2000 Technology Roadmap Optoelectronics. John Stafford, Motorola January 17, 2001

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1 2000 Technology Roadmap Optoelectronics John Stafford, Motorola January 17, 2001

2 Optoelectronic Roadmap Agenda Optoelectronics Market Overview Optical Communications Roadmap Optical Communications Technology Roadmap Optical Switches Optical Amplifiers Substrates for Optical systems Packaging for Optical Components Image Sensors 2

3 Optoelectronic s? Optoelectronics is a Combination of Technologies that Provide the Capacity to Generate, Transport and Manipulate Data at High Rates. 3

4 Scenario Of Optical Joining Technology 4

5 Examples Of Products Enabled By Optoelectronics Technology NEMI Product Sector Low Cost Hand Held Cost / Performance High Performance Harsh Environment Optoelectronics Products / Components Serving This Sector Optical fiber, LED lamps, laser pointers, low-speed optical data links, IR ports for computers Night vision scope, head mounted display Laser printer, digital camera, high-speed optical data links, laser scanner, digital medical imaging, product defect sensors, camcorders 10 Gb/s laser transmitter, optical amplifier, tunable laser, DWDM components, optical switches, airborne and space: communications and radar IR camera, light-guided missile, automotive: communications, sensors and lighting; airborne data links 5

6 World Market For Fiber Optic Products In Communication Applications Market Segment Year Sales ($B) Test Equipment Optical Components Optical System Equipment

7 Predicted Annual Compound Growth of Key Optical Components Component Annual Growth Rate in % ( ) Fibers 17 Lasers 15 LED s 9 Detectors 15 Connectors and Couplers 16 Components for Amplifiers 21 Optical Swithching Components 67 WDM Components 34 Other Multiplexing Components 14 7

8 Optical Communications Roadmap Services / Networks Services POTS Data Fax Internet High-speed Internet Tele-working, tele-learning Tele-medicine Video On Demand Next-Generation Internet (1Gb/s to the desktop) Distributed Virtual Environments (joint working, learning, and play) CATV Interactive entertainment CMOS VLSI interconnects PWB interconnects Core 2.5Gb/s point to point 10 Gb/s 40Gb/s 100/160Gb/s 400Gb/s OADM, OXC Fully reconfigurable OXC. 8 wavelength WDM pt. to pt. ~128 wavelength DWDM >800 wavelengths DWDM Access POTS, Modem, ISDN, HFC, Cellular, Broadcast Satellite 56kb/s, 144kb/s ATM/PON (155/622Mb/s) Cable Modems 2.5Gb/s-10Gb/s Gb/s DWDM Premises 100Mb/s Ethernet 1 Gb Ethernet 10 Gb/s Trunks 10 Gb Ethernet 100Gb/s to 1Tb/s trunks 40 Gb Board to Board Chip to Chip Research demos, Gb/s (all numbers are aggregate) Research demos, Gb/s (all numbers are aggregate) Gb/s, Commercial 1-10Gb/s, massively parallel Gb/s Gb/s 1-10Gb/s, massively parallel Gb/s 8

9 Optical Communication Technology Roadmap (1 of 3) Technology / Components Commercial Availability Long Haul Bitrate: (TDM) (DWDM) Gb/s 40 Gb/s 80/ 160 Gb/s 400 Gb/s Solitons Tb/s 3.2 Tb/s 10Tb/s Optical 3R Regenerators? Access Bitrate (residential): 155 / 622 Mb/s 2.5 Gb/s 10 Gb/s ADSL, cable modem DWDM 1 Gb/s ethernet? LAN (Premises) Bitrate 1Gb ethernet 10 Gb ethernet 40 Gb/s ethernet 10 Gb/s trunks 100 Gb/s trunks Board to Board Bitrates Gb/s 1-10 Gb/s Gb/s (aggregrate) massively parallel On Board/On Chip 100 Gb/s 1 TB/s Chip-to-Chip Node Capacity Routing / Switching, Inc. O/E No of WDM Channels Channel Spacing WDM Subsystems 80 Gb/s 2.4 Tb/s 5 Tb/s >100 Tb/s ? Polarization Interleaving? 100/50GHz 25GHz (with bitrate limit!) OADM, OXC Reconfigurable OXC All Optical Network? 9

10 Optical Communication Technology Roadmap (2 of 3) Technology/Components Commercial Availability Laser Sources: edge-emitters VCSELs Optical Detectors Transceivers packaging LAN price Single λ DFBs 40 Σ tunable 100 Σ tunable 1000 channels 850 nm discrete 850 nm arrays 1300/1550 nm discrete WDM detector w/ filter Lower cost APDs Organic Photodetectors Discrete Components Hybrid Integration (with CMOS VLSI) Lower Cost, LSI OEICs $ 25 LED datacom $15 LED datacom $75 VCSEL datacom $45 VCSEL datacom $700 ONU $175 ONU $100 ONU? $1 T/R for board to board links Optical Amplifiers <80nm 100nm Ultra -wideband OAs, nm EDFA/Raman hybrid Channel Gain Compens. Price <$1000? Optical Switches 16 x x x x4096 Optical Packet Switching 10

11 Optical Communication Technology Roadmap (3 of 3) Technology/Components Commercial Availability Dispersion Compensators Disp. comp.fiber Bragg grating devices Slope management Dynamic dispersion compensation? Dynamic PMD compensation Wavelength Converters Optoelectronic all-optical (transducers) Connectors Single mode very low cost (Access and Datacom) Array large array (for ~100 channel DWDM, Routers, Switches) Multimode & POF very low cost for premises networks Optical Fibers Dispersion flattened large core for DWDM ultra wideband (no OH ultra low loss, low cost/ high speed plastic optical fiber Optical Packages and Assembly Low cost packaging and fiber coupling Automated surface mount assembly 11

12 Key Optical Switch Technologies Optomechanical Devices Micro-Electro-Mechanical Systems Liquid Crystals Champagne /Bubble Switch Thermo-Optical Switch 12

13 Current Approaches to MEMS Optical Switches Device #Optical Actuation Architecture Elements Methods Small < 20 Electrostatic, 2D Array Fabric Thermal Medium Electrostatic, 2D Array Fabric Magnetic Large > 256 Electrostatic, 3D Array Fabric Magnetic 13

14 Technology Issues for Optical Power Amplifiers System Level Operational Wavelength 1490 nm 1610 nm Operating Temperature 0ϒC 65ϒC Output Power 26 dbmw - 30 dbmw Linearity ± 0.1 db Noise Figure 5 db Sub-System Level Pump Wavelengths 980 nm 802 nm 1480 nm Pump Power 180 mw 300 mw Pump Laser Reliability 10 6 Hrs. 14

15 Technology Advancements Needed for Optical Power Amplifiers Economic means for thermal management of packaged high power amplifiers. This issue extends to other aspects of the physical design, including the optoelectronic devices and optical passives, which must meet stringent alignment tolerances. It is expected that within two years, market demand will be centered at the 80 channel to 160 channel capacity per band. Means for controlling the gain flatness of PAs over the full range of S, C, and L band are needed. These solutions are likely to involve a combination of improved materials, circuit and software techniques. PA noise figures need to be improved. Further development in this area is needed. To serve the MAN/LAN markets, which are progressively higher volume, more cost sensitive markets, nearly an order of magnitude further cost reduction will be required. 15

16 Substrates for Optical Systems As system signal bandwidth requirements have increased, the printed circuit board(pcb) substrate characteristics and features have become an key part of the system specification and performance. Ultimately, the signal bandwidth will exceed the capability of copper (<~5 Gb/s) and on-board optical transmission will become a necessity. As systems become more complex and the number of fibers increase, it will become necessary to integrate the optical pathway into the high layer count PCB backplane fabrication and SMT assembly processes. An optical waveguide can be created by lithographic processing of thin polymer films and patterned on the surface of the PWB or be buried within the substrate by subsequent lamination. 16

17 Rigid backplanes are expected to dominate, but flexible backplanes will have strong presence in the marketplace as optical substrates become more widely used. Source: Electronic Packaging and Production Publication, March

18 Packaging and Assembly Technology Issues Need for faster, higher performance, miniaturized packages. Need to incorporate increased levels of optical/electrical integration into package. Need to incorporate features for cost effective assembly technologies. Innovate new materials, design technologies to support above items. Thermal solutions for 1 to 2+ Watt packaged Lasers. 18

19 Image Sensors Imaging CMOS (IMOS) Technology is Emerging as a Strong Competitor for Digital Cameras. Low Cost Packaging is a Critical Issue for the IMOS Technology to be dominant. 19

20 Summary» Optoelectronics is about bandwidth. The Copper Crunch has come.» Technologies are available to meet bandwidth needs up to 10Gbps. Core technology and component needs have been identified for the next decade.» Issues: (a)manufacturing capacity for components (ie emitters, detectors) and fiber. (b) Low cost assembly processes and low cost packages for optoelectronic components. (c)ability for standard automated board assembly of all optoelectronic parts. 20

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