ULTRASONIC SENSOR ICs PCB LAYOUT GUIDELINES AN 0082
|
|
- Bernadette Walton
- 6 years ago
- Views:
Transcription
1 1 Description This application note provides hints to hardware developers designing the PCB of an ultrasonic system including the Elmos Ultrasonic Sensor ICs. 2 Scope If it is not specially marked, this document is valid for the following Elmos Ultrasonic Sensor ICs: E / E / E E / E / E / E PCB layout guidelines 1. During receiving the reflected ultrasonic burst, the system, especially the transformer is very sensitive to magnetic fields. Therefore place supply and communication traces as far away as possible from transformer and the receiving input circuit and ensure they don t cross each other. 2. For optimal EMC/EMI performance 4 layer PCB is highly recommended. Top and bottom layers can be allocated for signal and supply. 2 inner planes are set as grounds. On the top and bottom layers, it is recommended to separate into 3 distinct sections first before they all come together in a common ground plane just below the IC, connecting to the exposed Pad of IC. Power and Communication (IC pins VSUP, GNDP, DRV1, DRV2, IO/LINx and the components C SUP1, C SUP2, C SUP_TD, R SUP_TD and the transducer) These are the components regarding the supply voltage for the transducer driving and the communication. These parts can disturb the receiver side. Analog (IC pins VDDA, GNDA, AINS, AING and the components C VDDA, C AIN1, C AIN2, R AIN, C TD, R TD, transformer and transducer) These are all the components on the transducer matching and receiver side. Digital (IC pins VDDD, GNDD and test pins, like TDO, TDI, TCK, TMS and TMEN or GPIOs 1-4) These are the rest of the components on the module that can be lumped together and connected to digital ground. All components in their respective area (power, analog, digital) should have common ground and should be connected to the IC respective pins (GNDP, GNDA and GNDD). All areas should be connected to the GND plane below the IC and the internal layer ground plane. 1/6
2 3. Internal regulated digital supply decoupling CVDDD place next to pin VDDD and GNDD. Place the decoupling capacitor directly between VDDD (pin 12) and GNDD (pin 13), as shown in figure 1. The ground side of the capacitor (1) is connected with GNDD and GNDD is directly connected to the exposed Pad. Do not connect any other ground layer to pin 1 of the capacitor and keep the distance as close as possible. Simil - arly, CVDDA must be close to IC pins VDDA and GNDA. Figure 1: CVDDD placed between VDDD and GNDD 4. Do not connect pin AING and pin GNDA together, even though they are both analog grounds. AING should connect to transducer receiver circuit while GNDA should be used for decoupling capacitor CVDDA return ground connection. These 2 grounds only connect back at the central GND below the IC. 5. The ground side of the transducer should be connected to the PCB ground with a good connection. Dur - ing an ESD event (several 10 kv) on the surface of the transducer, it is good to have a defined current path from the transducer to the module GND. Otherwise, if the transducer is only connected to AING, all the current during this ESD event will flow through the IC and destroy it. Thus, use the inner ground layers to set up a good ground connection to keep the current away from the IC. 6. The resistor R SUP smooths the current spikes during an ultrasonic burst. The transducer driver may generate spikes up to 500 ma and if these spikes are not filtered, they will appear on the supply line. Because the supply line may be long, it acts a s a good antenna and may fail electromagnetic emission tests. The resistor withstand a power consumption of 1/3 Watt. Thus, do not use a too small size of resistor. 7. A electrolytic capacitor with at least 68uF is recommended to store the required energy during a burst. The actual capacitance depends on the used driver current. Calculate the dip during one burst and take care that there is always enough energy available. Adjust the capacitance accordingly. 2/6
3 8. Do not route the supply line (VSUP) over the complete PCB. Place the filter capacitors C SUP1 and C SUP2 near by the connector pins. 9. Route the signal lines from the transducer to AINS and AING parallel to each other to minimize the coup - ling into the receiving path from disturbances. 10. Check the voltage rating of R TD and C TD. At the transformer side there will be voltages >100V. 11. Connect test pins and unused GPIOs to digital GND. 12. Connect as much VIA through holes as possible to ensure lowest possible resistance. 13. Additional hint regarding EMC, R SUP_TD can be changed to inductor for better EMC suppression in the supply line. This minimizes the emission on the cable harness. 3/6
4 4 QFN land pattern layout In general the following design rules apply for land pattern design on PCB s: 1. Land pattern length is 0,05 mm extended (d2) to the centre of the package compared to the terminal length of the package (L), as well as 0,2 mm extended (d1) outside the package outline unless this will compromise distance between terminal and exposed die pad. 2. The land pattern width (b3) should be 0.25 mm or bigger, but not more than 0.3 mm on terminals for pitches above 0,5 mm. However, to avoid solder bridging for components having lead pitches of 0,5 mm, or smaller, the pad width (b3) should be reduced to 0,28mm or smaller. 3. Minimum spacing between land pattern and exposed die pad is 0,3 mm for packages up to 5x5 4. Placement accuracy should be 50% of the terminal length, since the reflow process will centre the product. 5. Conductor patterns towards the package are not allowed to go underneath the package, since this can create shorts. 6. The corners of the packages should be kept free of solder. 7. The land pattern for the exposed die pad can have the same dimension as the exposed die pad of the package. Please refer to item 3, the exposed pad on the PCB could also be smaller. 8. For QFN packages with plated terminal side walls the land pattern outside the package (d1) has to be extended as much as possible to benefit from the advantages of the side wall plating, recommended is 0.4 till 0.8 mm, but more would be better. The self alignment works well with d1 is 0.4 mm minimum. 9. The thermal holes on the PCB could have a diameter of 0.25 to 0.4 mm and a grid array of 0.8 to 1.2 mm. 4/6
5 4.1 Recommended dimensions for land pattern Figure 2: QFN land pattern layout with package overlay The Elmos ICs E / E and E are delivered in a QFN20L4 package and the Elmos ICs E / E / E and E are delivered in a QFN20L5 package. QFN20L4 QFN20L5 Description Symbol Dimension [mm] Dimension [mm] lead pitch e exposed pad D2/ E terminal length L lead width b land pattern extension 1 d1 min min exposed pad pattern land pattern length L3 (d2) min (0) min (0) land pattern width b Table 1: Recommended dimensions for land pattern 1 land pattern extension outside the package (d1) must minimum be 0.2 mm, in case of sidewall plating the dimension should be mm, this will give a better wettability of side plated products. 5 References [1] 25DS0068E.xx Data sheet E / E (Elmos Semiconductor AG) [2] 25DS0075E.xx Data sheet E / E / E / E (Elmos Semiconductor AG) 5/6
6 WARNING Life Support Applications Policy Elmos Semiconductor AG is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Elmos Semiconductor AG products, to observe standards of safety, and to avoid situations in which malfunction or failure of an Elmos Semiconductor AG Product could cause loss of human life, body injury or damage to property. In the development of your design, please ensure that Elmos Semiconductor AG products are used within specified operating ranges as set forth in the most recent product specifications. General Disclaimer Information furnished by Elmos Semiconductor AG is believed to be accurate and reliable. However, no respons - ibility is assumed by Elmos Semiconductor AG for its use, nor for any infringements of patents or other rights of third parties, which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Elmos Semiconductor AG. Elmos Semiconductor AG reserves the right to make changes to this document or the products contained therein without prior notice, to improve performance, reliability, or manufacturability. Application Disclaimer Circuit diagrams may contain components not manufactured by Elmos Semiconductor AG, which are included as means of illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily given. The information in the application examples has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies. Furthermore, such information does not convey to the purchaser of the semiconductor devices described any license under the patent rights of Elmos Semiconductor AG or others. ELMOS Semiconductor AG Headquarters Heinrich-Hertz-Str Dortmund Germany Phone + 49 (0) Fax + 49 (0) sales@elmos.com 6/6
E IO-Link Transceiver Evaluation Kit PCB 2 (with external transistor)
E981.10 IO-Link evaluation Kit PCB 2 (with external transistor) AN 006 E981.10 IO-Link Transceiver Evaluation Kit PCB 2 (with external transistor) 1 What you get - E981.10 IO-Link Evaluation Kit PCB 2
More informationAN 022. E nd generation 4-branch FlexRay star coupler 1/18. E Application note MaY 23, 2011
E98.56 Application note MaY, 0 AN 0 APPLICATION NOTE E98.56 nd generation -branch FlexRay star coupler Conform to FlexRay electrical physical layer specification v.0 FlexRay and are trademarks of Daimler
More informationElectrical Characteristics
2 MOS (PTY) LTD. Microsystems On Silicon Member of ELMOS Semiconductor AG DUAL CHANNEL PIR SIGNAL PROCESSOR E910.62 Features General Description ÿ Direct connection to PIR sensor elements ÿ Temperature
More informationThis application note is written for a reader that is familiar with Ethernet hardware design.
AN 14.8 LAN8700/LAN8700I and LAN8187/LAN8187I Ethernet PHY Layout Guidelines 1 Introduction 1.1 Audience 1.2 Overview The LAN8700/LAN8700I and LAN8187/LAN8187I are highly-integrated devices designed for
More information10/100 Application Note General PCB Design and Layout Guidelines AN111
10/100 Application Note General PCB Design and Layout Guidelines AN111 Introduction This application note provides recommended guidelines in designing a product that complies with both EMI and ESD standards
More informationEVB-USB2514Q36-BAS, USB2513 and USB Pin QFN Evaluation Board, Revision C User Manual
EVB-USB2514Q36-BAS, USB2513 and USB2512 36-Pin QFN Evaluation Board, Revision C User Manual Copyright 2009 SMSC or its subsidiaries. All rights reserved. Circuit diagrams and other information relating
More informationDM9051NP Layout Guide
NP Version: 1.1 Technical Reference Manual Davicom Semiconductor, Inc Version: NP-LG-V11 1 1. Placement, Signal and Trace Routing Place the 10/100M magnetic as close as possible to the (no more than 20mm)
More informationVoltage regulator 5V/20mA RXD SILIM. System control SILIM ILIM ONHS ONLS SPEED. ELMOS Semiconductor AG Data Sheet QM-No.: 25DS0007E.
Basic IO-link transceiver E981.10 Features Supply voltage range 8V to 36V Integrated 5V voltage regulator Wake-up detection Driver capability up to 200mA C/Q reverse polarity protection 3.3V / 5V compatible
More informationEVB-USB2514Q36-BAS, USB2513 and USB Pin QFN Evaluation Board User Manual
EVB-USB2514Q36-BAS, USB2513 and USB2512 36-Pin QFN Evaluation Board User Manual Copyright 2008 SMSC or its subsidiaries. All rights reserved. Circuit diagrams and other information relating to SMSC products
More informationE ASIF (Asynchronous Programming Interface) Figure 1: Evaluation Board ASIF Interface
E.0 EVALUATION KIT FEB, 0 AN 00 E.0 ASIF (Asynchronous Programming Interface) Figure : Evaluation Board ASIF Interface What you get. Piggy-back ASIF Interface with µc PCB. USB Cable What you need in addition.
More informationPRTR5V0U2X Ultra low capacitance double rail-to-rail ESD protection diode Rev January 2008 Product data sheet
Rev. 02 14 January 2008 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance rail-to-rail ElectroStatic Discharge (ESD) protection diode in a small SOT143B Surface-Mounted
More informationE Flash Program Procedure via JTAG AN 0136 Jun 15, 2015
1 Scope This document describes flash access procedures via JTAG interface. The compliance of the rules below guaranties the reliable programming of the E520.32. TEN TEN LN24 D5 JTAG MASTER TCK TDI +5V
More informationAN USB332x Transceiver Layout Guidelines
AN 17.19 USB332x Transceiver Layout Guidelines 1 Introduction SMSC s USB332x comes in a 25 ball Wafer-Level Chip-Scale Package (WLCSP) lead-free RoHS compliant package; (1.95 mm X 1.95 mm, 0.4mm pitch
More informationE Demonstration Board AN 0178 Dec 15, 2016
E.0 Demonstration Board AN 0 Dec, 0 E.0 Power LIN.X Stepper with Stall Detection What you get. Demoboard E.0 What you need in addition. V Power Supply, capable of providing the motor current. Bipolar stepper
More informationDistance measurement using Elmos E Ultrasonic Sensor IC
Distance measurement using Elmos E524.05 Ultrasonic Sensor IC Figure 1: E524.05 Ultrasonic Sensor Board Elmos E524.05 Ultrasonic Sensor Board The E524.05 is part of the Elmos Ultrasonic Direct Drive IC-family.
More informationPESD5V0U2BT. 1. Product profile. Ultra low capacitance bidirectional double ESD protection diode. 1.1 General description. 1.
Ultra low capacitance bidirectional double ESD protection diode Rev. 01 27 March 2007 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance bidirectional double ElectroStatic
More informationAN3001 Application note
Application note Demonstration board user guidelines for the TS4657 single supply stereo digital audio line driver Introduction This application note focuses on the TS4657 demonstration board, designed
More informationApplication Suggestions for X2Y Technology
Application Suggestions for X2Y Technology The following slides show applications that would benefit from balanced, low inductance X2Y devices. X2Y devices can offer a significant performance improvement
More informationTD62M8600FG TD62M8600FG 8CH LOW SATURATION VOLTAGE SOURCE DRIVER FEATURES SCHEMATICS PIN CONNECTION (TOP VIEW)
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT MULTI CHIP TD62M8600FG TD62M8600FG 8CH LOW SATURATION VOLTAGE SOURCE DRIVER TD62M8600FG is Multi Chip IC incorporates 8 low saturation discrete transistors equipped
More informationPESD3V3L1UA; PESD3V3L1UB; PESD3V3L1UL
PESD3V3L1UA; PESD3V3L1UB; PESD3V3L1UL Rev. 01 17 June 2009 Product data sheet 1. Product profile 1.1 General description Low capacitance unidirectional ElectroStatic Discharge (ESD) protection diodes in
More informationBidirectional ESD protection diode
11 December 2018 Preliminary data sheet 1. General description 2. Features and benefits 3. Applications 4. Quick reference data Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection
More informationS12VR Hardware Design. Guidelines. 1 Introduction. 2 Hardware Design. Guidelines. 2.1 Voltage regulator. Freescale Semiconductor
Freescale Semiconductor Document Number: AN4643 Application Note Rev 1, 10/2013 S12VR Hardware Design Guidelines by: Carlos Aceff 1 Introduction This document lists the required external components and
More informationPESD5V0U1BA; PESD5V0U1BB; PESD5V0U1BL
PESD5V0U1BA; PESD5V0U1BB; PESD5V0U1BL Rev. 01 25 April 2007 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diodes
More informationHigh-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs. I.K. Anyiam
High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs I.K. Anyiam 1 Introduction LVDS SerDes helps to reduce radiated emissions, but does not completely eliminate them EMI prevention must
More informationREV CHANGE DESCRIPTION NAME DATE. A Release B Increased +1.2V Capacitor Value & VDD12A Cap Requirement
REV CHANGE DESCRIPTION NAME DATE A Release 8-1-16 B Increased +1.2V Capacitor Value & VDD12A Cap Requirement 1-16-17 Any assistance, services, comments, information, or suggestions provided by Microchip
More informationUSB3740. High Speed Switch for Mobile and Portable Applications USB3740 PRODUCT FEATURES DATASHEET. USB3740 Block Diagram
USB3740 High Speed Switch for Mobile and Portable Applications PRODUCT FEATURES High Speed USB Mux for multiplexing the USB lanes between different functions Switch the USB connector between two different
More informationFour Quadrant Photodiode PR5401
Two differential pairs of photodiodes with amplifiers consists of two pairs of photodiodes placed in opposite quadrants with diffferential amplifiers. If illuminated uniformly, the output is Vcc/2, but
More informationSFC ChipClamp ΤΜ Flip Chip TVS Diode with T-Filter PRELIMINARY Features
Description The SFC2282-50 is a low pass T-filter with integrated TVS diodes. It is designed to provide bidirectional filtering of EMI/RFI signals and electrostatic discharge (ESD) protection in portable
More informationFeatures. Applications
HCSL-Compatible Clock Generator for PCI Express General Description The is the smallest, high performance, lowest power, 2 differential output clock IC available for HCSL timing applications. offers -130dBc
More informationAP XC2000 & XE166 Families. Design Guidelines for XC2000 & XE166 Microcontroller Board Layout. Microcontrollers
Application Note, V2.1, Jun. 2008 AP16116 XC2000 & XE166 Families Design Guidelines for XC2000 & XE166 Microcontroller Board Layout Microcontrollers Edition 2008-06-24 Published by Infineon Technologies
More informationTD62384APG,TD62384AFG TD62385APG,TD62385AFG
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62384APG,TD62384AFG TD62385APG,TD62385AFG 8CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER The TD62384APG / AFG and TD62385APG / AFG are non inverting
More informationEVB-USB2517 Evaluation Board User Manual (Revision A)
EVB-USB2517 Evaluation Board User Manual (Revision A) Copyright 2009 SMSC or its subsidiaries. All rights reserved. Circuit diagrams and other information relating to SMSC products are included as a means
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationDAC348x PCB Layout Guidelines for the Multi-Row QFN package
Texas Instruments Application Report DAC348x PCB Layout Guidelines for the Multi-Row QFN package Russell Hoppenstein Revision 1.0 Abstract This document provides additional information related to the multi-row
More informationNCR402T. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
16 October 2015 Product data sheet 1. General description LED driver consisting of a resistor-equipped PNP transistor with two diodes on one chip in a small SOT23 plastic package. 2. Features and benefits
More informationTORX147(F,T) TORX147(F,T) FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE. 1. Absolute Maximum Ratings (Ta = 25 C) 2.
FIBER OPTIC RECEIVING MODULE TORX147(F,T) FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE Unit: mm For JEITA Standard CP 1212 (Digital Audio Optical Interface for Consumer Equipment). A self tapping
More informationCY3280-BBM Universal CapSense TM Prototyping Module Kit Quick Start
CY3280-BBM Universal CapSense TM Prototyping Module Kit Quick Start Doc. # 001-43368 Rev. ** Cypress Semiconductor 198 Champion Court San Jose, CA 95134-1709 Phone (USA): 800.858.1810 (Intnl): 408.943.2600
More informationREV CHANGE DESCRIPTION NAME DATE. A Release
REV CHANGE DESCRIPTION NAME DATE A Release 5-29-08 Any assistance, services, comments, information, or suggestions provided by SMSC (including without limitation any comments to the effect that the Company
More informationPRTR5V0U2X. 1. Product profile. Ultra low capacitance double rail-to-rail ESD protection diode in SOT143B. 1.1 General description. 1.
in SOT143B Rev. 01 22 September 2005 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance double rail-to-rail ElectroStatic Discharge (ESD) protection diode in a small SOT143B
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationDSL03-24T ULTRA LOW CAPACITANCE STEERING DIODE/THYRISTOR ARRAY DESCRIPTION SOT-23-6 PACKAGE APPLICATIONS FEATURES MECHANICAL CHARACTERISTICS
ULTRA LOW CAPACITANCE STEERING DIODE/THYRISTOR ARRAY DESCRIPTION The provides ESD, EFT and surge protection for high-speed data interfaces. The 24V thyristor array, steering diode combination device meets
More informationUNITED MICRO DEVICE INC.
Description TVS diodes are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDA s. They offer superior electrical characteristics such
More informationMAS6240 Piezo Driver with Multi-Mode Charge Pump
MAS624 Piezo Driver with Multi-Mode Charge Pump Both Single Ended and Differential Output Three-Step Volume Adjusting Up to 8Vpp Output from 3V Supply One Wire Audio & Shutdown Control High Efficiency
More informationLCA701. Single Pole, Normally Open OptoMOS Relay INTEGRATED CIRCUITS DIVISION
Single Pole, Normally Open OptoMOS Relay Parameter Rating Units Blocking Voltage V P Load Current. A rms / A DC On-Resistance (max). Input Control Current ma Features V P Blocking Voltage Operational Temperature
More informationSFC05-4 ChipClamp ΤΜ Flip Chip TVS Diode Array PRELIMINARY Features
Description The SFC05-4 is a quad flip chip TVS array. They are state-of-the-art devices that utilize solid-state siliconavalanche technology for superior clamping performance and DC electrical characteristics.
More informationREV CHANGE DESCRIPTION NAME DATE. A Release
REV CHANGE DESCRIPTION NAME DATE A Release 7-25-12 Any assistance, services, comments, information, or suggestions provided by SMSC (including without limitation any comments to the effect that the Company
More informationApplication Note: AN-146. Guidelines for Effective LITELINK Designs. AN-146-R03 1
Guidelines for Effective LITELINK Designs AN-146-R03 www.ixysic.com 1 1. Introduction Two of the important functions provided by LITELINK to the host systems are high-voltage isolation between the host
More informationCPC1510GSTR. Single-Pole, Normally Open Relay with Integrated Current Limit INTEGRATED CIRCUITS DIVISION. Description
CPC Single-Pole, Normally Open Relay with Integrated Current Limit Parameter Rating Units Blocking Voltage 2 V P Load Current 2 ma rms / ma DC On-Resistance (max Features Integrated Active Current-Limit
More informationMAS6240C Piezo Driver with Multi-Mode Charge Pump
DESCRIPTION MAS6240 is a piezo driver device that can drive outputs up to 18Vpp from 3V supply. An internal threemode charge pump generates boosted supply voltage for piezo driver. For adjusting the piezo
More informationREV CHANGE DESCRIPTION NAME DATE. A Release
REV CHANGE DESCRIPTION NAME DATE A Release 11-07-12 Any assistance, services, comments, information, or suggestions provided by SMSC (including without limitation any comments to the effect that the Company
More informationSLVU WATT ULTRA LOW CAPACITANCE TVS ARRAY PIN CONFIGURATION
600 WATT ULTRA LOW CAPACITANCE TVS ARRAY Description The is a low voltage, low leakage current and ultra low capacitance TVS device designed for EOS and ESD protection of low voltage circuits commonly
More informationDual back-to-back Zener diode
Rev. 01 28 January 2008 Product data sheet 1. Product profile 1.1 General description in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package. 1.2 Features Non-repetitive peak reverse
More informationE Mux Demonstration Board AN 0141 Jul 10, 2015
1 What you get: 1. One or more demonstration boards 2. Board description (this document) 3. USB Stick or CD - with driver for elmos LIN converter - GUI - flash and auto-addressing software 2 What you need
More informationPSLC03 - PSLC24C. 350 watt low capacitance tvs array. applications
350 watt low capacitance tvs array Description The PSLC and PSLCxxC Series of devices are low capacitance TVS arrays available in a SOT-3 package. These devices are designed to protect Ethernet data I/O
More informationLow Voltage, 10-Bit Digital Temperature Sensor in 8-Lead MSOP AD7314
a FEATURES 10-Bit Temperature-to-Digital Converter 35 C to +85 C Operating Temperature Range 2 C Accuracy SPI and DSP Compatible Serial Interface Shutdown Mode Space-Saving MSOP Package APPLICATIONS Hard
More informationAOZ8101. Ultra-Low Capacitance TVS Diode Array. General Description. Features. Applications. Typical Application
Ultra-Low Capacitance TS Diode Array General Description The AOZ8101 is a transient voltage suppressor array designed to protect high speed data lines from Electro Static Discharge (ESD) and lightning.
More informationCM DE. 4-Channel LCD and Camera EMI Filter Array with ESD Protection
CM1408-04DE 4-Channel LCD and Camera EMI Filter Array with ESD Protection Features Four Channels of EMI Filtering with Integrated ESD Protection Pi Style EMI Filters in a Capacitor Resistor Capacitor (C
More informationLS9100. Archimedes Series. Dimmable High Voltage LED Direct AC Driver
LS900 Dimmable High Voltage LED Direct AC Driver Archimedes Series Features Integrated Bridge Rectifier and MOSFET Driver Wide AC input range up to 30 Vac 50/60Hz 50mA DC output current Ultra simple circuit
More informationPAM8304-EV board User Guide AE Department. Date Revision Description Comment
1. Revision Information -EV board User Guide AE Department Date Revision Description Comment 2013/5/31 V1.0 Initial release 1 of 5 2. Key Features Supply Voltage from 2.8V to 6.0V 3.0W@10% THD Output with
More informationCircuit Board Guidelines for aqfn Package nan-40
Circuit Board Guidelines for aqfn Package nan-40 Application Note v1.1 4413_398 v1.1 / 2018-04-23 Contents Revision history.................................. iii 1 Introduction...................................
More informationTORX176 TORX176 FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO EQUIPMENT. 1. Maximum Ratings (Ta = 25 C) 2. Recommended Operating Conditions
FIBER OPTIC RECEIVING MODULE TORX176 FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO EQUIPMENT Unit: mm Conform to JEITA Standard CP 1201 (For Digital Audio Interfaces including Fiber Optic inter connections).
More informationFeatures. Applications
Push-Button Reset IC General Description The are low-current, ultra-small, pushbutton reset supervisors with long set-up delays. The devices feature two manual reset inputs and two reset outputs. The devices
More informationOmnidirectional Microphone with Bottom Port and Analog Output ADMP401
FEATURES 4.72 mm 3.76 mm 1.0 mm surface-mount package High SNR of 62 dba Sensitivity of 42 dbv Flat frequency response from 100 Hz to 15 khz Low current consumption of
More informationApplication Note, V 1.0, April 2005 AP32086 EMC. Design Guideline for TC1796 Microcontroller Board Layout. Microcontrollers. Never stop thinking.
Application Note, V 1.0, April 2005 AP32086 EMC Design Guideline for TC1796 Microcontroller Board Layout Microcontrollers Never stop thinking. TriCore Revision History: 2005-04 V 1.0 Previous Version:
More informationS USB-PC Connection (Cable Not Included) S USB Powered (No External Power Supply Required) S Real-Time Data Acquisition Through the USB
19-5610; Rev 1; 8/11 MAXADClite Evaluation Kit General Description The MAXADClite evaluation kit (EV kit) evaluates the MAX11645, Maxim's smallest, very-low-power, 12-bit, 2-channel analog-to-digital converter
More informationE Demonstration Board AN 0177 Dec 15, 2016
E. Demonstration Board AN 0 Dec, 0 E. Power LIN.X Stepper with Stall Detection What you get. Demoboard E. What you need in addition. V Power Supply, capable of providing the motor current. Bipolar stepper
More informationESD Protection Layout Guide
Application Report Guy Yater... High Volume Linear ABSTRACT Successfully protecting a system against electrostatic discharge (ESD) is largely dependent on the printed circuit board (PCB) design. While
More informationIP1001 LF DESIGN & LAYOUT GUIDELINES
Index 1 Purpose...2 2 Magnetic trace routing...2 3 Power Supply Plane & GND Plane...3 4 PHY interface...3 5 Trace routing & Placement...3 6 ESD protection...3 7 EMI Supression...3 1/7 April 17 2008. Ver:1.5
More informationJanuary 16th, 2013 Document-No.: DB_PCapØ2-EVA-Kit_en V0.0
January 16th, 2013 Document-No.: DB_PCapØ2-EVA-Kit_en V0.0 PCapØ2 Published by acam -messelectronic gmbh acam-messelectronic gmbh 2013 Disclaimer / Notes Preliminary product information describes a product
More informationFeatures. Applications
6GHz, 1:4 CML Fanout Buffer/Translator with Internal I/O Termination General Description The is a 2.5V/3.3V precision, high-speed, fully differential 1:4 CML fanout buffer. Optimized to provide four identical
More informationBest practices for EMI filtering and IC bypass/decoupling applications
X2Y Component Connection and PCB Layout Guidelines Best practices for EMI filtering and IC bypass/decoupling applications X2Y Attenuators, LLC 1 Common X2Y Circuit Uses EMI FILTERING Conducted and Radiated
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationUMD05B-323 UNITED MICRO DEVICE INC. Small Surface Mount Device TVS. Description. SOD-323 Pin Configuration. Mechanical Characteristics.
SOD-323 Single Line Diode for ESD Protection Description diodes are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDA s. They offer
More informationREV CHANGE DESCRIPTION NAME DATE. A Release B Increased +1.2V Capacitor Value & VDD12A Cap Requirement
REV CHANGE DESCRIPTION NAME DATE A Release 8-1-16 B Increased +1.2V Capacitor Value & VDD12A Cap Requirement 1-16-17 Any assistance, services, comments, information, or suggestions provided by Microchip
More informationRechargeable Solid State Energy Storage: 50µAh, 3.8V. 1 V+ 4 V- 2,3 NIC 5-16 NIC Note: NIC = No Internal Connection CBC050 Schematic - Top View
Product Discontinued - Not for New Designs EnerChip CBC050 Rechargeable Solid State Energy Storage: 50µAh, 3.8V Features All Solid State Construction SMT Package and Process Lead-Free Reflow Tolerant Thousands
More informationPMEG3015EH; PMEG3015EJ
Rev. 03 13 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for
More informationTORX111 TORX111 FIBER OPTIC RECEIVING MODULE FOR APF. 1. Maximum Ratings (Ta = 25 C) FIBER OPTIC RECEIVING MODULE.
FIBER OPTIC RECEIVING MODULE TORX111 FIBER OPTIC RECEIVING MODULE FOR APF Unit: mm Non connector (connector less) type Data rate: DC to 6 Mb / s (NRZ code) Transmission distance: Up to 10 m (With TOTX111)
More informationTORX177(F,T) TORX177(F,T) TENTATIVE FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE. 1. Maximum Ratings (Ta = 25 C)
TENTATIVE FIBER OPTIC RECEIVING MODULE TORX177(F,T) FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE Unit: mm For JEITA Standard CP- 1212 (Digital Audio Optical Interface for Consumer Equipment).
More informationData Sheet BMD070. Specification subject to change without notice. Proprietary information, not
Analog pressure sensor Data Sheet Data sheet Data sheet Device order code 0 273 300 140 Package type TO-8 Document revision 1.3 Document release date 29 October 2008 Document number BST--DS000-03 Notes
More informationAN PCB Layout Guide for USB2502. Introduction. Two Layer PCB
AN.9 PCB Layout Guide for USB2502 Introduction Two Layer PCB This application note provides information on designing a printed circuit board (PCB) for SMSC USB2502 USB Hub Controller. The PCB requires
More informationHX4002 HX1001. White LED Backlighting Li-Ion Battery Backup Supplies Local 3V to 5V Conversion Smart Card Readers PCMCIA Local 5V Supplies
HX1001 Low Noise, Regulated Charge Pump DC/DC Converter Features Fixed 5V±4% Output VIN Range: 2.7V ~ 5V Output Current: up to 250mA (V IN =4.5V) Low Noise Constant Frequency Operation Shutdown Current:
More informationFeatures. Applications
3.3V Ultra-Precision 1:4 LVDS Fanout Buffer/Translator with Internal Termination General Description The is a 3.3V, high-speed 2GHz differential low voltage differential swing (LVDS) 1:4 fanout buffer
More informationPMEG1030EH; PMEG1030EJ
Rev. 04 15 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for
More informationDesign Guideline for TC1782 Microcontroller Board Layout
TC1782 AP32145 Application Note V1.4 2012-02 Microcontrollers Edition 2012-02 Published by Infineon Technologies AG 81726 Munich, Germany 2012 Infineon Technologies AG All Rights Reserved. LEGAL DISCLAIMER
More informationHigh Current Power Switch
SP619 High Current Power Switch FEATURES Max RDS(ON).377 Ohms Overcurrent deactivation 800mA Max leakage current less than 2µA while deactivated Small 6 pin SOT-23 package Built-in Over-temperature Protection
More informationAN2470 Application note TS4871 low voltage audio power amplifier Evaluation board user guidelines Features Description
Application note TS4871 low voltage audio power amplifier Evaluation board user guidelines Features TS4871 low voltage audio power amplifier with active low standby mode Operating range from V CC =2.2V
More informationTD62382AP,TD62382AF TD62382AP/AF 8CH LOW INPUT ACTIVE SINK DRIVER FEATURES PIN CONNECTION (TOP VIEW) SCHEMATICS (EACH DRIVER)
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62382AP,TD62382AF TD62382AP/AF 8CH LOW INPUT ACTIVE SINK DRIVER The TD62382AP / AF are non inverting transistor array which are comprised
More informationPS25401A / B EPIC Ultra High Impedance Movement Sensor
EPIC Ultra High Impedance Movement Sensor Data Sheet 291837 issue 2 FEATURES Ultra high effective input resistance, typically 20GΩ. Effective input capacitance as low as 15pF. Upper 3dB point typically
More information1 x 1.7 W CS35L01 Amplifier Reference Design Kit
1 x 1.7 W CS35L01 Amplifier Reference Design Kit Features Description Four boards provided in the CS35L01 Amplifier Reference Design Kit Separate boards for each mode configuration SD, FSD, HD, and FHD
More informationPAA140STR. Dual Single-Pole, Normally Open OptoMOS Relays INTEGRATED CIRCUITS DIVISION
Dual Single-Pole, Normally Open OptoMOS Relays Parameter Rating Units Load Voltage 4 V Load Current ma rms / ma DC On-Resistance (max 8 Features 37V rms Input/Output Isolation Low Drive Power Requirements
More informationAN2408 Application note
Application note 900mA standalone linear Li-Ion battery charger with thermal regulation Introduction One way to minimize the size and complexity of a battery charger is to use a linear-type charger. The
More informationLCA127STR. Single-Pole, Normally Open OptoMOS Relay INTEGRATED CIRCUITS DIVISION
Single-Pole, Normally Open OptoMOS Relay Parameter Ratings Units Blocking Voltage V P Load Current ma rms / ma DC On-Resistance (max Features 37V rms Input/Output Isolation Low Drive Power Requirements
More informationPESD5V0X2UM. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
Ultra low capacitance unidirectional double ESD protection diode 3 February 2014 Product data sheet 1. General description Ultra low capacitance unidirectional double ElectroStatic Discharge (ESD) protection
More informationPESD18VF1BL. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data. 5. Pinning information
10 July 2018 Product data sheet 1. General description Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a DFN1006-2 (SOD882) leadless ultra small Surface-Mounted Device
More informationHARDWARE REFERENCE IMM-NRF51822
HARDWARE REFERENCE IMM-NRF51822 Micro-module Copyright 2014 I-SYST, all rights reserved. This document may not be reproduced in any form without, express written consent from I-SYST. Limited Warranty The
More informationCM1621. LCD and Camera EMI Filter Array with ESD Protection
LCD and Camera EMI Filter Array with ESD Protection Features Six Channels of EMI Filtering with Integrated ESD Protection Pi Style EMI Filters in a Capacitor Resistor Capacitor (C R C) Network ±15 kv ESD
More informationTORX178B TORX178B FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE. 1. Maximum Ratings (Ta = 25 C) FIBER OPTIC RECEIVING MODULE
FIBER OPTIC RECEIVING MODULE TORX178B FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE Unit: mm Conforms to EIAJ Standard CP 1201 (For Digital Audio Interface including Fiber Optic inter connections).
More informationLCA182STR. Single Pole, Normally Open OptMOS Relay INTEGRATED CIRCUITS DIVISION
Single Pole, Normally Open OptMOS Relay Parameter Rating Units Blocking Voltage 3 V P Load Current 12 ma rms / ma DC On-Resistance (max 3 Input Control Current.2 ma Features Very Low Input Control Current
More informationZSPM4121. Under-Voltage Load Switch for Smart Battery Management. Datasheet. Brief Description. Features. Related IDT Smart Power Products
Under-Voltage Load Switch for Smart Battery Management ZSPM4121 Datasheet Brief Description The ZSPM4121 battery management load switch can be used to protect a battery from excessive discharge. It actively
More information2 TO 4 DIFFERENTIAL CLOCK MUX ICS Features
DATASHEET 2 TO 4 DIFFERENTIAL CLOCK MUX ICS557-06 Description The ICS557-06 is a two to four differential clock mux designed for use in PCI-Express applications. The device selects one of the two differential
More information