centerline Modified Gen II Scanner for fiber laser use and fiber focal plane pickup Modifications for final high vacuum use will be: Zirconium Oxide race, Silicon Nitride ball bearings Steel pinion gear, Aluminum Bronze Bull helical gears Braycot high vacuum lubrication on motor bearings 20
21 Laser Assembly Output Stage 2 output, shorter range inspection LADAR, nm: 1008 W peak power, fiber intensity 3.34 Billion Watts/cm sq, 3W rms, 72uJ for short pulse train, 845uJ for long pulse train Stage 3 output, long range LADAR, LMA EYDFA nm: Peak power is 16,000W minimum, 30W rms,.00125j for short pulse train. Raman Laser, 445nm: 30W peak power 13uJ for short pulse train 21
22 Laser Assembly, PC104 Format 4.73 x 4.16 with 6.14 base Back Pumps(2) & Seed TEC Controllers(4) Power Supplies(2) Pump Controller(2) & TEC Controller(1) Front Cold Plate Surface Pump Combiners(2) & Isolators(2) & Fiber, not yet secured 22
23 Stage 3 EYDFA Amplifier Front, EYDFA Back, Pumps 23
24 Radiation Hardened CMOS RGB Micro Camera 30x30x40mm camera 2048x2048 pixels, global framing 180fps in 10bit, 37fps in 12 bit Integrated clock and timing generator Integrated Image Signal Processor GPIO and Spacewire interfaces Radiation Hardened by design 24
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