Pixus Technologies Catalog

Transcription

1 The Power of Embedded Ingenuity Pixus Technologies Catalog Kaparel, Ripac, & Vario Brand Products US: CAN:

2 Order Information AdvancedTCA Shelf AdvancedTCA is a registered trademark of PICMG Rittal Corporation reserves the right to improve, alter or cancel any of its product line. 16 Basic Mechanical Elements: The basic elements of the platform are: The Boards: A mix of IEC dimensions and PICMG 3.0 specific mechanical solutions. Front Boards (8U x 6HP and 280 mm depth) contain the electronic functions and the required connectors. The PCB is offset to the pitch-line by 6.61 mm and may be 1.6 mm to 2.4 mm of nominal thickness and includes a component side 1 ESD strip and component side 2 cover attachment holes. The Front Board assembly includes, as mandatory features, a Front Panel assembly with Alignment/ GND Pin, EMC Gasket, ESD strip, Injector/Extractor/Locking handles with optional microswitch operation for Hot-Swap and optional M3 retention screws. A component side 2 (backside) cover is for PCB stiffening and/or EMI protection is mandatory. The Connectors: Zone 1: Power and System Management. Zone 2: Data Transport. Zone 3: Rear I/O. Zone 1 and Zone 2 are controlled by a dedicated Alignment/Keying Device. Optional, additional Zone 3 applications provide for a further dedicated Alignment/ Keying device. The Subrack: The Subrack provides for the Front Board and optional RTM interfaces. The 14 slot or the 16 slot subrack provides for attachment points of the backplane, as well as alignment/keying, support and mechanical advantage of the insertion and extraction of Front Boards and optional RTM s. The Subrack provides for the optional Zone 3 I/O and the A/K2 alignment/keying interface. The Shelf: The Shelf consists of the integrated Subrack, Cooling/Filter Devices, Power Entry Modules, System Management Functions and Cable Management The Shelf may support either 14 slots or 16 slots (for 16 slots inquire) The 14 slot Shelf may be 19" based or ETSI based (for ETSI inquire) The 16 slot Shelf may be 23" based or ETSI based (please inquire) The height of the Shelf may be N x U (19"/23") or N x 25 mm (ETSI) The depth of the Shelf is approximately 390 mm to fit into a 600 mm deep cabinet

3 Order Information AdvancedTCA Shelf Vertical 13U - Cooling Vertical 13U - Shelf Management Shelf Cooling Features: Designed to cool 200 Watts/Slot Rear Baffles prevent hot air re-circulation. RTM is cooled by vacuum effect. (Approximately 30 Watts/Slot) Field replaceable dust filter located below lower card guide assembly. Management interfaces throughout the Shelf enable the monitor & control of: Boards PEM (Input/Output Voltages & Current) Blowers Air inlet temperature Remote alarm signals Air filter present sensor The AdvancedTCA Developer Chassis The 13U x 14 slot AdvancedTCA Developer Chassis is designed to comply with the electronic requirements of PICMG 3.0 and provide developers with an open sided bench top. The AdvancedTCA platform to architect applications based on the PICMG 3.0 specification. The AdvancedTCA Developer Chassis accommodates 14 slots of 8U x 6 HP x 280 mm Front Boards and 8U x 6 HP x 70 mm RTM (Rear Transition Modules). The AdvancedTCA Developer Chassis is available with 14 slot Kaparel/Rittal Full Mesh or Dual-Star architecture backplane. The AdvancedTCA Developer Chassis is cooled by six 115 cfm 48V DC fans and includes dual 48V DC input feeds and ESD socket. Height 14U Side panel No. of slots Usable width HP For front board For RTMs Quantity For 19 inch depth (mm) EIA 310-D/IEC U x 280 mm 8U x 70 mm

4 AdvancedTCA Shelf Version VA AdvancedTCA Shelf Version VB Front View Version VA Rear View Air Flow Sec. Side View 18 EMI Containment Sec. Side View

5 Order Information AdvancedTCA Shelf AdvancedTCA Shelf Version VA-1 14 slot full mesh backplane, bussed IPMI 2x rear PEMs, redundant (4x optional) Space for 2x rear mounted ShMC AdvancedTCA Shelf Version VB-1 14 slot full mesh backplane, radial IPMI 2 x rear mounted PEMs (4x optional) Space for 2x front mounted ShMC AdvancedTCA Shelf Version VB-2 14 slot full mesh backplane, bussed IPMI 2 x rear mounted PEMs (4x optional) Space for 2x front mounted ShMC Bussed IPMI FCI Kernel x 1 optional Kaparel/Kernel/PC optional The functionality of the chosen ShMC will define the functionality of the Peripheral Controller (PC) is defined for Force Computers (FCI) ShMC rear mount requirements. Radial IPMI Intel CMM x 1 optional Kaparel/CMM/PC optional is defined for Intel CMM requirements. Bussed IPMI PP ShMM optional Kaparel/ShMM/PC optional is defined for Pigeon Point (PP) ShMM requirements. AdvancedTCA Shelf Version VB-3 14 slot full mesh backplane, bussed IPMI 2 x rear mounted PEMs (4x optional) Space for 2x front mounted ShMC Bussed IPMI FCI Kernel x 1 optional Kaparel/Kernel/PC optional is defined for Force Computers (FCI) ShMC front mount requirements. 19

6 Order Information AdvancedTCA Backplanes AdvancedTCA Shelf Version HA-1 Horizontal 19" x 3U x 385 mm depth (base) 4 x 6HP slots for front boards and RTMs 4 slot full mesh backplane, bussed IPMI Redundant power entry on rear Space for 2x rear mounted ShMC Telco Alarming, rear Front removable fan tray, right side (2 fans) Front removable fan tray, left side (2 fans) Front removable filter, right side Airflow, right to left Bussed IPMI FCI Kernel x 1 optional Kaparel/Kernel/PC on board 1 included Note: The choice of the backplane is based on the Shelf Management Controller (ShMC) used is defined for Force Computers (FCI) ShMC front mount requirements. Front to back airflow is not achievable in the 19" format. AdvancedTCA Shelf Accessories Accessories Description Used For Quantity Zone 3 air seal 6HP - FR4 Zone Filler panel (FP) 8U x 6HP front/rear FP w/air management 8U x 6HP x 280 mm front FP w/air management 8U x 6HP x 70 mm rear (RTM) Note: Due to the flexibility of the PICMG 3.0 Specification many ShMC solutions may emerge. The above shelf designs are based on sound mechanical research. The 14 slot Full Mesh AdvancedTCA Backplane The AdvancedTCA Backplanes: Kaparel/Rittal are active members of the PICMG 3.0 subcommittee including a contract for the simulation and routing analysis for the Dual Star, Dual-Dual Star and Full Mesh configurations. Simulations were run using a minimum speed of Gbps. For the base and Fabric Interface, an 8 mil line width, 10 mils within the pair and 35 mils pair to pair achieving a low 0.2% noise coupling. Simulations were also run on 5 Gbps and above but showed that steps like back drilling and/or silicon equalization options may be required. Kaparel/Rittal offers a complete range of off-the-shelf 14 and 16 slot versions of their AdvancedTCA backplanes including Full Mesh, Dual Star, Dual-Dual Star and Dual Dual Stare with 1x Mesh overlay. In addition custom designs are available for specific customer applications. A 4 slot Full Mesh version will be available for horizontal chassis applications. The Dual Star version is completed in 14 layers and the Full Mesh in 36 layers, both in Nelco material. This material allows a thinner board as well as provides the signal integrity required for AdvancedTCA based applications. The backplanes use the high speed AMP/ERNI ZD connector in zone 2 for signal noise and ease of routing differential pairs. The routing uses broadside differential pairs providing low noise coupling without additional signal layers. Off-the-shelf or custom AdvancedTCA solutions available from Kaparel/Rittal will allow you to get your applications quickly to the market. The AdvancedTCA Backplanes Model No. Slots Description Full mesh bussed IPMI Full mesh bussed IPMI Dual Star bussed IPMI Full mesh bussed IPMI Dual Star bussed IPMI Note: Radial IPMI versions available, please contact the factory. Cool Running: Actual thermal image of Kaparel/Rittal backplane under full load conditions 14 slots at 200W. The red imaging at top is feed through from load resistors. 20