Recent Advances in Ultrafast Laser Subtractive and Additive Manufacturing

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1 Industrial Affiliates Symposium March 16-18, 2017 Recent Advances in Ultrafast Laser Subtractive and Additive Manufacturing Xiaoming Yu Assistant Professor Ultrafast Laser Processing Group CREOL, The College of Optics & Photonics University of Central Florida

2 Outline Introduction to Ultrafast Laser Processing Bessel Beam for Thin Film Scribing and 3D Printing Two-Color Micromachining of Glass Conclusion & Outlook 1

3 Ultrafast Laser for Material Processing Pulse duration 10s femtoseconds 10s picoseconds Shorter than thermal propagation time (>nanosecond) Heat confined in focal volume Reduce heat-affected-zone (HAZ) Increase resolution to < 1µm 3.3 ns 200 fs Holes drilled on 100-µm thick steel foil industrial-lasers.com; Appl. Phys. A 63 (1996) 109 2

4 Ultrafast Laser as a High-Precision Manufacturing Tool Scribing Solar Cell Glass Cutting Drilling Printer Nozzle Stent Microfluidics Micro Mechanics spie.org; Corning, Inc.; Fraunhofer ILT; Opt. Eng. 2005; Nanoscribe; laserfocusworld.com 3

5 Ultrafast Laser Processing is Complex, Dynamic, and Extreme Nat. Photon Photo-ionization, laser-plasma interaction, Coulomb explosion, shock wave, hydrodynamics Take place in fs-ps-ns time scale Temperature 10 5 K, Pressure Pa Conditions can be found at the explosion of 25,000 tons of TNT, or a nuclear bomb. 4

6 Outline Introduction to Ultrafast Laser Processing Bessel Beam for Thin Film Scribing and 3D Printing Two-Color Micromachining of Glass Conclusion & Outlook 5

7 Motivation: Gaussian Beam Focused with a Lens 6 Focal Range F [mm] 5 4 FF = ππ 2λλ dd ] Diameter d [µm] Diameter d 0.1 mm 10 µm 5 µm 2 µm Focal Range F G 20 mm 200 µm 50 µm 8 µm With µm-focusing, it becomes difficult to process material with uneven and curved surface. Image: one.aao.org 6

8 Axicon Focusing: Bessel Beam Axicon Interference Zone Gaussian (0.25NA Objective Lens) Laser Bessel (12 Axicon) Diameter d 0.1 mm 10 µm 5 µm 2 µm Focal Range (Gaussian) F G 20 mm 200 µm 50 µm 8 µm Focal Range (Bessel) F B 420 mm (20X) 32 mm (160X) 16 mm (320X) 13 mm (1600X) Edmund; Laser & Photon. Rev. 6, 607 (2012) Bessel beam can extend focal range by orders of magnitude. 7

9 Bessel Beam Scribing Solar Cell D= 60 fs, 800 nm 1 khz, 15 µj Axicon D Sample moving direction X. Yu, J. Ma, and S. Lei, Journal of Manufacturing Processes, 20, 349 (2015). 8

10 Superposed Bessel Beam Phase Modulation Axicon X. Yu, C.A. Trallero-Herrero, and S. Lei, Appl. Surf. Sci. 360, 833 (2016). 9

11 Use 1+(-1) Beam for Scribing 0 th order Bessel 1+(-1) Bessel Phase Modulation Axicon Comparison of groove scribing with 0 th -order and superposed Bessel beams. X. Yu, C.A. Trallero-Herrero, and S. Lei, Appl. Surf. Sci. 360, 833 (2016). 10

12 Bessel Beam for Photo-Polymerization 35fs 100mW 2kHz, 800nm Curing with 0 th -order Bessel Single exposure Micro wires with >100:1 aspect ratio 11

13 Outline Introduction to Ultrafast Laser Processing Bessel Beam for Thin Film Scribing and 3D Printing Two-Color Micromachining of Glass Conclusion & Outlook 12

14 Two-Color Method for Nanomachining with Below-Threshold Energy Laser Single-color Dielectrics Free e - (n e ) n e = n c Generation of free electrons Damage UV Laser IR Laser + = Two-color Dielectrics n e < n c n e = n c Seed electrons Electron density buildup Damage 13

15 Two-color Micromachining: UV Damage Threshold IR Fluence UV damage threshold measured at different UV-IR delays. Dots: experimental data. Curves: simulation data. X. Yu, Q. Bian, B. Zhao, Z. Chang, P. B. Corkum, and S. Lei, Appl. Phys. Lett. 102, (2013) 14

16 IR Polarization UV+IR 15µJ Cir. UV Energy Radius Squared (µm 2 ) IR 15µJ Cir. 12.5µJ Lin. 12.5µJ Cir. 10µJ Lin. 10µJ Cir. UV Only UV Pulse Energy (µj) Determine UV damage threshold when combined with linearly (Lin.) or circularly (Cir.) polarized IR beam. Linear and circular polarization have similar effects on damage threshold. However, with circular polarization, UV threshold can be further reduced. X. Yu, Z. Chang, P.B. Corkum, and S. Lei, SPIE Optics + Optoelectronics

17 Two-color Micromachining: Damage Controlled by UV Damage size is controlled by the UV focal spot. 500 µm X. Yu, Q. Bian, B. Zhao, Z. Chang, P. B. Corkum, and S. Lei, Appl. Phys. Lett. 102, (2013) 16

18 Outline Introduction to Ultrafast Laser Processing Bessel Beam for Thin Film Scribing and 3D Printing Two-Color Micromachining of Glass Conclusion & Outlook 17

19 Conclusion & Outlook Bessel beam is used to scribe thin film solar cell, extending focal range by 3 orders of magnitude compared to Gaussian focusing. Superposed Bessel beam is created by spatial beam shaping. Collateral damage is reduced by the 1+(-1) superposition. Temporal pulse shaping, wavelength tuning, and laser polarization can reduce damage threshold. 3D printing using spatial beam shaping to increase printing speed. Super-resolution machining at nano-scale by combining spatial, temporal and polarization methods. 18

20 Industrial Affiliates Symposium March 16-18, 2017 Thank you for your attention. Questions?

Introduction Introduction Introduction Introduction Introduction use damage for processing! Outline Outline Processing with fs pulses Role of focusing Low-energy processing Processing with fs pulses 10

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