EXCELLENT FOR MASS PRODUCTION THESE SOP IC SOCKETS RESIST VIBRATION AND SHOCK
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1 EXCELLENT FOR MSS PRODUCTION THESE SOP IC SOCKETS RESIST VIRTION ND SHOCK SOP IC SOCKETS (600 mil contacts 1.27mm pitch) SSOP IC SOCKETS (600 mil contacts 0.8mm pitch) Compliance with RoHS Directive FETURES 1. Suited for mass production Two-piece socket that features simple assembly to facilitate mass production. 2. Easy IC attachment and detachment Owing to a structure that keeps stress from being applied to the IC leads when attaching and detaching, there will be no loss of contact reliability. 3. utomated mounting compatible The socket has an open flat construction on its top surface so that it can be picked up by an automated mounting machine using suction for automated mounting. 4. Resistant against vibration and shock (edge contact structure) PPLICTIONS musement-related applications, etc. SUITLE ody color No. of contacts Part No. of body (Type) Frame Example of suitable IC vendor lack White Note) *Please consult one of our sales offices regarding suitable IC vendor. ORDERING INFORMTION 1. SOP XS6N9P ( type) XS6N9P ( type) XS6S9P ( type) XS6S9P ( type) XS6SC9P (C type) XS6N149P ( type) XS6N149P ( type) XS6S149P ( type) XS6S149P ( type) XS6SC149P (C type) XS6S54V XS6S54V XS6S24V XS6S24V MCRONIX etc. MCRONIX, ST MICRO etc. FUJITSU DEVICE etc. MCRONIX etc. MCRONIX, ST MICRO etc. FUJITSU DEVICE etc. 6N: SOP <No. of contacts (2 digits)> : contacts <Shape (applicable IC)> : MCRONIX etc. : <Classification> 1: ody of socket (White) 4: ody of socket (lack) XS 6 N 4 9 P <Nominal dimension> 4: 600 mil <Surface treatment (Contact portion/terminal portion)> 9: Sn plating/sn plating <Package form> P: 450 pcs. embossed tape and paper reel 5
2 2. SSOP 6S: SSOP XS 6 S <No. of contacts (2 digits)> : contacts <Shape (applicable IC)> : : MCRONIX, ST MICRO etc. C: FUJITSU DEVICE etc. Nil: Frame <Classification> 1: ody of socket (White) 2: Frame (Natural) 4: ody of socket (lack) 5: Frame (lack) <Nominal dimension> 4: 600 mil <Surface treatment (Contact portion/terminal portion)> 9: Sn plating/sn plating Nil: Frame <Package form> P: 450 pcs. embossed tape and paper reel 5 V: 450 pcs. vinyl package 5 PRODUCT TYPES ody color lack White No. of contacts Nominal dimension 600 mil Note) *Please consult one of our sales offices regarding suitable IC packages. Emboss tape package Plastic bag packaging ody Packing quantity Frame (color) Packing quantity Part No. of frame 1 reel Outer carton Part No. of frame 1 bag Outer carton XS6N9P XS6N9P XS6S9P XS6S9P XS6SC9P XS6N149P XS6N149P XS6S149P XS6S149P XS6SC149P 450 pcs. 2,250 pcs. XS6S54V (lack) XS6S24V (Natural) 450 pcs. 2,250 pcs. 1. Chracteristics Item Specifications contacts contacts Conditions Rated current Insulation resistance Min. 1,000MΩ Min. 1,000MΩ Using 500V DC megger Electrical reakdown voltage 500V C for 1 minute 250V C for 1 minute Detection current: 1m Measured based on the HP4338 measurement Contact resistance Max. 40mΩ Max. 50mΩ method of JIS C Does not include conductor resistance of IC leads. Mechanical Shock resistance 981m/s 2 (3-axis) 981m/s 2 (3-axis) No interruption of current longer than 1µs fter 48 hours of exposure to humidity 75 to 80% H2S Contact resistance Max. 40mΩ Contact resistance Max. 50mΩ R.H., temperature 40 C±2 C, concentration 3±1ppm fter 48 hours of exposure to humidity 90 to 95% SO2 Contact resistance Max. 40mΩ Contact resistance Max. 50mΩ R.H., temperature 40 C±2 C, concentration 10±3ppm Environmental Humidity Thermal shock resistance Contact resistance Max. 40mΩ, Contact resistance Max. 40mΩ, Contact resistance Max. 50mΩ, Contact resistance Max. 50mΩ, fter 96 hours of exposure to humidity 90 to 95% R.H., temperature 40 C±2 C fter 5 cycles where 1 cycle consists of steps 1 to 4 Steps C, 30 minutes C, Max.5 minutes C, 30 minutes C, Max.5 minutes mbient temperature 55 C to +85 C 55 C to +85 C No freezing at low temperatures Soldering heat Peak temperature: Max. 245 C Peak temperature: Max. 245 C Infrared reflow soldering resistance 300 C within 5 seconds 300 C within 5 seconds Soldering iron Suitable IC package* contacts: SOP IC with nominal dimension 600 mil and 1.27mm pitch contacts: SSOP IC with nominal dimension 600 mil and 0.8mm pitch
3 2. Materials and Surface Treatment Molded plastic part Part name Material Surface treatment Contact DIMENSIONS (Unit: mm) ody Glass fiber reinforced polyamide (UL94V-0) Frame Glass fiber reinforced PPS resin (UL94V-0) Socket body Nominal dimension: 600 mil contacts CD Data Copper alloy Contact portion: Ni plating on base, Sn plating on surface Terminal portion: Ni plating on base, Sn plating on surface (except for top of the terminal) The CD data of the products with a CD Data mark can be downloaded from: ±0.15 (Top of the terminal) 1.27±0.1 (Top of the terminal) 0.35± Recommended PC board pattern (TOP VIEW) Note: Only the IC package positioning part shape (4 corners) and dimensions differ slightly between and types. IC chip and frame mounted on socket body ± ± ± ± ± ± ±0.1 Contact portion (37.0) (8.0) (20.0) Frame set direction Holding part of frame and main unit (frame claw)
4 Socket body Nominal dimension: 600 mil contacts CD Data ±0.15 (Top of the terminal) 0.8±0.1 (Top of the terminal) 0.3± ±0.1 (Top of the terminal) Recommended PC board pattern (TOP VIEW) 27.2± ± ± ± ± ± ± ±0.1 Note: Only the IC package positioning part shape (4 corners) and dimensions differ slightly between, and C types. IC chip and frame mounted on socket body Contact portion (37.0) (20.0) Frame set direction (8.0) Holding part of frame and main unit (frame claw)
5 EMOSSED TPE ND REEL (Unit: mm) 1. Nominal dimension: 600 mil contacts 1) Tape dimensions (Conforming to JIS C T5624) (56.0) (52.4) (26.2) (1.55 dia.) 2) Reel dimensions (JIS C R56F) +2 ( ) Taping reel Pull-out direction (2.0) (4.0) (Note 1) 165 to 180 (3 dia.) Label (1.75) Notch oriented on this side. SOP IC socket 2. Nominal dimension: 600 mil contacts 1) Tape dimensions (Conforming to JIS C T5624) Pull-out direction (56.0) (52.4) (26.2) (1.55 dia.) (Note 1) 165 to 180 2) Reel dimensions (JIS C R56F) (3 dia.) +2 ( ) Taping reel Label (2.0) (4.0) (1.75) Notch oriented on this side. SSOP IC socket NOTES 1. s this construction stresses the PC board s contact ability, you should take the PC board thickness into account when studying creating a socket. The recommended PC board (made from FR-4) thickness is at least 1.0 mm for an SOP IC socket. 2. Reflow soldering In order to ensure solder strength, cream solder used should have a strength equivalent to Sparkle Solder Paste F (Senju Metal Industry Co., Ltd.). 3. Manual soldering the SO packages (1) Soldering iron and solder Use a small capacity soldering iron with a narrow tip and thin wire solder. Example) Capacity: 100V C 15W Tip diameter: 1.0 to 1.2mm Wire solder diameter: 0.6 to 0.8mm (2) Soldering time Perform soldering quickly. Solder within 5 seconds using the soldering iron specified above. 4. If the IC s pin pitch is uneven, it might not fit into the socket or the IC may become damaged. Check the IC s pin pitch before insertion. 5. When setting the frame, please use one of our specialized tools, and make sure that all frame tabs are securely inserted. If setting an IC embedded in a frame on the main unit, press in the frame until both tabs are firmly snapped into the main unit. When the frame is full inserted, there will be an audible snapping sound. 6. When setting the frame by hand, lock all arms ( and contacts: 4 points) to the socket body at the same time. Same time When replacing an IC, be sure to use the special frame removal tool available from us. Do not apply excessive displacement to the arms on the frame. Doing so may result in damage. 8. Do not bend the pins. Doing so may result in damage. 9. Do not pull the pins with excessive force. Doing so may cause them to come off. 10. Unevenness in the mold color The white socket frame shows uneven color tones varying from white to gray. However, the unevenness of the color does not affect the socket performance or functions. The black type does not show such color unevenness. Therefore, please choose the black type if color unevenness can be a problem. (Good) (Not good) For other details, please verify with the product specification sheets. 7. When removing the frame, use the special tool available from us designed for that purpose.
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