HSMF-C116. Ultra Small Surface Mount Tricolor ChipLED. Data Sheet. Features. Description. Applications. Package Dimensions. Pin4. Pin1. Pin1.

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1 Ultra Small Surface Mount Tricolor ChipLED Description This ultra-small tricolor chipled is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInaP die and high intensity InaN green and blue die. To improve contrast the PC substrate has a black surface. Applications Display acklighting Indicator Features LED with AlInaP and InaN die Surface mount device with ultra small 1. 1.mm footprint Suitable for application that requires small pitch size Compatible with reflow soldering Taped in 8mm carrier tape on a 7 inch diameter reel Package Dimensions Pin Pin1.65 (.3) Pin Pin4 Pin4 Pin3 Pin2 Pin3 Pin2 esin PC Pin2 Pin3 Pin1 NOTE All dimensions in millimeters. Tolerance is ±.1 mm unless otherwise specified. CAUTION This LED is class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-1. Please observe appropriate precautions during handling and processing. efer to application note AN-1142 for additional details. roadcom - 1 -

2 Absolute Maximum atings (T J = 25 C) Parameter AlInaP ed InaN reen InaN lue Unit DC Forward Current [1] ma Peak Forward Current [2] ma Power Dissipation mw LED Junction Temperature C Operating Temperature ange 4 to 85 C Storage Temperature ange 4 to 85 C NOTE 1. Derate linearly as shown in Figure /1 duty factor and.1ms pulse width. Optical Characteristics (T J = 25 C, = 1 ma, / = 5 ma) Color Luminous Intensity, Iv(mcd) [3] Peak Wavelength, p(nm) Dominant Wavelength, d (nm) [4] Viewing Angle, 2 1/2 ( ) [5] Typ. Typ. Typ. Typ. ed reen lue NOTE 3. The luminous intensity is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with the axis. 4. The dominant wavelength is derived from the CIE chromaticity diagram and represents the perceived color of the device. 5. 1/2 is the off axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics (T J = 25 C, = 1 ma, / = 5 ma) Forward Voltage, V F (V) [6] Color everse Voltage, V (V) [7] at I =1μA ed reen lue NOTE 6. Forward voltage tolerance ±.1V. 7. everse voltage indicates product final test. Long term reverse bias is not recommended. roadcom - 2 -

3 Intensity ins (CAT) ed Color ins (IN) ed in ID Luminous Intensity (mcd) in ID Dominant Wavelength (nm) P Q Q Q Tolerance: ±1nm Color ins (IN) reen Tolerance: ±15% Intensity ins (CAT) reen in ID Dominant Wavelength (nm) Luminous Intensity (mcd) in ID S S Tolerance: ±15% Intensity ins (CAT) lue Luminous Intensity (mcd) in ID N N N P Tolerance: ±1nm Color ins (IN) lue Dominant Wavelength (nm) in ID Tolerance: ±1nm Tolerance: ±15% CAUTION 1. The above optical performance specifications are valid in the case where single LED is lit up. 2. The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time or uniformity in luminous intensity when more than 1 LED is lit up. roadcom - 3 -

4 Figure 1 Spectral Power Dissipation Figure 2 elative Intensity vs. Forward Current ELATIVE INTENSITY WAVELENTH - nm ELATIVE LUMINOUS INTENSITY (NOMALIZED AT =1mA, /=5mA) FOWAD CUENT - ma Figure 3 Forward Current vs. Forward Voltage 6 5 FOWAD CUENT - ma FOWAD VOLTAE - V Figure 4 Dominant Wavelength Shift vs. Forward Current DOMINANT WAVELENTH SHIFT - nm FOWAD CUENT - ma Figure 5 adiation Pattern Figure 6 elative Intensity vs. Temperature NOMALIZED INTENSITY ANULA DISPLACEMENT - DEEES ELATIVE LUMINOUS INTENSITY JUNCTION TEMPEATUE - C roadcom - 4 -

5 Figure 7 Derating Curve 12 1 FOWAD CUENT - ma AMIENT TEMPEATUE - C Figure 8 ecommended Soldering Land Pattern roadcom - 5 -

6 Tape and eel Dimensions Tape and eel Dimensions Figure 9 Carrier Tape Dimensions ±.1 4. ±.1 2. ± ±.1.78± ± ±.5 8. ± ±.1 USE FEED DIECTION LED OIENTATION IN POCKET.25 ±.5 PIN 3 PIN 4 PIN 2 PIN 1 Figure 1 eel Dimensions Ø 13.1 ±.5 (Ø.516 ±.2) 8. ± 1. (.315 ±.39) 1.5 ± 1. (.413 ±.39) 3. ±.5 (.118 ±.2) Ø 2.2 MIN. (Ø.795 MIN.) ± 1. (7.24 ±.39) 59.6 ± 1. (2.346 ±.39) 4. ±.5 (.157 ±.2) 6 PS 5. ±.5 (.197 ±.2) roadcom - 6 -

7 Soldering Soldering ecommended eflow Soldering Conditions: TEMPEATUE 217 C 2 C 15 C C 3 C/SEC. MAX. 3 C/SEC. MAX SEC. TIME 1 SEC. MAX. 6 C/SEC. MAX. 1 SEC. MAX. a. eflow soldering must not be done more than 2 times. Observe necessary precautions of handling moisture sensitive device as stated in the section below. b. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. c. eflow soldering is the preferred method by which to solder the LED. However, if unavoidable (eg. rework), manual hand soldering may be used under strictly controlled conditions as stated below: Max soldering iron tip temperature = 31 C Max soldering duration = 2 sec Max number of cycles = 1 Max soldering iron power rating = 5W d. The soldering iron should only contact the soldering terminals. The soldering iron should not make any contact with the LED package body as it may cause damage to the LED. e. User is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. Precautionary Notes Handling of moisture sensitive device This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-2. efer to Avago Application Note AN535, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. efore use An unopened moisture barrier bag (M) can be stored at <4 C/9% H for 12 months. If the actual shelf life has exceeded 12 months and the humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. It is recommended that the M not be opened prior to assembly (e.g., for IQC). b. Control after opening the M The humidity indicator card (HIC) shall be read immediately upon opening of M. The LEDs must be kept at <3 C / 6% H at all times and all high temperature related processes including soldering, curing or rework need to be completed within 168 hours. c. Control for unfinished reel Unused LEDs must be stored in a sealed M with desiccant or desiccator at <5% H. d. Control of assembled boards If the PC soldered with the LEDs is to be subjected to other high temperature processes, the PC need to be stored in sealed M with desiccant or desiccator at <5% H to ensure that all LEDs have not exceeded their floor life of 168 hours. e. aking is required if: The HIC indicator is not blue at 1% and is pink at 5%. The LEDs are exposed to condition of >3 C / 6% H at any time. The LED floor life exceeded 168 hrs. The recommended baking condition is: 6 C ±5 ºC for 2 hrs. aking should only be done once. roadcom - 7 -

8 DISCLAIME Avago Technologies products are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago Technologies or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: roadcom, the pulse logo, Connecting everything, Avago Technologies, and the A logo are the trademarks of roadcom in the United States, certain other countries and/or the EU. Copyright roadcom. All ights eserved. The term "roadcom" refers to roadcom Limited and/or its subsidiaries. For more information, please visit roadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by roadcom is believed to be accurate and reliable. However, roadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. pub-5255 June 16, 216

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