Dispensing Applications and Methods. August, 2014 Mani Ahmadi, Director of Technical Services Nordson, Advanced Technology Systems
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1 Dispensing Applications and Methods August, 2014 Mani Ahmadi, Director of Technical Services Nordson, Advanced Technology Systems 1 August 2014
2 Agenda Introduction Dispensing method and technologies for mobile electronics Dispensing applications for mobile and wearable electronics Yield management and throughput considerations Key technical challenges and trends Environmental impact and consideration 2 August 2014
3 Introduction Dispensing includes application of all fluid material for the construction of the electronic device Solder paste Silver epoxy Non conductive epoxy Polymer or synthetic rubber based This presentation focuses on dispensing application on the rigid and flex board This presentation does not cover applications of fluids using screen/stencil printing. 3 August 2014
4 Introduction The manufacturing of typical handheld mobile device utilizes various forms of dispensing application covering dozens of fluid types in several hundred locations. The following industry trend is increasing number of fluid dispensing applications: Smaller form factors Higher component density Thermal management Curved shapes Water resistance 4 August 2014
5 Smart Phones & Tablets 1. Micro coatings for moisture protection 2. Hot Melt for display assembly 3. CSP & PoP Underfill 4. Solder paste for RF shield, module attach & SIM card solder joints 5. Lens bonding & underfill for camera modules 6. Solder Paste & Silicone Encapsulation for MEMS microphones 7. Epoxy Flux, Liquid RF shielding 5 August 2014
6 Dispense Valve Types Needle Valve Time/pressure Operation Auger Valve Auger Screw Feed Piston Valve Positive Displacement Jet Valve Pulse Dot Ejection 6 August 2014
7 Jet Valve 7 August 2014
8 Jet vs Needle in droplet location Jet can dispense dot close to die, and high above the die Needle must come down to touch substrate next to die, with clearance Droplet location from die edge: Jet 150um vs Needle 380um 8 August 2014
9 Agenda Introduction Dispensing method and technologies for mobile electronics Dispensing applications for mobile and wearable electronics Yield management and throughput considerations Key technical challenges and trends Environmental impact and consideration 9 August 2014
10 Mobile Assembly, Smart Phone & Tablet 4 Key Assemblies 1. Case / Enclosure 5 2. Battery 3. Main (rigid) Board LCD/Screen Bezel 5. Flex boards Modules Apple iphone 5C Source: ifixit.com 1 10 August 2014
11 Mobile Assembly Samsung Galaxy S4 Apple ipad mini Source: ifixit.com 11 August 2014
12 Rigid Board Underfill/Encapsulation Application: Board level underfill and encapsulation Key Challenges: Keep out zones for encapsulation UPH, Dual valve for UPH Board flatness Irregular shares/ molded parts 12 August 2014
13 Typical Flex Boards in High End Smart Phone 13 August 2014
14 Tight Line Width, Thin/Selective Coating, Small KOZ Illumination LED MEMS Microphone Phosphor coating: 25um thickness 250um solder paste sealing line width Mobile Phone Module Selective precise coating for individual components Mobile CSP on Flex 2nd level underfill KOZ
15 Small Dot, Tight KOZ, Narrow Dispense Gaps Dispensing Between Die RF Module Dispense small underfill dots for less KOZ
16 Application 2: 250um lines/rings/dots => 12k dispense/hour (b) Dispensed results August 2014
17 Common Trends, Challenges and Expectations Reduced chip geometries Reduced spacing between components Tall components with limited reach points Increased challenges to improve KOZ, avoid epoxy on die Improve UPH even with, small dot/line and dispense accuracy. Fine line and low shot weight dispense capability Better placement capability Improved automation, monitoring and self diagnostics
18 Agenda Introduction Dispensing method and technologies for mobile electronics Dispensing applications for mobile and wearable electronics Yield management and throughput considerations Key technical challenges and trends Environmental impact and consideration 18 August 2014
19 Environmental Impact & Consideration Utilization of fluids without solvent provides a significant environmental benefit 100% Solids Synthetic Rubber Based Coating Hot-Melt and moisture cure adhesive 19 August 2014
20 Environmental Impact & Consideration Current manufacturing techniques results in a high percentages of fluid waist Syringe, fluid tubes, valves have several CC of fluids that is disposed during cleaning Only a portion of the fluid dispensed is really needed for the intended purpose Current designs not optimized for minimal usage of fluids 20 August 2014
21 Thank You! 21 August 2014
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