Product End-of-Life Disassembly Instructions

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1 Product End-of-Life Disassembly Instructions Product Category: Monitors and Displays Marketing Name / Model [List multiple models if applicable.] HP V inch LED Backlit LCD Monitor Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 22/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1. Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 1 sq cm With a surface greater than 1 sq cm I/F Board*1, Power Board*1, Control Board*1 All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps panel*1 3 1 Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height power board 1 External electrical cables and cords VGA cable*1, Power cord*1 All are inside monitor carton box 2 Gas Discharge Lamps Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing EL-MF877- Page 1

2 refractory ceramic fibers Components, parts and materials containing radioactive substances 2. Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Screw driver Hexagon Screw Driver Diagonal cutting nippers Nosed pliers 3. Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. Separate base and column by hand, then use tool to separate monitor head and stand. 2. Use tool to separate screw from rear cover, then separate rear cover from monitor head by hand. 3. Tear the tape from lamp wire and LVDS FFC, then disassemble the lamp wire, LVDS FFC and ctrl-bd FFC from connector, disassemble the chassis from panel. 4. Disassemble the ctrl-bd from panel and ctrl-bd, then disassemble ctrl-bd from bezel and separate panel and bezel by hand. 5. Separate safety Mylar from chassis, then use tool to release screws on PCBs, tear gaskets from chassis, and separate all connector on PCBs. 6. Use tool to separate wall mount plate from rear cover, and separate HP LOGO, button and lens form bezel. 7. Use tool to disassemble column rear cover from column, then release the screws to separate hinge from column, and release screws to separate hinge top bracket from hinge. 8. Tear the rubber foot from base, then use tool to release screws from base plate, and use tool to separate base plate and base cover. 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). EL-MF877- Page 2

3 1.Remove ASSY Stand 1.1 Unlock the release bottom 1.2 Disassemble the ASSY BASE & ASSY CLMN by hand EL-MF877- Page 3

4 1.3 Unlock all screws & remove ASSY hinge BKT 2.Remove ASSY Rear Cover 2.1 Unlock screws by hand 2.2 Work in the gap with your finger along the top, right, & left side to separate bezel & RC EL-MF877- Page 4

5 2.3 Flip the monitor over and disassemble the RC from left to right EL-MF877- Page 5

6 3.Remove ASSY SHD & PCBA 3.1 Remove fabric conductive*2, acetic tapes*2, CTRL BD FFC & LVDS FFC 3.2 Unlock all screws in PCBA EL-MF877- Page 6

7 3.3 Disassemble PCBA from ASSY SHD & remove all wires 4. Remove panel & CTRL BD 4.1 Remove panel EL-MF877- Page 7

8 4.2 Remove CTRL BD & CTRL FFC EL-MF877- Page 8

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