Getting started with the STEVAL-STLKT01V1 SensorTile integrated development platform

Transcription

1 UM0 User manual Getting started with the STEVAL-STLKT0V SensorTile integrated development platform Introduction The STEVAL-STLKT0V development kit for the STEVAL-STLCS0V SensorTile board is a highly integrated development platform with a broad range of functions aimed at improving system design cycles and accelerating the delivery of results. The tiny SensorTile core system board (. x. mm) embeds high-accuracy and very-low-power inertial sensors, a barometric pressure sensor and a digital MEMS top-port microphone. The onboard 80-MHz MCU features a dedicated hardware microphone interface and ultra-low-power support. The wireless network processor provides Bluetooth Smart connectivity and the integrated balun maximizes RF performance for minimum size and design effort. The kit includes a cradle expansion board for software and system architecture design support and a compact cradle host featuring a battery charger and SD card interface for on-field testing and data acquisition; both boards come complete with SWD programming interfaces. It contains FCC ID: S9NSTILE0 and module IC 8976C-STILE0 certified with PMN: STEVAL- STLKT0V; HVIN: STEVAL-STLCS0V; HMN: STEVAL-STLCX0V; FVIN: bluenrg_7 e_mode_-mhz-xok_m.img. Figure : SensorTile functional block diagram The FP-SNS-ALLMEMS firmware provides a complete framework to build wearable applications. The BlueMS application based on the BlueST-SDK protocol allows data streaming and a serial console over BLE controls the configuration parameters for the connected boards. It is recommended to upgrade the SensorTile firmware to the latest available version on October 07 DocID096 Rev /

2 Contents Contents UM0 Getting started.... Overview.... Package components.... Initial setup with pre-loaded demo System requirements... 8 STEVAL-STLCS0V hardware description Power supply... 0 STLCX0V hardware description.... Power supply.... USB device.... Audio DAC.... Solder bridge details... STLCR0V hardware description.... Power supply SensorTile and cradle assembly in form factor case... 7 SensorTile programming interface Sensors and Bluetooth low energy connectivity LSM6DSM LSM0AGR LPSHB MPDT BLUENRG-MS BALF-NRG-0D... 7 Board schematic and bill of materials Bill of materials Schematic diagrams Formal notices required by the U.S. Federal Communications Commission ("FCC") Formal product notice required by the Industry Canada ("IC"). 0 TYPE certification... Revision history... / DocID096 Rev

3 UM0 List of tables List of tables Table : STEVAL-STLCS0V main components... 9 Table : STEVAL-STLCS0V pinout... 0 Table : STLCX0V main components... Table : STLCX0V solder bridge details... Table : STLCR0V main components... Table 6: STEVAL-STLCS0V bill of materials... Table 7: STLCX0V bill of materials... Table 8: STLCR0V bill of materials... Table 9: Document revision history... DocID096 Rev /

4 List of figures List of figures UM0 Figure : SensorTile functional block diagram... Figure : SensorTile kit blister... 6 Figure : Orientation of SensorTile and cradle expansion connectors... 7 Figure : SensorTile mounted on cradle expansion... 7 Figure : STEVAL-STLCS0V main components and pinout... 9 Figure 6: STEVAL-STLCS0V power supply block diagram... Figure 7: STEVAL-STLCS0V component placement (top side)... Figure 8: STLCX0V main components... Figure 9: STLCX0V component placement (top side)... Figure 0: STLCR0V cradle main components... Figure : SensorTile soldered onto cradle board... 6 Figure : Battery connection and power switch... 6 Figure : SensorTile and cradle in plastic case... 7 Figure : STEVAL-STLCR0V component placement (top side)... 8 Figure : STEVAL-STLCR0V component placement (bottom side)... 8 Figure 6: STM Nucleo board, cradle and cradle expansion SWD connectors... 9 Figure 7: SWD connections with -pin flat cable... 9 Figure 8: STEVAL-STLCS0V schematic diagram ( of )... 6 Figure 9: STEVAL-STLCS0V schematic diagram ( of )... 7 Figure 0: STLCX0V schematic diagram... 8 Figure : STLCR0V schematic diagram... 9 / DocID096 Rev

5 UM0 Getting started Getting started. Overview STEVAL-STLKT0V is the development kit includes everything you need to remotely sense and measure motion, environmental and acoustic parameters. It is designed to support the prototyping phases of new projects and can be used in the contexts below. An evaluation system Evaluate high accuracy and very low power ST sensors in an optimized system architecture Field-test data fusion and embedded signal processing algorithms Deploy data collection campaigns to support custom algorithm development Reference design Compact solution for high-accuracy, low-power motion, environmental and audio sensor data in compact form-factor designs Complete hardware and software examples form the starting point for new designs with: hardware: schematics, Gerber, BoM, D CAD software: from basic examples (STSW-STLKT0) to complete function packs (FP-SNS-ALLMEMS, FP-AUD-BVLINK) Embedded software development kit Source code project examples based on the STMCube architecture Fully compatible with the Open.Software embedded processing libraries, and supported by the STM ODE host board implements the Arduino UNO R expansion connector to enable bridging to well-known development ecosystems such as STM ODE and Arduino Fast prototyping tool Plug or solder onto your prototype motherboard to instantly add its embedded sensing and communication functions to your design Use the D CAD files to integrate the SensorTile in your mechanical design. Package components Inside the STEVAL-STLKT0V package, you will find all the components needed to experience the demo on this optimized platform and to start developing you application. DocID096 Rev /

6 Getting started Figure : SensorTile kit blister UM0. Initial setup with pre-loaded demo The easiest thing to do after unpacking is to run the preloaded software using the SensorTile board together with the cradle expansion (STLCX0V). Take the SensorTile and plug it on the cradle expansion through the dedicated connector. Take care to match the orientation shown below. 6/ DocID096 Rev

7 UM0 Figure : Orientation of SensorTile and cradle expansion connectors Getting started Figure : SensorTile mounted on cradle expansion Connect a USB type A to mini-b USB cable to turn ON the board for the first time, verify that the J jumper is in position - (power supply from USB). If everything works fine then you ll see the SensorTile LED blinking approximately every seconds. The board is now ready to connect to the ST BlueMS mobile App: available on official stores for Android or ios. For more details on the embedded software and the apps, please refer to the BLUEMICROSYSTEM documentation on DocID096 Rev 7/

8 Getting started UM0 To exploit the newest features, upgrade the default firmware version to the new version of the FP-SNS-ALLMEMS function pack available at System requirements As the STEVAL-STLKT0V is already programmed with BLUEMICROSYSTEM firmware, to run the demo, you only need: A smartphone or tablet with minimum Android. or ios 8.0 operating systems and minimum BLE technology.0 A USB type A to mini-b USB cable for power supply (connected to a PC, AC adapter or any other source) To start designing your own project, you will need: A Windows PC (ver. 7 or higher) with an IAR, KEIL or AC6 firmware development environment A USB type A to Micro USB male cable to connect the STEVAL-STLKT0V to the PC for power supply An STM Nucleo board with ST-Link V. in-circuit debugger/programmer (preferred) or other compatible device The ST-LINK Utility for firmware download (latest embedded software version on 8/ DocID096 Rev

9 UM0 STEVAL-STLCS0V hardware description STEVAL-STLCS0V hardware description STEVAL-STLCS0V (SensorTile) is a highly integrated reference design that can be plugged into form-factor prototypes, adding sensing and connectivity capabilities to new designs through a smart hub solution. It can also easily support development of monitoring and tracking applications as standalone sensor nodes connected to ios /Android smartphone applications. The SensorTile occupies a very small.x. mm square outline, with all the electronic components on the top side and small connector on the bottom side to plug it onto the cradle expansion board. The connector pinout is repeated on 8 PCB pads that render the SensorTile a solderable system on module as well. The figure below and following two tables provide the main board component and pinout details. Figure : STEVAL-STLCS0V main components and pinout Table : STEVAL-STLCS0V main components Reference Device Description A MPDT0 MEMS audio sensor digital microphone B LD9J8R 0 ma low quiescent current low noise LDO.8 V C D E F STML76 MCU LSM6DSM LSM0AGR LPSHB ARM Cortex-M -bit microcontroller inemo inertial module: low-power D accelerometer and D gyroscope Ultra-compact high-performance ecompass module: ultra-low power D accelerometer and D magnetometer MEMS nano pressure sensor: hpa absolute digital output barometer DocID096 Rev 9/

10 STEVAL-STLCS0V hardware description UM0 Reference Device Description G BlueNRG-MS Bluetooth low energy network processor H BALF-NRG- 0D 0 Ω balun with integrated harmonic filter Board pin CONN pin Table : STEVAL-STLCS0V pinout Pin name MCU pin Main functions () MIC_CLK PC DFSDM_CKOUT, ADC _OUT /VBAT.8V from onboard LDO 6 VIN / Power supply for LDO [V-.V] 8 USB IO USB Power supply for USB peripheral and IO [.8V-.V] 0 VSS Ground 6 RXD/USB_DP PD/PA USART RX or USB_OTG_FS DP () 7 TXD/USB_DM PC/PA USART TX or USB_OTG_FS DM 8 6 SAI_CLK PG9 () SAI_SCK_A, SPI_SCK 9 SAI_FS PG0 () SAI_FS_A, SPI_MISO 0 SAI_MCLK PG () SAI_MCLK_A, SPI_MOSI SAI_SD PG () SAI_SD_A, SPI_NSS 9 GPIO PB8/PB9/PC DFSDM_DATIN6, IC_SDA 7 GPIO PC0 DFSDM_DATIN, IC_SCL NRST NRST STM Reset SWD_CLK SWD Programming interface clock 6 SWD_IO SWD Programming interface IO 7 / Ground 8 / Ground Notes: () Refer to STML76 Datasheet on for the complete set of functions of each pin () USB_OTG_FS Peripheral is functional for USB V () Logic level of this pins is referred to IO. Power supply The SensorTile board has the following input supply pins:. VIN is the input for the onboard voltage regulator generating.8 V (0 ma max).. USB is an input for the STML USB and IO pins (to use the STML USB OTG peripheral, USB must be V) is an output for.8 V. If the USB peripheral and other. V signals are not needed for a particular application, you can connect to USB so that one power supply can power the whole system. 0/ DocID096 Rev

11 UM0 STEVAL-STLCS0V hardware description This connection can be done externally (e.g., SB8 on STLCX0V) or by soldering a 0 Ω resistor on R (bottom layer). Figure 6: STEVAL-STLCS0V power supply block diagram Figure 7: STEVAL-STLCS0V component placement (top side) DocID096 Rev /

12 STLCX0V hardware description UM0 STLCX0V hardware description The SensorTile cradle expansion is an easy-to-use companion board for SensorTile and the SensorTile cradle boards included in the SensorTile Kit. The SensorTile board does not need to be soldered onto the cradle expansion board, but can be plugged onto the dedicated connector (see Figure : "Orientation of SensorTile and cradle expansion connectors" and Figure : "SensorTile mounted on cradle expansion". Apart from being a standalone host for the SensorTile board, the cradle expansion board can be connected to an STM Nucleo or other expansion board via the Arduino UNO R connectors to easily expand functionality. Figure 8: STLCX0V main components Table : STLCX0V main components Reference Device Description A SensorTile connector and footprint To plug or solder the SensorTile board B Arduino UNO R UNO R connector For STM Nucleo board compatibility C D E F ST78ETTR micro-usb connector, USBLC6-P6 (U), LDK0M-R (U) Audio DAC, phono jack SWD connector, Reset button 8-bit dual supply.7 V to. V level translator micro USB power supply /communication port and. V voltage regulation 6-Bit, low-power stereo audio DAC and. mm stereo phono jack -pin SWD connector for programming debugging and board reset button / DocID096 Rev

13 UM0. Power supply STLCX0V hardware description The power is either supplied by the host PC via USB or by an external source through the Arduino UNO R connector (CN6.). Jumper J selects the power source for the onboard. V regulator (U) and the SensorTile VIN pin: position -: V external position -: V via USB (default) The. V output of the regulator can be routed to the Arduino UNO R connector to power on other external components by soldering SB8 (default OFF). The USB pin of the SensorTile can be connected to two different power sources:. USB device. V SB9 (default ON).8 V (SensorTile ) SB8 (default OFF) The USB connector on the board can be used to supply power and for communication (USB_OTG_FS). To use the USB peripheral, use the following solder bridge configuration: SB0, SB, SB0 and SB OFF (disconnect the signals from U) SB9 ON (supply. V to the USB peripheral of the STM MCU). Audio DAC The PCM77 is a low-power stereo DAC designed for portable digital audio applications, and can be driven by the SensorTile to play any kind of Audio stream. A dedicated. mm audio jack makes it easy to connect headphones or active loudspeakers. In order to use the onboard audio DAC (U), the SAI (serial audio interface) and I²C signals must be routed to the component using the following configuration: SB, SB, SB, SB, SB6 and SB7 OFF (disconnect the signals from Arduino UNO R connector) SB, SB, SB, SB, SB6, SB7 ON (connect the signals to the DAC). Solder bridge details Table : STLCX0V solder bridge details Solder Bridge SensorTile signal Onboard signal Arduino signal SB Reset CN8. SB () GPIO DAC control IC SCL (pull-up) SB () GPIO DAC control IC SDA (pull-up) SB () SAI_SD DAC Audio IS_SD SB () SAI_SCK DAC Audio IS_SCK SB6 () SAI_FS DAC Audio IS_WS SB7 () SAI_MCLK DAC Audio IS_MCLK SB8 USB.8V from SensorTile SB9 () USB V from regulator DocID096 Rev /

14 STLCX0V hardware description UM0 Solder Bridge SensorTile signal Onboard signal Arduino signal SB0 RXD-USB_DP Level Translator - UART_RX CN9. SB RXD-USB_DP Level Translator - UART_TX CN9. SB SAI_SD SPI_CS CN. SB SAI_MCLK SPI_MOSI CN. SB SAI_FS SPI_MISO CN. SB SAI_SCK SPI_SCK CN.6 SB6 () GPIO CN.0 SB7 () GPIO CN.9 SB8 MIC_CLK Level Translator - MIC_CLK_V CN9. SB9 V V_Nucleo CN6. CN6. SB0 TXD-USB_DM Level Translator - UART_RX CN9. SB TXD-USB_DM Level Translator - UART_TX CN9. SB GPIO Level Translator - GPIO_V CN9.6 SB GPIO Level Translator GPIO_V CN9.7 Notes: () closed by default Figure 9: STLCX0V component placement (top side) / DocID096 Rev

15 UM0 STLCR0V hardware description STLCR0V hardware description The SensorTile cradle is a small companion board for SensorTile, geared at the development of form factor prototypes. You need to solder the SensorTile board to this board to render the system robust. The small cradle is ideal for applications requiring small, standalone, battery-powered sensor nodes. Figure 0: STLCR0V cradle main components Table : STLCR0V main components Reference Device Description A SensorTile footprint To solder the SensorTile board B C D HTS STBC08PMR, STC, LDK0M-R, USBLC6-P6 Power on/off switch Capacitive digital sensor for relative humidity and temperature 800 ma standalone linear Li-Ion battery charger with thermal regulation, Gas gauge IC, 00 ma low quiescent current very low noise LDO, very low capacitance ESD protection E SWD connector -pin SWD connector for programming and debugging F G Micro USB connector, - pin battery connector micro-sd card socket micro USB battery charging supply /communication port and connector for Li-Ion battery power supply Solder the SensorTile board onto the cradle board as shown in the figure below. DocID096 Rev /

16 STLCR0V hardware description Figure : SensorTile soldered onto cradle board UM0. Power supply The main board power supply is the 00 mah lithium-ion polymer battery attached to the appropriate connector on the PCB. Figure : Battery connection and power switch The battery can be recharged via USB connected to a PC or any micro-usb battery charger. A RED LED indicates the charging status: steady ON: the USB plug is correctly connected and the board is charging steady OFF: charging complete blinking: battery not present 6/ DocID096 Rev

17 UM0 STLCR0V hardware description The onboard STBC08 battery charger IC is configured by default with a maximum charging current of 0 ma. It is possible to modify this current by changing the R resistor value. Equation : The default 0 kω value for R hence gives: I chrg = V R 000 V 000 = 0mA 0K During normal usage, the battery needs to be connected to the board for proper operation. When the battery is plugged, the board is turned ON via the SW switch. This switch enables LDK0 V voltage regulator pin, which powers all board components.. SensorTile and cradle assembly in form factor case Refer to the following image for the orientation of the soldered SensorTile and cradle boards in the dedicated form factor case. Figure : SensorTile and cradle in plastic case DocID096 Rev 7/

18 STLCR0V hardware description Figure : STEVAL-STLCR0V component placement (top side) UM0 Figure : STEVAL-STLCR0V component placement (bottom side) 8/ DocID096 Rev

19 UM0 SensorTile programming interface SensorTile programming interface To program the board, connect an external ST-LINK to the SWD connector on the cradle; a -pin flat cable is provided in the SensorTile Kit package. The easiest way to obtain an ST-LINK device is to get an STM Nucleo board, which bundles an ST-LINK V. debugger and programmer. Ensure that CN jumpers are OFF and connect your STM Nucleo board to the SensorTile cradle via the cable provided, paying attention to the polarity of the connectors. Pin is identified by: a small circle on the PCB silkscreen STM Nucleo board and SensorTile cradle expansion the square shape of the soldering pad connector on the SensorTile cradle. Figure 6: STM Nucleo board, cradle and cradle expansion SWD connectors Figure 7: SWD connections with -pin flat cable DocID096 Rev 9/

20 Sensors and Bluetooth low energy connectivity UM0 6 Sensors and Bluetooth low energy connectivity 6. LSM6DSM The LSM6DSM is a system-in-package featuring a D digital accelerometer and a D digital gyroscope performing at 0.6 ma in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSM supports main OS requirements, offering real, virtual and batch sensors with Kbytes for dynamic data batching. ST s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DSM has a full-scale acceleration range of ±/±/±8/±6 g and an angular rate range of ±/±/±00/±000/±000 dps. The LSM6DSM fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI configurable for both gyroscope and accelerometer. High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for the creation and manufacturing of reliable products. 6. LSM0AGR The LSM0AGR is an ultra-low-power high-performance system-in-package featuring a D digital linear acceleration sensor and a D digital magnetic sensor. The Device has linear acceleration full scales of ±g/±g/±8g/±6g and a magnetic field dynamic range of ±0 gauss. The LSM0AGR includes an IC serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (00 khz, 00 khz, MHz, and. MHz) and an SPI serial standard interface. The system can be configured to generate an interrupt signal for freefall, motion detection and magnetic field detection. The magnetic and accelerometer blocks can be enabled or put into power-down mode separately. 6. LPSHB The LPSHB is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I²C or SPI from the sensing element to the application. The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST. The LPSHB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -0 C to +8 C. The package is holed to allow external pressure to reach the sensing element. 0/ DocID096 Rev

21 UM0 Sensors and Bluetooth low energy connectivity LPSHB is factory calibrated but a residual offset could be introduced by the soldering process. This offset can be removed with a one-point calibration. a 6. MPDT0 The MPDT0 is an ultra-compact, low-power, TOP port, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital output signal in PDM format. The MPDT0 has an Acoustic Overload Point of 0 dbspl with a 6 db Signal-to- Noise Ratio and 6 dbfs sensitivity. 6. BLUENRG-MS The BlueNRG-MS is a very low power Bluetooth low energy (BLE) single-mode network processor, compliant with Bluetooth specification v.. The BlueNRG-MS supports multiple roles simultaneously and can act at the same time as Bluetooth smart sensor and hub device. The Bluetooth Low Energy stack runs on the embedded ARM Cortex-M0 core. The stack is stored on the on-chip non-volatile Flash memory and can be easily upgraded via SPI. The device comes pre-programmed with a production-ready stack image b. A different or more up-to-date stack image can be downloaded from the ST website and programmed on the device through the ST provided software tools. The BlueNRG-MS allows applications to meet the tight advisable peak current requirements imposed by standard coin cell batteries. The maximum peak current is only 0 ma at dbm output power. Ultra low-power sleep modes and very short transition times between operating modes allow very low average current consumption, resulting in longer battery life. The BlueNRG-MS offers the option of interfacing with external microcontrollers via SPI transport layer. 6.6 BALF-NRG-0D BALF-NRG-0D is a 0 Ω conjugate match to BLUENRG-MS (QFN package) that integrates balun transformer and harmonics filtering. It features high RF performances with a very small footprint and a RF BOM reduction. It has been chosen as the best trade-off for costs, area occupation and high radio performances. The layout has been optimized to suit a -layer design and a chip antenna. a For further details, refer to application note AN8, "Measuring pressure data from ST's LPSHB digital pressure sensor", on b Its version could change at any time without notice DocID096 Rev /

22 Board schematic and bill of materials UM0 7 Board schematic and bill of materials This section contains the bill of materials and schematics. 7. Bill of materials Table 6: STEVAL-STLCS0V bill of materials Item Q.ty Ref. Value Description Order code Manufacturer U ARM Cortex- M b MCU Microcontroller STML76JGY6TR ST U 0 ma,.8 V low quiescent current low noise LDO LD9J8R ST U9 Ultra-low Power Acc + Magn LSM0AGRTR ST U0 Low-Power Accelerometer + Gyroscope LSM6DSMTR ST U6 Bluetooth Low-Energy Chip V. - MS BlueNRG-MSCSP ST 6 U Low-Power Pressure sensor LPSHBTR ST 7 U MEMS audio sensor digital microphone MPDT0 ST 8 U Bluetooth Low-Energy Balun Chip BALF-NRG-0D ST 9 X CRYSTAL MHZ 8PF SMD CX06DB000D0FLJCC AVX 0 X.7680kHz, 0ppm, pf, 60kΩ Crystal ABS KHZ-T Abracon C, C0 pf V CAP CER NP0 00 CBR0C09BGAC Kemet C, C7 pf V CAP 00 NP0 00A0JATA AVX FT 0pF V CAP CER NP0 00 0R0L00GVT Johanson Technology R 0 Ω Resistor SMD R00 Any FT / DocID096 Rev

23 UM0 Board schematic and bill of materials Item Q.ty Ref. Value Description Order code Manufacturer 6 MT 0.0pF V 7 C, C.µF 6.V 8 C9 0.µF 6.V 9 C0 0nF, 0V 0 C, C 00pF V ANT.GHZ 9 C, C, C0, C, C, C8, C9, C, C 0.µF 6.V ±0% CAP CER NP0 00 CAP CERAMIC XR, 00 CAP CER X7S 00 CAP, MLCC, XR, 00 CAP CER NP0 00 ANTENNA SMD CAP CER XR 00 0R0L0RAVT 006DMATA C060X7S0JK00BC C060XRAK00BB 0R0L0JVT ANT06008LCSMA GRM0R60J0KE9D R 60 Ω Resistor SMD Any 9 C, C, C6, C7, C8, C, C6, C9, C LED µf 6.V 60 nm, V, 0 ma, 0 mcd 6 CONN 0.mm 7 L 8 SWD Cable.9nH 00mA 00 MΩ.mm, L=cm CAP CER XR 00 LED, Low Power, Orange Connector Board-to- Board CL0A0KQCSNC KPG-060SEC-TT BM0NB(0.8)-6DS- 0.V() Johanson Technology AVX TDK TDK Johanson Technology TDK Murata Samsung KINGBRIGHT Hirose FIXED IND LQP0TNN9B0D Murata pin ribbon cable DocID096 Rev /

24 Board schematic and bill of materials Item Q. ty CN Table 7: STLCX0V bill of materials / DocID096 Rev UM0 Ref. Value Description Order code Manufacturer BM0JC- 6DP- 0.V() BM0JC-6DP- 0.V() Hirose CN HEADER 0 SSQ-0-0-L-S Samtec CN6,CN9 HEADER 8 SSQ-08-0-L-S Samtec CN8 HEADER 6 SSQ-06-0-L-S Samtec C,C,C0, C,C 00nF X7R 6 C,C6 7µF, 6.V Tantal 7 C8,C9,C, C.7µF, >6.V, < Ω ESR Tantal 8 C,C6.7µF, 0V XR 9 J 0 J PHONOJAC K STEREO Header M x J,J,J,J6 PCB Hole RESET SYS_MODE R 7kΩ ±% R 7kΩ±% SB,SB,R,SB,R,SB,SB6,SB7,S B9,SB6,SB 7 0R 6 R,R6 K7 7 SB,SB8,SB 0,SB,SB,SB,SB,SB,SB 8,SB9,SB 0,SB,SB,SB NC 8 SWD CON RASMTBHNTR X PTS80 J0M SMTR LFS 9 USB USB-MICRO USB07-0-A GCT 0 U U USBLC6- P6 PCM77R GP USBLC6-P6 PCM77RGP U LDK0M-R LDK0M-R ST U ST78ETT R ST78ETTR Switchcraft C&K Components ST TI ST

25 UM0 Board schematic and bill of materials Table 8: STLCR0V bill of materials Item Q.ty Ref. Value Description Order code Manufacturer BATT Battery Connector Molex CHRG LED Red C,C8,C9 00nF X7R C,C,C6,C7 0V,.7µF XR 6 C0 0V, µf XR 7 LED LED Green 8 R 7kΩ±% 9 R 7kΩ±% 0 R kω R,R8 kω R 0kΩ±% R6,R7,R NC R0 0 Ω R9 0mΩ±%, >=/6W 6 SD Micro-SD DMD-SF Hirose 7 SWD CON 8 SW PWR SSAJ000 9 USB USB-MICRO USB07-0- A 0 U USBLC6-P6 USBLC6-P6 ST U STBC08PMR STBC08PMR ST U LDK0M-R LDK0M-R ST U STCIQT STCIQT ST U HTS HTS ST Battery.7V 00mAh LiPO-0 pin connector 6 Plastic Box Plastic Box 7 M-Nut HEX shape HEX Nut M - steel 8 M-Screw 9 M-Screw Pan head - Phillips Pan head - Phillips 0mm M Pan head Phillips - steel mm M Pan head Phillips - steel LiPO-0 Alps Electric Co. GCT Himax electronics RS or equivalent RS or equivalent RS or equivalent DocID096 Rev /

26 Board schematic and bill of materials 7. Schematic diagrams Figure 8: STEVAL-STLCS0V schematic diagram ( of ) Ultra-low-power DSP STML76xx Microcontroller UM0 LED USB RXD-USB_DP SAI_SCK GPIO TXD-USB_DM SAI_FS USB MIC_DATA A A A A A A6 A7 A8 A9 B B B B B B6 B7 B8 B9 CS_A BLUE_IRQ TEST CS_M BLUE_CS CS_P BLUE_SCK BLUE_MISO BLUE_MOSI USB PA PD PG9 PG PB PB7 VSS U VSS STML76JGY6 PA PC PG0 PG IO PB6 PC VBAT C Crystal X ABS KHZ-T C0 OSC_OUT LED R SAI_SD p p Decoupling Capacitors USB KPG-060SEC-TT SPI_CLK CS_AG J9 VSS J8 J7 PC J6 PC J PB0 J PB J PB J VSS J H9 A H8 PA0 H7 PA H6 PA H PA6 H PA7 H PB0 H PB H PB C PA C PA C PC C PG C PG C6 PB C7 PB C8 PC C9 PC D PA D PA0 D PC0 D7 BOOT0 D8 PH D9 PH0 E PC9 E PA8 E PA9 VSSA VREF+ PC PA PA PA PB PB PB PC0 PC PC PC6 PC8 PC7 NRST PB9 PB8 G9 G8 G7 G6 G G G G G F9 F8 F7 F F F E9 E8 E7 INT INT INT SPI_SDA GPIO GPIO MIC_CLK INT INT INT NRST GPIO GPIO RXD-USB_DP GPIO6 SAI_MCLK SAI_SD OSC_OUT OSC_IN TXD-USB_DM OSC_IN BLUE_RST C8 u C C C6 C C C u u u 00n u 00n Moon Pin output ADC_IN, DFSDM_CKOUT SWD_ +V supply.0v -.6V supply USART RX or USB DP USART TX or USB DM SPI_SCK, SAI_SCK_A SPI_MISO, SAI_FS_A MIC_CLK VIN USB RXD-USB_DP TXD-USB_DM SAI_SCK SAI_FS GPIO6 GPIO NRST GPIO GPIO SAI_SD SAI_MCLK SWD_ SWD_IO SWD_CLK SWD_RST LP_UART_RX, IC_SCL, ADC_IN, DFSDM_DATIN LP_UART_TX, IC_SDA, ADC_IN, DFSDM_CKIN (DFSDM_DATIN6) SPI_NSS, SAI_SD_A SPI_MOSI, SAI_MCLK_A Low-Drop Out Voltage Regulator Hirose bottom connector (optional) VIN U B B IN OUT A A EN LD9J8 C7 u C0 00n C9 u C6 u R USB 0 GPIO6 GPIO NRST GPIO GPIO SAI_SD SAI_MCLK SAI_FS G P P P P7 P9 P P P CONN G G G P P P P P P P6 P P6 P8 P7 P8 P0 P9 P0 P P P P P P P6 P P6 MIC_CLK VIN USB RXD-USB_DP TXD-USB_DM SAI_SCK G G G G BM0NB(0.8)-6DS-0.V() 6/ DocID096 Rev

27 UM0 Board schematic and bill of materials Figure 9: STEVAL-STLCS0V schematic diagram ( of ) BlueNRG - Bluetooth low energy chip Accelerometer + Magnetometer P P U9 SPI_CLK CS_A P P SCL CS_XL INT INT _IO P0 P9 CS_M SPI_SDA P P CS_MAG SDA DRDY P8 P7 LSM0AGR C9 0n Accelerometer + Gyroscope P P P U0 P P P P SDO NC SDX OCS SCX INT INT LSM6DSH SDA SCL CS IO P P6 P7 P P0 P9 P8 INT C 00n C8 00n SPI_SDA SPI_CLK CS_AG Pressure Sensor Digital Microphone U P0 P9 P8 U SPI_CLK P P _IO SCL INT/DRDY CS P7 P6 CS_P B G* LR CLK DOUT B B B MIC_CLK MIC_DATA P RES P SDA P SDO LPSHB MPDT0 SPI_SDA P P6 C Tuning Balun + chip antenna DocID096 Rev 7/

28 Board schematic and bill of materials UM0 8/ DocID096 Rev Figure 0: STLCX0V schematic diagram SH 7 OUT SensorTile SAI_FS 8 V SWDIO TILE_RESET SensorTile Connector USB, SWD, Power RXD-USB_DP SWDCLK SB8 CN BM0B(0.8)-6DP-0.V() C.7μF 6 V V 6 MIC_CLK G USB GPIO D GPIO SAI_MCLK V_USB G 8 0 V_USB VIN RXD-USB_DP GPIO J VIN SB9 6 SAI_MCLK Max 00mA SAI_SCK C6.7μF TXD-USB_DM EN SensorTile Footprint 7 V_USB ADJ SWDCLK SWDIO TXD-USB_DM G 9 D TXD-USB_DM VIN 6 8 GPIO D TILE_RESET SH D IN USB USB-MICRO MIC_CLK 7 USB C 00nF SAI_SD Fixing holes On the corners Hole:.mm Head: mm STM Nucleo R 7K 0 RXD-USB_DP VBUS SAI_SCK 6 RESET C 00nF TILE_RESET R 7K 9 G VIN SAI_FS 6 SAI_SD SAI_SCK 6 IC_SCL V CN9 SB8 6 UART_TX SB9 7 GPIO_V CN R K7 SPI_CS 7 SB SB SB UART_RX 6 SB6 TILE_RESET SAI_MCLK 6 GPIO_V SAI_FS SPI_SCK 8 8 CN6 8 V_Nucleo GPIO IC_SDA GPIO SB SPI_MOSI R6 K7 SPI_MISO V CN8 V SB7 0 SAI_SD 9 MIC_CLK_V 7 SB SWDCLK TILE_RESET SWD SWDIO SB0 C0 00nF L6 UART_RX 6 GPIO SB0 SB L RXD-USB_DP 8 9 VCC CC7 0 6 L TXD-USB_DM CC CC U ST78ETTR UART_TX L7 MIC_CLK_V CC OE TXD-USB_DM L 7 CC MIC_CLK 8 CC 0 CC6 7 SB GPIO_V SB GPIO_V CC8 9 VL C 00nF L8 RXD-USB_DP L GPIO SB L V U LDK0M-R ADR VCOM SAI_FS SCKI SAI_MCLK SB R0R V A + SB P MODE J PHONOJACK STEREO H_L 7 V AIR VIO PAD C 7μF LRCK C.7μF 6 SB P GPIO DIN SB6 SB7 C 00nF VCC SAI_SCK + GPIO 0 6 R0R 8 + BCK C9.7μF 9 SDA C.7μF SAI_SD V 8 D AIL H_R + SB 0 SCL C8.7μF VPA C6 7μF + U PCM77RGP U USBLC6-P6

29 UM0 Figure : STLCR0V schematic diagram Board schematic and bill of materials USB, SWD, Power switch RXD-USB_DM RXD-USB_DP U USBLC6-P6 VBUS D D 6 D D V_USB C 00nF V_USB USB-MICRO SH SH SWD SWDCLK SWDIO RESET V R K LED SWDCLK V MIC_CLK RXD-USB_DP RXD-USB_DM SD_SCK SD_MISO SensorTile footprint SWDIO SWDCLK RESET IC_SCL IC_SDA SD_CS SD_MOSI Battery Charger micro-sd card socket C.7μF V_USB CHRG U STBC08PMR 6 Vcc BAT PROG CHRG PWR_ON PAD R0 0R R 0K VBat V_USB VBat SD_CS SD_MOSI SD_SCK SD_MISO V C9 00nF VPROG = V IBAT=(VPROG/RPROG)x000 RPROG=000*VPROG/IBAT R7 NC R6 NC V_USB Battery Connector VBat BATT BAT_NTC SD C R NC 7.7μF R K CHRG CHRG DAT DAT0 CLK CMD CD/DAT DAT IC_SDA IC_SCL U STCIQT 0 ALM VIN 9 SDA VCC 8 SCL BATD/CD 7 NC RSTIO 6 CG VBat C0 μf Bat- Micro-SD DETC SW SWA SWB R8 K R9 0 mω BAT_NTC VBat PWR SW VBat U V_EN IN EN C7 LDK0M-R OUT Max 00mA ADJ R 7K V C6 C8 HTS sensor U HTS SCL IC_SCL 6 CS SDA IC_SDA.7μF R 7K.7μF 00nF DRDY DocID096 Rev 9/

30 Formal notices required by the U.S. Federal Communications Commission ("FCC") UM0 8 Formal notices required by the U.S. Federal Communications Commission ("FCC") Model: STEVAL-STLKT0V FCC ID: S9NSTILE0 FCC NOTICE: This device complies with part of the FCC Rules. Operation is subject to the following two conditions: () This device may cause harmful interference, and () this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user s authority to operate the equipment. Additional warnings for FCC This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference's by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/tv technician for help. 0/ DocID096 Rev

31 UM0 Formal product notice required by the Industry Canada ("IC") 9 Formal product notice required by the Industry Canada ("IC") Model: STEVAL-STLKT0V IC: 8976C-STILE0 Innovation, Science and Economic Development Canada Compliance - This device complies with Innovation, Science and Economic Development RSS standards. Operation is subject to the following two conditions: () this device may not cause harmful interference, and () this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user s authority to operate the equipment. Conformité à Innovation, Sciences et Développement Économique Canada - Cet appareil est conforme aux normes RSS d'innovation, Science et Développement économique. L'utilisation est soumise aux deux conditions suivantes: () cet appareil ne doit pas causer d'interférences nuisibles, et () cet appareil doit accepter de recevoir tous les types d interférence, y comprises les interférences susceptibles d'entraîner un fonctionnement indésirable. Les changements ou les modifications non expressément approuvés par le fabricant pourraient annuler le permis d'utiliser l'équipement. DocID096 Rev /

32 TYPE certification UM0 0 TYPE certification The module has been tested according to the following TYPE certification rules: Type of specified radio equipment: radio equipment according to the certification ordinance article --9 sophisticated low power data communication system in a. GHz band Class of emissions, assigned frequency and antenna power: FD, 0 to 80 MHz, channel separation MHz/0 channels, W Certification number: The design and manufacturing are certified on the basis of the Japan Radio Law 8-. / DocID096 Rev

33 UM0 Revision history Revision history Table 9: Document revision history Date Version Changes 7-Aug-06 Initial release. 8-Aug-07 0-Oct-07 Updated Section "Introduction", Section.: "Overview", Section.: "Initial setup with pre-loaded demo", Section 6.: "MPDT0", Section 6.: "BLUENRG-MS" and Section 9: "Formal product notice required by the Industry Canada ("IC")" Added Figure 7: "STEVAL-STLCS0V component placement (top side)", Figure 9: "STLCX0V component placement (top side)", Figure : "STEVAL-STLCR0V component placement (top side)", Figure : "STEVAL-STLCR0V component placement (bottom side)" and Section 0: "TYPE certification" Updated Figure : "STLCR0V schematic diagram" DocID096 Rev /

34 UM0 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 07 STMicroelectronics All rights reserved / DocID096 Rev