Automation Controls Group Catalog. Connectors High Current Connectors. industrial.panasonic.com/ac/e/ Active Optical Connectors

Transcription

1 Automation Controls Group Catalog Connectors industrial.panasonic.com/ac/e/ High Current Connectors Active Optical Connectors

2 T A B L E O F C O N T E N T S Page Feature of TOUGH CONTACT...2 Guide for Navigating Website...4 Narrow pitch Connectors Narrow pitch Connectors Selector Chart mm pitch S A35US...27 A35S...32 P35S mm pitch A4US...44 A4S...52 F4S...59 P4S...66 P4S Shield type...75 P mm pitch P5KF...90 P5K / P5KS...96 High Current Connectors High Current Connectors Selector Chart...15 A35US with power terminal A35P B L FPC/FFC Connectors FPC Connectors Selector Chart...18 Y2B (0.2 mm pitch) Y3BL (0.3 mm pitch) Y3B / Y3BW (0.3 mm pitch) Y3BC (0.3 mm pitch) Y4BH (0.4 mm pitch) Y5B / Y5BW (0.5 mm pitch) Active Optical Connector V series MID Solutions MIPTEC LDS MID Package AAM Notes on Using Narrow pitch Connectors/High Current Connectors Notes on Using High Current Connector L Notes on Using FPC Connectors Notes on Using Active Optical Connector V Series ISO14001, ISO9001, ISO/TS16949 Certificate of Approval INDEX Automation Controls Sales Network ACCTB34E T 1

3 Putting our customers first Panasonic continually strives to increase product reliability by working closely with our customers and meeting their stringent design requirements. Hence, Panasonic developed Connectors. The technology address small footprint design requirements for use in most operating environments. High Reliability Tough... against shock impact! Bellows contact construction able to withstand twisting and mechanical shock if dropped. The high precision design curved molding provides the right amount of spring action from the contacts which is made possible by means of high precision-metal-processing, one of Panasonic's core technologies. This spring-like feature is key in many mobile devices. Simulation Analysis Through extensive analysis, the contacts are optimally designed to bring the best spring action. Once this is set, the contacts are then precision molded. Tough... against exposure to foreign particles and solder flux! V notch contact construction improves contact reliability (Prevents entry of foreign particles) The amount of contact pressure (per unit area) was dramatically increased by taking into consideration the contact edge design. This further improves the overall ability to resist foreign particles from entering inside the contact area. 2-point contacting Surface contact to edge contact Improved contact movement effect before and after V notch passage The combination of these effects greatly improves contact reliability (resistance to entry of foreign matter) *Contact image of A4S Evaluation example of plastic powder adhered on post contact surface Product without notch V notched product A4S Contact Construction View Cross section of the socket side contact Cross section of the header side contact More effective in eliminating flux and foreign particles, and also more effective in keeping foreign particles from getting inside Patented Double contact Same effect as V notch attained by double contact. Patent and Design Japan: Registration of patent (Patent No ) Korea: Registration of patent (Patent No ) Taiwan: Registration of patent (Patent No ) China: Registration of patent (Patent No ) North America: Registration of patent (Patent No ) 2 ACCTB35E T

4 Withstands various environmental conditions series 0.35mm pitch S35/A35US/A35S/P35S 0.4mm pitch A4US/A4S/F4S/P4S/P4S Shield type/p4 0.5mm pitch P5KF/P5K/P5KS Four Key Points Stacking connector for high current A35US with power terminal/a35p/b01 Tough against solder rise! Ni Barrier construction Prevents Solder Rise Exposed nickel is placed on mid part of socket contacts. This contact, while being ultra low in profile, prevents solder rise. Influence of solder controlled in contact and contact spring parts. Solder remains in the terminals and stable fillet mold is possible. Exposed Ni barrier portion Cu Ni Au Exposed Ni portion Cross section of the socket side contact Solder rise after reflow Example without Ni barrier Rises past lead and into horizontal area. Example with Ni barrier Ni exposure part Solder paste coating conditions: Metal screen thickness; 120 m; Open ratio 90% (solder amount 136% of recommended value) Reflow conditions: (lead-free solder conditions) temperature profile; 260C peak temperature, atmosphere; N2 reflow (oxygen concentration 1,000 ppm) Limit of solder rise. Tough against corrosive gases! Porosity Treatment Resistance to Corrosion This treatment consists of coating surface with a very thin film to seal pinholes in the gold plating. We have developed this porosity treatment technology, which ensures the same contact reliability for thin gold plating as that of thick gold plating. Improvement in resistance to corrosion Improvement in insertion/ removal durability Improvement in contact reliability for digital signals Plating technology (Porosity treatment technology) Porosity treatment film Pinholes Au plating Surrounding gas Number of pinholes (piece/mm 2 ) Relationship between gold plate thickness and number of pinholes This shows the relationship between the thickness of the gold plating on the nickel plating (1 m) and the number of pinholes. 1 Gold plate thickness (m) Improvement of the corrosion resistance Status of the post s contact after the sulfur dioxide test <Porosity-treated product> <Conventional product> 2 Corroded mainly at the pinholes. Ni plating Base material Test conditions SO2 concentration: 103 ppm, Humidity: 90 to 95% RH Temperature: 402C Time: 145 hours ACCTB35E T 3

5 Guide for Navigating Website Main Web Page of Automation Controls You can check discontinued products. You can access the FAQ 24 hours a day. You can also send inquiries by . Download Center At the download center you can download information about products such as product catalogs and CAD data. * Some products are not listed. 4 ACCTB36E T

6 Product pages Individual product front pages and an application-based search function are provided for each product category. Front page of connectors Product page Product list PDF catalogs and CAD data can be downloaded*. Correspondence data: 2D (DXF) 3D (IGES, Palasolid, STEP, PDF) *Registration is required to download CAD data. Specifications are displayed by part number in an easy-to-read form. (You can choose a product even if you only know its part number.) Dimensions search (Part number, specification and application searches are also available.) ACCTB36E T 5

7 CONNECTORS Narrow Pitch Connectors 0.35 mm Pitch FPC/FFC Connectors P20 P43 P124 P152 Narrow Pitch Connectors 0.4 mm Pitch Active Optical Connectors P44 P89 P153 P157 Narrow Pitch Connectors 0.5 mm Pitch Technology Introduction 3D Packaging Devices MID Solutions P90 P104 P159 P170 High Current Connectors P105 P Feature of Guide for Navigating Website Narrow pitch Connectors Selector Chart High Current Connectors Selector Chart FPC Connectors Selector Chart Notes on Using Narrow pitch Connectors/ High Current Connectors Notes on Using High Current Connector L2 Notes on Using FPC Connectors Notes on Using Active Optical Connector V Series ISO14001, ISO9001, ISO/TS16949 Certificate of Approval INDEX Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 6 Panasonic Corporation 2016 ACCTB37E T

8 Narrow pitch connectors High Current Connectors series Narrow pitch connectors 0.35 mm pitch Narrow pitch connectors 0.4 mm pitch Narrow pitch connectors 0.5 mm pitch High Current Connectors Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 7 Panasonic Corporation 2016 ACCTB38E T

9 Narrow pitch Connectors Selector Chart Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Terminal pitch Types Product name Part No. Shape Features Mated height Dimensions (short width) (Include terminal) No. of pins Rated current Rated voltage Ambient temperature Insertion and removal life Terminal shape RoHS compliant Page mm S35 Socket: AXG1 Header: AXG2 Width 1.7 mm slim and low profile two-piece type connector construction for both high contact reliability and good workability. For 0.6 mm mated height, thanks to our proprietary "Fine fitting structure", high removability with a nice click feel is maintained while being low profile Socket: 1.7mm Header: 1.5mm 0.8mm 0.3A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC 55 C to +85 C 30 times SMD Compliant P mm pitch For board-to-fpc A35US Socket: AXG7 Header: AXG8 0.6 mm Mated Height with 2.2 mm width. Proprietary Fine Fitting Construction A slim 2.2 mm (width) design provides space-saving benefits. structure provides a slim and low-profile design resistant to various environmental conditions. Soldering terminals enhance mounting strength. 0.6mm Socket: 2.2mm Header: 1.8mm A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC 55 C to +85 C 30 times SMD Compliant P.27 Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 8 Panasonic Corporation 2016 ACCTB39E T

10 Narrow pitch Connectors Selector Chart For board-to-fpc A35S Socket: AXE7 Header: AXE8 Small size (Terminal pitch: 0.35 mm, width: 2.5 mm and Mated height: 0.8 mm) Low-profile connector with up to 100 pin contacts Strong resistance to adverse environments! Utilizes construction for high contact reliability. Connectors for inspection available 0.8mm Socket: 2.5mm Header: 2.0mm A/pin contact (Max. 4 A at total pin contacts) 44 60V AC/DC 55 C to +85 C 30 times SMD Compliant P mm pitch For board-to-fpc/board-to-board P35S Socket: AXT1 Header: AXT2 Small size 0.35 mm pitch contributes to device miniaturization Strong resistance to adverse environments! Utilizes construction for high contact reliability. Pattern wiring possible on PC board below connectors Connectors for inspection available 1.5mm Socket: 3.6mm Header: 2.35mm A/pin contact (Max. 4 A at total pin contacts) 60V AC/DC 55 C to +85 C 50 times SMD Compliant P.38 Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 9 Panasonic Corporation 2016 ACCTB39E T

11 Narrow pitch Connectors Selector Chart Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Terminal pitch Types Product name Part No. Shape Features Mated height Dimensions (short width) (Include terminal) No. of pins Rated current Rated voltage Ambient temperature Insertion and removal life Terminal shape RoHS compliant Page Width: 2.0 mm/2.2 mm and mated height: 0.6 mm/ 0.8 mm Strong resistance to adverse environments! Utilizes construction for high contact reliability The slim body has a sufficient suction face Connectors for inspection available 0.4 mm pitch For board-to-fpc 0.6mm 0.8mm 0.8mm 1.0mm Socket: 2.2mm Header: 1.8mm A4US Socket: AXE1 Header: AXE A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC 55 C to +85 C 30 times SMD Compliant P.44 Socket: 2.0mm Header: 1.8mm A4S Socket: AXE5 Header: AXE6 2.5 mm width slim two-piece type connector Mated heights of 0.8 and 1.0 mm are available for the same foot pattern Strong resistance to adverse environments! Utilizes construction for high contact reliability Connectors for inspection available Socket: 2.5mm Header: 2.0mm A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC 55 C to +85 C 30 times SMD Compliant P.52 Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 10 Panasonic Corporation 2016 ACCTB39E T

12 Narrow pitch Connectors Selector Chart 1.0mm 80 For board-to-fpc 55 C to +85 C 50 times SMD Compliant 1.2mm F4S Socket: AXT5 Header: AXT6 Low-profile connectors that form a board-to FPC connection with 1.0 mm and 1.2 mm mated height Strong resistance to adverse environments! Utilizes construction for high contact reliability Connectors for inspection available Socket: 3.6mm Header: 2.6mm A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC P mm pitch P4S Socket: AXT3 Header: AXT4 Wide range of mated height 1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm Strong resistance to adverse environments! Utilizes construction for high contact reliability. Pattern wiring possible on PC board below connectors Connectors for inspection available 1.5mm 2.0mm 2.5mm 3.0mm Socket: 3.6mm Header: 2.35mm A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC 55 C to +85 C 50 times SMD Compliant P.66 For board-to-fpc/board-to-board P4S shield type Socket: AXT3 Header: AXT4 Radiation noise is reduced thanks to better grounding with multi-point ground construction and covering using a shield plate. ensures high resistance to various environments Previous product can also be used on the header side Freedom of design is increased, because it has the same foot pattern as the previous standard product 1.5mm Socket: 3.8mm Header: 2.35mm A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC 55 C to +85 C 50 times SMD Compliant P.75 Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 11 Panasonic Corporation 2016 ACCTB39E T

13 Narrow pitch Connectors Selector Chart Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Terminal pitch Types Product name Part No. Shape Features Mated height Dimensions (short width) (Include terminal) No. of pins Rated current Rated voltage Ambient temperature Insertion and removal life Terminal shape RoHS compliant Page P4 (Without soldering terminal) Socket: AXK7 Header: AXK8 Wide range of mated height 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm Strong resistance to adverse environments! Utilizes construction for high contact reliability Pattern wiring possible on PC board below connectors Connectors for inspection available mm pitch For board-to-fpc/board-to-board A/pin contact (Max. 5 A at total pin contacts) 40 P4 (With soldering terminal) Socket: AXK7 Header: AXK8 1.5mm 2.0mm 2.5mm 3.0mm 3.5mm 1.5mm 2.0mm 2.5mm 3.0mm 3.5mm Socket: 5.1mm Header: 3.96mm 60V AC/DC 55 C to +85 C 50 times SMD Compliant P.80 Wide range of mated height 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm Strong resistance to adverse environments! Utilizes construction for high contact reliability Pattern wiring possible on PC board below connectors Connectors for inspection available With soldering terminals for improved mountability Socket: 5.1mm Header: 3.96mm Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 12 Panasonic Corporation 2016 ACCTB39E T

14 Narrow pitch Connectors Selector Chart 1.5mm 2.0mm 2.5mm 3.0mm 3.5mm For board-to-fpc/board-to-board P5KF Socket: AXK5F Header: AXK6F The mated height is the 1.5 mm, 2.0 mm and 2.5 mm Strong resistance to adverse environments! Utilizes construction for high contact reliability Pattern wiring possible on PC board below connectors Socket: 5.8mm Header: 3.3mm A/pin contact (Max. 10 A at total pin contacts) 60V AC/DC 55 C to +85 C 50 times SMD Compliant P mm pitch For board-to-board P5K Socket: AXK5 Header: AXK6 The mated heights are 3.0 mm and 3.5 mm Strong resistance to adverse environments! Utilizes construction for high contact reliability Socket: 5.8mm Header: 4.6mm Compliant A/pin contact (Max. 10 A at total pin contacts) 60V AC/DC 55 C to +85 C 50 times SMD P.96 Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 13 Panasonic Corporation 2016 ACCTB39E T

15 Narrow pitch Connectors Selector Chart Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Terminal pitch Types Product name Part No. Shape Features Mated height Dimensions (short width) (Include terminal) No. of pins Rated current Rated voltage Ambient temperature Insertion and removal life Terminal shape RoHS compliant Page mm 4.5mm 5.0mm 5.5mm mm pitch For board-to-board P5KS Socket: AXK5S Header: AXK6S Wide range of mated height (4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm, 7.0 mm, 8.0 mm, and 9.0 mm) Strong resistance to adverse environments! Utilizes construction for high contact reliability 6.0mm 6.5mm 7.0mm 8.0mm 9.0mm Socket: 5.4mm Header: 5.0mm A/pin contact (Max. 16 A at total pin contacts) 60V AC/DC 55 C to +85 C 50 times SMD Compliant P Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 14 Panasonic Corporation 2016 ACCTB39E T

16 High Current Connectors Selector Chart Terminal pitch Types Product name Part No. Shape Features Mated height Dimensions (short width) (Include terminal) No. of pins Rated current Rated voltage Ambient temperature Insertion and removal life Terminal shape RoHS compliant Page A35US with power terminal Socket: AXG7 J Header: AXG8 J Supports 3A power terminals Power terminal type make pin reduction possible structure provides a slim and low-profile design resistant to various environmental conditions. 0.6 mm mated height with 2.2 mm width mm pitch 0.8 mm pitch Connector for board-to-fpc 0.6mm 0.8mm 0.6mm/0.8mm Socket: 2.2mm Header: 1.8mm A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal) (Max. 5 A at total pin contacts) 60V AC/DC 55 C to +85 C 30 times SMD Compliant P.105 A35P Socket: AXF5A Header: AXF6A High current rating 5 A (using 1.25 A/pin 8 pins) Support of high current means number of pins can be reduced. Increased design freedom (pin layout and multiple high current lines) Mated height: 0.8 mm and width: 2.5 mm Socket: 2.5mm Header: 2.0mm A/pin contact 4 pin contacts or 1.25 A/pin contact 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts) 30V AC/DC 55 C to +85 C 30 times SMD Compliant P.110 B01 Socket: AXF Header: AXF High current rating: 6A (3A/pin 2 pins) Low profile but high removal force Helps make mobile devices thinner thanks to its low profile height of 0.6mm/0.8mm. Socket: 2.4mm Header: 1.8mm 3.0A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal) 6 30V AC/DC 55 C to +85 C 30 times SMD Compliant P.115 Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 15 Panasonic Corporation 2016 ACCTB91E T

17 Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 16 Panasonic Corporation 2016

18 FPC Connector Series 0.2 mm pitch 0.3 mm pitch 0.4 mm pitch (Impedance matching type) 0.5 mm pitch Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 17 Panasonic Corporation 2016 ACCTB41E T

19 FPC Connectors Selector Chart Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Contact pitch Product name Part No. Shape Features Lock structure Compatibility with FPC/FFC Applicable FPC/FFC thickness Contact structure Contact pitch Terminal pitch Mounting height Dimensions (width) No. of pins Rated current Rated voltage to 9 0.2mm pitch Y2B AYF21 35 Slim (width: 3.15 mm) and low profile design Double top and bottom contacts Wiring patterns can be placed underneath the connector FPC 0.2mm Top and bottom double contacts 0.2mm 0.4mm 0.9mm 3.15mm (Including lever) 2.95mm mm pitch A/pin contact (Max. 5A at total pin contacts) 50V AC/DC Back lock Y3BL AYF35 25 Low profile (0.6 mm) and slim design Compatible with FPC 0.2 mm thickness High durability assured with proprietary soldering terminals Wiring patterns can be placed underneath the connector FPC 0.2mm Top contact 0.3mm 0.6mm 0.6mm 3.35mm (Including lever) 2.95mm Back lock 0.2A/pin contact 50V AC/DC Y3B AYF33 35 FPC 0.2mm 0.3mm 0.6mm 0.9mm 0.2A/pin contact 50V AC/DC Y3BW AYF33 65 Slim (width: 3.15 mm) and low profile design Double top and bottom contacts Wiring patterns can be placed underneath the connector Y3BW features lock holding type 1. With a structure that temporarily holds the FPC 2. Higher FPC holding force Back lock Top and bottom double contacts mm (Including lever) 2.95mm Ambient temperature 55 C to +85 C 55 C to +85 C 55 C to +85 C Insertion and removal life 20 times 20 times 20 times Terminal shape SMD SMD SMD RoHS compliant Compliant Compliant Compliant Page P.124 P.128 P.132 Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 18 Panasonic Corporation 2016 ACCTB42E T

20 FPC Connectors Selector Chart 0.3mm pitch 0.4mm pitch 0.5mm pitch Y3BC AYF36 35 Double top and bottom contacts Slim (width: 3.5 mm) and low profile design Wiring patterns can be placed underneath the connector Lever open/close operation is possible without FPC inserted FPC 0.2mm Y4BH AYF4 35 Differential impedance matching (100, 90, 85 Ω) compliant with various high-speed transmission standards Double top and bottom contacts Easy-to-handle back lock structure Man-hours of assembly time can be reduced by delivering the connectors with their levers opened FPC 0.3mm 0.4mm 0.4mm 1.0mm Back lock Top and bottom double contacts Top and bottom double contacts 0.3mm 0.6mm 1.0mm 3.5mm (Including lever) 3.2mm Back lock 0.2A/pin contact 3.7mm (Including lever) 3.2mm 0.3A/pin contact Y5B AYF53 35 FPC/FFC 50 Top and bottom double contacts 0.5mm 0.5mm 1.0mm Back lock 3.7mm (Including lever) 3.2mm Y5BW AYF53 65T Low profile, space saving back lock type with improved lever operability Top and bottom double contacts structure Wiring patterns can be placed underneath the connector Y5BW features lock holding type 1. With a structure that temporarily holds the FPC 2. Higher FPC holding force 0.3mm FPC A/pin contact Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors 50V AC/DC 55 C to +85 C 20 times SMD Compliant P V AC/DC 55 C to +85 C 20 times SMD Compliant P V AC/DC 55 C to +85 C 20 times SMD Compliant P.148 Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 19 Panasonic Corporation 2016 ACCTB42E T

21 Narrow pitch connectors S35 (0.35mm pitch) 1.7mm 1.5mm Socket Header RoHS compliant For board-to-fpc Narrow Pitch Connectors (0.35mm pitch) FEATURES 1. Width 1.7 mm slim and low profile two-piece type connector Mated height 0.6 mm Smaller compared to A35US Width: Approx. 33% down Mated height 0.6mm Mated height 0.8 mm Smaller compared to A35S/A4S Width: Approx. 32% down Mated height 0.8mm <Mating cross section> S35 Width: 1.7mm (S35) Width: 2.2mm (A35US) Approx. 33% down <Mating cross section> S35 Width: 1.7mm (S35) Width: 2.5mm (A35S/A4S) Approx. 32% down S35 2. Proprietary construction for both high contact reliability and good workability. (h = 0.6 mm) Socket 1.7 mm 2-point soldering Header 1.5 mm (h = 0.8 mm) Socket 1.7 mm 2-point soldering Header 1.5 mm 0.35 mm (pitch) 8.45 mm (34 pins) 0.35 mm (pitch) 7.75 mm (34 pins) 0.35 mm (pitch) 0.35 mm (pitch) 8.30 mm (34 pins) 7.60 mm (34 pins) 3. For 0.6 mm mated height, thanks to our proprietary Fine fitting structure, high removability with a nice click feel is maintained while being low profile. APPLICATIONS All types of board-to-fpc connection applications for miniature mobile devices such as wearable devices. 20 ACCTB66E T

22 Narrow pitch connectors S35 (0.35mm pitch) ORDERING INFORMATION Mated height: 0.6mm 1: Socket 2: Header Number of pins (2 digits) Mated height <Socket>/<Header> 1: 0.6 mm PRODUCT TYPES Mated height 0.6mm 0.8mm AXG Functions 4: Without positioning bosses / Fine fitting structure Surface treatment (Contact portion / Terminal portion) <Socket> 4: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating, Surface: Au plating Number of pins Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. Part number Packing Socket Header Inner carton (1-reel) Outer carton 6 AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG Mated height: 0.8mm 1: Socket 2: Header Number of pins (2 digits) Mated height <Socket>/<Header> 2: 0.8 mm 34 AXG AXG AXG AXG Functions 2: Without positioning bosses AXG Surface treatment (Contact portion / Terminal portion) <Socket> 4: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating, Surface: Au plating 15,000 pieces 30,000 pieces 15,000 pieces 30,000 pieces 21 ACCTB66E T

23 Narrow pitch connectors S35 (0.35mm pitch) SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight Item Specifications Conditions Rated current Max. 0.3 A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for 1 min. Insulation resistance Min. 1,000MΩ (Initial) Using 250V DC megger (applied for 1 min.) Contact resistance Max. 90mΩ h = 0.6 mm 20 or less pins: Max. 26.0N, pin contact Over 22 pins: Max N/pin contact pin Composite insertion force contacts (Initial stage) h = 0.8 mm Max N/pin contact pin contacts (Initial stage) Composite removal force Min N/pin contact pin contacts Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (Header and socket mated) Humidity resistance (Header and socket mated) Salt water spray resistance (Header and socket mated) H2S resistance (Header and socket mated) Insertion and removal life Peak temperature: 260 C or less (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron 55 C to +85 C (Products only) 40 C to +50 C (Packaging structure) After 5 cycles Insulation resistance: Min. 100MΩ, Contact resistance: Max. 90mΩ After 120 hours Insulation resistance: Min. 100MΩ, Contact resistance: Max. 90mΩ After 24 hours Insulation resistance: Min. 100MΩ, Contact resistance: Max. 90mΩ After 48 hours Contact resistance: Max. 90mΩ 30 times 34 pin contacts Socket h = 0.6 mm: 0.01g, h = 0.8 mm: 0.02g Header h = 0.6 mm: 0.01g, h = 0.8 mm: 0.01g 2. Material and surface treatment Part name Material Surface treatment Molded portion Contact and Post Heat resistant plastic (LCP resin) (UL94V-0) Copper alloy According to the contact resistance measurement method of JIS C 5402 No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, Humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, Salt water concentration 5%±1% Conformed to JEIDA Bath temperature 40 C±2 C, Gas concentration 3 ppm ±1 ppm, Humidity 75% to 80% R.H. Repeated insertion and removal cycles of max. 200 times/ hour Contact portion (Main): Au plating (Min. 0.1μm) over nickel Contact portion (Sub): Au plating (Min μm) over nickel Terminal portion: Au plating over nickel (except for top of the terminal) Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal) Soldering terminals (Header): Au plating over nickel (except for top of the terminal) 22 ACCTB66E T

24 Narrow pitch connectors S35 (0.35mm pitch) DIMENSIONS (Unit: mm) Socket (Mated height: 0.6 mm) CAD Data 0.40 (Suction face) Y (Note 1) Z (Note 1) Header (Mated height: 0.6 mm) CAD Data The CAD data of the products with a CAD Data mark can be downloaded from: A B± ± ± ±0.03 C±0.1 (0.825) Terminal coplanarity 0.08 (Contact and soldering terminals) General tolerance: ±0.2 Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically (Suction face) Soldering terminals A B± ± ± ±0.03 C± (0.37) Soldering terminals 0.46 Terminal coplanarity 0.08 (Post and soldering terminals) General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C ACCTB66E T

25 Narrow pitch connectors S35 (0.35mm pitch) Socket (Mated height: 0.8 mm) CAD Data 0.50 (Suction face) Y (Note 1) Z (Note 1) Header (Mated height: 0.8 mm) CAD Data Socket and Header are mated B± ± ± ±0.03 A C±0.1 X X (0.80) Terminal coplanarity 0.08 (Contact and soldering terminals) General tolerance: ±0.2 Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically. Header 0.60±0.1 Socket 0.62 (Suction face) Soldering terminals Header Socket ±0.1 A B± ± ±0.03 C±0.1 X X 1.12 (0.36) Soldering terminals 0.65 Terminal coplanarity 0.08 (Post and soldering terminals) General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C ACCTB66E T

26 Narrow pitch connectors S35 (0.35mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C :1999. However, not applied to the mounting-hole pitch of some connectors.) Leading direction after packaging Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C Quantity per reel Socket: 0.6mm and 0.8mm Header: 0.6mm and 0.8mm Tape I +0.3 (A 0.1 ) (B) 1.75 Max. 30 Tape I , to 60 Tape I ,000 Max. 34 Tape I , to 60 Tape I ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress Type (2.0) (4.0) dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (C±1) 380 dia. Label Common for S35 Socket Header Top cover tape Taping reel Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 25 ACCTB66E T

27 Narrow pitch connectors S35 (0.35mm pitch) NOTES 1. Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 0.6 mm and 0.8 mm) Recommended PC board pattern (TOP VIEW) 2.00± ±0.01 (0.40) 0.35± ± ± ±0.03 (0.40) Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) 0.35± ± ± ±0.01 (0.31) 0.20± ± ±0.03 : Insulation area 1.38± ±0.01 Header (Mated height: 0.6 mm and 0.8 mm) Recommended PC board pattern (TOP VIEW) 1.80± ± ±0.03 (0.40) 1.00±0.01 (0.40) Regarding cautions for use, please refer to page ± ± ± ±0.03 (0.40) Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) 0.35± ± ± ±0.01 (0.31) 0.66± ± ± ± ±0.01 : Insulation area Please refer to the latest product specifications when designing your product. 26 ACCTB66E T

28 Narrow pitch connectors A35US (0.35mm pitch) 2.2mm ORDERING INFORMATION 7: Socket 8: Header Socket 1.8mm RoHS compliant Number of pins (2 digits) Mated height <Socket>/<Header> 0: 0.6 mm Header For board-to-fpc Narrow Pitch Connectors (0.35mm pitch) FEATURES mm Mated Height with 2.2 mm width. 2. Proprietary Fine Fitting Construction Our proprietary design provides a comfortable and tact feel while providing a secure connection. Socket Fine Fitting structure Header Soldering terminals at each corner 1.8 mm 2.2 mm AXG 0 4 Functions 4: Without positioning bosses / Fine fitting construction Surface treatment (Contact portion / Terminal portion) <Socket> 7: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating, Surface: Au plating Top view Bottom view 0.35 mm 5.30 mm (20 pin) Soldering terminals at each corner 6.00 mm (20 pin) Fine Fitting structure A35US Proprietary Fine Fitting construction High unmating force is maintained while soldering terminals on socket and header are held in place. Soldering terminal on header Cross section showing mating with soldering terminals Soldering terminalt on socket 3. A slim 2.2 mm (width) design provides space-saving benefits. The actual footprint is reduced by 20%, when compared to a 40 pin A4S. 4. structure provides a slim and low-profile design resistant to various environmental conditions. 5. Soldering terminals enhance mounting strength. APPLICATIONS Board-to-FPC connections in hand held devices that require compact design and enhanced functionality. 27 ACCTB65E T

29 Narrow pitch connectors A35US (0.35mm pitch) PRODUCT TYPES Mated height 0.6mm Number of pins Part number Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Item Specifications Conditions Rated current 0.30A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Electrical characteristics Mechanical characteristics Environmental characteristics 2. Material and surface treatment Part name Material Surface treatment Packing Socket Header Inner carton (1-reel) Outer carton 10 AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG AXG ,000 pieces 20,000 pieces Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) Max. 90mΩ Max N/pin contact pin contacts (initial) Min N/pin contact pin contacts Min. 0.20N/pin contact Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Peak temperature: 260 C or less (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 48 hours, contact resistance max. 90mΩ Lifetime characteristics Insertion and removal life 30 times Unit weight 60 pin contacts Socket: 0.02g Header: 0.01g Molded portion Contact and Post LCP resin (UL94V-0) Copper alloy No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating 28 ACCTB65E T

30 Narrow pitch connectors A35US (0.35mm pitch) DIMENSIONS (Unit: mm) Socket (Mated height: 0.6 mm) CAD Data Header (Mated height: 0.6 mm) CAD Data Socket and Header are mated 0.60 (Suction face) Y (Note) Z (Note) The CAD data of the products with a CAD Data mark can be downloaded from: A B± ± ±0.03 (0.68) 0.30±0.03 C±0.1 Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically. Header 0.60± (Suction face) Soldering terminals A B± ± ± ±0.03 C± Soldering terminals Terminal coplanarity 0.08 (Contact and Metal bracket) 2.20 General tolerance: ±0.2 Terminal coplanarity 0.08 (Post and Metal bracket) 1.80 General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C Socket 29 ACCTB65E T

31 Narrow pitch connectors A35US (0.35mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C :1999. However, not applied to the mounting-hole pitch of some connectors.) Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C Quantity per reel Socket Header Leading direction after packaging +0.3 (A 0.1 ) (B) (1.75) (2.0) (4.0) 4.0 Max. 30 Tape I , to 60 Tape I ,000 Max. 34 Tape I , to 60 Tape I ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress Type Tape I 1.5 dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (C±1) 380 dia. Common for A35US Socket Header Label Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 30 ACCTB65E T

32 Narrow pitch connectors A35US (0.35mm pitch) NOTES 1. Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 0.6 mm) Recommended PC board pattern (TOP VIEW) 2.50± ±0.03 (0.73) 2.50± ±0.01 (0.35) 12 C ± ± ± ±0.03 : Insulation area Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 46%) 8 C ± ± ± ±0.01 (0.50) 0.20± ±0.03 (0.39) 1.82± ±0.01 Header (Mated height: 0.6 mm) Recommended PC board pattern (TOP VIEW) 1.48± ± ± ± ±0.03 (0.39) 0.70±0.01 (0.39) 0.35± ±0.03 : Insulation area Recommended metal mask pattern Metal mask thickness: When 100μm (Signal terminal opening ratio: 70%) (Power terminal opening ratio: 77%) 0.35± ± ± ±0.01 Regarding cautions for use, please refer to page 171. (0.50) 0.90± ± ±0.03 (0.39) 1.42± ±0.01 Please refer to the latest product specifications when designing your product. 31 ACCTB65E T

33 Narrow pitch connectors A35S (0.35mm pitch) 2.5mm Socket 2.0mm RoHS compliant Header ORDERING INFORMATION For board-to-fpc Narrow pitch connectors (0.35mm pitch) FEATURES 1. Small size (Terminal pitch: 0.35 mm, width: 2.5 mm and Mated height: 0.8 mm) When mated, the footprint is reduced by approx. 10% from A4S (60 pin contacts), contributing to the functionality enhancement and size reduction of end equipment. 2.5mm 2.0mm 7: Narrow Pitch Connector A35S (0.35 mm pitch) Socket 8: Narrow Pitch Connector A35S (0.35 mm pitch) Header Number of pins (2 digits) Mated height <Socket> / <Header> 1: For mated height 0.8 mm Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 7: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating, Surface: Au plating Suction face: 0.7mm Suction face: 0.7mm mm (60 pins) A4S mm (60 pins) Soldering terminals at each corner mm (60 pins) A4S 13.8 mm (60 pins) Soldering terminals at each corner Socket Header AXE 1 2 A35S 2. ensures high resistance to various environments in lieu of its spacesaving footprint. Ni barrier construction (Against solder rise!) Bellows contact construction (Against dropping!) Porosity treatment (Against corrosive gases!) V notch and Double contact constructions (Against foreign particles and flux!) 3. Low-profile connector with up to 100 pin contacts. 4. Soldering terminals at each corner enhance mounting strength. 5. Simple lock structure provides tactile feedback to ensure excellent mating/unmating operation feel. 6. Connectors for inspection available. APPLICATIONS Board-to-FPC connections in mobile equipment that requires size and thickness reduction and functionality enhancement. 32 ACCTB2E T

34 Narrow pitch connectors A35S (0.35mm pitch) PRODUCT TYPES Mated height 0.8mm Number of pins Part number Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Item Specifications Conditions Rated current 0.25A/pin contact (Max. 4 A at total pin contacts) Rated voltage 60V AC/DC Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight 2. Material and surface treatment Part name Material Surface treatment Molded portion Contact and Post Packing Socket Header Inner carton (1-reel) Outer carton 10 AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE ,000 pieces 10,000 pieces Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) Max. 100mΩ Max N/pin contact pin contacts (initial) Min N/pin contact pin contacts Min. 0.20N/pin contact Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life LCP resin (UL94V-0) Copper alloy Peak temperature: 260 C or less (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 48 hours, contact resistance max. 100mΩ 30 times 60 pin contacts Socket: 0.03 g Header: 0.02 g No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) 33 ACCTB2E T

35 Narrow pitch connectors A35S (0.35mm pitch) DIMENSIONS (Unit: mm) Socket (Mated height: 0.8 mm) CAD Data 0.70 (Suction face) Y note Z note Socket and Header are mated The CAD data of the products with a CAD Data mark can be downloaded from: A B± ± ± ±0.03 C±0.1 (0.90) Terminal coplanarity 0.08 (Contact and soldering terminals) 2.50 General tolerance: ±0.2 Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected. Header (Mated height: 0.8 mm) CAD Data Header Socket 0.70 (Suction face) Soldering terminals 0.80±0.1 A B± ± ± ±0.03 C± (0.31) Soldering terminals 0.65 Terminal coplanarity 0.08 (Post and soldering terminals) 2.00 General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C ACCTB2E T

36 Narrow pitch connectors A35S (0.35mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C :1999. However, not applied to the mounting-hole pitch of some connectors.) Leading direction after packaging Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers Tape II (A±0.3) (B) 10 to 24 Tape I , to 80 Tape I , Tape II ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress Tape I +0.3 (A 0.1) (C) (1.75) 8.0 (2.0) (4.0) Type 0 dia. (C) (1.75) 8.0 (2.0) (4.0) dia. Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (D±1) 380 dia. Common for A35S Socket Header Label Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 35 ACCTB2E T

37 Narrow pitch connectors A35S (0.35mm pitch) 2.5mm Socket TABLE OF PRODUCT TYPES : Available for sale Product name A35S for inspection 2.0mm RoHS compliant Notes: 1. Please inquire about number of pins other than those shown above. 2. Please inquire with us regarding availability. 3. Please keep the minimum order quantities no less than 50 pieces per lot. 4. Please inquire if further information is needed. PRODUCT TYPES Header For board-to-fpc Connectors for inspection usage (0.35mm pitch) FEATURES 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Number of pins A35S APPLICATIONS Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection Specifications Part No. Specifications Part No. Socket Without positioning bosses AXE7E 26 Header Without positioning bosses AXE8E 26 Note: When placing an order, substitute the (asterisk) in the above part number with the number of pins for the specific connector. 36 ACCTB2E T

38 Narrow pitch connectors A35S (0.35mm pitch) NOTES Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 0.8 mm) Recommended PC board pattern (TOP VIEW) 2.90± ±0.03 (0.92) 2.90± ± ± ± ± ±0.03 (0.50) 0.20±0.03 C 0.30 Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 70%) (0.65) 0.35± ± ± ±0.01 Regarding cautions for use, please refer to page ±0.03 : Insulation area (0.39) 2.02±0.01 C ±0.01 Header (Mated height: 0.8 mm) Recommended PC board pattern (TOP VIEW) 1.66± ± ±0.03 (0.53) 0.60±0.01 (0.53) 0.35± ± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) 0.35± ± ± ±0.01 Please refer to the latest product specifications when designing your product. (0.65) 1.10± ±0.03 (0.50) 1.30± ± ACCTB2E T

39 Narrow pitch connectors P35S (0.35mm pitch) 3.6mm Socket 2.35mm RoHS compliant Header ORDERING INFORMATION For board-to-board For board-to-fpc Narrow pitch connectors (0.35mm pitch) FEATURES 1. Small size 0.35 mm pitch contributes to device miniaturization. Smaller compared to P4S (40 pins): Socket 11% smaller, Header 12% smaller Socket 3.60 Header 1: Narrow Pitch Connector P35S (0.35 mm pitch) Socket 2: Narrow Pitch Connector P35S (0.35 mm pitch) Header Number of pins (2 digits) Mated height <Socket>/<Header> 1: For mated height 1.5 mm Functions <Socket>/<Header> 2: No pickup cover, without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 4: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 4: Ni plating on base, Au plating on surface (40 pins) 8.73 (40 pins) Soldering terminals at each corner Soldering terminals at each corner 2. Strong resistance to adverse environments! Utilizes construction for high contact reliability. AXT P35S 3. Greater flexibility in connector placement. Pattern wiring to the connector bottom is made possible with a molded covering on the undersurface of the connector. Soldering terminals at each corner <Socket> <Header> Insulation Insulation area area Connector bottom: Create any thru-hole and pattern wiring. 4. Connectors for inspection available APPLICATIONS Mobile devices, such as cellular phones, digital still cameras and digital video cameras. Soldering terminals at each corner 38 ACCTB87E T

40 Narrow pitch connectors P35S (0.35mm pitch) PRODUCT TYPES Mated height 1.5mm Number of pins Part number Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units. For samples, please contact our sales office. SPECIFICATIONS 1. Characteristics Item Specifications Conditions Rated current 0.25A/pin contact (Max. 4 A at total pin contacts) Rated voltage 60V AC/DC Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight 2. Material and surface treatment Part name Material Surface treatment Molded portion LCP resin (UL94V-0) Contact and Post Packing Socket Header Inner carton (1-reel) Outer carton 40 AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT ,000 pieces 6,000 pieces Dielectric strength 150V AC for 1 min. Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1mA. Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) Max. 100mΩ Max N/pin contact pin contacts (initial) Min N/pin contact pin contacts Min N/pin contact Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life Copper alloy Max. peak temperature of 260 C (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. or 350 C within 3 sec. Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 48 hours, contact resistance max. 100mΩ 50 times 50 pin contacts Socket: 0.06 g Header: 0.03 g No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Temperature 35 C±2 C, saltwater concentration 5%±1% Temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/hours Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal) However, the area adjacent to the socket terminal is exposed to Ni on base. Soldering terminals portion; Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal) Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal) 39 ACCTB87E T

41 Narrow pitch connectors P35S (0.35mm pitch) DIMENSIONS (Unit: mm) 1. Socket (Mated height: 1.5mm) CAD Data 0.70 (Suction face) Y (Note) Z (Note) 2. Header (Mated height: 1.5mm) CAD Data 0.54 (Suction face) R 0.20 The CAD data of the products with a CAD Data mark can be downloaded from: ± ± ±0.03 Soldering terminals 0.35± ± ±0.03 A B±0.1 C±0.1 A B±0.1 C±0.1 (0.66) (0.90) General tolerance: ±0.2 R (0.33) Soldering terminals R 0.25 General tolerance: ± (0.50) (0.45) Terminal coplanarity 0.08 (Contact and soldering terminals) 3.60 Dimension table (mm) Number of pins/ dimension A B C Terminal coplanarity 0.08 (Contact and soldering terminals) Dimension table (mm) Number of pins/ dimension A B C Socket and Header are mated Header Socket 1.50± ACCTB87E T

42 Narrow pitch connectors P35S (0.35mm pitch) EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header) Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II Pull out direction A±0.3 C Dimension table (mm) dia. Mated height Number of pins Type of taping A B C D Quantity per reel Common for socket and header: 1.5mm Pull out direction A±0.3 B 40 to 70 Tape I , to 100 Tape II ,000 Connector orientation with respect to direction of progress of embossed tape Direction of tape progress Type Socket C dia. Plastic reel dimensions (Conforming to EIAJ ET-7200B) 380 dia. D±1 Common for P35S Header Taping reel Label Top cover tape Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 41 ACCTB87E T

43 Narrow pitch connectors P35S (0.35mm pitch) 3.6mm Socket TABLE OF PRODUCT TYPES : Available for sale Product name P35S for inspection 2.35mm RoHS compliant Notes: 1. The pickup surface shape of the inspection sockets is different from that of the standard sockets. (For details, refer to the product specification diagram.) 2. Please inquire number of pins other than those shown above. 3. Please inquire us regarding availability. 4. Please keep the minimum order quantities no less than 50 pieces per lot. 5. Please inquire if further information is needed. PRODUCT TYPES Header For board-to-board For board-to-fpc Connectors for inspection usage (0.35mm pitch) FEATURES 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Number of pins P35S APPLICATIONS Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection Specifications Part No. Specifications Part No. Socket AXT1E 26 Header AXT2E 26 Note: When placing an order, substitute the (asterisk) in the above part number with the number of pins for the specific connector. 42 ACCTB87E T

44 Narrow pitch connectors P35S (0.35mm pitch) NOTES 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors. 2. Keep the PC board warp no more than 0.03 mm in relation to the overall length of the connector Max mm Max mm 3. If extra resistance to shock caused by dropping is required, we recommend using P4. 4. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 1.5mm) Recommended PC board pattern (TOP VIEW) 1.80±0.03 (1.20) 4.20± ±0.01 (1.20) 0.35± ± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) 0.35± ± ± ±0.01 (0.80) 2.60± ±0.03 (0.53) 2.94± ±0.01 Header (Mated height: 1.5mm) Recommended PC board pattern (TOP VIEW) 1.65± ±0.03 (0.50) Recommended metal mask pattern Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) 1.65± ±0.01 (0.50) 0.35± ± ± ± ± ± ± ±0.01 Max (0.75) : Insulation area (0.50) Regarding cautions for use, please refer to page 171. Please refer to the latest product specifications when designing your product. 1.45± ± ± ± ACCTB87E T

45 Narrow pitch connectors A4US (0.4mm pitch) 2.0mm ORDERING INFORMATION Mated height: 0.6 mm 1: Socket 2: Header Socket 1.8mm RoHS compliant Number of pins (2 digits) Mated height <Socket>/<Header> 0: 0.6 mm AXE Header Functions 4: Without positioning bosses / Fine fitting construction For board-to-fpc Narrow pitch connectors (0.4mm pitch) FEATURES 1. Slim body width of 2.0/2.2 mm contributes to space-saving. 2.0/2.2mm 1.8mm Unit: mm Mated height Width (socket) Suction face Surface treatment (Contact portion / Terminal portion) <Socket> 7: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating, Surface: Au plating 0 Soldering terminals at each corner Suction face Suction face 12.5 mm (50 pins) Socket Soldering terminals at each corner 11.8 mm (50 pins) Header 2.0 Socket Header D A4US 2. ensures high resistance to various environments in lieu of its spacesaving footprint. Ni barrier construction (Against solder rise!) Bellows contact construction (Against dropping!) Porosity treatment (Against corrosive gases!) V notch and Double contact constructions (Against foreign particles and flux!) 3. Soldering terminals at each corner enhance mounting strength. 4. For 0.6 mm mated height, thanks to our proprietary Fine fitting structure, high removability with a nice click feel is maintained while being low profile. 5. Connectors for inspection available APPLICATIONS Board-to-FPC connections in mobile equipment that requires size and thickness reduction and functionality enhancement. Package D: Embossed packaging (4 mm pitch) (Inner carton (1-reel): 10,000 pieces, Outer carton: 2-reel) 44 ACCTB85E T

46 Narrow pitch connectors A4US (0.4mm pitch) Mated height: 0.8 mm 1: Socket 2: Header PRODUCT TYPES Mated height 0.6mm 0.8mm AXE Number of pins (2 digits) Mated height <Socket> 5: 0.8 mm mated height <Header> 1: 0.8 mm mated height Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 7: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating, Surface: Au plating Package D: Embossed packaging (4 mm pitch) Number of pins Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. 2 Part number Packing Socket Header Inner carton (1-reel) Outer carton 16 AXE116047D AXE216044D 30 AXE130047D AXE230044D 40 AXE140047D AXE240044D 50 AXE150047D AXE250044D 10 AXE110527D AXE210124D 14 AXE114527D AXE214124D 18 AXE118527D AXE218124D 20 AXE120527D AXE220124D 24 AXE124527D AXE224124D 30 AXE130527D AXE230124D 34 AXE134527D AXE234124D 36 AXE136527D AXE236124D 40 AXE140527D AXE240124D 50 AXE150527D AXE250124D 60 AXE160527D AXE260124D 70 AXE170527D AXE270124D 80 AXE180527D AXE280124D D 10,000 pieces 20,000 pieces 45 ACCTB85E T

47 Narrow pitch connectors A4US (0.4mm pitch) SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight Item Specifications Conditions Rated current 0.30A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) Max. 90mΩ Max N/pin contacts pin contacts (initial) h = 0.6mm: Min N/pin contact pin contacts h = 0.8mm: Min N/pin contact pin contacts Min. 0.20N/pin contact 2. Material and surface treatment Part name Material Surface treatment Molded portion Contact and Post Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life LCP resin (UL94V-0) Copper alloy Peak temperature: 260 C or less (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 48 hours, contact resistance max. 90mΩ 30 times 50 pin contacts Socket (h = 0.6mm: 0.02g, h = 0.8mm: 0.03g) Header (h = 0.6mm: 0.01g, h = 0.8mm: 0.01g) No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) 46 ACCTB85E T

48 Narrow pitch connectors A4US (0.4mm pitch) DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: Socket (Mated height: 0.6 mm) CAD Data 0.60 (Suction face) Y (Note) Z (Note) A B± ± ± ±0.03 C±0.1 (0.68) Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically. Header (Mated height: 0.6 mm) CAD Data 0.80 (Suction face) Soldering terminals A B± ± ± ±0.03 C± Soldering terminals 0.59 Terminal coplanarity 0.08 (Contact and soldering terminals) 1.50 (0.35) 2.20 General tolerance: ± (0.40) 1.00 Terminal coplanarity 0.08 (Post and soldering terminals) 1.80 General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C ACCTB85E T

49 Narrow pitch connectors A4US (0.4mm pitch) Socket (Mated height: 0.8 mm) CAD Data 0.60 (Suction face) Z (Note) Socket and Header are mated Y (Note) A B± ± ± ±0.03 C±0.1 (0.80) Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically. Header (Mated height: 0.8 mm) CAD Data Header Socket 0.60± (Suction face) Soldering terminals Header Socket A B± ± ± ±0.03 C± ± (0.54) (0.72) 1.80 Soldering terminals Terminal coplanarity 0.08 (Contact and soldering terminals) General tolerance: ±0.2 Terminal coplanarity 0.08 (Post and soldering terminals) General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C ACCTB85E T

50 Narrow pitch connectors A4US (0.4mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C :1999. However, not applied to the mounting-hole pitch of some connectors.) Leading direction after packaging +0.3 (A 0.1) (C) (1.75) Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers: 0.6mm Common for sockets and headers: 0.8mm (A±0.3) (B) (C) (1.75) Max. 24 Tape I , to 50 Tape I ,000 Max. 24 Tape I , to 60 Tape I ,000 70, 80 Tape II ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress Tape I (4.0) (2.0) dia. Type Tape II (4.0) (2.0) dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (D±1) 380 dia. Label Common for A4US (Mated height: 0.6/0.8 mm) Socket Header Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 49 ACCTB85E T

51 Narrow pitch connectors A4US (0.4mm pitch) 2.0mm Socket TABLE OF PRODUCT TYPES : Available for sale Product name A4US for inspection Mated height: 0.8mm 1.8mm RoHS compliant Notes: 1. Please inquire about number of pins other than those shown above. 2. Please inquire with us regarding availability. 3. Please keep the minimum order quantities no less than 50 pieces per lot. 4. Please inquire if further information is needed. PRODUCT TYPES Header For board-to-fpc Connectors for inspection usage (0.4mm pitch) FEATURES 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Number of pins A4US APPLICATIONS Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection Specifications Part No. Specifications Part No. Socket AXE1E 16D Header AXE2E 16D Note: When placing an order, substitute the (asterisk) in the above part number with the number of pins for the specific connector. 50 ACCTB85E T

52 Narrow pitch connectors A4US (0.4mm pitch) NOTES 1. Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 3. See the common NOTES FOR USE on the next page for other points to be noted. 0.6 mm Socket Recommended PC board pattern (TOP VIEW) 2.50± ±0.03 (0.73) 2.50± ±0.01 (0.35) 12 C ± ± ± ±0.03 (0.50) 0.20± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 46%) 8 C ± ± ± ±0.01 : Insulation area (0.40) 1.80± ± mm Socket Recommended PC board pattern (TOP VIEW) 2.40± ±0.03 (0.68) 2.40± ±0.01 (0.68) 0.40± ± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) 0.40± ± ± ±0.01 (0.45) C ± ±0.03 : Insulation area (0.36) 1.58± ±0.01 C0.30 Header (Mated height: 0.6 mm) Recommended PC board pattern (TOP VIEW) 1.48± ± ±0.03 (0.39) 0.70± ± ± ± ±0.03 (0.50) Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) (0.39) 0.40± ± ± ± ± ± ±0.03 : Insulation area (0.40) 1.40± ±0.01 Header (Mated height: 0.8 mm) Recommended PC board pattern (TOP VIEW) 2.20± ± ±0.03 (0.85) 0.55±0.01 Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 73%) (0.76) 0.40± ± ± ± ± ± ± ±0.01 (0.65) (0.52) Regarding cautions for use, please refer to page ± ± ±0.01 For other details, please verify with the product specification sheets. 2.07± ACCTB85E T

53 Narrow pitch connectors A4S (0.4mm pitch) 2.5mm Socket 2.0mm RoHS compliant Header ORDERING INFORMATION 5: Narrow Pitch Connector A4S (0.4 mm pitch) Socket 6: Narrow Pitch Connector A4S (0.4 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 0.8/1.0 mm <Header> 1: For mated height 0.8 mm 2: For mated height 1.0 mm Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 7: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 4: Ni plating on base, Au plating on surface Package Nil: Embossed packaging (8 mm pitch) D: Embossed packaging (4 mm pitch) For board-to-fpc Narrow pitch connectors (0.4mm pitch) FEATURES 1. Width 2.5 mm slim two-piece type connector Compact and slim structure contributes overall miniaturization of product design. <Compared to F4S (40 pins, when mated)> Width: 30% down Footprint: 30% down A4S 2.5 F4S 3.6 AXE 2 A4S 2. ensures high resistance to various environments in lieu of slim and low profile body Ni barrier construction (Against solder rise!) Bellows contact construction (Against dropping!) Porosity treatment (Against corrosive gases!) V notch and Double contact constructions (Against foreign particles and flux!) 3. Mated heights of 0.8 and 1.0 mm are available for the same foot pattern. 4. Connectors for inspection available APPLICATIONS Board-to-FPC connections of mobile equipment (cellular phones, smart phones, laptops, and portable music players, etc.) 52 ACCTB7E T

54 Narrow pitch connectors A4S (0.4mm pitch) PRODUCT TYPES 8 mm pitch embossed packaging Mated height 0.8mm 1.0mm Number of pins Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. 4 mm pitch embossed packaging Mated height 0.8mm Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. Part number Packing Socket Header Inner carton (1-reel) Outer carton 10 AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE AXE Number of pins 5,000 pieces 10,000 pieces Part number Packing Socket Header Inner carton (1-reel) Outer carton 10 AXE510127D AXE610124D 12 AXE512127D AXE612124D 14 AXE514127D AXE614124D 16 AXE516127D AXE616124D 20 AXE520127D AXE620124D 24 AXE524127D AXE624124D 30 AXE530127D AXE630124D 34 AXE534127D AXE634124D 40 AXE540127D AXE640124D 44 AXE544127D AXE644124D 50 AXE550127D AXE650124D 60 AXE560127D AXE660124D 64 AXE564127D AXE664124D 15,000 pieces 30,000 pieces 53 ACCTB7E T

55 Narrow pitch connectors A4S (0.4mm pitch) SPECIFICATIONS Characteristics Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight Item Specifications Conditions Rated current 0.3A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) Max. 90mΩ Max N/pin contact pin contacts (initial) Min N/pin contact pin contacts Min. 0.20N/pin contact Material and surface treatment Part name Material Surface treatment Molded portion Contact and Post Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life LCP resin (UL94V-0) Copper alloy Peak temperature: 260 C or less (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 48 hours, contact resistance max. 90mΩ 30 times 20 pin contacts Socket: 0.02 g Header: 0.01 g No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours Contact portion: Base: Ni plating Surface: Au plating Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating Surface: Au plating (except the terminal tips) 54 ACCTB7E T

56 Narrow pitch connectors A4S (0.4mm pitch) DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: Socket (Mated height: 0.8 mm/1.0 mm) CAD Data 0.70 (Suction face) Y note Z note A B± ± ± ±0.03 C±0.1 Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected. Header (Mated height: 0.8 mm) CAD Data 0.70 (Suction face) Soldering terminals A B± ± ± ±0.03 C±0.1 (0.90) (0.31) Soldering terminals 0.77 Terminal coplanarity 0.08 (Contact and soldering terminals) 2.50 General tolerance: ± Terminal coplanarity 0.08 (Post and soldering terminals) 2.00 General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C ACCTB7E T

57 Narrow pitch connectors A4S (0.4mm pitch) Header (Mated height: 1.0 mm) 0.70 (Suction face) Soldering terminals Socket and Header are mated Header Socket 0.80±0.1 Header Socket A B± ± ± ±0.03 C± Soldering terminals EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C :1999. However, not applied to the mounting-hole pitch of some connectors.) 8 mm pitch embossed packaging Leading direction after packaging Tape I +0.3 (A 0.1) (C) (1.75) (8.0) (2.0) (4.0) dia. 4 mm pitch embossed packaging Leading direction after packaging Tape III +0.3 (A 0.1) (C) (1.75) (4.0) (2.0) (4.0) 1.5 dia. 1.00±0.1 Tape II (A±0.3) (B) (C) (1.75) (8.0) (2.0) (4.0) dia (0.31) 0.85 Terminal coplanarity 0.08 (Post and soldering terminals) 2.00 General tolerance: ±0.2 Dimension table (mm) Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) 380 dia. (D±1) Label Number of pins/ dimension A B C Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole ACCTB7E T

58 Narrow pitch connectors A4S (0.4mm pitch) Dimension table (Unit: mm) 8 mm pitch embossed packaging Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers 0.8 mm/1.0 mm Max. 24 Tape I , to 70 Tape I , Tape II ,000 4 mm pitch embossed packaging Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets Max. 24 Tape III ,000 and headers 0.8 mm 30 to 64 Tape III ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress Type Socket Common for A4S Header Note: There is no indication on this product regarding top-bottom or left-right orientation. 57 ACCTB7E T

59 Narrow pitch connectors A4S (0.4mm pitch) 2.5mm TABLE OF PRODUCT TYPES : Available for sale Product name A4S for inspection Notes: 1. Please inquire about number of pins other than those shown above. 2. Please inquire with us regarding availability. 3. Please keep the minimum order quantities no less than 50 pieces per lot. 4. Please inquire if further information is needed. PRODUCT TYPES Specifications Part No. Specifications Part No. Socket Without positioning bosses AXE5E 26 Header Without positioning bosses AXE6E 26 Note: When placing an order, substitute the (asterisk) in the above part number with the number of pins for the specific connector. NOTES Socket 2.0mm RoHS compliant Header For board-to-fpc Connectors for inspection usage (0.4mm pitch) FEATURES 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Number of pins A4S APPLICATIONS Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 0.8mm/1.0mm) Recommended PC board pattern (TOP VIEW) 2.90± ± ± ±0.01 (0.92) 0.40± ± ± ±0.03 (0.50) 0.20± ±0.03 C 0.30 : Insulation area Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 70%) (0.65) 0.40± ±0.01 (0.40) 2.00± ±0.01 Header (Mated height: 0.8mm/1.0mm) Recommended PC board pattern (TOP VIEW) 1.66± ±0.03 (0.53) 1.66± ±0.01 (0.53) 0.40± ± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) 0.40± ±0.01 (0.65) 1.10± ±0.03 (0.52) 1.26± ± ± ±0.01 C ± ±0.01 Regarding cautions for use, please refer to page 171. Please refer to the latest product specifications when designing your product. 58 ACCTB7E T

60 Narrow pitch connectors F4S (0.4mm pitch) 3.6mm Socket 2.6mm RoHS compliant Header ORDERING INFORMATION 5: Narrow Pitch Connector F4S (0.4 mm pitch) Socket 6: Narrow Pitch Connector F4S (0.4 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 1.0 mm 2: For mated height 1.2 mm <Header> 1: For mated height 1.0 mm 2: For mated height 1.2 mm Functions <Socket, Header> 2: Without positioning bosses For board-to-fpc Narrow pitch connectors (0.4mm pitch) FEATURES 1. Space-saving (3.6 mm width) Socket 3.60 Soldering terminals at each corner Header (40 pins) Suction face: 0.8mm Soldering terminals at each corner 9.80 (40 pins) 2. Strong resistance to adverse environments! Utilizes construction for high contact reliability. Ni barrier construction (Against solder rise!) Surface treatment (Contact portion / Terminal portion) <Socket> 4: Base: Ni plating Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating Surface: Au plating Bellows contact construction (Against dropping!) Porosity treatment (Against corrosive gases!) V notch and Double contact constructions (Against foreign particles and flux!) AXT 2 4 F4S 3. Simple lock structure provides tactile feedback to ensure excellent mating/unmating operation feel. Simple lock structure 4. Connectors for inspection available APPLICATIONS Mobile devices, such as cellular phones, digital still cameras and digital video cameras. Board-to-board connection in measuring devices and industrial equipment, etc. Consumer equipment such as handheld terminals Note: Please note that models with a mated height of 1.0 mm (7th digit of part number is 1 ) and 1.2 mm (7th digit of part number is 2 ) are not compatible. 59 ACCTB29E T

61 Narrow pitch connectors F4S (0.4mm pitch) PRODUCT TYPES Mated height 1.0mm 1.2mm Number of pins Notes: 1. Order unit: For volume production: 1-inner-box (1-reel) units For samples, please contact our sales office. Part number Packing Socket Header Inner carton (1-reel) Outer carton 10 AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT ,000 pieces 6,000 pieces 60 ACCTB29E T

62 Narrow pitch connectors F4S (0.4mm pitch) SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight Item Specifications Conditions Rated current 0.3A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) Max. 90mΩ Max N/pin contact pin contacts (initial) Min N/pin contact pin contacts Min. 0.49N/pin contact 2. Material and surface treatment Part name Material Surface treatment Molded portion Contact and Post Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life LCP resin (UL94V-0) Copper alloy Peak temperature: 260 C or less (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 48 hours, contact resistance max. 90mΩ 50 times 20 pin contacts Socket: 0.03 g Header: 0.01 g No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours Contact portion: Base: Ni plating Surface: Au plating Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating Surface: Au plating (except the terminal tips) 61 ACCTB29E T

63 Narrow pitch connectors F4S (0.4mm pitch) DIMENSIONS (Unit: mm) Socket (Mated height: 1.0 mm and 1.2 mm) CAD Data 0.80 (Suction face) Y note Z note The CAD data of the products with a CAD Data mark can be downloaded from: A B± ± ± ±0.03 C±0.1 Note: Since the soldering terminals* has a single-piece construction, sections Y and Z are electrically connected. Header (Mated height: 1.0 mm and 1.2 mm) CAD Data 0.80 (Suction face) C0.13 Soldering terminals* A B± ± ± ±0.03 C± R C (0.80) D C (0.48) Soldering terminals D (0.46) (0.62) 2.36 (0.62) Terminal coplanarity 0.08 (Contact and soldering terminals*) 3.60 General tolerance: ± Mated height/ dimension D 1.0mm mm 1.17 Terminal coplanarity 0.08 (Post and soldering terminals*) General tolerance: ±0.2 Mated height/ dimension D 1.0mm mm 1.01 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C Socket and Header are mated Header Socket 1.00±0.15 Mated height: 1.0 mm Header Socket 1.20±0.15 Mated height: 1.2 mm 62 ACCTB29E T

64 Narrow pitch connectors F4S (0.4mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C 0806:1990. However, not applied to the mounting-hole pitch of some connectors.) Tape I Tape II Leading direction after packaging A±0.3 C Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers: 1.0mm, 1.2mm or less Tape I , to 70 Tape I , Tape II ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress dia. Type Socket Leading direction after packaging A±0.3 B C dia. Specifications for the plastic reel (In accordance with EIAJET-7200B.) 380 dia. D±1 Common for F4S Header Taping reel Label Top cover tape Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 63 ACCTB29E T

65 Narrow pitch connectors F4S (0.4mm pitch) 3.6mm Socket TABLE OF PRODUCT TYPES : Available for sale Product name F4S for inspection 2.6mm RoHS compliant Notes: 1. Please inquire about number of pins other than those shown above. 2. Please inquire with us regarding availability. 3. Please keep the minimum order quantities no less than 50 pieces per lot. 4. Please inquire if further information is needed. 5. Please note that this inspection connector cannot be connected to standard models with a stacking height of 1.2 mm (AXT5 224 and AXT6 224). Please contact our sales office for a type connectable to models with a stacking height of 1.2 mm. PRODUCT TYPES Header For board-to-fpc Connectors for inspection usage (0.4mm pitch) FEATURES 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Number of pins F4S APPLICATIONS Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection Specifications Part No. Specifications Part No. Socket AXT5E 26 Header AXT6E 26 Note: When placing an order, substitute the (asterisk) in the above part number with the number of pins for the specific connector. 64 ACCTB29E T

66 Narrow pitch connectors F4S (0.4mm pitch) NOTES Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 1.0 mm/1.2 mm) Recommended PC board pattern (TOP VIEW) 1.80±0.03 (1.20) 0.90± ± ± ±0.03 (0.92) 2.36± ±0.03 : Insulation area Recommended metal mask pattern Metal mask thickness: When 150μm (Terminal opening ratio: 48%) (Metal-part opening ratio: 100%) 4.20± ±0.01 (1.20) 0.90± ± ± ±0.01 (0.51) 2.98± ±0.01 Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal opening ratio: 60%) (Metal-part opening ratio: 100%) 4.20± ±0.01 (1.20) 0.90± ± ± ±0.01 (0.63) 2.74± ±0.01 Header (Mated height: 1.0 mm/1.2 mm) Recommended PC board pattern (TOP VIEW) 2.06± ±0.03 (0.655) Recommended metal mask pattern Metal mask thickness: When 150μm (Terminal opening ratio: 48%) (Metal-part opening ratio: 100%) 2.06± ±0.01 (0.655) 0.80± ± ± ± ± ± ± ±0.01 Max (0.75) 1.70± ±0.03 : Insulation area Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal opening ratio: 60%) (Metal-part opening ratio: 100%) 2.06± ±0.01 (0.655) 0.80± ± ± ±0.01 (0.41) 2.18± ±0.01 (0.52) 1.96± ±0.01 Regarding cautions for use, please refer to page 171. Please refer to the latest product specifications when designing your product. 65 ACCTB29E T

67 Narrow pitch connectors P4S (0.4mm pitch) 3.6mm Socket 2.35mm RoHS compliant Header ORDERING INFORMATION 3: Narrow Pitch Connector P4S (0.4 mm pitch) Socket 4: Narrow Pitch Connector P4S (0.4 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 1.5 mm and 2.0 mm 2: For mated height 2.5 mm and 3.0 mm <Header> 1: For mated height 1.5 mm and 2.5 mm 2: For mated height 2.0 mm 3: For mated height 3.0 mm Functions <Socket/Header> 2: Without positioning bosses For board-to-board For board-to-fpc Narrow pitch connectors (0.4mm pitch) FEATURES 1. Space-saving (3.6 mm width) Smaller compared to P4 with soldering terminals (30 pins): Socket 38% smaller, Header 34% smaller Socket 3.60 Header (30 pins) 7.90 (30 pins) Soldering terminals at each corner Soldering terminals at each corner 2. Strong resistance to adverse environments! Utilizes construction for high contact reliability. AXT 2 4 Surface treatment (Contact portion / Terminal portion) <Socket> 4: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 4: Ni plating on base, Au plating on surface P4S 3. Greater flexibility in connector placement. Pattern wiring to the connector bottom is made possible with a molded covering on the undersurface of the connector. Soldering terminals at each corner <Socket> <Header> Insulation Insulation area area Connector bottom: Create any thru-hole and pattern wiring. Soldering terminals at each corner 4. Connectors for inspection available 5. Shield socket is also available. APPLICATIONS Mobile devices, such as tablet PC, note PC, digital still cameras (DSC) and digital video cameras (DVC). Board-to-board connection in measuring devices and industrial equipment, etc. Consumer equipment such as handheld terminals 66 ACCTB14E T

68 Narrow pitch connectors P4S (0.4mm pitch) PRODUCT TYPES Mated height 1.5mm 2.0mm 2.5mm 3.0mm Number of pins Part number Packing Socket Header Inner carton Outer carton 10 AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT AXT Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units. For samples, please contact our sales office. 2. The shield compatible products are also available for 14, 38, 50 and 74 pins with mated height of 1.5 mm. 3,000 pieces 6,000 pieces 67 ACCTB14E T

69 Narrow pitch connectors P4S (0.4mm pitch) SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight Item Specifications Conditions Rated current 0.3A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Dielectric strength Insulation resistance Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) 150V AC for 1 min. Min. 1,000MΩ (initial) Max. 90mΩ Max N/pin contact pin contacts (initial) Min N/pin contact pin contacts Min N/pin contact 2. Material and surface treatment Part name Material Surface treatment Molded portion LCP resin (UL94V-0) Contact and Post Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1mA. Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life Copper alloy Max. peak temperature of 260 C (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. or 350 C within 3 sec. Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 48 hours, contact resistance max. 90mΩ 50 times Mated height 1.5mm, 20 pin contacts Socket: 0.04 g Header: 0.02 g No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Temperature 35 C±2 C, saltwater concentration 5%±1% Temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/hours Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal) However, the area adjacent to the socket terminal is exposed to Ni on base. Soldering terminals portion; Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal) Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal) 68 ACCTB14E T

70 Narrow pitch connectors P4S (0.4mm pitch) DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: 1. Socket (Mated height: 1.5mm, 2.0mm, 2.5mm, 3.0mm) CAD Data Dimension table (mm) Suction face 0.70 Y (Note) Z (Note) 0.40± ± ±0.03 A B±0.1 C±0.1 (0.66) 2. Header (Mated height: 1.5mm, 2.5mm) CAD Data General tolerance: ±0.2 Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically. Suction face 0.54 R 0.20 Soldering terminals 0.40± ± ±0.03 A B±0.1 C±0.1 (0.33) R (0.90) E Soldering terminals 3.60 R 0.25 (0.50) Terminal coplanarity 0.08 (Contact and soldering terminals) (0.45) Terminal coplanarity 0.08 (Post and soldering terminals) 2.35 General tolerance: ±0.2 Number of pins/ dimension A B C Mated height/ dimension E 1.5mm mm mm mm 2.45 Dimension table (mm) Number of pins/ dimension A B C Note: The soldering terminal dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different. 69 ACCTB14E T

71 Narrow pitch connectors P4S (0.4mm pitch) DIMENSIONS (Unit: mm) 3. Header (Mated height: 2.0mm) CAD Data Suction face 0.54 R 0.20 A B± ± ±0.03 Soldering terminals 0.15±0.03 C± Header (Mated height: 3.0mm) CAD Data The CAD data of the products with a CAD Data mark can be downloaded from: R (0.33) R 0.25 General tolerance: ±0.2 Note: The soldering terminals dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different. Suction face 0.54 R ± ±0.03 A B±0.1 R R Terminal coplanarity 0.08 (Post and soldering terminals) (0.45) Terminal coplanarity 0.08 (Post and soldering terminals) 2.35 Dimension table (mm) Number of pins/ dimension A B C Soldering terminals 0.15±0.03 C±0.1 (0.76) General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Note: The soldering terminals dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different. 70 ACCTB14E T

72 Narrow pitch connectors P4S (0.4mm pitch) Socket and Header are mated Header Socket EMBOSSED TAPE DIMENSIONS (unit: mm) Dimension table (mm) Mated height 1.50±0.15 Common for socket and header: 1.5mm, 2.0mm, 2.5mm and 3.0mm Number of pins Socket/Header Header Socket Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II Pull out direction Connector orientation with respect to direction of progress of embossed tape Direction of tape progress A±0.3 C 8.0 (2.0) (4.0) dia. Type Socket Pull out direction A±0.3 B C 2.00± (2.0) (4.0) dia. Header Socket Type of taping A B C D Quantity per reel Max. 24 Tape I , to 70 Tape I , to 100 Tape II , ±0.15 Header Socket Plastic reel dimensions (Conforming to EIAJ ET-7200B) 380 dia. D±1 Common for P4S Header Taping reel Label Top cover tape 3.00±0.15 Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 71 ACCTB14E T

73 Narrow pitch connectors P4S (0.4mm pitch) 3.6mm TABLE OF PRODUCT TYPES : Available for sale Product name P4S for inspection Socket 2.35mm RoHS compliant Notes: 1. You can use with each mated height in common. 2. The pickup surface shape of the inspection sockets is different from that of the standard sockets. (For details, refer to the product specification diagram.) 3. Please inquire about number of pins other than those shown above. 4. Please inquire with us regarding availability. 5. Please keep the minimum order quantities no less than 50 pieces per lot. 6. Please inquire if further information is needed. PRODUCT TYPES Header For board-to-board For board-to-fpc Connectors for inspection usage (0.4mm pitch) FEATURES 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Number of pins P4S APPLICATIONS Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection Specifications Part No. Specifications Part No. Socket AXT3E 26 Header AXT4E 26 Notes: 1. When placing an order, substitute the (asterisk) in the above part number with the number of pins for the specific connector. 2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. 72 ACCTB14E T

74 Narrow pitch connectors P4S (0.4mm pitch) NOTES 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors. 2. Keep the PC board warp no more than 0.03mm in relation to the overall length of the connector. Max mm Max mm 3. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 1.5mm, 2.0mm, 2.5mm and 3.0mm) Recommended PC board pattern (TOP VIEW) 1.80±0.03 (1.20) 0.95± ± ± ±0.03 (0.80) 2.60± ±0.03 Recommended metal mask pattern Metal mask thickness: When 150 μm (Terminal portion opening area ratio: 48%) (Metal portion opening area ratio: 100%) 4.20± ±0.01 (1.20) 0.95± ± ± ±0.01 (0.44) 3.12± ±0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) 4.20± ±0.01 (1.20) 0.95± ± ± ±0.01 (0.55) 2.90± ± ACCTB14E T

75 Narrow pitch connectors P4S (0.4mm pitch) Header (Mated height: 1.5mm and 2.5mm) Recommended PC board pattern (TOP VIEW) 1.65±0.03 (0.50) 0.65± ± ± ± ±0.03 Max (0.75) 1.45± ±0.03 : Insulation area Recommended metal mask pattern Metal mask thickness: When 150 μm (Terminal portion opening area ratio: 49%) (Metal portion opening area ratio: 100%) 1.65± ±0.01 (0.50) 0.80± ± ± ±0.01 (0.42) 1.91± ±0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) 1.65± ±0.01 (0.50) 0.80± ± ± ±0.01 (0.52) 1.71± ±0.01 Header (Mated height: 2.0mm, 3.0mm) Recommended PC board pattern (TOP VIEW) 0.65±0.03 (1.15) 0.80±0.03 Max Recommended metal mask pattern Metal mask thickness: When 150 μm (Terminal portion opening area ratio: 49%) (Metal portion opening area ratio: 100%) 0.65± ±0.01 (1.15) 0.45± ± ± ± ±0.01 (0.75) 1.45± ±0.03 : Insulation area Recommended metal mask pattern Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) 2.95± ±0.01 (1.15) 0.20± ± ± ± ± ±0.01 (0.42) 1.91± ±0.01 (0.52) 1.71± ±0.01 Regarding cautions for use, please refer to page 171. Note: The recommended PC board pattern diagrams and metal mask pattern diagrams for headers with mated heights of 1.5 mm/ 2.5 mm and 2.0 mm/3.0 mm are different. Please refer to the latest product specifications when designing your product. 74 ACCTB14E T

76 Narrow pitch connectors P4S Shield type (0.4mm pitch) New 3.80mm Socket 2.35mm RoHS compliant Header ORDERING INFORMATION 3: Socket (with shield) 4: Header (Common for standard / with shield) Number of pins (2 digits) Mated height <Socket> 1: For mated height 1.5 mm <Header> 1: For mated height 1.5 mm Functions <Socket> F: With shield plate, without positioning bosses <Header> 2: Without positioning bosses For board-to-board For board-to-fpc Narrow pitch connectors (0.4mm pitch) FEATURES 1. Radiation noise is reduced thanks to better grounding with multi-point ground construction and covering using a shield plate. Keeping the ground terminal pitch distanced properly reduces radiation noise. <Ground terminal cross-section diagram> Multi-point ground terminals (every 2.4 mm pitch) Shield plate Ground terminals With the shield plate contact, ground is conducted on both the socket and header. AXT 1 4 Surface treatment (Contact portion / Terminal portion) <Socket> 4: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 4: Ni plating on base, Au plating on surface P4S Shield type 2. ensures high resistance to various environments. 3. Previous standard product (P4S) can also be used on the header side. 4. Freedom of design is increased, because it has the same foot pattern as the previous standard product (P4S). APPLICATIONS High-speed data transfer in tablet PC and note PCs, and connectivity applications in which certain parts require shielding. 75 ACCTB68E T

77 Narrow pitch connectors P4S Shield type (0.4mm pitch) PRODUCT TYPES Mated height 1.5mm Number of pins Part number Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units. For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Item Specifications Conditions Rated current Max. 0.3 A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight 2. Material and surface treatment Part name Material Surface treatment Molded portion Contact and Post, Shield plate, Soldering terminal Packing Socket Header Inner carton Outer carton 14 (Signal: 10/GND: 4) AXT3141F4 AXT (Signal: 30/GND: 8) AXT3381F4 AXT (Signal: 40/GND: 10) AXT3501F4 AXT (Signal: 60/GND: 14) AXT3741F4 AXT ,000 pieces 6,000 pieces Dielectric strength 150V AC for 1 minute Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1mA. Insulation resistance Min. 1,000MΩ (Initial stage) Using 250V DC megger (applied for 1 minute) Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) Max. 90mΩ Max N/pin contact pin contacts (Initial stage) Min N/pin contact pin contacts Min N/pin contact According to the contact resistance measurement method of JIS C Measuring the maximum force. As the contact is axially pull out. Shield plate holding force Min N Measure maximum force when the terminal of an end is pulled out in axial direction. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (Header and socket mated) Humidity resistance (Header and socket mated) Salt water spray resistance (Header and socket mated) H2S resistance (Header and socket mated) Insertion and removal life Heat resistant plastic (UL 94V-0) Copper alloy Max. peak temperature of 260 C (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. or 350 C within 3 sec. Soldering iron 55 C to +85 C (Products only) 40 C to +50 C (Packaging structure) After 5 cycles Insulation resistance: Min. 100MΩ, Contact resistance: Max. 90mΩ After 120 hours Insulation resistance: Min. 100MΩ, Contact resistance: Max. 90mΩ After 24 hours Insulation resistance: Min. 100MΩ, Contact resistance: Max. 90mΩ After 48 hours Contact resistance: Max. 90mΩ 50 times 38 pin contacts: Socket 0.07g, Header 0.03g 50 pin contacts: Socket 0.09g, Header 0.04g 74 pin contacts: Socket 0.12g, Header 0.05g No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, Humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, Salt water concentration 5%±1% Conformed to JEIDA Bath temperature 40 C±2 C, Gas concentration 3 ppm ±1 ppm, Humidity 75% to 80% R.H. Repeated insertion and removal cycles of max. 200 times/hour Contact / Post; Contact portion: Au plating over nickel Terminal portion: Au plating over nickel (except for top of the terminal) Shield plate; Contact portion: Au plating over nickel Terminal portion: Au plating over nickel Soldering terminal portion (socket): Pd + Au flash plating over nickel (except for top of the terminal) Soldering terminal portion (header): Au plating over nickel (except for top of the terminal) 76 ACCTB68E T

78 Narrow pitch connectors P4S Shield type (0.4mm pitch) DIMENSIONS (Unit: mm) 1. Socket (Mated height: 1.5mm) CAD Data 0.70 (Suction face) every pitch 2.40 (Connect to GND pad) Y Note 1 Z Note 1 2. Header (Mated height: 1.5mm) CAD Data A B± ± ± ±0.03 The CAD data of the products with a CAD Data mark can be downloaded from: C±0.1 (0.66) 3.54 C0.2 Note 2 GND terminal 0.65 (1.00) Terminal coplanarity 0.08 (Contact, shield plate and soldering terminals) General tolerance: ±0.2 Notes: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically. 2. Because the Ground terminals are the unified structure, they are connected electrically (Suction face) R 0.20 Soldering terminals A B± ± ± ±0.03 every pitch 2.40 (Connect to GND pad) C±0.1 R (0.33) Soldering terminals 1.24 R 0.25 (0.45) General tolerance: ±0.2 Terminal coplanarity 0.08 (Post and soldering terminals) Dimension table (mm) Number of pins/dimension A B C 14 (Signal: 10/GND: 4) (Signal: 30/GND: 8) (Signal: 40/GND: 10) (Signal: 60/GND: 14) Dimension table (mm) Number of pins/dimension A B C 14 (Signal: 10/GND: 4) (Signal: 30/GND: 8) (Signal: 40/GND: 10) (Signal: 60/GND: 14) Socket and Header are mated Header 1.50±0.15 Socket 77 ACCTB68E T

79 Narrow pitch connectors P4S Shield type (0.4mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C :1999. However, not applied to the mounting-hole pitch of some connectors.) Leading direction after packaging Dimension table (mm) Mated height Number of pins Type of taping A B C D Quantity per reel Common for socket and header: 1.5mm Tape II (A±0.3) (B) 14 Tape I and 50 Tape I Tape II Connector orientation with respect to direction of progress of embossed tape Direction of tape progress Tape I +0.3 (A 0.1) (C) (1.75) 8.0 (2.0) (4.0) Type 0 dia. (C) (1.75) 8.0 (2.0) (4.0) dia. Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (D±1) 380 dia. Common for P4S Shield type Socket Header Label Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole 3,000 Note: There is no indication on this product regarding top-bottom or left-right orientation. 78 ACCTB68E T

80 Narrow pitch connectors P4S Shield type (0.4mm pitch) NOTES 1. Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 1.5 mm) Recommended PC board pattern (TOP VIEW) 1.80±0.03 (1.20) 4.20± ± ± ± ± ± ± ±0.03 (0.80) Recommended metal mask pattern Metal mask thickness: When 150μm (Terminal opening ratio: 48%) (Metal-part opening ratio: 100%) (1.20) Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal opening ratio: 60%) (Metal-part opening ratio: 100%) (1.20) 0.95± ± ± ± ± ± ± ±0.01 (0.44) (0.55) 2.60± ±0.03 : Connect to GND : Connect to GND (every 2.4 mm pitch) 3.12± ± ± ±0.01 Header (Mated height: 1.5 mm) Recommended PC board pattern (TOP VIEW) 1.65± ±0.03 (0.50) 1.65± ± ± ± ± ± ±0.03 Max Recommended metal mask pattern Metal mask thickness: When 150μm (Terminal opening ratio: 49%) (Metal-part opening ratio: 100%) 0.65±0.01 Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal opening ratio: 60%) (Metal-part opening ratio: 100%) (0.50) (0.50) 0.80± ±0.01 : Insulation area 0.20± ± ± ± ± ±0.01 (0.42) (0.52) 1.91± ±0.01 (0.75) 1.45± ±0.03 : Connect to GND : Connect to GND (every 2.4 mm pitch) 2.75± ±0.01 Regarding cautions for use, please refer to page 171. Please refer to the latest product specifications when designing your product. 79 ACCTB68E T

81 Narrow pitch connectors P4 (0.4mm pitch) Without soldering terminals 5.1mm 3.96mm 5.1mm 3.96mm Socket Header With soldering terminals Socket Header RoHS compliant For board-to-board For board-to-fpc Narrow pitch connectors (0.4mm pitch) FEATURES mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm. 2. Strong resistance to adverse environments! Utilizes construction for high contact reliability. 3. Constructed with impact dispersion keys inside the body to disperse shocks when dropped. Socket A high level of shock resistance is ensured by dispersing impact over the four locations where the socket indentations and header protrusions are mated together. Note: The following number of pins are not supported due to suction surface factors. Without soldering terminals: 18 pins or less With soldering terminals: 22 pins or less 4. Construction makes designing devices easier. The lower connector bottom surface construction prevents contact and shorts between the PCB and metal terminals. This enables freedom in pattern wiring, helping to make PCB s smaller. <Socket> Impact dispersion key <Header> Header Insulation area Insulation area Connector bottom: Create any thru-hole and pattern wiring. P4 5. Contributes to improved mating 1) Guides are provided to take up any position shift and facilitate insertion. Insertion guide 2) Simple lock structure provides tactile feedback to ensure excellent mating/ unmating operation feel. Header side contact Simple lock mechanism Socket side contact 6. Design facilitates efficient mounting. Features a terminal flatness of 0.08 mm, construction resistant to creeping flux, and design that allows visual inspection of the soldered part. 7. Connectors for inspection available APPLICATIONS Mobile devices, such as cellular phones, digital still cameras and digital video cameras. Board-to-board connection in measuring devices and industrial equipment, etc. Consumer equipment such as handheld terminals 80 ACCTB57E T

82 Narrow pitch connectors P4 (0.4mm pitch) ORDERING INFORMATION 7: Narrow Pitch Connector P4 (0.4 mm pitch) Socket 8: Narrow Pitch Connector P4 (0.4 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 1.5 mm 2: For mated height 2.0 mm 3: For mated height 2.5 mm and 3.0 mm 4: For mated height 3.5 mm <Header> 1: For mated height 1.5 mm, 2.0 mm and 2.5 mm 2: For mated height 3.0 mm and 3.5 mm Surface treatment (Contact portion / Terminal portion) <Socket> 7: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 5: Ni plating on base, Au plating on surface Other specifications <Header> W: V notch Packing G: 3,000 pieces embossed tape and plastic reel 2 AXK Functions 2: With soldering terminals, without positioning bosses 4: Without soldering terminals, without positioning bosses Notes: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel Please note that the models with a soldering terminals (8th digit of part number is 2 ) and those without a soldering terminals (8th digit of part number is 4 ) are shaped differently and are not compatible. G 81 ACCTB57E T

83 Narrow pitch connectors P4 (0.4mm pitch) PRODUCT TYPES 1. Without soldering terminals Mated height 1.5 mm 2.0 mm 2.5 mm 3.0 mm 3.5 mm Number of pins Note: Regarding ordering units; During production: Please make orders in 1-reel units. For samples, please contact our sales office. Part number Packing Socket Header Inner carton Outer carton 14 AXK714147G AXK814145WG 20 AXK720147G AXK820145WG 22 AXK722147G AXK822145WG 24 AXK724147G AXK824145WG 26 AXK726147G AXK826145WG 30 AXK730147G AXK830145WG 34 AXK734147G AXK834145WG 40 AXK740147G AXK840145WG 44 AXK744147G AXK844145WG 50 AXK750147G AXK850145WG 54 AXK754147G AXK854145WG 60 AXK760147G AXK860145WG 64 AXK764147G AXK864145WG 70 AXK770147G AXK870145WG 80 AXK780147G AXK880145WG 100 AXK700147G AXK800145WG 14 AXK714247G AXK814145WG 20 AXK720247G AXK820145WG 24 AXK724247G AXK824145WG 26 AXK726247G AXK826145WG 30 AXK730247G AXK830145WG 40 AXK740247G AXK840145WG 50 AXK750247G AXK850145WG 60 AXK760247G AXK860145WG 70 AXK770247G AXK870145WG 80 AXK780247G AXK880145WG 14 AXK714347G AXK814145WG 20 AXK720347G AXK820145WG 24 AXK724347G AXK824145WG 30 AXK730347G AXK830145WG 40 AXK740347G AXK840145WG 50 AXK750347G AXK850145WG 60 AXK760347G AXK860145WG 70 AXK770347G AXK870145WG 80 AXK780347G AXK880145WG 20 AXK720347G AXK820245WG 24 AXK724347G AXK824245WG 30 AXK730347G AXK830245WG 40 AXK740347G AXK840245WG 50 AXK750347G AXK850245WG 60 AXK760347G AXK860245WG 80 AXK780347G AXK880245WG 20 AXK720447G AXK820245WG 30 AXK730447G AXK830245WG 40 AXK740447G AXK840245WG 3,000 pieces 6,000 pieces Socket: 2,000 pieces Header: 3,000 pieces Socket: 4,000 pieces Header: 6,000 pieces 82 ACCTB57E T

84 Narrow pitch connectors P4 (0.4mm pitch) 2. With soldering terminals Mated height Number of pins Note: Regarding ordering units; During production: Please make orders in 1-reel units. For samples, please contact our sales office. SPECIFICATIONS 1. Characteristics Part number 2. Material and surface treatment Part name Material Surface treatment Molded portion LCP resin (UL94V-0) Packing Socket Header Inner carton Outer carton 10 AXK710127G AXK810125WG 1.5 mm 34 AXK734127G AXK834125WG 40 AXK740127G AXK840125WG 2.0 mm 34 AXK734227G AXK834125WG 2.5 mm 3.0 mm 3.5 mm Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight 12 AXK712327G AXK812125WG 20 AXK720327G AXK820125WG 32 AXK732327G AXK832125WG 40 AXK740327G AXK840125WG 20 AXK720327G AXK820225WG 36 AXK736327G AXK836225WG 60 AXK760327G AXK860225WG 70 AXK770327G AXK870225WG 80 AXK780327G AXK880225WG 60 AXK760427G AXK860225WG 70 AXK770427G AXK870225WG 80 AXK780427G AXK880225WG 3,000 pieces 6,000 pieces Socket: 2,000 pieces Header: 3,000 pieces Socket: 4,000 pieces Header: 6,000 pieces Item Specifications Conditions Rated current 0.3A/pin contact (Max. 5 A at total pin contacts) Rated voltage 60V AC/DC Dielectric strength 150V AC for 1 min. Detection current: 1mA Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Composite insertion force Composite removal force Max. 70mΩ Max N/pin contact pin contacts (initial) Min N/pin contact pin contacts (Mated height 1.5 mm without soldering terminals type) Min N/pin contact pin contacts All the other types except the above Based on the contact resistance measurement method specified by JIS C Post holding force Min N/pin contact Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life Max. peak temperature of 260 C (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 70mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 70mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 70mΩ 48 hours, contact resistance max. 70mΩ 50 times Mated height 1.5mm, 20 pin contacts; Socket: 0.04g Header: 0.02g No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/hours Contact/Post Copper alloy Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) However, upper terminal of Ni barrier production: Exposed over Ni The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base. Soldering terminals portion Copper alloy Ni plating on base, Sn plating on surface (Except for front terminal) 83 ACCTB57E T

85 Narrow pitch connectors P4 (0.4mm pitch) DIMENSIONS (Unit: mm) 1. Without Soldering Terminals Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data 0.40± ± ±0.03 A B± C Max. 18 pin contacts D The CAD data of the products with a CAD Data mark can be downloaded from: (Suction face) 4.10 E Terminal coplanarity (0.675) 5.10 (0.675) General tolerance: ±0.2 Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data ± ± ±0.03 A B±0.1 C Max. 18 pin contacts D 0.76 F (Suction face) E ±0.03 Terminal coplanarity 0.08 (0.42) 3.12 (0.42) 3.96 General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C D Mated height/dimension E 1.5mm mm mm, 3.0mm mm 2.92 Dimension table (mm) Number of pins/ dimension A B C D Mated height/dimension E F 1.5mm, 2.0mm, 2.5mm mm, 3.5mm Socket and Header are mated 1.50± ± ± ± ± ACCTB57E T

86 Narrow pitch connectors P4 (0.4mm pitch) 2. With Soldering Terminals Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data ± ± and 12 pin contacts E A B±0.1 C D 1.11 (Suction face) 20 pin contacts E 0.80 F Soldering terminals 0.10± (0.675) Terminal coplanarity (0.675) General tolerance: ±0.2 Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data Soldering terminals 10 and 12 pin contacts E A B±0.1 C D 0.40± ± ± pin contacts E G (Suction face) F ± Terminal coplanarity 0.08 (0.42) (0.42) General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C D E Mated height/dimension F 1.5mm mm mm, 3.0mm mm 2.92 Dimension table (mm) Number of pins/ dimension A B C D E Mated height/dimension F G 1.5mm, 2.0mm, 2.5mm mm, 3.5mm Socket and Header are mated. 1.50± ± ± ± ± ACCTB57E T

87 Narrow pitch connectors P4 (0.4mm pitch) EMBOSSED TAPE DIMENSIONS (unit: mm) Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II Pull out direction Dimension table (mm) 1. Without Soldering Terminals Mated height 2. With Soldering Terminals 3. Connector orientation with respect to direction of progress of embossed tape 1) Without soldering terminals 2) With soldering terminals Number of pins Socket Header Type of taping A B C D Quantity per reel Common for socket and header: Max. 18 Max. 18 Tape I , mm, 2.0 mm, 2.5 mm and 3.0 mm 20 to to 70 Tape I ,000 Header: 3.5 mm 80 to to 100 Tape II ,000 Socket: 3.5 mm 20 to 40 Tape I ,000 Mated height Common for socket and header: 1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm Header: 3.5 mm Socket: 3.5 mm Direction of tape progress Direction of tape progress A±0.3 C dia. Type Type Socket Socket Pull out direction A±0.3 B Number of pins Socket Header C dia. Plastic reel dimensions (Conforming to EIAJ ET-7200B) 380 dia. D±1 Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole Type of taping A B C D Quantity per reel Max. 18 Max. 18 Tape I , to to 70 Tape I , to Tape II , Tape I , to 80 Tape II ,000 Common for P4 Header Label Note: There is no indication on this product regarding top-bottom or left-right orientation. Common for P4 Header Note: There is no indication on this product regarding top-bottom or left-right orientation. 86 ACCTB57E T

88 Narrow pitch connectors P4 (0.4mm pitch) 5.1mm Socket TABLE OF PRODUCT TYPES : Available for sale Product name P4 for inspection without soldering terminals P4 for inspection with soldering terminals 3.96mm RoHS compliant Notes: 1. You can use with each mated height in common. 2. Please inquire about number of pins other than those shown above. 3. Please inquire with us regarding availability. 4. Please keep the minimum order quantities no less than 50 pieces per lot. 5. Please inquire if further information is needed. PRODUCT TYPES Header For board-to-board For board-to-fpc Connectors for inspection usage (0.4mm pitch) FEATURES 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. P4 APPLICATIONS Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection. Number of pins Specifications Part No. Specifications Part No. With soldering terminals AXK7E 26G With soldering terminals AXK8E 26WG Socket Header Without soldering terminals AXK7E 46G Without soldering terminals AXK8E 46WG Note: When placing an order, substitute the (asterisk) in the above part number with the number of pins for the specific connector. 87 ACCTB57E T

89 Narrow pitch connectors P4 (0.4mm pitch) NOTES 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors. 2. Keep the PC board warp no more than 0.03 mm in relation to the overall length of the connector. Max mm Max mm 3. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 1) Without soldering terminals Socket Recommended PC board pattern (TOP VIEW) 0.40± ± ± ± ± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 40%) 5.50± ±0.01 (0.51) (0.51) 0.40± ± ± ±0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 50%) 5.50± ±0.01 (0.63) (0.63) 0.40± ± ± ±0.01 Header Recommended PC board pattern (TOP VIEW) 0.40± ± ± ± ± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 32%) 4.10± ±0.01 (0.30) (0.30) 4.10± ± ± ± ± ±0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 40%) (0.37) (0.37) 0.40± ± ± ± ACCTB57E T

90 Narrow pitch connectors P4 (0.4mm pitch) 2) With soldering terminals Socket Recommended PC board pattern (TOP VIEW) 5.70± ±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Terminal portion opening area ratio: 40%) (Metal portion opening area ratio: 65%) 5.50± ± ±0.01 (1.10) (1.10) Recommended metal mask pattern Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 50%) (Metal portion opening area ratio: 80%) 5.50± ± ±0.01 (0.51) (0.51) (0.63) (0.63) 0.40± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.01 Header Recommended PC board pattern (TOP VIEW) 4.56± ±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Terminal portion opening area ratio: 32%) (Metal portion opening area ratio: 65%) 4.10± ± ±0.01 (0.80) (0.80) 0.40± ± ± ± ± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 40%) (Metal portion opening area ratio: 80%) 4.10± ± ±0.01 (0.30) (0.30) (0.37) (0.37) 0.40± ± ± ± ± ± ± ± ± ± ± ± ± ±0.01 Regarding cautions for use, please refer to page 171. Please refer to the latest product specifications when designing your product. 89 ACCTB57E T

91 Narrow pitch connectors P5KF (0.5mm pitch) 5.8mm Socket 3.3mm RoHS compliant Header FEATURES 1. Two-piece structure and 0.5mm pitch. The product lineup includes mated heights of 1.5mm, 2.0mm and 2.5mm. ORDERING INFORMATION 5F: Narrow Pitch Connector P5KF (0.5 mm pitch) Socket 6F: Narrow Pitch Connector P5KF (0.5 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 3: For mated height 1.5 mm 5: For mated height 2.0 mm and 2.5 mm <Header> 3: For mated height 1.5 mm and 2.0 mm 5: For mated height 2.5 mm Functions 4: Without positioning bosses For board-to-board For board-to-fpc Narrow pitch connectors (0.5mm pitch) 2. Strong resistance to adverse environments! Utilizes construction for high contact reliability. 3. Simple lock structure provides tactile feedback to ensure excellent mating/unmating operation feel. Simple lock mechanism 4. Effective mating length 0.55mm In addition to achieving a low profile of from 1.5mm between PCBs, the effective mating length has been extended to ensure that there is latitude for insertion. 0.55mm Surface treatment (Contact portion / Terminal portion) <Socket> 7: Ni plating on base, Au plating on surface/ni plating on base, Au plating on surface (for Ni barrier available) Contact portion <Socket> Y: V notch type product <Header> Y: V notch type product Packing G: 2,000 pieces embossed tape and plastic reel 2 AXK P5KF 5. The lower connector bottom surface construction prevents contact and shorts between the PCB and metal terminals. Benefits include freedom in pattern wiring, helping to make PCB s smaller. <Socket> <Header> Insulation area Insulation area Connector bottom: Create any thru-hole and pattern wiring. APPLICATIONS Digital devices, such as digital still cameras and digital video cameras. Various wireless module units. 4 7 Y G 90 ACCTB23E T

92 Narrow pitch connectors P5KF (0.5mm pitch) PRODUCT TYPES Mated height 1.5 mm 2.0 mm 2.5 mm No. of pins Part No. Notes: 1. Regarding ordering units, During production: Please make orders in 1-reel units. For samples, please contact our sales office. 2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production. Packing Socket Header Inner carton (1-reel) Outer carton 10 AXK5F10347YG AXK6F10347YG 12 AXK5F12347YG AXK6F12347YG 14 AXK5F14347YG AXK6F14347YG 16 AXK5F16347YG AXK6F16347YG 18 AXK5F18347YG AXK6F18347YG 20 AXK5F20347YG AXK6F20347YG 22 AXK5F22347YG AXK6F22347YG 24 AXK5F24347YG AXK6F24347YG 26 AXK5F26347YG AXK6F26347YG 30 AXK5F30347YG AXK6F30347YG 32 AXK5F32347YG AXK6F32347YG 34 AXK5F34347YG AXK6F34347YG 40 AXK5F40347YG AXK6F40347YG 50 AXK5F50347YG AXK6F50347YG 60 AXK5F60347YG AXK6F60347YG 70 AXK5F70347YG AXK6F70347YG 80 AXK5F80347YG AXK6F80347YG 10 AXK5F10547YG AXK6F10347YG 12 AXK5F12547YG AXK6F12347YG 14 AXK5F14547YG AXK6F14347YG 16 AXK5F16547YG AXK6F16347YG 18 AXK5F18547YG AXK6F18347YG 20 AXK5F20547YG AXK6F20347YG 22 AXK5F22547YG AXK6F22347YG 24 AXK5F24547YG AXK6F24347YG 26 AXK5F26547YG AXK6F26347YG 30 AXK5F30547YG AXK6F30347YG 34 AXK5F34547YG AXK6F34347YG 40 AXK5F40547YG AXK6F40347YG 50 AXK5F50547YG AXK6F50347YG 60 AXK5F60547YG AXK6F60347YG 70 AXK5F70547YG AXK6F70347YG 80 AXK5F80547YG AXK6F80347YG 100 AXK5F00547YG AXK6F00347YG 10 AXK5F10547YG AXK6F10547YG 12 AXK5F12547YG AXK6F12547YG 14 AXK5F14547YG AXK6F14547YG 16 AXK5F16547YG AXK6F16547YG 20 AXK5F20547YG AXK6F20547YG 22 AXK5F22547YG AXK6F22547YG 24 AXK5F24547YG AXK6F24547YG 30 AXK5F30547YG AXK6F30547YG 34 AXK5F34547YG AXK6F34547YG 40 AXK5F40547YG AXK6F40547YG 50 AXK5F50547YG AXK6F50547YG 60 AXK5F60547YG AXK6F60547YG 70 AXK5F70547YG AXK6F70547YG 80 AXK5F80547YG AXK6F80547YG 100 AXK5F00547YG AXK6F00547YG 2,000 pieces 4,000 pieces 91 ACCTB23E T

93 Narrow pitch connectors P5KF (0.5mm pitch) SPECIFICATIONS 1. Characteristics Electrical characteristics Item Specifications Conditions Rated current 0.5A/pin contact (Max. 10 A at total pin contacts) Rated voltage 60V AC/DC Dielectric strength 150V AC for 1 minute Detection current: 1mA Insulation resistance Min. 1,000MΩ (initial) Using 500V DC megger Contact resistance Composite insertion force Mechanical Composite removal force characteristics Contact holding force Environmental characteristics Max. 90mΩ Max N/pin contacts pin contacts (initial) Min N/pin contacts pin contacts Min N/pin contact Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact & post is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Lifetime characteristics Unit weight Max. peak temperature of 260 C (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 seconds, 350 C within 3 seconds Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 48 hours, contact resistance max. 90mΩ No icing or condensation. Conformed to MIL-STD-202F, method 107G Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwarter concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/hours Mated height 1.5mm, 20 pin contacts; Socket: 0.06g Header: 0.04g 2. Material and surface treatment Part name Material Surface treatment Molded portion LCP resin (UL94V-0) Contact/Post Copper alloy Order Temperature ( C) Time (minutes) Max Max Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) The section close to the soldering portion has a nickel barrier. (The nickel base is exposed.) 92 ACCTB23E T

94 Narrow pitch connectors P5KF (0.5mm pitch) DIMENSIONS (Unit: mm) Socket (Mated height: 1.5mm, 2.0mm, 2.5mm) CAD Data Dimension table (mm) No. of pins A B The CAD data of the products with a CAD Data mark can be downloaded from: ±0.05 Header (Mated height: 1.5mm, 2.0mm, 2.5mm) CAD Data Dimension table (mm) No. of pins A B ±0.05 A B± ±0.05 A 0.20±0.03 B± ± ± (Suction face) (Suction face) 2.50 C 0.12± ±0.03 C (0.75) 1.80 (0.75) (0.80) (0.80) General tolerance: ± General tolerance: ±0.2 Mated height C 1.5 mm mm, 2.5 mm 1.85 Mated height C 1.5 mm, 2.0 mm mm 1.75 Socket and header are mated Mated height: 1.5 mm Mated height: 2.0 mm Mated height: 2.5 mm 1.50± ± ± ACCTB23E T

95 Narrow pitch connectors P5KF (0.5mm pitch) EMBOSSED TAPE DIMENSIONS (unit: mm) Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II Pull out direction A±0.3 C dia. Dimension table (mm) Suffix: G (1 reel, 2,000 pieces embossed tape: Plastic reel package) Mated height No. of pins Type of taping A B C D Quantity per reel Socket and header are common: 1.5mm, 2.0mm, 2.5mm 10 to 58 Tape I ,000 pcs. 60 to 70 Tape II ,000 pcs. 72 to 100 Tape II ,000 pcs. Connector orientation with respect to direction of progress of embossed tape Direction of tape progress Type Socket Pull out direction A±0.3 B C dia. Plastic reel dimensions (Conforming to EIAJ ET 7200B) 380 dia. D±1 Common for P5KF Header Taping reel Label Top cover tape Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 94 ACCTB23E T

96 Narrow pitch connectors P5KF (0.5mm pitch) NOTES 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors. 2. Keep the PC board warp no more than 0.03 mm in relation to the overall length of the connector. Max. 0.03mm Max. 0.03mm 3. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket Recommended PC board pattern (TOP VIEW) B± ± ± ± ± ± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 56%) B± ± ± ±0.01 (0.85) (0.85) 5.10± ±0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 69%) B± ± ± ±0.01 (1.05) (1.05) 4.70± ±0.01 Header Recommended PC board pattern (TOP VIEW) 0.50±0.05 B± ± ± ± ± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 58%) B± ± ± ±0.01 (0.85) 2.60±0.01 (0.85) 4.30±0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 72%) B± ± ± ±0.01 (1.05) 2.20±0.01 * See the dimension table on page 93 for more information on the B dimension of the socket and header. (1.05) 4.30±0.01 Regarding cautions for use, please refer to page 171. Please refer to the latest product specifications when designing your product. 95 ACCTB23E T

97 Narrow pitch connectors P5K/P5KS (0.5mm pitch) P5K P5KS 5.8mm 5.4mm Socket Socket 4.6mm 5.0mm Header Note: The external appearance and PC board pattern differs between the P5K and P5KS. RoHS compliant ORDERING INFORMATION 1. P5K (Mated height: 3.0 mm and 3.5 mm) 5: Narrow Pitch Connector P5K Socket 6: Narrow Pitch Connector P5K Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 3.0 mm and 3.5 mm <Header> 2: For mated height 3.5 mm 3: For mated height 3.0 mm Functions 4: Without positioning bosses Header For board-to-board Narrow pitch connectors (0.5mm pitch) FEATURES 1. The product lineup consists of 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm, 7.0 mm, 8.0 mm, and 9.0 mm mated heights. P5K P5KS Type Mated height Notes 3 mm, 3.5 mm 4 mm, 4.5 mm, 5 mm, 5.5 mm, 6 mm, 6.5 mm, 7 mm, 8 mm, 9 mm The external appearance and PC board pattern differs for the P5K and P5KS. 2. Strong resistance to adverse environments! Utilizes construction for high contact reliability. 3. The effective mating length has been extended to ensure that there for insertion. Effective mating length Type P5K P5KS Surface treatment (Contact portion / Terminal portion) 7: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface (Ni barrier product) With long effective mating lengths, even if the connection is not perfect, the electrical connection is more than enough for normal operations. Effective mating length 0.65 mm 1.0 mm P5K/P5KS 4. Automatic mounting Suction area for automatic mounting machines is employed. P5K Header AXK 7 Y G P5K Socket Suction face APPLICATIONS Digital devices, such as laptop, digital still cameras and digital video cameras OA equipment, industrial equipment and measuring devices Contact portion <Socket> Y: V notch type product <Header> Y: V notch type product Packing G: 1,500 pieces embossed tape and plastic reel 2 96 ACCTB22E T

98 Narrow pitch connectors P5K/P5KS (0.5mm pitch) 2. P5KS (Mated height: 4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm, 7.0 mm, 8.0 mm and 9.0 mm) 5S: Narrow Pitch Connector P5KS Socket 6S: Narrow Pitch Connector P5KS Header Number of pins (2 digits) Mated height <Socket> 0: For mated height 4.0 mm, 5.0 mm and 6.0 mm 2: For mated height 4.5 mm, 5.5 mm and 6.5 mm 3: For mated height 7.0 mm, 8.0 mm and 9.0 mm <Header> 4: For mated height 4.0 mm, 4.5 mm and 7.0 mm 5: For mated height 5.0 mm, 5.5 mm and 8.0 mm 6: For mated height 6.0 mm, 6.5 mm and 9.0 mm Functions 3: With positioning boss and direction for protection from reverse mating 4: Without positioning boss/with direction for protection from reverse mating Surface treatment (Contact portion / Terminal portion) 7: Ni plating on base, Au plating on surface / Ni plating on base, Au plating on surface (Ni barrier product) Contact portion <Socket> Y: V notch type product <Header> Y: V notch type product Packing G: 1,500 pieces embossed tape and plastic reel 2 Socket: Mated heights 4.0 mm, 4.5 mm, 5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm Header: Mated heights 4.0 mm, 4.5 mm, 7.0 mm 1,000 pieces plastic reel 2 Socket: Mated heights 7.0 mm, 8.0 mm, 9.0 mm Header: Mated heights 5.0 mm, 5.5 mm, 6.0 mm, 6.5 mm, 8.0 mm, 9.0 mm PRODUCT TYPES 1. P5K Product name P5K Mated height 3.0 mm 3.5 mm No. of pins Notes: 1. Regarding ordering units: During production: Please make orders in 1 reel units. For samples, please contact our sales office. 2. The standard type comes without positioning bosses. AXK 7 Y G Part No. Packing Socket Header Inner carton (1 reel) Outer carton 20 AXK520147YG AXK620347YG 22 AXK522147YG AXK622347YG 30 AXK530147YG AXK630347YG 40 AXK540147YG AXK640347YG 50 AXK550147YG AXK650347YG 60 AXK560147YG AXK660347YG 70 AXK570147YG AXK670347YG 80 AXK580147YG AXK680347YG 100 AXK500147YG AXK600347YG 120 AXK5A2147YG AXK6A2347YG 20 AXK520147YG AXK620247YG 22 AXK522147YG AXK622247YG 30 AXK530147YG AXK630247YG 34 AXK534147YG AXK634247YG 40 AXK540147YG AXK640247YG 50 AXK550147YG AXK650247YG 60 AXK560147YG AXK660247YG 70 AXK570147YG AXK670247YG 80 AXK580147YG AXK680247YG 100 AXK500147YG AXK600247YG 120 AXK5A2147YG AXK6A2247YG 1,500 pieces 3,000 pieces 97 ACCTB22E T

99 Narrow pitch connectors P5K/P5KS (0.5mm pitch) 2. P5KS Product name P5KS P5KS P5KS Mated height 4.0 mm 4.5 mm 5.0 mm 5.5 mm 6.0 mm 6.5 mm 7.0 mm No. of pins Part No. Packing Socket Header Inner carton (1 reel) Outer carton 20 AXK5S20047YG AXK6S20447YG 24 AXK5S24047YG AXK6S24447YG 30 AXK5S30047YG AXK6S30447YG 34 AXK5S34047YG AXK6S34447YG 40 AXK5S40047YG AXK6S40447YG 50 AXK5S50047YG AXK6S50447YG 60 AXK5S60047YG AXK6S60447YG 70 AXK5S70047YG AXK6S70447YG 80 AXK5S80047YG AXK6S80447YG 100 AXK5S00047YG AXK6S00447YG 20 AXK5S20247YG AXK6S20447YG 24 AXK5S24247YG AXK6S24447YG 30 AXK5S30247YG AXK6S30447YG 34 AXK5S34247YG AXK6S34447YG 36 AXK5S36247YG AXK6S36447YG 40 AXK5S40247YG AXK6S40447YG 50 AXK5S50247YG AXK6S50447YG 60 AXK5S60247YG AXK6S60447YG 70 AXK5S70247YG AXK6S70447YG 80 AXK5S80247YG AXK6S80447YG 100 AXK5S00247YG AXK6S00447YG 20 AXK5S20047YG AXK6S20547YG 24 AXK5S24047YG AXK6S24547YG 30 AXK5S30047YG AXK6S30547YG 34 AXK5S34047YG AXK6S34547YG 40 AXK5S40047YG AXK6S40547YG 50 AXK5S50047YG AXK6S50547YG 60 AXK5S60047YG AXK6S60547YG 70 AXK5S70047YG AXK6S70547YG 80 AXK5S80047YG AXK6S80547YG 100 AXK5S00047YG AXK6S00547YG 20 AXK5S20247YG AXK6S20547YG 24 AXK5S24247YG AXK6S24547YG 30 AXK5S30247YG AXK6S30547YG 34 AXK5S34247YG AXK6S34547YG 40 AXK5S40247YG AXK6S40547YG 50 AXK5S50247YG AXK6S50547YG 60 AXK5S60247YG AXK6S60547YG 70 AXK5S70247YG AXK6S70547YG 80 AXK5S80247YG AXK6S80547YG 100 AXK5S00247YG AXK6S00547YG 20 AXK5S20047YG AXK6S20647YG 30 AXK5S30047YG AXK6S30647YG 40 AXK5S40047YG AXK6S40647YG 50 AXK5S50047YG AXK6S50647YG 60 AXK5S60047YG AXK6S60647YG 70 AXK5S70047YG AXK6S70647YG 80 AXK5S80047YG AXK6S80647YG 100 AXK5S00047YG AXK6S00647YG 20 AXK5S20247YG AXK6S20647YG 30 AXK5S30247YG AXK6S30647YG 40 AXK5S40247YG AXK6S40647YG 50 AXK5S50247YG AXK6S50647YG 60 AXK5S60247YG AXK6S60647YG 70 AXK5S70247YG AXK6S70647YG 80 AXK5S80247YG AXK6S80647YG 100 AXK5S00247YG AXK6S00647YG 20 AXK5S20347YG AXK6S20447YG 30 AXK5S30347YG AXK6S30447YG 40 AXK5S40347YG AXK6S40447YG 50 AXK5S50347YG AXK6S50447YG 60 AXK5S60347YG AXK6S60447YG 70 AXK5S70347YG AXK6S70447YG 80 AXK5S80347YG AXK6S80447YG 100 AXK5S00347YG AXK6S00447YG 1,500 pieces 3,000 pieces Socket: 1,500 pieces Header: 1,000 pieces Socket: 1,000 pieces Header: 1,500 pieces Socket: 3,000 pieces Header: 2,000 pieces Socket: 2,000 pieces Header: 3,000 pieces 98 ACCTB22E T

100 Narrow pitch connectors P5K/P5KS (0.5mm pitch) Product name P5KS Mated height 8.0 mm 9.0 mm No. of pins Notes: 1. Regarding ordering units: During production: Please make orders in 1 reel units. For samples, please contact our sales office. 2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production. SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight Item Rated current Rated voltage Part No. Packing Socket Header Inner carton (1 reel) Outer carton 20 AXK5S20347YG AXK6S20547YG 30 AXK5S30347YG AXK6S30547YG 40 AXK5S40347YG AXK6S40547YG 50 AXK5S50347YG AXK6S50547YG 60 AXK5S60347YG AXK6S60547YG 70 AXK5S70347YG AXK6S70547YG 80 AXK5S80347YG AXK6S80547YG 100 AXK5S00347YG AXK6S00547YG 20 AXK5S20347YG AXK6S20647YG 30 AXK5S30347YG AXK6S30647YG 40 AXK5S40347YG AXK6S40647YG 50 AXK5S50347YG AXK6S50647YG 60 AXK5S60347YG AXK6S60647YG 70 AXK5S70347YG AXK6S70647YG 80 AXK5S80347YG AXK6S80647YG 100 AXK5S00347YG AXK6S00647YG 3mm, 3.5mm type 0.5A/pin contact (Max. 10A at total pin contacts) Specifications 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm type 7mm, 8mm, 9mm type 0.5A/pin contact (Max. 16A at total pin contacts) 60V AC/DC 1,000 pieces 2,000 pieces Conditions Dielectric strength 150V AC for 1 min. Detection current: 1mA Insulation resistance Min. 1000MΩ Using 500V DC megger Contact resistance Max. 60mΩ Max. 80mΩ Composite insertion force Composite removal force Max N/pin contact pin contacts (initial) Min N/pin contact pin contacts Based on the contact resistance measurement method specified by JIS C Contact holding force Min. 0.98N/pin contact Measuring the maximum force. As the contact & post is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life Max. peak temperature of 260 C (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec., 350 C within 3 sec. Soldering iron 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 60mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 60mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 60mΩ 48 hours, contact resistance max. 60mΩ 50 times 55 C to +85 C (product only) 40 C to +50 C (emboss packing) P5K h = 3mm 30 pin contacts Socket: 0.17g Header: 0.09g P5KS h = 4mm 30 pin contacts Socket: 0.18g Header: 0.16g 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 80mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 80mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 80mΩ 48 hours, contact resistance max. 80mΩ No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) 3 30 Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwarter concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/hours Max Max ACCTB22E T

101 Narrow pitch connectors P5K/P5KS (0.5mm pitch) 2. Material and surface treatment Part name DIMENSIONS (Unit: mm) Material Mated height 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 8mm, 9mm Surface treatment Molded portion Heat-resistant resin (UL94V-0) Contact/post Copper alloy Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) The section close to the soldering portion has a nickel barrier. (The nickel base is exposed.) The CAD data of the products with a CAD Data mark can be downloaded from: P5K: Mated height 3mm, 3.5mm type Socket CAD Data Dimension table (mm) No. of pins A B Header CAD Data Dimension table (mm) No. of pins A B Socket and header are mated A Suction face 1.44 A B± ± ± ±0.03 A B± ± ± ±0.03 Mated height A 3.0 mm mm Suction face 1.44 General tolerance: ± General tolerance: ± ±0.03 C 0.20±0.03 (0.9) (0.9) D (1.4) (1.4) Terminal coplanarity 0.10 Terminal coplanarity 0.10 Mated height C D 3.0 mm mm Note: P5KS (mated heights 4.0mm, 4.5mm, 5.0mm, 5.5mm, 6.0mm, 6.5mm, 7.0mm, 8.0mm, and 9.0mm) cannot be mated to this type. 100 ACCTB22E T

102 Narrow pitch connectors P5K/P5KS (0.5mm pitch) P5KS: Mated height 4.0mm, 4.5mm, 5.0mm, 5.5mm, 6.0mm, 6.5mm, 7.0mm, 8.0mm, 9.0mm type Socket CAD Data Dimension table (mm) No. of pins A B Header CAD Data Dimension table (mm) No. of pins A B Socket and header are mated A Note: P5K (mated heights 3.0mm, 3.5mm) cannot be mated to this type. 0.50± ±0.05 A B±0.1 B±0.1 A 0.50± ± (Suction face) 4.6 General tolerance: ± ± ±0.03 Mated height A 4.0 mm mm mm mm mm mm mm mm mm 9.00 C (Suction face) 4.2 C 0.15±0.03 General tolerance: ± ±0.03 Terminal coplanarity 0.10 (1.10) (1.10) D C Mated height C 4.0 mm, 5.0 mm, 6.0 mm mm, 5.5 mm, 6.5 mm mm, 8.0 mm, 9.0 mm 6.05 Terminal coplanarity 0.10 (1.1) (1.1) Mated height C D 4.0 mm, 4.5 mm, 7.0 mm mm, 5.5 mm, 8.0 mm mm, 6.5 mm, 9.0 mm ACCTB22E T

103 Narrow pitch connectors P5K/P5KS (0.5mm pitch) EMBOSSED TAPE DIMENSIONS (unit: mm) Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II Pull out direction Dimension table (mm) Suffix: G (1 reel, 1,500 pieces or 1,000 pieces embossed tape and plastic reel package) Type Mated height No. of pins Type of taping A B C D Quantity per reel P5K P5KS A±0.3 C 1.75 Socket and header are common 3.0mm, 3.5mm Socket: 4.0mm, 4.5mm, 5.0mm, 5.5mm, 6.0mm, 6.5mm Header: 4.0mm, 4.5mm, 7.0mm Socket: 7.0mm, 8.0mm, 9.0mm Header: 5.0mm, 5.5mm, 6.0mm, 6.5mm, 8.0mm, 9.0mm 20 to 50 Tape I to 70 Tape II to 100 Tape II Tape II to 50 Tape I to 70 Tape II to 100 Tape II to 50 Tape I to 70 Tape II to 100 Tape II Connector orientation with respect to direction of progress of embossed tape Direction of tape progress dia. Type Socket Header Pull out direction A±0.3 B C P5K dia. This corner is oriented on the C side. This corner is oriented on the C side. Plastic reel dimensions (Conforming to EIAJ ET 7200B) 380 dia. D±1 Socket Header Taping reel Label Top cover tape P5KS Embossed carrier tape This corner is oriented on the C side. This corner is oriented on the C side. Embossed mounting-hole 1,500 pcs. 1,500 pcs. 1,000 pcs. 102 ACCTB22E T

104 Narrow pitch connectors P5K/P5KS (0.5mm pitch) NOTES 1. Prevention of reverse mating The socket and header are protected from reverse mating by a molded resin key. Excessive mating force may damage the key, so be sure to match chamfered corners when mating. Chamfered corner Chamfered corner Outline (top view) Mating state Chamfered corner Chamfered corner Chamfered corner 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. P5K Socket Recommended PC board pattern (TOP VIEW) B± ± ± ± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 56%) B± ± ± ± ± ±0.01 (1.10) (1.10) 4.60±0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 69%) B± ± ± ± ± ±0.01 (1.35) (1.35) 4.10± ± ± ± ±0.01 P5K Header Recommended PC board pattern (TOP VIEW) B± ± ± ± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 62%) B± ± ± ± ± ±0.01 (1.55) (1.55) Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 78%) B± ± ± ± ± ±0.01 * See the dimension table on page 100 for more information on the B dimension of the socket and header. (1.95) (1.95) 1.70± ± ± ± ± ± ACCTB22E T

105 Narrow pitch connectors P5K/P5KS (0.5mm pitch) P5KS: Mated height 4.0mm, 4.5mm, 5.0mm, 5.5mm, 6.0mm, 6.5mm, 7.0mm, 8.0mm, 9.0mm type Socket Recommended PC board pattern (TOP VIEW) B± ± ± ± ± ±0.05 Header Recommended PC board pattern (TOP VIEW) B± ± ± ± ± ± ± ± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 60%) 0.50± ± ±0.01 B± ± ±0.01 Recommended metal mask pattern Metal mask thickness: When 150 μm (Opening area ratio: 69%) B± ± ± ±0.01 (1.30) (1.30) 3.80± ±0.01 Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 76%) B± ± ± ± ± ±0.01 * See the dimension table on page 101 for more information on the B dimension ± ±0.01 (1.50) (1.50) 3.00± ±0.01 B± ± ± ± ± ±0.01 (1.65) (1.65) Recommended metal mask pattern Metal mask thickness: When 120 μm (Opening area ratio: 87%) * See the dimension table on page 101 for more information on the B dimension. (1.90) (1.90) Regarding cautions for use, please refer to page 171. Please refer to the latest product specifications when designing your product. 3.10± ± ± ± ACCTB22E T

106 High current connectors A35US with power terminal (0.35mm pitch) For board-to-fpc High Current Connectors A35US With Power Terminal 4. Power terminal type means power line is ensured without having to use signal line. Contributes to space savings Narrow pitch connectors New 2.2mm Socket 1.8mm RoHS compliant Header FEATURES mm Mated Height with 2.2 mm width. 2. Supports 3A power terminals 3. structure provides a slim and low-profile design resistant to various environmental conditions. ORDERING INFORMATION 7: Socket 8: Header Mated height <Socket>/<Header> 0: 0.6 mm AXG Number of pins (2 digits) Functions J: 3A type Power terminal Surface treatment (Contact portion / Terminal portion) <Socket> 7: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating, Surface: Au plating 0 J Power terminals Specification: 3 A in two locations 2.2mm Socket 3.5mm 1.8mm Header Example; Charging current: Max. 3.0 A (0.3 A/pin, Pitch: 0.35 mm) Product without power terminals 20 pins signal terminals used With power terminal 20 pins signal terminals can be reduced. 3 A power terminals 3.5mm APPLICATIONS Multiple connection of power signal between USB and battery in portable terminals such as smartphones and tablet PCs Active optical connector FPC/FFC connectors High current connectors 105 ACCTB78E T

107 High current connectors A35US with power terminal (0.35mm pitch) Narrow pitch connectors Active optical connector FPC/FFC connectors High current connectors PRODUCT TYPES Mated height 0.6mm Number of pins Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Item Specifications Conditions Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Soldering heat resistance Rated current Rated voltage 2. Material and surface treatment Part number Packing Socket Header Inner carton (1-reel) Outer carton 10 AXG7100J7 AXG8100J4 12 AXG7120J7 AXG8120J4 16 AXG7160J7 AXG8160J4 20 AXG7200J7 AXG8200J4 24 AXG7240J7 AXG8240J4 30 AXG7300J7 AXG8300J4 34 AXG7340J7 AXG8340J4 40 AXG7400J7 AXG8400J4 44 AXG7440J7 AXG8440J4 50 AXG7500J7 AXG8500J4 60 AXG7600J7 AXG8600J4 3.0A/pin contact (power terminal) 0.30A/pin contact (signal terminal): Max. 5 A at total pin contacts 60V AC/DC 10,000 pieces 20,000 pieces Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Composite insertion force Composite removal force Contact holding force (Socket signal terminal, Header power terminal) Max. 30mΩ (power terminal) Max. 90mΩ (signal terminal) 1.300N/pin contacts pin contacts 0.165N/pin contacts pin contacts Min. 0.20N/pin contacts Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 30mΩ (power terminal) max. 90mΩ (signal terminal) 120 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ (power terminal) max. 90mΩ (signal terminal) 24 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ (power terminal) max. 90mΩ (signal terminal) 48 hours, contact resistance max. 30mΩ (power terminal) max. 90mΩ (signal terminal) 30 times The initial specification must be satisfied electrically and mechanically Unit weight 60 pin contacts: Socket 0.02g Header 0.01g Part name Material Surface treatment Molded portion Contact and Post LCP resin (UL94V-0) Copper alloy No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours Infrared reflow soldering: Peak temperature: 260 C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300 C within 5 sec. 350 C within 3 sec. Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Power terminals: Sockets: Base: Ni plating, Surface: Au plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating 106 ACCTB78E T

108 High current connectors A35US with power terminal (0.35mm pitch) DIMENSIONS (Unit: mm) Socket (Mated height: 0.6 mm) CAD Data Header (Mated height: 0.6 mm) CAD Data Socket and Header are mated 0.60 (Suction face) Y (Note) Z (Note) The CAD data of the products with a CAD Data mark can be downloaded from: A B± ± ± Power terminal Signal terminal (0.68) 0.30±0.03 C±0.1 Note: Since power terminals are built into the body, the Y and Z parts are connected electrically. Header 0.60± (Suction face) A B± ± ± Signal terminal Power terminal 0.08±0.03 C± (Power terminal) The degree of terminal flat 0.08 (Contact and Power terminal) General tolerance: ±0.2 The degree of terminal flat (Post and Power terminal) General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C Narrow pitch connectors Active optical connector FPC/FFC connectors High current connectors Socket 107 ACCTB78E T

109 High current connectors A35US with power terminal (0.35mm pitch) Narrow pitch connectors Active optical connector FPC/FFC connectors High current connectors EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C :1999. However, not applied to the mounting-hole pitch of some connectors.) Dimension table (Unit: mm) Socket Header Leading direction after packaging +0.3 (A 0.1 ) (B) (1.75) (2.0) (4.0) 4.0 Number of pins Type of taping A B C Quantity per reel Max. 30 Tape I , to 60 Tape I ,000 Number of pins Type of taping A B C Quantity per reel Max. 34 Tape I , to 60 Tape I ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress Type Tape I 1.5 dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (C±1) 380 dia. Common for A35US with power terminal Label Socket Header Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 108 ACCTB78E T

110 High current connectors A35US with power terminal (0.35mm pitch) NOTES 1. Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 0.6 mm) Recommended PC board pattern (TOP VIEW) 2.50± ±0.03 (0.73) 2.50± ±0.01 (0.35) 12 C ± ± ± ±0.03 : Insulatin area Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 46%) 8 C ± ± ± ±0.01 (0.50) 0.20± ±0.03 (0.39) 1.82± ±0.01 Header (Mated height: 0.6 mm) Recommended PC board pattern (TOP VIEW) 1.48± ± ± ± ±0.03 (0.39) 0.70±0.01 (0.39) 0.35± ±0.03 : Insulatin area Recommended metal mask pattern Metal mask thickness: When 100μm (Signal terminal opening ratio: 70%) (Power terminal opening ratio: 77%) 0.35± ± ± ±0.01 Regarding cautions for use, please refer to page 171. (0.50) 0.90± ± ±0.03 (0.39) 1.42± ±0.01 Please refer to the latest product specifications when designing your product. Narrow pitch connectors Active optical connector FPC/FFC connectors High current connectors 109 ACCTB78E T

111 High current connectors A35P (0.35mm pitch) Narrow pitch connectors Active optical connector FPC/FFC connectors High current connectors New 2.5mm Socket 2.0mm RoHS compliant FEATURES 1. High current rating 5 A (using 1.25 A/pin 8 pins) 2. Support of high current means number of pins can be reduced and design with space saving requirements. Reduced space with decrease in number of pins used for power contacts. Example: Power line Max. 3 A (Pitch: 0.35 mm) Previous product A35P 3 A (2 pins) 3 A (2 pins) 3 A (12 pins) 3 A (12 pins) Max. 0.5 A/pin Max. 0.5 A/pin Max A/pin Max A/pin Space reduction Header ORDERING INFORMATION 5A: Socket 6A: Header Number of pins (2 digits) Mated height <Socket> / <Header> 1: 0.8 mm For board-to-fpc High Current Connectors Required number of pins 3 A: 0.25 A/pin 24 pins Required number of pins 3 A: 1.5 A/pin 4 pins AXF 1 2 Rated current Number of power contacts Max. 4 pins Max. 8 pins A35P Rated current Power contact Signal contact Total 1.5 A/pin 1.25 A/pin 0.5 A/pin Max. 12 A Number of power contacts: 1.5 A/pin x 4 pins or 1.25 A/pin x 8 pins can be used 3. Increased design freedom (pin layout and multiple high current lines) Any pin contact can be used as a power contact. Any layout is possible for the power supply line. Sample layout 1.5A 1.5A 1.5A 1.5A * For 1.5 A/pin power contact Other pin contacts can be up to max. 0.5 A (total of pin is max. 12 A). 4. Terminal pitch: 0.35 mm, width: 2.5 mm and Mated height: 0.8 mm APPLICATIONS Connections between PC boards where there is a tendency for increased number of pins with the increase in charging current. Connection section of all modules where power consumption increases. Functions 2: Without positioning bosses 110 ACCTB81E T

112 High current connectors A35P (0.35mm pitch) PRODUCT TYPES Mated height 0.8mm Number of pins Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. Part number Packing Socket Header Inner carton (1-reel) Outer carton 10 AXF5A1012 AXF6A AXF5A1212 AXF6A AXF5A1612 AXF6A AXF5A2012 AXF6A AXF5A2412 AXF6A AXF5A3012 AXF6A AXF5A3412 AXF6A AXF5A4012 AXF6A AXF5A4412 AXF6A AXF5A5012 AXF6A AXF5A5412 AXF6A AXF5A6012 AXF6A AXF5A6412 AXF6A AXF5A7012 AXF6A AXF5A8012 AXF6A AXF5A0012 AXF6A0012 5,000 pieces 10,000 pieces SPECIFICATIONS 1. Characteristics Item Specifications Conditions Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight Rated current Rated voltage 1.5 A/pin contact 4 pin contacts or 1.25 A/pin contact 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts) 30V AC/DC Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Contact resistance Composite insertion force Composite removal force Contact holding force (Socket contact) Max. 30mΩ Max N/pin contact pin contacts (initial) Min N/pin contact pin contacts Min. 0.20N/pin contact Based on the contact resistance measurement method specified by JIS C Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 C to +85 C No icing or condensation. Soldering heat resistance Storage temperature Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Insertion and removal life Peak temperature: 260 C or less (on the surface of the PC board around the connector terminals) Infrared reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 30mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ 48 hours, contact resistance max. 30mΩ 30 times 60 pin contact Socket 0.03 g Header 0.02 g No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours 111 ACCTB81E T

113 High current connectors A35P (0.35mm pitch) 2. Material and surface treatment Part name Material Surface treatment Molded portion Contact and Post LCP resin (UL94V-0) Copper alloy DIMENSIONS (Unit: mm) Socket (Mated height: 0.8 mm) CAD Data 0.70 (Suction face) Y note Z note Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) The CAD data of the products with a CAD Data mark can be downloaded from: A B± ± ± ±0.03 C±0.1 (0.90) Terminal coplanarity 0.08 (Contact and soldering terminals) 2.50 General tolerance: ±0.2 Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected. Header (Mated height: 0.8 mm) CAD Data 0.70 (Suction face) Soldering terminals A B± ± ± ±0.03 C± (0.31) Soldering terminals 0.65 Terminal coplanarity 0.08 (Post and soldering terminals) 2.00 General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C Dimension table (mm) Number of pins/ dimension A B C Socket and Header are mated Header 0.80±0.1 Socket 112 ACCTB81E T

114 High current connectors A35P (0.35mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C :1999. However, not applied to the mounting-hole pitch of some connectors.) Leading direction after packaging Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers 0.8mm Tape II (A±0.3) (B) 10 to 24 Tape I , to 80 Tape I , Tape II ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress Tape I +0.3 (A 0.1) (C) (1.75) 8.0 (2.0) (4.0) Type 0 dia. (C) (1.75) 8.0 (2.0) (4.0) dia. Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (D±1) 380 dia. Common for A35P Socket Header Label Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. Narrow pitch connectors Active optical connector FPC/FFC connectors High current connectors 113 ACCTB81E T

115 High current connectors A35P (0.35mm pitch) NOTES Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 0.8 mm) Recommended PC board pattern (TOP VIEW) 2.90± ±0.03 (0.92) 2.90± ± ± ± ± ±0.03 (0.50) 0.20±0.03 C 0.30 : insulation area Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 85%) (Metal-part opening ratio: 50%) (0.49) 0.35± ± ± ±0.01 (0.47) 1.96± ±0.01 C ±0.03 Header (Mated height: 0.8 mm) Recommended PC board pattern (TOP VIEW) 1.66± ± ± ±0.01 (0.53) 0.35± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 84%) (Metal-part opening ratio: 100%) (0.53) 0.20± ± ± ± ±0.01 (0.65) 1.10± ±0.03 Regarding cautions for use, please refer to page 171. Please refer to the latest product specifications when designing your product. (0.61) 1.18± ± ACCTB81E T

116 High current connectors B01 New 2.40mm ORDERING INFORMATION 3: Socket 4: Header Socket 1.80mm RoHS compliant Header Number of contacts (1 digit) 6: 6 contacts (Power contact and signal contact) Stacking height <Socket>/<Header> 1: 0.6 mm 3: 0.8 mm Current capacity 5: 3.0 A/Power pin Function 0: No polarity For board-to-fpc High Current Connectors FEATURES 1. High current rating: 6 A (3 A/pin 2 pins) 6A 3A 3A 6A 3A 3A 2. Miniature design provides spacesaving benefits. Socket 2.40mm Header 1.80mm 4.45mm 3.76mm AXF B01 3. High removal force. 4. Helps make mobile devices thinner thanks to its low profile height of 0.6 mm/0.8 mm. APPLICATIONS Battery section of miniature mobile devices such as smartphones, wearable terminals and tablet PCs 115 ACCTB71E T

117 High current connectors B01 Narrow pitch connectors PRODUCT TYPES Stacking height Number of contacts Part number Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. Packing Socket Header Inner carton (1-reel) Outer carton 0.6mm 6 AXF AXF ,000 pieces 30,000 pieces 0.8mm 6 AXF AXF ,000 pieces 30,000 pieces Active optical connector FPC/FFC connectors High current connectors SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Soldering heat resistance Unit weight Item Specifications Conditions Rated current 3.0 A/pin contact (Power terminal) 0.3 A/pin contact (Signal terminal) Rated voltage 30V AC/DC Insulation resistance Min. 1,000MΩ (Initial stage) Using 250V DC megger (applied for 1 minute) Dielectric strength Contact resistance 150V AC for 1 minute Power terminal: Max. 20mΩ Signal terminal: Max. 90mΩ Max. 40 N Min. 10 N (H: 0.6, Initial stage) Composite insertion force Composite removal force Ambient temperature 55 C to +85 C No icing or condensation. Storage temperature Thermal shock resistance (Header and socket mated) Humidity resistance (Header and socket mated) Salt water spray resistance (Header and socket mated) H2S resistance (Header and socket mated) Insertion and removal life 55 C to +85 C (Products only) 40 C to +50 C (Packaging structure) After 5 cycles Insulation resistance: Min. 100MΩ, Contact resistance Power terminal: Max. 20mΩ Signal terminal: Max. 90mΩ After 120 hours Insulation resistance: Min. 100MΩ, Contact resistance Power terminal: Max. 20mΩ Signal terminal: Max. 90mΩ After 24 hours Insulation resistance: Min. 100MΩ, Contact resistance Power terminal: Max. 20mΩ Signal terminal: Max. 90mΩ After 48 hours Contact resistance Power terminal: Max. 20mΩ Signal terminal: Max. 90mΩ Mechanical life: 30 times Contact resistance: Power terminal: Max. 20mΩ Signal terminal: Max. 90mΩ Composite removal force: Min. 7 N The initial specification must be satisfied electrically and mechanically 6 pin contact Socket h = 0.6 mm: g h = 0.8 mm: g Header h = 0.6 mm: g h = 0.8 mm: g 2. Material and surface treatment Part name Material Surface treatment Molded portion Contact and Post Heat resistant plastic (LCP resin) (UL94V-0) Copper alloy No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. According to the contact resistance measurement method of JIS C 5402 No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Conformed to IEC Bath temperature 40 C±2 C, Humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, Salt water concentration 5%±1% Conformed to JEIDA Bath temperature 40 C±2 C, Gas concentration 3 ppm ±1 ppm, Humidity 75% to 80% R.H. Repeated insertion and removal cycles of max. 200 times/ hour Infrared reflow soldering: Max. peak temperature of 260 C (PC board surface temperature near connector terminals) Soldering iron: 300 C within 5 sec. 350 C within 3 sec. Contact portion (Main): Au plating (Min. 0.1μm) over nickel Contact portion (Sub): Au plating (Min μm) over nickel Terminal portion: Au plating over nickel (except for top of the terminal) Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal) Soldering terminals (Header): Au plating over nickel (except for top of the terminal) 116 ACCTB71E T

118 High current connectors B01 DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: Socket (Mated height: 0.6 mm and 0.8 mm) CAD Data 0.50 (Suction face) A B± ± ± E The degree of terminal flat 0.08 (Contact and soldering terminals) Narrow pitch connectors Y (Note 1) Z (Note 1) Header (Mated height: 0.6 mm and 0.8 mm) CAD Data Socket and Header are mated C±0.1 D± ± ± Signal contact (2 pins) Power contact (4 pins) Mated height/ dimension E 0.6mm mm 0.79 General tolerance: ±0.2 Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically. Header Socket 0.60± (Suction face) A B±0.1 C± ± ± ±0.03 Signal contact (2 pins) Power contact (4 pins) Header Socket 0.80±0.1 (0.34) D (Soldering terminal) The degree of terminal flat 0.08 (Post and soldering terminals) 1.80 Mated height/ dimension D 0.6mm mm 0.65 General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension A B C D Dimension table (mm) Number of pins/ dimension A B C Active optical connector FPC/FFC connectors High current connectors 117 ACCTB71E T

119 High current connectors B01 Narrow pitch connectors Active optical connector FPC/FFC connectors High current connectors EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping (In accordance with JIS C :1999. However, not applied to the mounting-hole pitch of some connectors.) Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C Quantity per reel Common for socket and headers 0.6mm and 0.8mm Tape I +0.3 (A 0.1) 1.5 dia. 6 Tape I ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress Leading direction after packaging Type (B) (1.75) (4.0) (2.0) Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (C±1) 380 dia. Label Common for B01 Top cover tape Taping reel Socket Header Embossed carrier tape Embossed mounting-hole Note: There is no indication on this product regarding top-bottom or left-right orientation. 118 ACCTB71E T

120 High current connectors B01 NOTES 1. Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Socket (Mated height: 0.6 mm and 0.8 mm) Recommended PC board pattern (TOP VIEW) 2.80± ± ± ± ± ±0.03 : Insulation area Recommended metal mask pattern Metal mask thickness: When 100μm (Power contact opening ratio: 88%) (Signal contact opening ratio: 83%) (Metal-part opening ratio: 100%) 0.70± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.03 Header (Mated height: 0.6 mm and 0.8 mm) Recommended PC board pattern (TOP VIEW) 0.32± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 100μm (Power contact opening ratio: 73%) (Signal contact opening ratio: 75%) (Metal-part opening ratio: 100%) 0.32± ± ± ± ± ± ± ± ±0.03 : Insulation area 0.20± ± ± ± ± ± ± ±0.03 Regarding cautions for use, please refer to page 171. Please refer to the latest product specifications when designing your product. 119 ACCTB71E T

121 High current connectors L2 Narrow pitch connectors Active optical connector FPC/FFC connectors High current connectors ORDERING INFORMATION 2: L2 Product type 1: Receptacle 9: Mating jig Wire type 1: Solid wire Wire range 1: #24 RoHS compliant For Wire connection type High Current Connectors FEATURES 1. Easy connecting with vertical mating structure a click feed back. The structure design prevents loose mating and makes it easy to visually check the mating. Lock part Single wire (Part of contact step) (Core) Mating set position Mating complete When the wire goes through the lock part, click feedback is given, and the structure design prevents loose mating. 2. Original terminal shape provides strong pull strength and less concern on half mating. Securing of the wire in the direction of tension is possible by edge contact. Single wire (AWG#24) AYL L2 3. More design ability of your board by small, low profile, and 1 pin connection. 4. The high capacity 3 A, 250 V allows the connector to serve a wide variety of connection purposes. 5. Dedicated mating jig available. APPLICATIONS Wire connection for power supply and between PC boards connection of LED light bulbs, LED down-light and line lighting, etc. Power supply connection in the devices 120 ACCTB59E T

122 High current connectors L2 PRODUCT TYPES Receptacle Note: Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. Mating jig Note: Order unit: For volume production: Outer carton (10 pieces) units SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Environmental characteristics 2. Material and plating 1) Receptacle 2) Mating jig Product height Part No. Inner carton (1-reel) Packing Outer carton 1.35mm AYL ,000 pieces 24,000 pieces Part Part No. Packing Outer carton (Individual packaging) Mating jig AYL pieces Item Specifications Conditions Rated current Max. 3.0A Rated voltage Max. 250V AC/DC Contact resistance Wire insertion force Initial: Max. 30mΩ After environmental examination: Max. 45mΩ Max. 30N (Initial) Include the conductor resistance of 30 mm long applicable wire. Based on the contact resistance measurement method specified by JIS C Mating a wire to the receptacle, so that a wire and PC board are kept parallel. Measure using mating jig or mold cover. Wire retention force (Vertically) Min. 4N (Initial) Unmating a wire from the receptacle, so that a wire and PC board are kept parallel. Measure using mold cover. Wire retention force (Axial) Min. 5N (Initial) Apply an axial pull-off load to wire. Insertion and removal life Ambient temperature (Operating temperature) Storage temperature Thermal shock resistance (Receptacle and wire mated) Humidity resistance (Receptacle and wire mated) Saltwater spray resistance (Receptacle and wire mated) H2S resistance (Receptacle and wire mated) Soldering temperature resistance (Receptacle) Solder paste thickness 3 times (Containing initial mating) 40 C to +115 C 40 C to +85 C (Products only) 40 C to +50 C (Packaging structure) 200 cycles, contact resistance max. 45mΩ 500 hours, contact resistance max. 45mΩ 24 hours, contact resistance max. 45mΩ 48 hours, contact resistance max. 45mΩ The initial specification must be satisfied electrically and mechanically The initial specification must be satisfied electrically and mechanically Use a new wire. Must be inserted and removed by the designated method. No icing or condensation. No icing or condensation. Conformed to MIL-STD-202F, method 107G Order Temperature ( C) Time (minutes) Max Max Bath temperature 85 C±2 C, humidity 80% to 85% R.H. IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Reflow soldering: Max. peak temperature of 260 C (PC board surface temperature near the receptacle) Recommendation t = 0.12 mm Part Material Color Plating Contact Copper alloy Sn plating over Ni Part Material Color Plating Mating jig Polycarbonate resin Transparence 3. Applicable wires Wire range Number of conductors/diameter of conductor (Number of conductors/mm) AWG #24 1/0.511±0.010 Note: This product is not designed to be used for stranded wires (including spare solder). Diameter of insulation (mm) Max Note) Max when using the mold cover Wire core Tin plating annealed copper wire (Min. 0.3μm) 121 ACCTB59E T

123 High current connectors L2 DIMENSIONS (Unit: mm) Receptacle Receptacle and Wire are mated Mating jig Max dia. (Suction) A 0.511±0.010 dia. (0.96) 1.35 Mated height of the jig (1.65) R0.30 Terminal coplanarity 0.10 General tolerance: ± R Setting figure of jig Note 1) Detail A Note 1) Please mate the wire after confirming the position of the receptacle from the jig hole. General tolerance: ± ACCTB59E T

124 High current connectors L2 EMBOSSED TAPE DIMENSIONS (Unit: mm) Tape packed status Receptacle +0.3 ( ) (7.5) (1.75) (2.0) (4.0) (4.0) Connector orientation with respect to embossed tape feeding direction Direction of tape progress Leading direction after packaging Type 1.5 dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (17.4±1) 380 dia. L2 Label Top cover tape Taping reel Embossed carrier tape Embossed mounting-hole Regarding cautions for use, please refer to page 175. Please refer to the latest product specifications when designing your product. 123 ACCTB59E T

125 0.9 FPC connectors Y2B (0.2mm pitch) Narrow pitch connectors High current connectors Active optical connector FPC/FFC connectors RoHS compliant ORDERING INFORMATION 21: FPC Connector Y2B (0.2 mm pitch) Back lock Number of pins (2 digits) Contact direction 3: Top and bottom double contacts Surface treatment (Contact portion / Terminal portion) 5: Au plating/au plating (Ni barrier) For FPC FPC connectors (0.2mm pitch) Back lock FEATURES 1. Slim (width: 3.15 mm, including the lever) and low profile design (height: 0.9 mm) 3.15 Unit: mm 2. Mechanical design freedom is achieved with double top and bottom contacts. Top and bottom double contacts eliminate the need of using different connectors (with either top or bottom contacts) depending on the FPC wiring conditions. 3. FPC insertion displacement prevention Constructed to make positional displacement difficult by surrounding the four sides on the FPC inlet side with wall molding AYF Y2B 4. Easy-to-handle back lock design 5. Man-hours of assembly time can be reduced by delivering the connectors with their levers opened. 6. Wiring patterns can be placed underneath the connector. 7. Ni barrier helps resist solder creepage. APPLICATIONS Mobile devices, such as cellular phones, smartphones, digital still cameras and digital video cameras. 124 ACCTB15E T

126 FPC connectors Y2B (0.2mm pitch) PRODUCT TYPES Height Number of pins Part number 0.9 mm 23 AYF AYF AYF AYF AYF Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact our sales office for connectors having a number of pins other than those listed above. Inner carton (1-reel) SPECIFICATIONS 1. Characteristics The followings show specifications, when using an applicable FPC (thickness 0.20 mm) Item Specifications Conditions Rated current 0.2A/pin contact (Max. 5A at total pin contacts) Rated voltage 50V AC/DC Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight 2. Material and surface treatment Part name Material Surface treatment Molded portion Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) Contact Copper alloy Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Packing Outer carton 5,000 pieces 10,000 pieces Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Dielectric strength 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Contact resistance Max. 100mΩ Based on the contact resistance measurement method specified by JIS C Measurement of the maximum force applied until the FPC holding force Min. 0.13N/pin contact pin contacts (initial) inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed Ambient temperature 55 C to +85 C Storage temperature 55 C to +85 C (product only) No icing or condensation. 40 C to +50 C (emboss packing) Conformed to MIL-STD-202F, method 107G Thermal shock resistance (with FPC mated) Humidity resistance (with FPC mated) Saltwater spray resistance (with FPC mated) H2S resistance (with FPC mated) Soldering heat resistance 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 48 hours, contact resistance max. 100mΩ Peak temperature: 260 C or less 300 C within 5 sec. 350 C within 3 sec. Soldering iron Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Reflow soldering Insertion and removal life 20 times Repeated insertion and removal: min. 10 sec./time 51 pin contacts: 0.07 g Order Temperature ( C) Time (minutes) Max Max High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors 125 ACCTB15E T

127 FPC connectors Y2B (0.2mm pitch) DIMENSIONS (Unit: mm) Narrow pitch connectors 1.35 (Suction area) A 0.40±0.10 (Terminal pitch) High current connectors 0.20±0.10 (Contact pitch) 0.40±0.10 (Terminal pitch) Terminal coplanarity 0.1 (Contact) 0.90±0.10 (3.15) 2.95 (1.84) (1.35) (FPC insertion depth) Active optical connector FPC/FFC connectors (0.10) (0.10) B±0.20 C±0.20 RECOMMENDED FPC DIMENSIONS (Finished thickness: t = 0.2±0.03) The conductive parts should be based by Ni plating and then Au plating. 0.20± R0.20± max. A±0.05 B±0.02 C± ±0.015 (pitch) 0.20±0.015 (pitch) (Width of contact area) (Width of contact area) 0.40±0.015 (pitch) (*2) 0.10± ± ± ± ± ± ± ± ± ±0.30 (Conductor exposed area) (0.40) (0.30) 0.20± ±0.50 (Reinforcing board) Cutting direction (*1) General tolerance: ±0.3 Each mentioned sizes are at the stage of initial delivery. Number of pins/ dimension A B C Number of pins/ dimension A B C (*1) Cut FPC from the copper foil side to the reinforcing plate side. (*2) Please note if this dimension is too narrow, pattern crack due to FPC bending is more likely to occur. 126 ACCTB15E T

128 FPC connectors Y2B (0.2mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping Dimension table (Unit: mm) Connector orientation with respect to embossed tape feeding direction Direction of tape progress NOTES Leading direction after packaging +0.3 (A 0.1) (B) (1.75) (2.0) (4.0) (8.0) Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) Number of pins A B C Quantity per reel , to ,000 Type 1.50 dia. 1. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of contact pitch 0.4 mm, 0.5 mm or 0.6 mm. In order to reduce solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use our recommended patterns basically dia. (C±1) Y2B Recommended PC board pattern (mounting layout) (TOP VIEW) 0.40± ± ± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 120μm (Front terminal portion opening area ratio: 80%) (Back terminal portion opening area ratio: 96%) 0.40± ± ± ± ± ± ± ± ± ±0.03 (2.41) 3.15±0.01 Taping reel Top cover tape Label Embossed carrier tape Embossed mounting-hole Regarding cautions for use, please refer to page 178. Please refer to the latest product specifications when designing your product. High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors 127 ACCTB15E T

129 FPC connectors Y3BL (0.3mm pitch) Narrow pitch connectors High current connectors For FPC FPC connectors (0.3mm pitch) Back lock FEATURES 1. Low profile (height: 0.6 mm) and slim design (width: 3.35 mm, including the lever) 2. Compatible with FPC 0.2 mm thickness The connector has a 0.6 mm low-profile; however, it is compatible with FPCs that are 0.2 mm thick, facilitating assembly work. Y3BL 3. High durability assured with proprietary soldering terminal construction Housing damage is prevented when FPC is inserted incorrectly thanks to the two walls on the FPC inlet side being metal (soldering terminal). Active optical connector FPC/FFC connectors RoHS compliant ORDERING INFORMATION 35: FPC Connector Y3BL (0.3 mm pitch) Back lock Number of pins (2 digits) Contact direction 2: Top contact Surface treatment (Contact portion / Terminal portion) 5: Au plating/au plating (Ni barrier) AYF (including the lever) Unit: mm Metal wall (soldering terminal) 4. Assembly time is reduced when connector levers are received open. 5. Wiring patterns can be placed underneath the connector. 6. Ni barrier with high resistance to solder creepage APPLICATIONS Compact mobile devices such as wearable devices, smartphones, tablet PCs, DSCs, and DVCs. 128 ACCTB52E T

130 FPC connectors Y3BL (0.3mm pitch) PRODUCT TYPES Height Number of pins Part number 0.6 mm 7 AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact our sales office for connectors having a number of pins other than those listed above. Inner carton (1-reel) Packing SPECIFICATIONS 1. Characteristics The followings show specifications, when using an applicable FPC (thickness 0.20 mm) Item Specifications Conditions Rated current 0.2A/pin contact Rated voltage 50V AC/DC Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight 2. Material and surface treatment Part name Material Surface treatment Molded portion Outer carton 5,000 pieces 10,000 pieces Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Dielectric strength Contact resistance FPC holding force Ambient temperature Storage temperature Thermal shock resistance (with FPC mated) Humidity resistance (with FPC mated) Saltwater spray resistance (with FPC mated) H2S resistance (with FPC mated) Soldering heat resistance 150V AC for 1 min. Max. 160mΩ Min. 0.10N/pin contact pin contacts (initial) 55 C to +85 C 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 160mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 160mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 160mΩ 48 hours, contact resistance max. 160mΩ No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Based on the contact resistance measurement method specified by JIS C Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed No icing or condensation. Conformed to MIL-STD-202F, method 107G Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Peak temperature: 260 C or less Reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron Insertion and removal life 20 times Repeated insertion and removal: min. 10 sec./time 51 pin contacts: 0.05 g Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) Order Temperature ( C) Time (minutes) Max Max Contact Copper alloy Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Soldering terminal Copper alloy Ni on base, Pd + Au flash plating High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors 129 ACCTB52E T

131 FPC connectors Y3BL (0.3mm pitch) DIMENSIONS (Unit: mm) Narrow pitch connectors 1.00 (Suction area) A 0.60±0.10 (Terminal pitch) (1.25) (FPC insertion depth) (3.35) 0.30±0.10 (Contact pitch) High current connectors 0.60±0.10 (Terminal pitch) The shape of this portion may differ depending on No. of pins and the mold. Terminal coplanarity 0.1 (Contact and Soldering terminal) 0.60±0.08 (0.10) 2.95 (1.43) Active optical connector FPC/FFC connectors (0.34) (0.33) (0.10) (0.10) D±0.20 B±0.20 C±0.20 RECOMMENDED FPC DIMENSIONS (Finished thickness: t = 0.2±0.02) The conductive parts should be based by Ni plating and then Au plating. 0.30± ± R0.20± max max. 0.20± (Contact width) 0.60±0.02 (Pitch) A±0.05 B±0.03 C± ±0.02 (Pitch) 0.30±0.02 (Pitch) (Contact width) 0.10 max. 0.30± ± ±0.10 (0.10) 0.75± ± ± ± ±0.30 (Exposed part of the conductor) (0.05) (0.69) 0.20± ±0.50 (Reinforcing plate) Cutting direction* *Cut FPC from the copper foil side to the reinforcing plate side. General tolerance: ±0.3 Each mentioned dimension is at the stage of initial delivery. Number of pins/ dimension A B C D Number of pins/ dimension A B C ACCTB52E T

132 FPC connectors Y3BL (0.3mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping Leading direction after packaging Dimension table (Unit: mm) Connector orientation with respect to embossed tape feeding direction Direction of tape progress NOTES Tape I +0.3 (A 0.1 ) (A±0.3) (28.4) (B) (1.75) (2.0) (4.0) (8.0) 1.50 dia Leading direction after packaging Tape II (B) (1.75) (2.0) (4.0) (8.0) 1.50 dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole Number of pins Type of taping A B C Quantity per reel 7 to 15 Tape I , to 45 Tape I , Tape II ,000 Type 1. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of contact pitch 0.4 mm, 0.5 mm or 0.6 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use our recommended patterns basically. 0.84± ± dia. (C±1) Y3BL Recommended PC board pattern (mounting layout) Recommended metal mask pattern Metal mask thickness: When 120μm (Front terminal portion opening area ratio: 74%) (Back terminal portion opening area ratio: 96%) (Soldering terminal portion opening area ratio: 54%) 0.58± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.03 (2.47) 3.15±0.01 Label Regarding cautions for use, please refer to page 178. Please refer to the latest product specifications when designing your product. High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors 131 ACCTB52E T

133 0.9 FPC connectors Y3B/Y3BW (0.3mm pitch) Narrow pitch connectors High current connectors Active optical connector FPC/FFC connectors Y3B Y3BW RoHS compliant ORDERING INFORMATION 33: FPC Connector Y3B/Y3BW (0.3 mm pitch) Back lock Number of pins (2 digits) Function 3: Top and bottom double contacts (Y3B) 6: Top and bottom double contacts, lock holding type (Y3BW) Surface treatment (Contact portion / Terminal portion) 5: Au plating/au plating (Ni barrier) For FPC FPC connectors (0.3mm pitch) Back lock FEATURES 1. Slim (width: 3.15 mm, including the lever) and low profile design (height: 0.9 mm) 3.15 Unit: mm 2. Mechanical design freedom is achieved with double top and bottom contacts. Top and bottom double contacts eliminate the need of using different connectors (with either top or bottom contacts) depending on the FPC wiring conditions. 3. Easy-to-handle back lock structure 4. FPC insertion displacement prevention Constructed to make positional displacement difficult by surrounding the four sides on the FPC inlet side with wall molding 5. Man-hours of assembly time can be reduced by delivering the connectors with their levers opened. AYF Y3B/Y3BW 6. Wiring patterns can be placed underneath the connector. 7. Ni barrier with high resistance to solder creepage. 8. Y3BW features lock holding type, including a structure to temporarily hold the FPC and a higher holding force. The FPC holding contacts located on both ends of the connector facilitate positioning of FPC and further enhance the FPC holding force. Applicable FPC shapes Structure to lock notches on both ends of the FPC with holding contacts (1) The inserted FPC can be temporarily held until the lever is closed. (2) When the lever is closed, the holding contacts lock the FPC by its notches, enhancing the FPC holding force. APPLICATIONS Mobile devices, such as cellular phones, smartphones, digital still cameras and digital video cameras. 132 ACCTB47E T

134 FPC connectors Y3B/Y3BW (0.3mm pitch) PRODUCT TYPES Y3B Y3BW Height Number of pins Part number 0.9 mm 7 AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF AYF Height Number of pins Part number 0.9 mm 11 AYF AYF AYF Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office. 2. Please contact our sales office for connectors having a number of pins other than those listed above. Inner carton (1-reel) Packing Outer carton 5,000 pieces 10,000 pieces Inner carton (1-reel) Packing Outer carton 5,000 pieces 10,000 pieces High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors 133 ACCTB47E T

135 FPC connectors Y3B/Y3BW (0.3mm pitch) Narrow pitch connectors High current connectors Active optical connector FPC/FFC connectors SPECIFICATIONS 1. Characteristics The followings show specifications, when using an applicable FPC (thickness 0.20 mm) Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight Item Specifications Conditions Rated current 0.2A/pin contact (For min. 61 pins: Max. 12 A at total contacts) Rated voltage 50V AC/DC Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Dielectric strength Contact resistance FPC holding force Ambient temperature Storage temperature Thermal shock resistance (with FPC mated) Humidity resistance (with FPC mated) Saltwater spray resistance (with FPC mated) H2S resistance (with FPC mated) Soldering heat resistance 150V AC for 1 min. Max. 100mΩ Y3B: Min. 0.13N/pin contact pin contacts (initial) Y3BW: Min. 0.13N/pin contact pin contacts N (initial) 55 C to +85 C 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 48 hours, contact resistance max. 100mΩ No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Based on the contact resistance measurement method specified by JIS C Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed No icing or condensation. Conformed to MIL-STD-202F, method 107G Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Peak temperature: 260 C or less Reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron Insertion and removal life 20 times Repeated insertion and removal: min. 10 sec./time Y3B 61 pin contacts: 0.10 g Y3BW 51 pin contacts: 0.09 g Order Temperature ( C) Time (minutes) Max Max Material and surface treatment Part name Material Surface treatment Molded portion Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) Contact Copper alloy Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Holding contact (Only Y3BW) Copper alloy Contact portion; Base: Ni plating, Surface: Au plating 134 ACCTB47E T

136 FPC connectors Y3B/Y3BW (0.3mm pitch) DIMENSIONS (Unit: mm) Y3B No. of pins: Odd number 1.35 (Suction area) (0.10) (0.10) CAD Data A 0.60±0.10 (Terminal pitch) 0.30±0.10 (Contact pitch) 0.60±0.10 (Terminal pitch) B±0.20 C±0.20 No. of pins: Even number (8 pin contacts) 1.35 (Suction area) 1.80±0.20 (0.10) (0.10) 1.80± The CAD data of the products with a CAD Data mark can be downloaded from: (0.40) (0.30) 0.1 (Contact) 0.90±0.10 Terminal coplanarity 0.60±0.10 (Terminal pitch) 0.30±0.10 (Contact pitch) 0.60±0.10 (Terminal pitch) The degree of terminal flat 0.1 (Contact) (0.30) (0.40) CAD Data 0.90±0.10 (1.35) (FPC insertion depth) (3.15) 2.95 (3.15) 2.95 (1.84) (1.84) (1.35) (FPC insertion depth) Number of pins/ dimension A B C General tolerance: ±0.3 Each mentioned dimension is at the stage of initial delivery. Narrow pitch connectors High current connectors Active optical connector FPC/FFC connectors 135 ACCTB47E T

137 FPC connectors Y3B/Y3BW (0.3mm pitch) Narrow pitch connectors High current connectors Active optical connector FPC/FFC connectors RECOMMENDED FPC DIMENSIONS Y3B (Finished thickness: t = 0.2±0.03) The conductive parts should be based by Ni plating and then Au plating. No. of pins: Odd number 0.30± R0.20± max. 0.60± ±0.02 (Pitch) A±0.05 B±0.03 C± ±0.02 (Pitch) 0.30±0.02 (Pitch) (Contact width) 0.10 max ± ± ± ± ± ± ±0.30 (Exposed part of the conductor) 0.60± max. 0.20±0.02 (Contact width) 0.20± ±0.50 (Reinforcing plate) Cutting direction* *Cut FPC from the copper foil side to the reinforcing plate side. No. of pins: Even number (8 pin contacts) For Top Contacts For Bottom Contacts 0.30± ±0.02 (pitch) 0.30±0.02 (pitch) 0.10 max. 0.75± ± max. 2-R0.20± (Width of contact area) 0.60± ±0.02 (pitch) 2.70± ± ± ± (Width of contact area) 1.35± ± ± ±0.30 (Conductor exposed area) 0.10 max. 0.20± ± ± ±0.50 (Reinforcing board) Cutting direction* *Cut FPC from the copper foil side to the reinforcing board side. 0.30± ±0.02 (pitch) 0.30±0.02 (pitch) (Width of contact area) 0.75± ± max. 2-R0.20± ± ± ±0.03 Number of pins/ dimension A B C max. 1.35± ± ± ±0.30 (Conductor exposed area) 0.10 max ± (Width of contact area) 0.60± ± ±0.02 (pitch) 0.30± ± ±0.50 (Reinforcing board) Cutting direction* *Cut FPC from the copper foil side to the reinforcing board side. 136 ACCTB47E T

138 FPC connectors Y3B/Y3BW (0.3mm pitch) DIMENSIONS (Unit: mm) Y3BW CAD Data 1.35 (Suction area) The CAD data of the products with a CAD Data mark can be downloaded from: A 0.60±0.10 (Terminal pitch) Narrow pitch connectors 0.30±0.10 (Contact pitch) 0.60±0.10 (Terminal pitch) Holding contacts (The holding contacts cannot be used as conductors.) (0.10) (0.10) (0.10) B±0.20 C±0.20 D±0.20 RECOMMENDED FPC DIMENSIONS Y3BW (Finished thickness: t = 0.2±0.03) The conductive parts should be based by Ni plating and then Au plating. 1.45± ± max. 0.60± R0.20±0.05 R0.20±0.05 R0.20±0.05 A±0.05 B±0.03 C± ±0.02 (Pitch) 0.30±0.02 (Pitch) (Contact width) 0.10 max. Terminal coplanarity (Contact and holding contact) 0.65± ±0.10 (0.40) (0.30) 0.60± ± ± ± ±0.30 (Exposed part of the conductor) 0.90± ± ± max. 0.90± ±0.02 Cutting direction* * Cut FPC from the copper foil side 0.60±0.02 (Pitch) (Contact width) to the reinforcing plate side. 3.00±0.50 (Support plates) (3.15) (2.95) (1.84) (1.35) (FPC insertion depth) General tolerance: ±0.3 Each mentioned dimension is at the stage of initial delivery. Number of pins/ dimension A B C D Number of pins/ dimension A B C Active optical connector FPC/FFC connectors High current connectors 137 ACCTB47E T

139 FPC connectors Y3B/Y3BW (0.3mm pitch) High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping Leading direction after packaging Tape I Tape II +0.3 (A 0.1) (A±0.3) (B) (1.75) (1.75) (B) (2.0) (4.0) (8.0) Y3B Dimension table (Unit: mm) Number of pins Type of taping A B C Quantity per reel 7 to 17 Tape I , to 45 Tape I ,000 51, 61 Tape II , Tape II ,000 Y3BW Dimension table (Unit: mm) Number of pins Type of taping A B C Quantity per reel 11 Tape I , Tape I , Tape II ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress 1.50 dia Type (2.0) (4.0) Y3B (8.0) 1.50 dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) 380 dia. (C±1) Taping reel Top cover tape Label Y3BW Embossed carrier tape Embossed mounting-hole 138 ACCTB47E T

140 FPC connectors Y3B/Y3BW (0.3mm pitch) NOTES 1. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of contact pitch 0.4 mm, 0.5 mm or 0.6 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use our recommended patterns basically. Y3B No. of pins: Odd number Recommended PC board pattern (mounting layout) (TOP VIEW) 0.60± ± ± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 120μm (Front terminal portion opening area ratio: 96%) (Back terminal portion opening area ratio: 96%) 0.60± ± ± ± ± ± ± ± ± ± ±0.01 No. of pins: Even number (8 pin contacts) Recommended PC board pattern (mounting layout) (TOP VIEW) 0.30± ± ± ± ±0.03 Recommended metal mask pattern Metal mask thickness: When 120μm (Front terminal portion opening area ratio: 96%) (Back terminal portion opening area ratio: 96%) 0.30± ± ± ± ± ± ± ± ± ± ±0.01 Y3BW Recommended PC board pattern (mounting layout) (TOP VIEW) 0.60± ± ± ±0.03 : Insulation 0.23± ±0.03 Recommended metal mask pattern Metal mask thickness: When 120μm (Front terminal portion opening area ratio: 96%) (Back terminal portion opening area ratio: 96%) 0.60± ± ± ± ±0.01 Regarding cautions for use, please refer to page ± ± ± ± ± ±0.01 Please refer to the latest product specifications when designing your product. High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors 139 ACCTB47E T

141 Y3BC (0.3mm pitch) Narrow pitch connectors High current connectors New Y3BC For FPC FPC connectors (0.3mm pitch) Back lock FEATURES 1. Slim (width: 3.20 mm, including the lever) and low profile design (height: 1.0 mm) Unit: mm Y3BC 5. Man-hours of assembly time can be reduced by delivering the connectors with their levers opened. 6. While featuring back lock structure, lever open/close operation is possible without an FPC inserted. Breakage troubles during transport of modules or setting devices are prevented. Without an FPC inserted Active optical connector FPC/FFC connectors RoHS compliant ORDERING INFORMATION 36: FPC Connector Y3BC (0.3 mm pitch) Back lock Number of pins (2 digits) Function 3: Top and bottom double contacts Surface treatment (Contact portion / Terminal portion) 5: Au plating/au plating (Ni barrier) 2. Mechanical design freedom is achieved with double top and bottom contacts. Top and bottom double contacts eliminate the need of using different connectors (with either top or bottom contacts) depending on the FPC wiring conditions. 3. Easy-to-handle back lock structure 4. FPC insertion displacement prevention Constructed to make positional displacement difficult by surrounding the four sides on the FPC inlet side with wall molding AYF *Opening and closing of lever is limited to five times under same conditions and removal life. Please do not perform reflow heating when lever is closed or partly closed. 7. Wiring patterns can be placed underneath the connector. 8. Ni barrier with high resistance to solder creepage. APPLICATIONS Mobile devices, such as cellular phones, smartphones, digital still cameras and digital video cameras. 140 ACCTB77E T

142 Y3BC (0.3mm pitch) PRODUCT TYPES Y3BC Height Number of pins Part number 1.0 mm 25 AYF AYF AYF Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office. 2. Please contact our sales office for connectors having a number of pins other than those listed above. Inner carton (1-reel) SPECIFICATIONS 1. Characteristics The followings show specifications, when using an applicable FPC (thickness 0.20 mm) Item Specifications Conditions Rated current 0.2A/pin contact Rated voltage 50V AC/DC Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight 2. Material and surface treatment Part name Material Surface treatment Molded portion Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) Contact Copper alloy Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Packing Outer carton 5,000 pieces 10,000 pieces Insulation resistance Min. 1,000MΩ (Initial) Using 250V DC megger (applied for 1 min.) Dielectric strength Contact resistance FPC holding force Ambient temperature Storage temperature Thermal shock resistance (with FPC mated) Humidity resistance (with FPC mated) Saltwater spray resistance (with FPC mated) H2S resistance (with FPC mated) Soldering heat resistance 150V AC for 1 min. Max. 100mΩ 25 pins: Min. 0.20N/pin contact pin contacts (Initial) 31, 39 pins: Min. 0.18N/pin contact pin contacts (Initial) 55 C to +85 C 55 C to +85 C (Products only) 40 C to +50 C (Emboss packaging) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 48 hours, contact resistance max. 100mΩ No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Based on the contact resistance measurement method specified by JIS C Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed No icing or condensation. Conformed to MIL-STD-202F, method 107G Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Peak temperature: 260 C or less Reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron Insertion and removal life 20 times Repeated insertion and removal: min. 10 sec./time Y3BC 25 pin contacts: 0.05 g Order Temperature ( C) Time (minutes) Max Max High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors 141 ACCTB77E T

143 Y3BC (0.3mm pitch) Narrow pitch connectors DIMENSIONS (Unit: mm) Y3BC 1.67 (Suction area) A 0.60±0.10 (Terminal pitch) (1.70) (FPC insertion depth) (3.50) High current connectors 0.30±0.10 (Contact pitch) 0.60±0.10 (Terminal pitch) 1.00±0.10 (1.47) Terminal coplanarity Active optical connector FPC/FFC connectors (0.08) (0.10) B±0.02 C±0.20 Y3BC RECOMMENDED FPC DIMENSIONS (Finished thickness: t = 0.2±0.03) The conductive parts should be based by Ni plating and then Au plating. A± ±0.07 B± ±0.07 C± ±0.02 (Pitch) 0.30±0.02 (Pitch) (Contact width) 2-R0.20 max. 0.10± ± ± ± ±0.02 (Pitch) (0.34) (0.30) 0.30± ± ± ± ± ± ±0.30 (Exposed part of the conductor) 0.20± min. (Reinforcing plate) (Contact width) Cutting direction* *Cut FPC from the copper foil side to the reinforcing plate side. General tolerance: ±0.3 Each mentioned dimension is at the stage of initial delivery. Number of pins/ dimension A B C Number of pins/ dimension A B C ACCTB77E T

144 Y3BC (0.3mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping Leading direction after packaging Y3BC Dimension table (Unit: mm) Connector orientation with respect to embossed tape feeding direction Direction of tape progress NOTES Tape I +0.3 (A 0.1) (B) (1.75) (2.0) (4.0) (8.0) 1.50 dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole Number of pins Type of taping A B C Quantity per reel 25 to 39 Tape I ,000 Type 1. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of contact pitch 0.4 mm, 0.5 mm or 0.6 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use our recommended patterns basically. Recommended PC board pattern (mounting layout) (TOP VIEW) 0.60± ± ± ± ± ± ± ± dia. (C±1) Y3BC Recommended metal mask pattern Metal mask thickness: When 120μm (Front terminal portion opening area ratio: 53%) (Back terminal portion opening area ratio: 54%) 0.60± ± ± ± ± ± ±0.01 (2.59) 3.60±0.01 Label Regarding cautions for use, please refer to page 178. Please refer to the latest product specifications when designing your product. High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors 143 ACCTB77E T

145 FPC connectors Y4BH (0.4mm pitch) Narrow pitch connectors High current connectors Active optical connector FPC/FFC connectors New RoHS compliant ORDERING INFORMATION 41: FPC Connector Y4BH (0.4 mm pitch) Back lock 100Ω matched Differential impedance 42: FPC Connector Y4BH (0.4 mm pitch) Back lock 85Ω and 90Ω matched Differential impedance Number of pins (2 digits) Contact direction 3: Top and bottom double contacts Surface treatment (Contact portion / Terminal portion) 5: Au plating/au plating (Ni barrier) For FPC FPC connectors (0.4mm pitch) Back lock FEATURES 1. Differential impedance matching (100, 90, 85 Ω) compliant with various high-speed transmission standards. FPC connector for high-speed transmission. By matching the differential impedance, this FPC connector offers excellent highspeed differential transmission characteristics and supports all highspeed transmission standards. (when pin assignments are GSSG). Differential impedance, Ω Connector FPC Tr = 40ps (20-80%) Time, ps 2. Mechanical design freedom is achieved with 0.4 mm pitch, 1.0 mm height and double top and bottom contacts. AYF 3 5 Y4BH More freedom in mechanical design With top and bottom contact construction and no pin assignments, this FPC connector contributes to customer design freedom. FPC insertion displacement prevention Constructed to make positional displacement difficult by surrounding the four sides on the FPC inlet side with wall molding Easy-to-handle back lock structure. 4. Man-hours of assembly time can be reduced by delivering the connectors with their levers opened. APPLICATIONS Compact electronic devices such as PCs, tablet PCs, digital still cameras and digital video cameras Unit: mm 144 ACCTB67E T

146 FPC connectors Y4BH (0.4mm pitch) PRODUCT TYPES Height Differential impedance Number of pins Part number 1.0 mm 85Ω and 90Ω types 100Ω type 40 AYF AYF AYF AYF Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office. 2. Please contact our sales office for connectors having a number of pins other than those listed above. Packing Inner carton (1-reel) Outer carton 5,000 pieces 10,000 pieces Narrow pitch connectors SPECIFICATIONS 1. Characteristics The followings show specifications, when using an applicable FPC (thickness 0.30 mm) Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight Item Specifications Conditions Rated current 0.3A/pin contact Rated voltage 50V AC/DC Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Dielectric strength Contact resistance Differential impedance FPC holding force Ambient temperature Storage temperature Thermal shock resistance (with FPC mated) Humidity resistance (with FPC mated) Saltwater spray resistance (with FPC mated) H2S resistance (with FPC mated) Soldering heat resistance 250V AC for 1 min. Max. 100mΩ 85Ω and 90Ω types 100Ω type 85Ω±10Ω (Connector part) 90Ω±10Ω (Connector part) 100Ω±15Ω (Connector part) Min. 0.10N/pin contact pin contacts (initial) 55 C to +85 C 55 C to +85 C (Product only) 40 C to +50 C (Emboss packaging) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 48 hours, contact resistance max. 100mΩ No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Based on the contact resistance measurement method specified by JIS C Differential signal Rise times (Tr): 40 ps (20% to 80%) (FPC and PC board: Differential impedance 85Ω or 90Ω controlled.) Differential signal Rise times (Tr): 40 ps (20% to 80%) (FPC and PC board: Differential impedance 100Ω controlled.) Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed No icing or condensation. Conformed to MIL-STD-202F, method 107G Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Peak temperature: 260 C or less Reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron Insertion and removal life 20 times Repeated insertion and removal: min. 10 sec./time 50 pin contacts: 0.10 g Order Temperature ( C) Time (minutes) Max Max Material and surface treatment Part name Material Surface treatment Molded portion Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) Contact Copper alloy Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Active optical connector FPC/FFC connectors High current connectors 145 ACCTB67E T

147 FPC connectors Y4BH (0.4mm pitch) DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: Narrow pitch connectors High current connectors CAD Data 0.40±0.10 A B±0.20 Terminal coplanarity 0.1 (Contact and soldering terminals) 1.00±0.10 (0.30) (0.50) (3.70) (1.60) (Suction area) (1.73) (1.50) (FPC insertion depth) (0.15) Active optical connector FPC/FFC connectors (0.10) Recommended FPC dimensions (Finished thickness: t = 0.3±0.03) The conductive parts should be based by Ni plating and then Au plating. Normal FPC Impedance matching FPC (A+0.8)±0.05 A± ± ± ±0.03 R0.20± min. (Exposed part of the conductor) C± ± min. (Reinforcing plate) Cutting direction* *Cut FPC from the copper foil side to the reinforcing plate side. (0.35) 0.40± ±0.03 (A+0.8)±0.05 A± max. Please inquire separately for details about impedance matching FPC. Each mentioned dimension is at the stage of initial delivery. Number of pins/ dimension A B C R0.20± ± ± ± ±0.15 Please match 100, 90 and 85Ω differential impedances. 0.30± min. (Reinforcing plate) Cutting direction* *Cut FPC from the copper foil side to the reinforcing plate side. Number of pins/ dimension A ACCTB67E T

148 FPC connectors Y4BH (0.4mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping Dimension table (Unit: mm) Connector orientation with respect to embossed tape feeding direction Direction of tape progress NOTES Leading direction after packaging (A±0.3) (C) (B) (1.75) (2.0) (8.0) (4.0) 1.50 dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) Number of pins A B C D Quantity per reel , ,000 Type 1. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of contact pitch 0.4 mm, 0.5 mm or 0.6 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use our recommended patterns basically. 380 dia. (D±1) 0.40± ± ± ±0.01 Y4BH Taping reel Top cover tape Label Embossed carrier tape Embossed mounting-hole Recommended PC board pattern (mounting layout) 0.40± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal portion opening area ratio: 86%) (Terminal portion opening area ratio: 100%) 0.40± ± ± ± ± ± ± ± ±0.01 High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors Regarding cautions for use, please refer to page 178. Please refer to the latest product specifications when designing your product. 147 ACCTB67E T

149 FPC connectors Y5B/Y5BW (0.5mm pitch) Narrow pitch connectors High current connectors Active optical connector FPC/FFC connectors Y5B/Y5BW * RoHS compliant FEATURES 1. Low profile (height: 1.0 mm), space saving back lock type with improved lever operability. 2. Mechanical design freedom achieved by top and bottom double contacts pin contacts (Y5B: minimum) ORDERING INFORMATION Y5B 53: FPC Connector Y5B (0.5 mm pitch) Back lock Unit: mm Number of pins (2 digits) Function 3: Top and bottom double contacts Surface treatment (Contact portion / Terminal portion) 5: Au plating/au plating (Ni barrier) Y5BW 53: FPC Connector Y5BW (0.5 mm pitch) Back lock Number of pins (2 digits) Function 6: Top and bottom double contacts, lock holding type Surface treatment (Contact portion / Terminal portion) 5: Au plating/au plating (Ni barrier) T: Suction area expansion type For FPC/FFC* FPC connectors (0.5mm pitch) Back lock 3. FPC insertion displacement prevention Constructed to make positional displacement difficult by surrounding the four sides on the FPC inlet side with wall molding 4. Wiring patterns can be placed underneath the connector. 5. Man-hours for assembly can be reduced by delivering the connectors with their levers opened. 6. Y5BW features lock holding type, including a structure to temporarily hold the FPC and a higher holding force. The FPC holding contacts located on both ends of the connector facilitate positioning of FPC and further enhance the FPC holding force. AYF AYF Structure to lock notches on both ends of the FPC with holding contacts T Y5B/Y5BW Applicable FPC shape With notches (1) The inserted FPC can be temporarily held until the lever is closed. (2) When the lever is closed, the holding contacts lock the FPC by its notches, enhancing the FPC holding force. * (Y5BW is compatible with FPC only.) 7. Supports V-by-One HS. APPLICATIONS A wide range of digital equipment, including mobile phones, smartphones, PCs, digital still camera, and digital video camera. Ideal for touch panels and LCD backlights, which require connectors with a small number of pins. *V-by-One HS: An interface for the next-generation high-speed signals developed by THine Electronics, Inc. V-by-One is a registered trademark of THine Electronics, Inc. 148 ACCTB1E T

150 FPC connectors Y5B/Y5BW (0.5mm pitch) PRODUCT TYPES Height 1.0 mm Y5B Y5BW Packing Number of pins Part number Number of pins Part number Inner carton (1-reel) Outer carton 4 AYF AYF530265T 5 AYF AYF530365T 6 AYF AYF530465T 8 AYF AYF530665T 10 AYF AYF530865T 12 AYF AYF531065T 14 AYF AYF531265T 16 AYF AYF531465T 24 AYF AYF532265T 28 AYF AYF532665T 30 AYF AYF532865T 32 AYF AYF533065T 34 AYF AYF533265T 40 AYF AYF533865T 42 AYF AYF534065T 50 AYF AYF534865T Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact our sales office for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics The followings show specifications, when using an applicable FPC (thickness 0.30 mm) Item Specifications Conditions Rated current 0.5A/pin contact (Except for holding contact) Rated voltage 50V AC/DC Electrical characteristics Mechanical characteristics Environmental characteristics Lifetime characteristics Unit weight 5,000 pieces 10,000 pieces Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.) Dielectric strength Contact resistance FPC holding force Ambient temperature Storage temperature Thermal shock resistance (with FPC mated) Humidity resistance (with FPC mated) Saltwater spray resistance (with FPC mated) H2S resistance (with FPC mated) Soldering heat resistance 250V AC for 1 min. Max. 100mΩ Y5B: Min. 0.2N/pin contact pin contacts (initial) Y5BW: Min. 0.2N/pin contact pin contacts + 2.0N (initial) 55 C to +85 C 55 C to +85 C (product only) 40 C to +50 C (emboss packing) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 48 hours, contact resistance max. 100mΩ No short-circuiting or damage at a detection current of 1 ma when the specified voltage is applied for one minute. Based on the contact resistance measurement method specified by JIS C Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed No icing or condensation. Conformed to MIL-STD-202F, method 107G Conformed to IEC Bath temperature 40 C±2 C, humidity 90% to 95% R.H. Conformed to IEC Bath temperature 35 C±2 C, saltwater concentration 5%±1% Bath temperature 40 C±2 C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Peak temperature: 260 C or less Reflow soldering 300 C within 5 sec. 350 C within 3 sec. Soldering iron Insertion and removal life 20 times Repeated insertion and removal: min. 10 sec./time Y5B 50 pin contacts: 0.16 g 2. Material and surface treatment Part name Material Surface treatment Molded portion Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) Order Temperature ( C) Time (minutes) Max Max Contact Copper alloy Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Holding contact (Only Y5BW) Copper alloy Terminal portion; Base: Ni plating, Surface: Au plating Soldering terminals Copper alloy Base: Ni plating, Surface: Au plating High current connectors Narrow pitch connectors Active optical connector FPC/FFC connectors 149 ACCTB1E T

151 FPC connectors Y5B/Y5BW (0.5mm pitch) Narrow pitch connectors High current connectors Active optical connector FPC/FFC connectors DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: Y5B A CAD Data General tolerance: ± ±0.10 (0.15) (0.15) 0.50± ±0.03 B±0.20 C±0.20 (A+1)±0.05 A±0.03 (FPC) 0.35±0.03 (FFC) 0.30±0.03 (0.32) 1.00±0.10 Terminal coplanarity 0.1 (0.30) (0.50) (Contact and soldering terminals) Y5B RECOMMENDED FPC/FFC DIMENSIONS (Finished thickness: t = 0.3±0.03) The conductive parts should be based by Ni plating and then Au plating. Y5BW CAD Data 0.50±0.10 A Holding contacts (The holding contacts cannot be used as conductors.) (0.15) (0.15) (0.15) B±0.20 D±0.20 C±0.20 R0.20± min. (Exposed part of the conductor) 0.30± min. (Reinforcing plate) Cutting direction* * Cut FPC from the copper foil side to the reinforcing plate side. Terminal coplanarity 0.1 (Contact, holding contact and soldering terminals) (0.32) (0.32) 1.00±0.10 (0.30) (0.50) (3.70) (1.76) (1.50) (FPC insertion depth) 1.60 (Suction area) (1.76) (1.50) (FPC insertion depth) 1.60 (Suction area) Each mentioned dimension is at the stage of initial delivery. Number of pins/ dimension A B C General tolerance: ±0.3 Number of pins/ dimension A Each mentioned dimension is at the stage of initial delivery. Number of pins/ dimension A B C D ACCTB1E T

152 FPC connectors Y5B/Y5BW (0.5mm pitch) Y5BW RECOMMENDED FPC DIMENSIONS (Finished thickness: t = 0.3±0.03) The conductive parts should be based by Ni plating and then Au plating. R0.25 max. R0.25 max. 1.00±0.07 Notches type (A+2)±0.05 A± ±0.03 (Pitch) 0.35±0.03 *1 0.70±0.05 R0.20±0.05 R0.20±0.05 R0.20± ± ± min. (Conductor exposed area) *1 Not interfere conductor 0.30± min. (Reinforcing plate) Cutting direction (*2) (*2) Cut FPC from the copper foil side to the reinforcing plate side. Number of pins/ dimension A Narrow pitch connectors High current connectors EMBOSSED TAPE DIMENSIONS (Unit: mm) Specifications for taping Leading direction after packaging Tape I +0.3 (A 0.1) Y5B Dimension table (Unit: mm) (A±0.3) (C) (1.75) (B) (1.75) (2.0) (4.0) (8.0) Tape II (2.0) (4.0) Number of pins Type of taping A B C D Quantity per reel 4 to 10 Tape I , to 30 Tape I , to 34 Tape II , to 50 Tape II ,000 Y5BW Dimension table (Unit: mm) Number of pins Type of taping A B C D Quantity per reel 2 to 8 Tape I , to 28 Tape I , to 32 Tape II , to 48 Tape II ,000 Connector orientation with respect to embossed tape feeding direction Direction of tape progress (B) dia. Type (8.0) 1.50 dia Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) 380 dia. (D±1) Y5B/Y5BW Taping reel Top cover tape Label Embossed carrier tape Embossed mounting-hole Active optical connector FPC/FFC connectors 151 ACCTB1E T

153 FPC connectors Y5B/Y5BW (0.5mm pitch) Narrow pitch connectors High current connectors NOTES 1. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of contact pitch 0.4 mm, 0.5 mm or 0.6 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use our recommended patterns basically. Y5B/Y5BW Recommended PC board pattern (mounting layout) (TOP VIEW) 0.50± ± ±0.05 Regarding cautions for use, please refer to page 178. Please refer to the latest product specifications when designing your product. Active optical connector FPC/FFC connectors 0.40± ± ±0.05 Recommended metal mask pattern Metal mask thickness: When 120μm (Terminal portion opening area ratio: 57%) (Soldering terminal portion opening area ratio: 100%) 0.40± ± ± ± ± ± ± ± ± ± ACCTB1E T

154 Active Optical Connector V Series Vertical insertion type Active Optical Connector V Series FEATURES 1. Plug connector is equipped with electrical/optical conversion function (bi-direction, Max. 6 Gbps transmission). Plug (E/O conversion) Electrical signal (Differential signal) Optical fiber Optical signal Receptacle Electrical signal (Differential signal) [Transmitter] <E/O Converter> Laser diode IC [Receiver] <O/E Converter> Photo diode IC O/E: Optical/Electrical conversion E/O: Electrical/Optical conversion 2. High speed and wide data rate transmission possible: 20 Mbps to 6 Gbps 3. Integration is possible to a small apparatus with compact, bi-directional transmission device. 4. Noise reduction and electrical isolation easily achieved. APPLICATIONS Recommended for the following high speed device transmission or electrical isolation applications BLOCK DIAGRAM The differential input signal is converted to an optical signal by the Laser Diode Driver (LDD) and Laser Diode (LD) in the plug. The optical signal is transmitted through the optical fiber and reproduced as differential output signal by the Photo Diode (PD) and Trans Impedance Amplifier (TIA). Differential output Differential input TIA Measuring equipment Printer Industrial robots, etc. LD LDD LD PD TIA Optical fiber Image processing instrument Medical equipment LDD: Laser Diode Driver, LD: Laser Diode, TIA: Trans Impedance Amplifier, PD: Photo Diode LD LDD Differential input Differential output 153 ACCTB69E T

155 Active Optical Connector V Series PRODUCT TYPES 1. Integrated cable and plug 2. Receptacle (PC board side) SPECIFICATIONS 1. Rated specifications Notes: 1. When performing AC coupling, the input common mode voltage is 0 to 1.8 V. 2. Input data pattern is PRBS Rjpp is equivalent to BER Use conditions Transmission rate Transmission specifications Cable length Part No. Packing quantity 20 Mbps to 6 Gbps Bi-direction, 1 channel Receptacle Part No. AXK6S20447M1 AXK6S20447M3 50 mm AYG4V10565M1 300 mm AYG4V13065M1 1 m AYG4V1A065M1 50 mm AYG4V10565M3 300 mm AYG4V13065M3 1 m AYG4V1A065M3 Packing quantity 20 pieces 200 pieces (reel) 10 pieces 100 pieces Item Min. Typical Max. Unit Condition Supply voltage V Power consumption 230 mw Bi-direction 1channel Transmission rate Gbps 8b/10b coding Input/output characteristic impedance Ω Differential input voltage mv Input common mode voltage mv Note 1) Input total jitter 0.24 UI Note 2) Input rise-time 0.30 UI Input fall-time 0.30 UI Differential output voltage mv Note 2) Output common mode voltage mv Note 2) Output rise-time 0.50 UI Note 2) Output fall-time 0.50 UI Note 2) Output total jitter 0.60 UI Note 2), Dj + Rjpp Item Performance Remarks Operating ambient temperature 0 C to +70 C No icing or condensation. Storage temperature -20 C to +50 C (Packaged form) -20 C to +85 C (Product only) No icing or condensation. Relative humidity 20% to 80%RH No condensation. Electrical static discharge 2kV Applied 3 times on the external shell C = 100pF, R = 1.5kΩ C = 150pF, R = 330Ω Immunity Conformed to IEC standard Electromagnetic interference Conformed to VCCI class B standard 154 ACCTB69E T

156 Active Optical Connector V Series 3. Materials specifications Component name Materials Specifications and Remarks Shell Copper alloy Nickel plating Bushing Elastomer Black Optical fiber Silica, UV-cured resin Cross section: mm, 2 cores Connector LCP resin, copper alloy Terminal (Au-plating on Ni-base) Photoelectric conversion PC board Glass-fibered epoxy, epoxy resin, etc. IC CMOS LD GaAs Photo diode GaAs TERMINAL LAYOUT Receptacle terminal No Receptacle Terminal layout diagram (Viewed from the top, receptacle as transparent) Optical fiber side No. Name Wiring 1 Open No connection 2 GND 3 Differential output Differential output 4 Differential output + Differential output 5 GND 6 Open No connection 7 Open No connection 8 Power Supply 3.3V DC 9 Power Supply 3.3V DC 10 GND 11 Open No connection 12 GND 13 Differential input Differential input 14 Differential input + Differential input 15 GND 16 GND 17 Power Supply 3.3V DC 18 Power Supply 3.3V DC 19 Power Supply 3.3V DC 20 GND 155 ACCTB69E T

157 Active Optical Connector V Series DIMENSIONS (Unit: mm) 1. Integrated cable and plug 2. Receptacle Plug and receptacle are mated 0.50± ± External dimensions (3.9) External dimensions General tolerance: ± ± ±0.03 C (Suction face) 4.20 Lot No. marking Note ±0.03 Note 1: The terminal close to the portion to be soldered have nickel barriers (except nickel portions) L (1.10) 2.80 (1.10) General tolerance: ± L: Cable length Tolerance Unit (mm) 50 mm 300 mm 1 m Part No. AYG4V10565 AYG4V13065 AYG4V1A Mated height of plug and receptacle 156 ACCTB69E T

158 Active Optical Connector V Series EMBOSSED TAPE DIMENSIONS (Unit: mm) Receptacle: Embossed tape packaging Specifications for taping (In accordance with JIS C 0806:1990. However, not applied to the mounting-hole pitch of some connectors.) Receptacle orientation with respect to embossed tape feeding direction Direction of tape progress Leading direction after packaging Type 24.0± dia. Specifications for the plastic reel (In accordance with EIAJ ET- 7200B.) 25.4±1 380 dia. Receptacle Label Taping reel Top cover tape Embossed carrier tape Embossed mounting-hole Regarding cautions for use, please refer to page 181. Please refer to the latest product specifications when designing your product. 157 ACCTB69E T

159 Active optical connectors FPC/FFC connectors High current connectors Narrow pitch connectors Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 158 Panasonic Corporation 2016

160 3D Packaging Devices MID Solutions Technology introduction MID Solutions MIPTEC 3D Packaging Devices LDS 3D Packaging Devices MID Package AAM11 Series for IR LED Module Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 159 Panasonic Corporation 2016 ACCTB93E T

161 MID Solutions Two MID technologies contribute to the creation of added value in a multitude of devices. We offer our proprietary MIPTEC and LDS MID (Three-dimensional injection molded circuit component) technologies to form circuits on the surfaces of injection molded components. We do this through custom orders to meet the diverse needs of our customers who seek miniaturization, feature advancement and improve efficiency in their devices. Measurement for Proximity Sensor MEMS for Camera Module Mobile Medical Automotive Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 160 Panasonic Corporation 2016 ACCTB94E T

162 What is MID? MID: Molded Interconnect Devices We have achieved 3D packaging devices in which fine patterning and bare chip mounting is possible through the advancement of our proprietary surface activation technology, laser patterning process, and other methods. MIPTEC and LDS use differentiation Coarse Pattern width (μm) Molded components with an electrical circuit directly formed on 3D surfaces. Molded component Circuit 3D-MID We offer the best solution to match component size and required specifications. LDS MIPTEC LDS Proximity sensor Gyro sensor Microprojector Gesture sensor Camera module Flash module Conductive particles in molded components are exposed to laser to form fine patterns. Selecting a molding material that differs from MIPTEC, we can produce larger molded components. Product chass (Large components, etc.) Feature integration (mechanical parts + electrical circuits) Component and device miniaturization Reduction in number of parts and substrates Reduced assembly time Miniaturization, fine circuit components, and easy bare chip mounting Large components, much freedom in material selection (PA, LCP, PC, etc.) LDS 50 MIPTEC Dense Size (mm) Small Large Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 161 Panasonic Corporation 2016 ACCTB94E T

163 MIPTEC 3D Packaging Devices What is? ( Microscopic Integrated Processing Technology ) Through the advancement of MID technology using our proprietary surface activation technology and laser patterning, among others, we have achieved 3D packaging devices that make fine patterning and bare chip mounting a possibility. Three achievable merits 1 Fine circuit pattern Line/Space = 50μm/50μm patterning is possible. Also, patterns can be changed by simply changing the program. 50μm 2 Improves mounting Wire-bonding and flip-chip mounting, etc. Direct mounting of chips is achieved 3 Improves reflectance Component image Wire-bonding mounting Possessing high reflection characteristics, it can be used as an optical reflection surface. MIPTEC Reflection characteristic (N = 5, average values) Radiation intensity: % (with the same making current) Other MID product 100 Radiation intensity: approx. 25 % 50 (with the same radiation intensity) Making current, ma Radiation intensity, μw UP DOWN Fine patterning and rapid pattern changes. Laser patterning process New technology enables fine pattern electrical circuits on six molded surfaces. Extra smoothness in the pattern section Achieved by surface activation processing and original material development MIPTEC (Ra0.1μm) Other MID example (Ra0.8μm) Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 162 Panasonic Corporation 2016 ACCTB94E T

164 Greater variety of device shapes with 3D molding circuits Achieve mechanisms designs that were unthinkable using previous methods. For example, even these shapes can be designed! Integrate Miniaturization through the integration of multiple components Curved surface Form circuits on curved surfaces Positioning Positioning bosses and structure of ribs Retain Tab for securing, etc. Added value with circuit pattern using proprietary technology Point Emitting section Smaller, thinner, and more detailed Miniaturization by component internalization Miniature shapes are possible using fine patterns (from 50 μm) that were not possible using previous construction methods. Camera modules for smartphone Receiving section Camera modules for medical endoscopes Point Bend Form circuits on folding and step structure Improves reflectance and mounting Integration of component mounted circuits with structures (reflectors and snap fit structures, etc.). Wire-bonding mounting Inductive proximity sensor for smartphone Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 163 Panasonic Corporation 2016 ACCTB94E T

165 LDS 3D Packaging Devices )LDS What is? ( Laser Direct Structuring It was difficult with MIPTEC to meet the following needs: Need for increased selection of molding materials Need for larger molded components Need to form isolated circuits Now covering these needs, we can offer devices that satisfy customer s diverse requirements. Abundant variation in materials Various molding materials are available from material manufacturers, such as PA, LCP, and PC. Low shrinkage ratio Superior dimensional stability Also supports large components Supports isolated circuits PC (Polycarbonate) Building a process that also supports large components, we have made it possible to form circuits on product chassis, etc., which has been very difficult up to now. PA (Polyamide) Material variation LCP (Liquid crystal polymer) Reflow heat resistance High circuit adhesion force High frequency characteristics Reflow heat resistance Please consult us regarding what is possible or not. Supports a maximum of 200 mm 400 mm 150 mm. Isolated circuits and be formed using a nonelectrolytic plating process. If the circuit thickness is thin (down to 10 μm), isolated circuits can be formed using the nonelectrolytic plating process. *Since electroplating does not thicken the membrane, a feeder circuit is not required for plating. Feeder circuit With feeder circuit (electroplating) No feeder circuit (nonelectrolytic plating) Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 164 Panasonic Corporation 2016 ACCTB94E T

166 Proposed solutions made possible by LDS Point Cut component count (molded component and FPC is achieved with LDS units) Improved ability to design (circuit wiring possible on complex curved surfaces) Reduced assembly steps LDS Direct circuit formation onto inner side of product chassis Previously difficult, free and direct circuit formation onto curved surfaces is possible. This greatly increases product design freedom. Application example (automotive) On-vehicle antenna Shift lever Soldered joint Soldering joint required with PC boards held at a right angle. Before (image) Soldered joint Partial shaving and bending of rigid flexible PC boards or PC boards Necessary to embed into chassis with structure that enabled holding of the PC board angle Thanks to integral structure, simplification and abbreviation of assembly and soldered joint processes are possible. After (image) Holding of PC board angle and assembly not required thanks to integration with chassis. Before (image) After (image) Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 165 Panasonic Corporation 2016 ACCTB94E T

167 Comparison of MID processes MIPTEC Primary molding Metalizing and laser patterning Plating and etching Molds one set LDS Molds one set 2-shot method Molds two sets Circuit pattern can be changed by simply changing the CAD data. Fine patterns are possible by selectively removing only metalized part. (L/S = 50/50 μm) Circuit pattern can be changed by simply changing the CAD data. The metal particles in the molded component are made conductive and a circuit pattern is formed. (L/S = 150/200 μm) Primary molding Laser patterning Plating Die correction/re-construction is required for the secondary molding in order to change the circuit pattern. Pattern width is limited by the working surface of the die. (L/S = 150/150μm) From Inquiries to Mass Production Process name Technical explanations about MIPTEC and LDS (design rules, restrictions) (NDA signing) Conceptual drawing and quantity information (Customer Panasonic) Feasibility study Circuit forming process and characteristics Primary molding Secondary molding Catalyst application Melting the secondary molded part Plating on the catalyst (Forming the shapes other than the pattern) (Catalyst remains in the pattern) Prototype die production and prototype sample submission Prototype sample evaluation Mass production specifications determination (Specifications and drawing submission) Mass production price quotation Panasonic supported Prototype die manufacturing and sample preparation lead-time: Approx. 1 month 5 Prototype price quotation and brief price quotation of mass-production 12 Mass production die manufacturing Mass production die manufacturing lead-time: Approx. 2 months 6 Starting specific reviews (Both parties) 13 Start mass production process, evaluation of mass production products 7 Submission of prototype drawing and specifications (Panasonic Customer) 14 Mass production commencement *Please contact our sales office for more details. Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 166 Panasonic Corporation 2016 ACCTB94E T

168 Specifications Specifications General process Process Molding material Basic sheet size (L W) Max. component size (L W t) Number of required molding dies Positional accuracy of mold and circuit Pattern change Pattern pitch Plating specifications (standard) Circuit surface roughness Solderability Wire bonding ability Flip chip mountability Molding material Item Circuit adhesion strength (initial) Specific gravity Moisture absorption rate Resistance to soldering heat Deflection temperature under loading (1.82MPa) Linear coefficient of thermal expansion (MD/TD) Molding shrinkage rate (MD/TD) Tensile strength Elongation Bending strength Bending elasticity Specific dielectric constant Dielectric loss tangent MIPTEC LDS Resin (PPA) Resin (PA/LCP/PC, etc.) 30 65mm/ 50 70mm/ mm Possible even without sheet shape mm mm One set (Molded die only) Normal mode: ±0.05mm or less, High accuracy mode: ±0.03mm or less ±0.05mm or less Possible by changing the laser patterning data (However, mold modification is required when changing component shape.) Line / Space = 50/50μm Line / Space = 150/200μm Cu: 10μm, Ni: 6μm, Au: 0.1μm *Thickness can be changed. For this and other conditions, please consult us. Ra 0.1 to 0.4μm Ra 0.8 to 2.0μm Possible Possible Possible Possible with limitations to specifications Possible Not possible * The values shown above are typical values, not guaranteed values. The values vary by molding condition etc. * Please consult us for other molding and plating materials. Design guidelines Unit N/mm Mass% C C X10-5 C % MPa % MPa GPa Cross section of through hole MIPTEC d Molding material for MIPTEC Polyphthalamide (PPA) 0.39 or higher / / (3GHz) (3GHz) øc øc (A) Singular cone (B) Dual cone *If plating will not be performed, straight through-holes are possible. Please consult us. LDS øc Min pattern width (a) Min. pattern spacing (b) Min through-hole diameter (c) Max aspect ratio (d/c) Min pin diameter (e) Max pattern angle (f) Min molding thickness 50µm 50µm 0.25mm 2 0.1mm 90 Min.0.3mm (Partly 0.15 mm) 150µm 200µm 0.25mm (A) Singular cone 1 (B) Dual cone 2 0.1mm (Plating e : from 0.1 mm to 30 taper) 90 Min.0.3mm (Partly 0.15 mm) *The values shown above are typical values. Please consult us for concrete form. *A circuit pattern can be formed on the bottom surface via a through-hole. *Delivery is made in sheet form or individual pieces. Panasonic Corporation Electromechanical Control Business Division industrial.panasonic.com/ac/e/ 167 Panasonic Corporation 2016 ACCTB94E T

169 MID Package AAM11 Individual piece (cut shape) RoHS compliant ORDERING INFORMATION For Infrared Ray LED Module MID Package FEATURES 1. Realization of small, low-profile reflector package through application of our unique MID* technology (MIPTEC). Individual piece: mm <Cross section of package> IR LED chip Concave reflector structure (Au-plating) Resin molded component (Black) Enabled reduction in profile to under 1 mm Note: LED chip to be prepared and mounted separately by the customer. * MID (Molded Interconnect Devices): Molded components with an electrical circuit formed on 3D surfaces. AAM11 2. A concave reflector structure with good directivity and increased light extraction efficiency due to bright plating specifications contributes to decreased module power consumption * The graph below uses typical values, and details will vary according to the LED chip specifications. Radiation intensity, μw When the same making current Radiation intensity: approx. 30% rise MIPTEC (N = 5, average values) Other MID product When the same radiation intensity Making current: approx. 25% decrease Making current, ma APPLICATIONS 1. Light projection type Inductive proximity sensor package Smartphone display control Finder control of single-lens reflex 2. IR LED lighting for surveillance camera AAM Molding material/size of sheet 1: PPA (Black) mm Unit size (2 digits) 01: mm Focal length (2 digits) 06: 0.06 mm* Au-plating thickness 1: 0.1±0.05 μm 2: 0.2±0.1 μm 3: 0.3±0.1 μm * For requests of products with different focal lengths, please contact our sales office. 168 ACCTB54E T

170 MID Package AAM11 PRODUCT TYPES Appearance of sheet Material of molding sheet Polyphthalamide (PPA) Black Appearance of individual piece Focal length 0.06 mm Focus Au-plating thickness (μm) Part number (Delivered in sheet form) 0.1±0.05 AAM ±0.1 AAM Packing (one carton) 6 trays (Contains 432 sheets) Narrow pitch connectors mm Notes: 1. This product is delivered in sheet form, and customers are required to mount the LED chips and cut the sheet into individual pieces. 2. For requests of focal lengths other than those mentioned above, please contact our sales office. 3. For requests of evaluation samples, please contact our sales office. SPECIFICATIONS Product specifications (Measurement conditions: 25±3 C unless stated otherwise) Plating thickness Item DIMENSIONS (Unit: mm) 1. Sheet dimensions (Delivered form) mm h = 0.9 mm (436 pieces/sheet) Cu-plating Ni-plating Au-plating Total thickness Plating adhesion strength (Measurement area refer to product drawing) Ambient environment (No icing and condensation at low temperatures) 1.5 R0.7 A Temperature Humidity Pressure 50± ± (Bowl pitch) 2.05 (Bowl pitch) B Distance from the bottom surface of the mounted LED chip to the focal section 13±7 μm 6±4 μm 0.1±0.05 μm (AAM ) 0.2±0.1 μm (AAM ) 0.3±0.1 μm (AAM ) 19±11 μm 0.3±0.1 AAM Specifications 0.39 N/m or higher (initial) Measured after Au-plating 20 C to 50 C Maximum temperature when applying an electrical current: 85 C 15% to 85%RH 86 kpa to 106 kpa High current connectors FPC/FFC connectors Active optical connector 2.91 (Bowl pitch) 70± ± dia. 2-1 dia. B B-B cross section (TOP VIEW) (BOTTOM VIEW) 169 ACCTB54E T

171 MID Package AAM11 2. Individual piece (cut shape) Narrow pitch connectors High current connectors 2.3 (Including pattern) 0.1 (Cut width) (WB area) 1.95 C C Detail drawing A 0.1 (Cut width) 0.7 dia (Gap distance) (WB area) (2.3) (0.17) 0.3 (TOP-WB) H (TOP-DB) 0.9 (Including individual piece height and pattern) C-C cross section (2.28) Taper 0.5 General tolerance: ±0.1 FPC/FFC connectors Active optical connector NOTES 1. Handling during storage 1) Although the outermost surface is coated in Au-plating, if exposed to atmospheres containing corrosive gases, humidity or at high temperature, the underlying nickel or copper may corrode causing discoloration of the plated surface, decreasing reflectance, and this may lead to decreased mountability or joint reliability of LED components or soldering. Therefore, please pay close attention to the atmosphere used for storage. 2) Storage conditions ( After opening refers to after opening the packing bag) The following conditions must be followed in order to maintain plating adhesive strength and external performance. Before opening After opening Temperature 15 C to 35 C 23 C±3 C Humidity RH25% to 75% RH50% or less Pressure 86 kpa to 106 kpa 86 kpa to 106 kpa Storage life (*2) 3 months 1 month (*1) *1: Please keep it in desiccator set into the clean room. *2: The storage life means the length from the date (lot number) printed on packaging. 2. Soldering Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below. Recommended soldering temperature conditions Surface temperature of molded components (package), C ~ to 110 sec Times, sec 10 sec or less 40 sec or less 70 sec or less Please refer to the latest product specifications when designing your product. 170 ACCTB54E T

172 Notes on Using Narrow pitch Connectors/High Current Connectors For board-to-board/board-to-fpc Notes on Using Narrow pitch Connectors/ High Current Connectors About safety Remarks 1) Do not use these connectors beyond the specification sheets. The usage outside of specified rated current, dielectric strength, and environmental conditions and so on may cause circuitry damage via abnormal heating, smoke, and fire. 2) In order to avoid accidents, your thorough specification review is appreciated. Please contact us if your usage is out of the specifications. Otherwise, Panasonic Regarding the design of devices and PC board patterns 1) When using the board to board connectors, do not connect a pair of board with multiple connectors. Otherwise, misaligned connector positions may cause mating failure or product breakage. 2) With mounting equipment, there may be up to a ±0.2 to 0.3-mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) PC board Control the thicknesses of the coverlay and adhesive to prevent poor soldering. This connector has no stand-off. Corporation cannot guarantee the quality and reliability. 3) Panasonic Corporation is consistently striving to improve quality and reliability. However, the fact remains that electrical components and devices generally cause failures at a given statistical probability. Furthermore, their durability varies with use environments or use conditions. In this respect, please check for actual electrical components and devices under actual conditions before use. Therefore, minimize the thickness of the coverlay, etc. so as to prevent the occurrence of poor soldering. 6) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws Spacer Connector Spacer Screw PC board When connecting PC boards, take appropriate measures to prevent the connector from coming off. 7) When mounting connectors on a FPC board: When the connector soldered to FPC is mated or unmated, solder detachment may occur by the force to the terminals. Connector handling is recommended in Continued usage in a state of degraded condition may cause the deteriorated insulation, thus result in abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. the condition when the reinforcing plate is attached to the backside of FPC where the connector is mounted. The external dimension of the reinforcing plate is recommended to be larger than the dimension of PC board recommended process pattern (extended dimension of one side is approximately 0.5 to 1.0 mm). The materials and thickness of the reinforcing plate are glass epoxy or polyimide (thickness mm) or SUS (thickness mm). As this connector has temporary locking structure, the connector mating may be separated by the dropping impact depend on the size, weight or bending force of the FPC. Please consider the measures at usage to prevent the mating separation. 8) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Narrow pitch connectors High current connectors FPC/FFC connectors Active optical connector MID Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the chucking force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. 6) In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40%RH to 60%RH and please remove static electricity by ionizer in manufacturing process. Information 171 ACCTB48E T

173 Notes on Using Narrow pitch Connectors/High Current Connectors Narrow pitch connectors High current connectors FPC/FFC connectors Active optical connector MID Regarding soldering Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (Please refer to the specification for detail because the temperature setting differs by products.) 2) As for cream solder printing, screen printing is recommended. 3) When setting the screen opening area and PC board foot pattern area, refer the recommended PC board pattern and window size of metal mask on the specification sheet, and make sure that the size of board pattern and metal mask at the base of the terminals are not increased. 4) Please pay attentions not to provide too much solder. It makes miss mating because of interference at soldering portion when mating. Terminal Paste solder PC board foot pattern 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) The condition of solder or flux rise and wettability varies depending on the type of solder and flux. Solder and flux characteristics should be taken into consideration and also set the reflow temperature and oxygen level. 7) Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. 8) Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). Narrow pitch connectors (except P8 type) Peak temperature 260 C 230 C 180 C 150 C 60 to 120 sec. Narrow pitch connector (P8) Temperature 245 C max. 155 to 165 C Temperature Upper limited (Solder heat resistance) Lower limited (Solder wettability) Peak temperature 220 C Preheating 200 C Peak temperature 200 C Preheating 60 to 120 sec. 25 sec. 70 sec. Time Within 30 sec. Time For products other than the ones above, please refer to the latest product specifications. 9) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector before mounting. 10) Consult us when using a screenprinting thickness other than that recommended. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. Table A Product name SMD type connectors 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. Terminal Apply the solder wire here Pattern Soldering iron temperature 300 C within 5 sec. 350 C within 3 sec. Soldering iron PC board Small angle as possible up to 45 degrees 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) These connector is low profile type. If too much solder is supplied for hand soldering, It makes miss mating because of interference at soldering portion. Please pay attentions. Solder reworking 1) Finish reworking in one operation. 2) In case of soldering rework of bridges. Don t use supplementary solder flux. Doing so may cause contact problems by flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. Information Handling Single Components 1) Make sure not to drop or allow parts to fall from work bench. 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. 172 ACCTB48E T

174 Notes on Using Narrow pitch Connectors/High Current Connectors Precautions for mating This product is designed with ease of handling. However, in order to prevent the deformation or damage of contacts and molding, take care and do not mate the connectors as shown right. Press-fitting while the mating inlets of the socket and header are not matched. Tilted mating Strongly pressed and twisted Narrow pitch connectors Cleaning flux from PC board There is no need to clean this product. If cleaning it, pay attention to the following points to prevent the negative effect to the product. 1) Keep the cleaning solvent clean and prevent the connector contacts from contamination. Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. 2) Some cleaning solvents are strong and they may dissolve the molded part and characters, so pure water passed liquid solvent is recommended. High current connectors FPC/FFC connectors The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. Active optical connector MID Other Notes 1) Do not remove or insert the electrified connector (in the state of carrying current or applying voltage). 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Product failures due to condensation are not covered by warranty. Information 173 ACCTB48E T

175 Notes on Using Narrow pitch Connectors/High Current Connectors Narrow pitch connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50- piece units in the condition given right. Consult a sale representative for ordering sample units. Condition when delivered from manufacturing Please refer to the latest product specifications when designing your product. High current connectors Embossed tape amount required for the mounting Required number of products for sample production (Unit 50 pcs.) Reel (Delivery can also be made on a reel by customer request.) Information MID Active optical connector FPC/FFC connectors 174 ACCTB48E T

176 Notes on Using High Current Connector L2 Notes on Using High Current Connector L2 Safety precautions Observe the following safety precautions to prevent accidents and injuries. 1) Do not use these connectors beyond the specification sheets. The usage outside of specified rated current, dielectric strength, and environmental conditions and so on may cause circuitry damage via abnormal heating, smoke, and fire. 2) In order to avoid accidents, your thorough specification review is appreciated. Please contact us if your usage is out of the specifications. Otherwise, Panasonic Corporation cannot guarantee the quality and reliability. 3) Panasonic Corporation is consistently striving to improve quality and reliability. However, the fact remains that electrical components and devices generally cause failures at a given statistical probability. Furthermore, their durability varies with use environments or use conditions. In this respect, please check for actual electrical components and devices under actual conditions before use. Continued usage in a state of degraded condition may cause the deteriorated insulation, thus result in abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. Mounting of receptacle 1) PC board design Refer to the recommended PC board pattern for keeping the strength of soldering. 2) Receptacle mounting When mounting, if there is too much suction nozzle pressure, the receptacle might deform and break. Please check beforehand. To mount the receptacle, place the adsorption nozzle within the adsorption range shown in the specification diagram and pay careful attention not to cause the receptacle to deform. In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40%RH to 60%RH and please remove static electricity by ionizer in manufacturing process. 3) Soldering (1) Manual soldering This product is not designed to be mounted by manual soldering. (2) Reflow soldering When cream solder printing is used, screen method is recommended. The relation between the screen opening area and PC board foot pattern area should be referred to Recommended PC board Pattern. Please avoid the excessive solder. Because the excessive solder makes contact failure by creepage. When applying the different thickness of a screen, please contact us. There may be a case of difficult self-alignment depending on the connector positions. In that case, please be careful to align terminals and solder pads. The following diagram shows the recommended reflow soldering temperature profile. Infrared reflow soldering is able to passed two times. The temperature is measured on the PC board surface near the receptacle. The condition of solder or flux creepage and wettability depend on the type of solder and flux. Please set the reflow temperature and oxygen level by considering the solder and flux characteristics. When the coating material is used for preventing PC board isolation deterioration after soldering, please assure the coating material is not adhered on any part of receptacle. Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. (4.00) 0.72±0.03 Temperature 260 C 230 C 180 C 150 C Upper limit (Solder heat resistance) Lower limit (Solder wettability) Peak temperature 220 C Preheating 200 C 60 to 120 sec. 25 sec. 70 sec. Recommended PC board Pattern (mounting pad layout) (TOP VIEW) As the excessive force on the receptacle may cause the deformation and the integrity of solderability will be lost during reflow soldering, please avoid dropping or rough handling of the receptacle. When cutting the PC board after mounting the receptacle, please avoid the stress at the soldering portion. Time 5.40±0.03 Note 1) 2.90±0.03 Jig area (8.00) (Unit: mm) Notes: 1) Do not mount any parts in the jig area. 2) Pad area (Two pads must be connected.) 3) Resist processing on the copper foil. (For solder outflow prevention.) 4) The open window area of solder screen is the same as pad area. [t = 0.12 mm (Screen thickness)] (1.56) Narrow pitch connectors High current connectors FPC/FFC connectors Active optical connector MID Information 175 ACCTB76E T

177 Notes on Using High Current Connector L2 Remarks 1) This product has simple lock structure for mating. However, applying load to the wire or drop impact may cause the wire to be disconnected. Please take countermeasures at the equipment for preventing removal of wire. 2) Provide a sufficient insulation distance between receptacles and between the ground and receptacle. Make sure that the insulation distance is based on the safety standards of each country. 3) Design the line to have redundancy by leaving some extra length for the wire so as not to cause the tensile force of the wire generated by the thermal expansion and contraction of PC board to apply load to the receptacle. 4) Do not use the wire at the movable part. Doing so will cause the receptacle to become deformed or the wire to be disconnected. 5) If the wire needs to be bent at the edge of the PC board, mount the receptacle so that the wire will bend at its insulation portion. Bending the wire at its core portion may cause the wire to get broken. Z X Y Y X Y Z Y Mating of wire 1) When mating the wire, use the recommended mating jig. (1) Positioning of wire Position the wire so that it will come to the center of the receptacle. X Min. 1.5mm Min. 1.5mm Y (2) Setting of the mating jig Check the positions of the receptacle through the hole in the jig, and then push the jig in the receptacle side. When pushing the jig in the receptacle side, pay careful attention not to cause the jig to become misaligned. Misalignment of the jig will damage the receptacle. X Y Check the positions of the receptacle. X Y Push the jig in the receptacle side. MID 6) Do not remove or insert the electrified wire (in the state of carrying current or applying voltage). Applicable wires 1) The following diagram shows wire strip length for stripping the wire in order to use a mating jig. (Consult us when using the mold cover.) Min. 8.4mm Core Insulation Z YZ 5.4mm 7.5mm Min. 8.4mm (3) Mating state Ensure that the wire is connected to the given position. (The core must be lower than the receptacle lock part.) Receptacle lock part Information 2) To strip the insulation, keep the core straight and protect it from any flaw and deformation. Deformation of the core will cause the receptacle to be deformed. Z Y 2) Do not twist the jig to insert it. Doing so will cause the receptacle to be deformed or broken down, or the soldered portion to be peeled off. Z X 3) This product is not designed to be used for stranded wires (including spare solder). X Y 176 ACCTB76E T

178 Notes on Using High Current Connector L2 3) Do not use the receptacle in a half-mating state. Doing so will result in a conduction failure. Ensure that the wire is completely connected. Z Y Pay attention to the position of the jig and do not apply an excessive load to the wire. Otherwise, the receptacle may be deformed. Z Narrow pitch connectors 4) When the soldering is not completed, do not connect the wire to the receptacle. And the external compulsory force to the receptacle may cause the coplanarity failures. 5) Secure jig areas shown in the recommended PC board pattern. Removal of wire 1) Prepare for a removal jig by reference to drawing and follow the steps for removal as shown below. (For a removal jig drawing, please contact our sales office.) X (3) Removal way of wire Remove the wire by lifting the jig straight up at a vertical angle to the receptacle. Lifting the jig at a slant may cause the deformation of receptacle. High current connectors (1) Setting of removal jig Insert the tip of the removal jig under the wire from the side of receptacle. Z Y X Removal jig (2) Positioning of removal jig Make sure that the tip of the removal jig is under the wire. Z Y X Z Y X 2) Reuse of disconnected wire is not allowed. The disconnected wire has a scratch and a deformed shape. Z X FPC/FFC connectors Active optical connector Information MID Z Z Y X 177 ACCTB76E T

179 Narrow pitch connectors High current connectors FPC/FFC connectors Active optical connector Notes on Using FPC Connectors Notes on Using FPC Connectors About safety Remarks Do not use these connectors beyond the specification sheets. The usage outside of specified rated current, dielectric strength, and environmental conditions and so on may cause circuitry damage via abnormal heating, smoke, and fire. In order to avoid accidents, your thorough specification review is appreciated. Please contact us if your usage is out of the specifications. Otherwise, Panasonic Corporation cannot guarantee the quality and reliability. Panasonic Corporation is consistently striving to improve quality and reliability. However, the fact remains that electrical components and devices generally cause failures at a given statistical probability. Furthermore, their durability varies with use environments or use conditions. In this respect, please check for actual electrical components and devices under actual conditions before use. Continued usage in a state of degraded condition may cause the deteriorated insulation, thus result in abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. PC board design Design the recommended foot pattern in order to secure the mechanical strength in the soldered areas of the terminal. In order to facilitate the connector mount, make sure to design the board with reduced warpage. Please design and pay attention to the distance from the board edge to the pattern. When cutting the board, do not give an excessive stress to the connector, which risks damaging the connector. FPC and equipment design Design the FPC based with recommended dimensions to ensure the required connector performance. When back lock type is used, secure enough space for closing the lever and for open-close operation of the lever. Make sure that connector positioning and FPC length are appropriate to prevent diagonal insertion of the FPC. Due to the FPC size, weight, or the reaction force of the routed FPC, FPC removed and connector deformation may occur by a fall, vibration, or other impact. When using FPC connector for smart phones, cellular phones and other applications which require falling resistance, please pay attention to precautions. Carefully check the equipment design and take required measures to prevent the FPC removed. If the shock of falling, vibration is applied to the FPC, please design the equipment not to be applied a load to connector, such as fixing the FPC. Make sure to design the FPC insertion part with reduced warpage. Otherwise, the warpage may adversely affect the FPC insertion. (Y4BH) When using in high-speed transmission applications, please take care when designing the FPC, because the differential impedance values may be uneven depending on FPC dimensions settings, uneven dimensions, and layering composition. (Y3BW/Y5BW) The holding contacts cannot be used as conductors. The holding contacts are located on both ends of the connector, and the shape of the soldered portions is the same as that of the signal contacts. Use caution to ensure connect identification. MID Information (Y3BW/Y5BW) Depending on FPC dimension and FPC insertion location, there is a possibility that the holding contact and an FPC pattern of both end of signal contacts are in short-circuited. Please design the equipment not to be affected even if a board pattern of holding contacts and an FPC pattern of both end of signal contacts are in short-circuited. (For example: Do not connect a board pattern of holding contacts and GND. If connect a board pattern of holding contacts and GND, also connect board pattern of both end of signal contacts.) (Y3BL) Soldering terminal structure Since soldering terminals touch FPC, note that the short circuit may occur when the metal parts exposed on side of FPC. Depending on FPC dimension, there is a possibility that soldering terminals and an FPC pattern of both end of signal contacts are in short-circuited. Please design the equipment not to be affected even if a board pattern of soldering terminals and an FPC pattern of both end of signal contacts are in short-circuited. (For example: Do not connect a board pattern of soldering terminals and GND. If connect a board pattern of soldering terminals and GND, also connect board pattern of both end of signal contacts.) Connector mounting Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied. In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40%RH to 60%RH and please remove static electricity by ionizer in manufacturing process. 178 ACCTB13E T

180 Notes on Using FPC Connectors Soldering 1) Manual soldering As this product is compact size, please avoid the excessive solder. Because the excessive solder makes creepage and flux wicking at contact portion, or impact contact by soldering interference. Please use the soldering iron under specified temperature and times. Soldering flux may contaminate the contact portion, please check the contact portion after soldering with a magnifying glass. If the contamination is found, please clean the contamination before use. As excessive force to terminal by manual soldering has some possibilities of contact portion deformation, please be careful to the force by hand. Please clean soldering iron tip. Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications. Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and cleans off any flux solder use. Be aware that a load applied to the connector terminals while soldering may displace the contact. Thoroughly clean the iron tip. 2) Reflow soldering When cream solder printing is used, screen method is recommended. To achieve the appropriate soldering state, make sure that the reflow temperature, PC board foot pattern, window size and thickness of metal mask are recommended condition. Note that excess solder on the terminals prevents complete insertion of the FPC, and causes flux climbing up. A screen thickness of 120μm is recommended during cream solder printing. When applying the different thickness of a screen, please contact us. There may be a case of difficult self-alignment depending on the connector size. In that case, please be careful to align terminals and solder pads. The following diagram shows the recommended reflow soldering temperature profile. Temperature 260 C 230 C 180 C 150 C Upper limit (Soldering heat resistance) Lower limit (Solder wettability) Preheating 60 to 120 sec. Peak temperature 220 C 200 C 25 sec. 70 sec. 3) Rework of soldering portion. Rework shall be only one time. Please avoid the supplementary flux in case of rework for soldering bridge, as this may cause flux creepage to contact portion. When adding the solder for reworking, do not add an excessive solder. Please use the soldering iron under specified temperature. As the excessive force on the terminals may cause the deformation and the integrity of solderability will be lost during reflow soldering, please avoid dropping or rough handling of the product. When the soldering is not completed, do not open/ close the lever or insert/ remove an FPC. And the external compulsory force to the terminal may cause the fixing force lowering between the terminal and the molding or the coplanarity failures. In addition, do not insert an FPC into the connector before soldering the connector. When cutting or bending the PC board after mounting the connector, please avoid the stress at the soldering portion. No stress here PC board As thick coverlay / solder resist and adhesive may cause poor soldering, please set thickness of coverlay and adhesive as thin as possible. Precautions for insertion/removal of FPC (Except for Y3BC) Avoid touching the lever (applying any external force) until an FPC is inserted. Do not open/close the lever without an FPC inserted. Failure to follow this instruction will cause the contacts to warp, leading to the contact tips to interfere with the insertion of an FPC, deforming the terminals. Failure to follow this instruction may cause the lever to be removed, terminals to be deformed, and/or the FPC insertion force to increase. Without an FPC inserted Narrow pitch connectors High current connectors FPC/FFC connectors Active optical connector MID Time Infrared reflow soldering is able to passed two times. The temperature is measured on the PC board surface near connector terminals. The condition of solder or flux creepage and wettability depend on the type of solder and flux. Please set the reflow temperature and oxygen level by considering the solder and flux characteristics. Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. When performing reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector using, for example, an adhesive. (Double reflow soldering on the same side is possible.) Do not apply reflow heating while a lever is closing (or on the way of closing). The terminals may be deformed by reflow heating with a lever is closing (or on the way of closing). These connectors are of the back lock type, which has the FPC insertion section on the opposite side of the lever. Be careful not to make a mistake in the FPC insertion position or the lever opening/closing position. Otherwise, a contact failure or connector breakage may occur. Do not insert an FPC upside down. Inserting an FPC in a direction opposite to that you intended may cause an operation failure or malfunction. Insert an FPC with the lever opened at right angle, that is, in the factory default position. Information 179 ACCTB13E T

181 Notes on Using FPC Connectors Information MID After checking the position of FPC insertion slot and FPC, completely insert the FPC horizontally to the full depth of the connector without altering the angle. An FPC inserted at an excessive angle to the board may cause the deformation of metal parts, crack of molding parts, FPC insertion failures, and FPC circuit breakages. Insert the FPC into the connector after checking the position of FPC insertion slot and FPC. Do not insert the FPC without positioning the FPC and connector. Otherwise, it may cause connector breakages. When it is hard to insert the FPC, do not insert the FPC on that condition. Confirm the FPC and connector positioning. Do not apply an excessive load to the lever in the opening direction beyond its open position; otherwise, the lever may be deformed or removed. Do not apply an excessive load to the lever in a direction perpendicular to the lever rotation axis or in the lever opening direction; otherwise, the terminals may be deformed, and the lever may be removed. To close the lever, turn down the lever by pressing the entire lever or both sides of the lever with fingers tips. And close the lever completely. Be careful not to apply partial load to the lever that may cause its deformation or destruction or lever going back to initial position. Close the lever completely to prevent contact failure. Avoid applying an excessive load to the top of the lever during or after closing the lever. Otherwise, the terminals may be deformed. When opening the lever to remove the FPC, rotate the lever to the initial position. Do not push the lever into the FPC inlet side and ensure that the lever will not go over the initial position; otherwise, it may be deformed or broken. To open the lever, if pressure to the lever is applied unevenly, such as to an edge only, it may deform or break. Do not open the lever forcefully with something sharp tool, otherwise, the lever may be deformed. Remove the FPC at parallel with the lever fully opened. If the lever is closed, or if the FPC is forcedly pulled, the product or FPC may break. If a lever is accidentally detached during the handling of a connector, do not use the connector any longer. After an FPC is inserted, carefully handle it so as not to apply excessive stress to the base of the FPC. When using FPC with a bent condition, please pay attention to precautions below; otherwise, in some conditions it may cause conduction failure, connector breakage, unlocking lever or FPC disconnection. Design so that a load is not applied to connector directly by FPC bending. Avoid sharp FPC bending at the root of FPC insertion part. Design so that a load is not applied to the part of FPC bending. If there might be a load on FPC, please fix the FPC. (Y3BW and Y5BW) Fix the FPC if there might be a load to the cut out, do not apply bending load to the cutout part of FPC. Otherwise, it may cause FPC disconnection and deformation since the cutout part of FPC is subjected to bending stress. FPC cutout part Cleaning treatment Cleaning this product is not needed basically. Please note the following points to prevent the negative effect to the product when cleaning is necessary. Please keep the cleanliness of the cleaning fluid to make sure that the contact surfaces are not contaminated by the cleaning fluid itself. Semi-aqueous cleaning solvent is recommended as some powerful solvent may dissolve the molding portion or the marked letters. Please contact us when other solvent is used. Precautions for operating environment and storage environment Panasonic Corporation does not guarantee the failures caused by condensation. Other precautions When the coating material is used for preventing PC board isolation deterioration after soldering, please assure the coating material is not adhered on any part of connector. Please avoid the usage of connector as electric switching basically. There is no problem on the product quality though the swelling, the black spot, the small scars and the foreign matter, etc. might be generated in the molding parts. There is no problem on the product quality though the weld line might be generated in the weld part of molding parts when the use of product is within the specifications. The detailed shape of metal parts and molding parts may differ depending on the mold. Height in FPC mating depends on the way to being used, such as mounting condition, thickness of FPC, and angle of lever lock etc. Please check it by actual equipment. Please refer to the latest product specifications when designing your product. 180 ACCTB13E T

182 Notes on Using Active Optical Connector V Series Notes on Using Active Optical Connector V Series About safety Remarks 1) Do not use these connectors beyond the specification sheets. The usage outside of specified rated current, dielectric strength, and environmental conditions and so on may cause circuitry damage via abnormal heating, smoke, and fire. 2) In order to avoid accidents, your thorough specification review is appreciated. Please contact us if your usage is out of the specifications. Otherwise, Panasonic Corporation cannot guarantee the quality and reliability. 3) Panasonic Corporation is consistently striving to improve quality and reliability. However, the fact remains that electrical components and devices generally cause failures at a given statistical probability. Furthermore, their durability varies with use environments or use conditions. In this respect, please check for actual electrical components and devices under actual conditions before use. Continued usage in a state of degraded condition may cause the deteriorated insulation, thus result in abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. 6) Insertion and removal operations must be performed while the power is off. Insertion or removal operations in a live condition (with current and voltage) may lead to a breakage. 7) Use caution with regard to the generation and handling of static electricity in the operating environment to protect the plug. 8) Secure sufficient insulation distance between the external metal enclosure of the plug and the peripheral components. The plug enclosure, which is connected to the ground, may give rise to danger from a short-circuit. 9) Mating of plug Mating direction Mating of the plug and receptacle requires orientation. Align the receptacle shape in the direction of the optical fiber of plug. Mated condition Make sure the plug is securely inserted into the receptacle. After mating, a gap remains between the PC board and plug. Avoid applying excessive pressure. Insertion Narrow pitch connectors High current connectors FPC/FFC connectors Cautions when using the product Please use the product in accordance with the conditions described in these specifications. The product quality cannot be warranted if the product fails because it is used outside the conditions in these specifications. 1) Cautions about the operating and storage environments Product failure due to condensation cannot be warranted. Use caution for avoiding dust. The following environment may deteriorate the product s appearance and affect the product characteristics, and should thus be avoided. An environment in which the possible adherence of chemicals such as acid and alkali exists. In a gaseous atmosphere of salt, sulfide, etc. 2) This product has a structure requiring an insertion force for mating, but the mating may come off when an external force is applied to the plug, impact is applied by dropping, or vibration is applied in equipment. Sufficient caution should be used with the equipment to avoid such incidents. 3) The product cannot be used in a movable parts while the optical fiber is bent. Such use may cause deformation of the receptacle or breakage of the optical fiber. 4) In order to avoid a load on the plug and receptacle applied by the tensile force of the optical fiber, a redundant design is required with respect to the optical fiber length. Ex) Bushing Optical fiber Securing with tape 10) Plug removal For the removal operation, hold both sides of the metal enclosure and lift the plug upward. * Do not pull the optical fiber and bushing. Enclosure metal side Enclosure metal side 11) Plug insertion Because this product has been designed with a thin mating structure between the plug and receptacle for compact-sizing purposes, excessive tilting during insertion or removal leads to product fracture and separation of the solder section of terminals. For avoiding breakage of the mating parts, confirm the alignment before mating. Active optical connector MID Information 5) Use caution for wiring the optical fiber to avoid getting entangled or twisting. Also, use adhesive tape for securing the optical fiber for preventing excessive stress caused by vibration and impact. 12) When the product is used in a different environment and in accordance with a method other than described in this document, please consult us. 181 ACCTB92E T

183 Notes on Using Active Optical Connector V Series Narrow pitch connectors High current connectors FPC/FFC connectors Active optical connector MID Information Receptacle Recommended PC board pattern (TOP VIEW) 0.75± ± ± ± ±0.05 (2.00) (2.00) Regarding soldering (for Receptacle) 2.00± ±0.05 Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (Please refer to the specification for detail because the temperature setting differs by products.) 2) As for cream solder printing, screen printing is recommended. 3) When setting the screen opening area and PC board foot pattern area, refer the recommended PC board pattern and window size of metal mask on the specification sheet, and make sure that the size of board pattern and metal mask at the base of the terminals are not increased. 4) Please pay attentions not to provide too much solder. It makes miss mating because of interference at soldering portion when mating. Terminal Paste solder PC board foot pattern 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) The condition of solder or flux rise and wettability varies depending on the type of solder and flux. Solder and flux characteristics should be taken into consideration and also set the reflow temperature and oxygen level. 7) Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. Recommended metal mask pattern Metal mask thickness: When 150μm (Opening ratio: 69%) 0.35± ± ± ± ±0.01 (1.50) (1.50) 3.00± ±0.01 Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). Narrow pitch connectors Temperature Peak temperature 260 C 230 C 180 C 150 C Upper limited (Solder heat resistance) Lower limited (Solder wettability) Peak temperature 220 C Preheating 200 C 60 to 120 sec. 25 sec. 70 sec. Time For products other than the ones above, please refer to the latest product specifications. 8) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector before mounting. 9) Consult us when using a screenprinting thickness other than that recommended. Recommended metal mask pattern Metal mask thickness: When 120μm (Opening ratio: 87%) 0.35± ± ± ± ±0.01 Manual soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. Table A Product name SMD type connectors (1.90) (1.90) 2.20± ±0.01 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. Terminal Apply the solder wire here Pattern Soldering iron temperature 300 C within 5 sec. 350 C within 3 sec. Soldering iron PC board Small angle as possible up to 45 degrees 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) These connector is low profile type. If too much solder is supplied for hand soldering, It makes miss mating because of interference at soldering portion. Please pay attentions. Solder reworking 1) Finish reworking in one operation. 2) In case of soldering rework of bridges. Don t use supplementary solder flux. Doing so may cause contact problems by flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. 182 ACCTB92E T

184 Notes on Using Active Optical Connector V Series Handling Single Components (for Receptacle) 1) Make sure not to drop or allow parts to fall from work bench. 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. Cleaning flux from PC board (for Receptacle) There is no need to clean this product. If cleaning it, pay attention to the following points to prevent the negative effect to the product. 1) Keep the cleaning solvent clean and prevent the connector contacts from contamination. Handling the PC board after mounting the connector (for Receptacle) When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. 3) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. 2) Some cleaning solvents are strong and they may dissolve the molded part and characters, so pure water passed liquid solvent is recommended. Narrow pitch connectors High current connectors FPC/FFC connectors Storage of connectors (for Receptacle) 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. Active optical connector Other Notes (for Receptacle) 1) Do not remove or insert the electrified connector (in the state of carrying current or applying voltage). 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Product failures due to condensation are not covered by warranty. Please refer to the latest product specifications when designing your product. MID Information 183 ACCTB92E T

185 Narrow pitch connectors High current connectors ISO14001, ISO9001, ISO/TS16949 Certificate of Approval ISO14001 Certificate of approval Panasonic Electromechanical Control Business Division, which develops, manufactures and sells such as relays, switches and sensors is certified according to the ISO environmental management system standard established by the International Standards for Organization (ISO). Through our business activities, which objectives are to live in harmony with the global environment and contribute to the realization of a sustainable society, we have been making efforts to reduce greenhouse gases and promote recycling of resources. Furthermore, with due consideration to biodiversity, we have been working for improving the global environment and living in harmony with the international community. ISO9001 Certificate of approval Our Electromechanical Control Business Division, which handles from development to production and marketing for relays, switches and sensors, has been approved for certification of the ISO9001 quality assurance standard established by the International Standards for Organization (ISO). FPC/FFC connectors The Necessity and Pursuit of ISO Certification Active optical connector MID Information ISO/TS16949 Certificate of approval Our Electromechanical Control Business Division has been accredited for ISO/TS16949, covering our quality management system for an entire spectrum of automotive products for relays, switches and connectors. ISO/TS16949 is a standard based on ISO9001 that adds items necessary for the automobile industry. It calls for a comprehensive quality management system that includes CS, cost performance, ongoing improvement, and many other aspects of quality management. Expanding to other overseas bases Expanding to affiliated companies and cooperating companies Check on how internal quality audit is being performed. A P C D Advantages ISO9000 Certification Acquisition Instructional activities relating to ISO Preparation of quality manuals and quality planning manuals Establishment of new quality systems and expanding them to business operations Upgrading internal quality monitoring Strengthening and upgrading quality assurance organizational structures applicable on an international basis Technology can be accumulated and disseminated through documentation and records Leads to improved reliability of the manufacturer s quality and improved CS (customer satisfaction) 184 AACTB5E T