Wireless Factory December 15. Michel Windal

Transcription

1 Wireless Factory December 15 th Michel Windal

2 A Complete Wireless Portfolio 3G and TD-SCDMA Cellular System Solutions GSM/GPRS/EDGE Cellular System Solutions Nomadik Application Processors Mobile Multimedia - Audio and Video Co-processors Power Management RF Transceivers Wireless Connectivity and Broadcast USB and W-USB (UWB) 25% of the M2M module market (Wavecom) 12/15/2008 2

3 The Most Complete Platform Offer User Interface JV solution Displays Keyboard Speakers Microphones Cameras Sensors Audio ICs Via ST Connectivity NFC Multimedia Processing Via Partners BT WLAN Application Processors Multimedia Co-processors UWB FM USB GPS Application Software VoIP UMA DRM Baseband Processor Digital Radio Broadcast Broadcast TV GSM/GPRS/EDGE/3G/LTE Telecom Software Security ABB Smart card SIM PA RF 12/15/2008 3

4 2G/3G Cellular System Solutions ST-NXP Wireless is a leader in the Cellular System Solutions Market with over 450 million GSM/GPRS/EDGE solutions shipped The highest integration in a single chip with best-in-class power consumption ST-NXP Wireless is the leader in system solutions for EDGE, having already shipped more than 120 million EDGE-enabled chipsets A range of complete system solutions for UMTS, HSDPA and TD- SCDMA ST-NXP Wireless is a leading participant in early field trials, including the LTE/SAE Trial Initiative (LSTI) 12/15/2008 4

5 Merging Ericsson Mobile Platforms and ST-NXP Wireless 50/50 joint venture Strong endorsement from key customers Pro forma sales in 2007 of USD 3.6B 8,000 employed, majority in R&D Fabless business model, benefiting from ST s industrial base and external partnerships Building on current partnership Global sales organization with strong local support December 11 th,

6 Creating a World Leader ST (ST-NXP Wireless) Leading supplier to Nokia, Samsung and Sony Ericsson Industry leading RF, analog, multimedia and connectivity World class 2G- and EDGE platform and strong 3G offering Ericsson (EMP) Leading supplier to Sony Ericsson, LG, Sharp Industry leading 3G, HSPA and LTE platform technology Leading IPR portfolio EMP & ST-NXP Wireless Technology leader 2G, EDGE, 3G, HSPA, TD-SCDMA and LTE Complete offering Modem, multimedia, connectivity ASSP and ASIC RF, analog and digital Strong customer base Engaged with all leading handset manufacturers Leverage communications and systems technology from Ericsson Leverage semiconductor technology, manufacturing and supply chain from ST December 11 th,

7 Mature & Proven Platforms Cellular System Platforms leverage on proven telecom stack Maturity: 12-year for GSM stack, 7 for GPRS stack, 4 for EDGE stack 2 for 3G stack Field Test : Tested in 36 operator networks, across 4 continents GCF : Internally completed before customer final GCF IOTs : Validated with all major infrastructure providers: Ericsson, Siemens/Nokia, Alcatel, Nortel, Lucent, Huawai 450 MioU GSM/GPRS/EDGE shipped worldwide 7

8 Wireless Factory Enablers Cellular networks: Worldwide coverage Becoming IP based MNO seeking to expand their business in data services MVNO will be instrumental in M2M success M2M modules integrates: GPS High processing power Short-range wireless connectivity (ZigBee, Wi-Fi, BT) Telematics and Telemetry unlimited/untapped potential Cellular M2M applications benefit from R&D & scale of the mobile handset industry Main challenges are Reliability (QoS) & Security 8

9 Industry-leading Rx Performance Best manufacturability Proven high yields Lowest field returns Low Noise Figure Enables -111/-110 dbm sensitivity (low-band/high-band) Low spurious Digital 200 khz low-if architecture Best-in-class margin for GMSK and 8-PSK blockers No dc induced spurs Minimal baseband calibrations No IR calibration No IP2 calibration No dc offset calibration RX Performance Summary Parameter Symbol LB HB Noise Figure Image Rejection Input IP2 Input IP3 1 db Compression NF(25) IR IP2 IP3 CP(min) LNAOff CP(max) LNAOn 2.3 db 2.9 db 55 db 55 db 40 dbm 40 dbm -12 dbm -12 dbm -18 dbm -18 dbm -22 dbm -22 dbm Note: Test Conditions of 25 C, V RF = 2.85V Date 21/11/08 9

10 Industry-leading Tx Performance Best manufacturability Robust linear EDGE architecture Competitors polar solutions struggle Very good 400 khz spectral margin -66/-65 dbc in GMSK low/high band Low spurious Very low out-of-band spurs (< -80dBm) Excellent 20MHz offset noise (-165dBc/Hz) Minimal BB calibration requirements No I/Q predistortion, PA AM/PM or delay calibrations No BB temperature or voltage calibration GMSK TX Performance Summary Parameter Low band High band Carrier Suppression -48 dbc -48 dbc Sideband Suppression -46 dbc -46 dbc IM3 Distortion -57 dbc -57 dbc Spectrum: 400 khz -66 dbc -65 dbc Spectrum: 1800 khz -70 dbc -70 dbc RMS Phase Error Peak Phase Error PSK Transmit Performance Summary Parameter Low band High band OOS -40 dbc -40 dbc Spectrum: 400 khz -64 dbc -64 dbc RMS EVM 3.0% 3.0% Peak EVM 10.0% 10.0% Note: Test Conditions of 25 C, V RF = 2.85V. Date 21/11/08 10

11 Highly Secure Platforms Built-in HW Security: Each BB has an unique serial number Each BB has HW Crypto accelerators : RNG, AES, DES, 3DES, PKI, ECC, Hash Engine Each platform supports: Flash integrity Secure boot Secure SW download Secure excecution High RF performances & high Security are key for M2M market 11

12 December 11 8 th th,