DATA SHEET. Integrated Transceiver Modules for IEEE Development Kits available: ZICM2410P0-KIT2-1, ZICM2410P2-KIT1-1

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1 DATA SHEET DESCRIPTION CEL's Series provides high performance and low cost 2.4 GHz IEEE modules for a broad range of wireless networks. The MeshConnect certified and qualified modules, enable customer to accelerate time to market by greatly reducing design and certification phases of development. CEL's radio modules leverage the advanced features of the Integrated Circuit (IC). The IC is a true single-chip solution, compliant with IEEE specifications, a complete wireless solution for all applications. The IC consists of an RF transceiver with baseband modem, a hardwired MAC and an embedded 8051 microcontroller with internal Flash memory. The device provides numerous generalpurpose I/O pins, peripheral functions such as timers and UARTs and is one of the first devices to provide an embedded Voice CODEC. This device is also ideal for low power applications. The original MeshConnect module delivers excellent performance at a surprisingly low cost. The module s +6dBm output power means better range, more reliable transmission and fewer nodes in your network. It also makes these modules ideal for applications where cost and power constraints do not allow for external power amplifiers or peripheral range extension components. The MeshConnect Extended Range module adds a power amplifier (PA) and low noise amplifier (LNA) to increase range to over two miles - plus more reliable transmission and fewer nodes in your network. It is especially useful for open outdoor applications where the nodes are physically far apart, or for indoor use where the nodes have to operate in a noisy RF environment. The Extended Range s outstanding +123 db budget link ensures high quality connections even in such harsh environments. ORDERING INFORMATION Series and Extended Range Integrated Transceiver s for IEEE Development Kits available: ZICM2410P0-KIT2-1, ZICM2410P2-KIT1-1 MeshConnect Series 96 kb FLASH Memory 8 kb SRAM 8051 MCU core up to 22 GPIO Pins SPI (Master/Slave) + UARTs I 2 S/PCM Interface with two 128-byte FIFOs µ-law/a-law/adpcm Voice Codec 4-channel 8-bit ADC FEATURES High RF performance: - Up to 123 db RF Link Budget - RX Sensitivity: -97 dbm and dbm - RF TX Power:+6 dbm and +20 dbm Scalable Data Rate: 250 kbps, 500 kbps and 1Mbps Small footprint: 1 x (25.4 mm x 35.9 mm) Voice Codec Support: µ-law/a-law/adpcm 4 Level Power Management Scheme w/ Deep Sleep Mode (0.3 µa) Integrated PCB trace antenna 16 RF channels Range: - ZICM2410P0: feet (609+ meters) - ZICM2410P2: feet (4876+ meters) AES 128-bit encryption Extended software support: - SNAP - SMAC, MAC - Audio FCC, CE and IC certifications ROHS compliant APPLICATIONS Industrial Controls Home & Food processing controls Building Automation Traffic Management Security Sensor Networks HVAC control Asset Management Lighting control Barcode reader Thermostats Patient Monitoring Glucose monitor Part Number Order Number Description Mins/Mults ZICM2410P dbm Output power, PCB Trace antenna 140 / 140 ZICM2410P0-1-SN +6 dbm Output power, PCB Trace antenna, SNAP OS with MAC address 14 0 / 140 ZICM2410P0-1C +6 dbm Output power, with u.fl Connector for external antenna 140 / 140 ZICM2410P0-1C-SN +6 dbm Output power, with u.fl Connector for external antenna, SNAP OS with MAC address 14 0 / 140 ZICM2410P0-KIT dbm Engineering Development Kit 1 / 1 ZICM2410P dbm Output power, PCB Trace antenna 140 /140 ZICM2410P2-2-SN +20 dbm Output power, PCB Trace antenna, SNAP OS with MAC address 14 0 / 140 Extended Range ZICM2410P2-2C +20 dbm Output power, with u.fl Connector for external antenna 140 /140 ZICM2410P2-2C-SN +20 dbm Output power, with u.fl Connector for external antenna, SNAP OS with MAC address 14 0 / 140 ZICM2410P2-KIT1-1 Evaluation board for +20 dbm module 1 / 1 The information in this document is subject to change without notice, please confirm data is current Document No: (Issue E) Date Published: June 14, 2012 Page 1

2 MODULE BLOCK DIAGRAM Extended Range PWR Reg Castellation Edge Connector Micro processor 16 MHz XTAL IC Radio DEVELOPMENT KIT CEL's MeshConnect Development Kit assist users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules in to the target environment and evaluate performance on-site. The MeshConnect Development Kit also serves as an invaluable aid in application development. Through the many interface headers on the board, the user has access to all the MeshConnect module pins enabling easy connection to target systems for application development. The key components of the MeshConnect Development Kits are the CEL s MeshConnect radio module and the interface board. The MeshConnect module contains the CEL transceiver IC, Crystals, Power Regulator and an integrated PCB antenna or connector for an external antenna (optional). The interface board features a serial communication interface, a power management module, and peripherals such as potentiometers, LEDs, and GPIO headers. For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CEL s website Order Number ZICM2410P0-KIT2-1 ZICM2410P2-KIT1-1 ANT Description +6 dbm Engineering Development Kit Evaluation board for +20 dbm module PWR Reg Castellation Edge Connector Micro processor 16 MHz XTAL IC Radio Kit Contents: Evaluation Boards w/ (3) USB Cables (1) Jumpers (10) USB/WNA w/cable (1) PA LNA Development Kit Kit Contents: Evaluation Boards w/ (1) USB Cables (1) ANT AA Batteries (4) Universal AC/DC Power Supply (2) Software & Technical Information CD (2) Extended Range Development Kit Jumpers (2) Software & Technical Information CD (2) Page 2

3 TABLE OF CONTENTS Introduction and Overview Description... 1 Features... 1 Applications... 1 Ordering Information... 1 Block Diagram... 2 Development Kit... 2 System Level Function Transceiver IC... 4 Modes of Operation (TX, RX, Sleep)... 5 Power Amplifier... 6 Interface... 6 Software Tools... 6 Electrical Specification Absolute Maximum Ratings... 8 Recommended (Operating Condition)... 8 DC Characteristics... 8 RF Characteristics... 8 Pin Signal & Interfaces Pin Signals I/O Configuration... 9 I/O Pin Assignment... 9 Dimensions Processing 13 Agency Certifications 14 Shipment, Storage & Handling 15 References & Revision History 16 Page 3

4 TRANSCEIVER IC A true monolithic solution, the MeshConnect IC incorporates the RF transceiver with baseband modem, a hardwired MAC, and an embedded 8051 microcontroller, offering an excellent low cost high performance solution for all IEEE applications. PS/2 UART/2 SPI WDT GPIO/24 Timer/4 PWM/2 Quad Key Scan Digital Regulator ADPCM a-law μ-law MCU (8051) RC Oscillator Voice FIFFO DMA Clock PLL With an industry best +6 dbm output power, the MeshConnect IC will support a wide a variety of applications without the need for external amplification. Combined with a highly sensitive -97 dbm receiver the MeshConnect IC leads the industry with 103 db link budget. In addition to excellent RF performance at 250 kbps data rates, the IC adds high speed modes, Turbo (500 kbps) and Premium (1 Mbps), for networks looking for increased throughput. The device provides numerous general-purpose I/O pins, peripheral functions such as timers and UARTs and is one of the first devices to provide an embedded Voice CODEC. CEL provides its customers with the IEEE stack as part of the software library. Also available are the hardware & software tools required to develop custom applications. The combination of industry leading link budget, high speed RF, and integrate voice CODEC make the IC a truly distinct single chip solution. The Extended Range module adds both an PA and LNA to maximize RF performance. The PA enable the Extended Range module to output up to +20 dbm transmit power. In the receive path the addition of the LNA boosts the already sensitive receiver up to -103 dbm. The Extended Range link budget boasts a very robust 123 db enabling a line of sight range over 3 miles. MAC AES Engine FLASH 96KB POR MODEM DATA 8KB 3V Ciruitry RF TX RF RX PLL Temp. Sensor Bat Monitor ADC (4CH) Analog Regulator ROM Page 4

5 ANTENNA CEL's MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional u.fl connector can be specified, providing connection to a 50-ohm external antenna of the user s choice. See Ordering Information on page 1. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern. To maximize antenna efficiency, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute significantly to the antenna performance (it should not be directly under the F-Antenna). The position of the module on the host board and overall design of the product enclosure contribute to antenna perfor mance. Poor design affects radiation patterns and can result in reflection, diffraction, and/or scattering of the transmitted signal. Here are some design guidelines to help ensure antenna performance: Never place the ground plane or route copper traces directly underneath the antenna portion of the module. Never place the antenna close to metallic objects. In the overall design, ensure that wiring and other components are not placed near the antenna. Do not place the antenna in a metallic or metalized plastic enclosure. Keep plastic enclosures 1cm or more from the antenna in any direction. For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout. MODES OF OPERATION There are three power down modes in the IC. Each mode can be set using the PDMODE [1:0] bits in the PDCON register and power down modes can be started by setting the PDSTART bit to 1. Each mode has a different current consumption and wake-up sources, please refer to the IC datasheet for further information on the available power down modes. Table 8 describes the three power down modes. Table 8 Power Down Modes PDMODE [1:0] Description Wake-Up Source Regulator for Digital block 0 Active (Normal Operation) PM1 mode 2 PM2 mode 3 PM3 mode Hardware Reset, Sleep Timer interrupt, External interrupt Hardware Reset, Sleep Timer interrupt, External interrupt Hardware Reset, External interrupt ON OFF (After wake-up, register configuration is required) OFF (After wake-up, register configuration is required) Page 5

6 POWER AMPLIFIER The ZICM2410P0 MeshConnect module does not incorporate an external Power Amplifier and therefore the RF output port is connected directly (through matching components) to the RF antenna. As CEL s IC IEEE transceiver already offers the industry s best link budget at 103 db, even without an external PA the MeshConnect can maintain wireless connection over long distance (2,000 ft line-of-sight). The Extended Range module adds both an PA and LNA to maximize RF performance. The PA enable the Extended Range module to output up to +20 dbm transmit power. In the receive path the addition of the LNA boosts the already sensitive receiver up to -103 dbm. The Extended Range link budget boasts a very robust 123 db enabling a line of sight range over 3 miles. INTERFACE The MeshConnect has all major communication interfaces routed from the IC to the module edge connectors: UART1 & UART 2 I 2 S SPI VOICE CODEC The MeshConnect IC includes three voice codec algorithms: μ-law, a-law and ADPCM. The μ-law algorithm is a companding algorithm primarily used in the digital telecommunication systems of North America and Japan. As with other companding algorithms, its purpose is to reduce the dynamic range of an audio signal. In the analog domain this can increase the signal-to-noise ratio (SNR) achieved during transmission and in the digital domain, it can reduce the quantization error (hence increasing signal to quantization noise ratio). These SNR improvements can be traded for reduced bandwidth and equivalent SNR instead. The a-law algorithm is a standard companding algorithm used in European digital communications systems to optimize/modify the dynamic range of an analog signal for digitizing. The a-law algorithm provides a slightly larger dynamic range than the μ-law at the cost of worse proportional distortion for small signals. Adaptive DPCM (ADPCM) is a variant of DPCM [Differential (or Delta) pulse-code modulation] that varies the size of the quantization step, allowing further reduction of the required bandwidth for a given signal-to-noise ratio. DPCM encodes the PCM values as differences between the current and the previous value. For audio applications this type of encoding reduces the number of bits required per sample by about 25% compared to PCM. SOFTWARE TOOLS CEL offers complete SW tools for MeshConnect that customers need to create their application. DEVICE PROGRAMMER Device Programmer is used to program the application firmware to the on-chip Flash program memory of the IC device. Device Programmer supports: ISP Mode: Download the firmware from the host PC via serial communication through the IC s UART1 interface. The evaluation boards utilize a USB -> Serial converter. OTA Mode: Download the firmware from the host PC using wireless communication (Over-The-Air). This requires two nodes, the host (connected to a PC) and the target device to be programmed. Device Programmer can read / write hardware information (i.e. IEEE Address, Channel #, etc) directly via the aforementioned communication modes. Page 6

7 SOFTWARE TOOLS (Continued) PACKET ANALYZER AND WIRELESS NETWORK ANALYZER Packet Analyzer monitors traffic over a wireless network channel by capturing RF packet data in real-time. Packet Analyzer requires the Wireless Network Analyzer to sniff the RF packets. Packet Analyzer also includes diagnostic tools: Energy Scan: Evaluates the received signal power within the bandwidth of an IEEE channel yielding available channels. Active Scan: Scanning for active Coordinators and Routers broadcasting a Beacon frame. Can be used in conjunction with any IEEE or network. KEIL 8051 DEVELOPMENT TOOLS (Evaluation version provided in development kit). Supports all 8051 derivatives and variants. Easy-to-Use µvision Integrated Development Environment (IDE) supports the complete development cycle. Supports memory banking for CODE and variables beyond the 64 kbyte threshold. Numerous optimization levels yield the ability to place more features into less memory providing the utmost code density. Page 7

8 ABSOLUTE MAXIMUM RATINGS Description Extended Range Min Max Min Max Power Supply Voltage (Vcc) VDC Voltage on any digital pin VDC Input RF Level 10-6 dbm Storage Temperature C Reflow Soldering Temperature C Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Description Extended Range Min Typ Max Operating ambient temperature range, T A C Operating Supply Voltage VDC Input Frequency GHz DC CHARACTERISTICS (@ 25 C, VCC = 3.0V unless otherwise noted) Description Unit Extended Range Min Typ Max Min Typ Max Vcc Supply (Vcc) VDC Rx mode Current (Vcc = 3.0V) ma Tx mode Current (Vcc = 3.0V, Pout Max) ma Tx mode Current (Vcc = 2.1V, Pout Max) ma Tx mode Current (Vcc = 3.0V, 0 dbm) ma Sleep Mode (Deep) Current 1 1 µa RF CHARACTERISTICS (@ 25 C, VCC = 3.0V unless otherwise noted) Description Extended Range Unit Min Typ Max Min Typ Max Frequency Band (16 5MHz wide channels) GHz Rx Sensitivity for 1% PER dbm Saturation (maximum input level) 5-11 dbm Tx Output Power (VCC = 3.0V) dbm TX Output Power (VCC = 2.1V) dbm Error Vector Magnitude % Adjacent Channel Rejection +/- 5 MHz +/- 10 MHz Frequency Error Tolerance khz Output Power Control Range db Over the Air Data Rate kbps Harmonics (2 nd & 3 rd ) dbm/mhz Unit Unit db Page 8

9 PIN SIGNALS I/O port CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user s host board. The MeshConnect Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O Pin Assignments Pin # Extended Range Type Description Functionality 1 GND GND GND-RF Ground Ground N/A 2 GND GND GND-RF Ground Ground N/A 3 MS1 NC Mode Select, Bit #1. Active Low Internal Voltage Regulator Enable: static control 0: Internal Voltage Regulator Enabled line 1: Internal Voltage Regulator Disabled, Supply Analog and Digital Supply Voltages Externally No connect 14 4 GND GND GND-RF Ground Ground N/A 5 GND NC GND GND Ground 13 6 NC NC NC no connect No connect N/A 7 GND GND GND-Logic Ground Ground 49 8 GND GND GND-Logic Ground Ground 49 9 GND GND GND-Logic Ground Ground GND GND GND-Logic Ground Ground GND GND GND-Logic Ground Ground ACH0 ACH0 Analog Input 1.5V Level Analog ADC0 Input ADC input 8 13 ACH1 ACH1 Analog Input 1.5V Level Analog ADC1 Input ADC input 9 14 ACH2 ACH2 Analog Input 1.5V Level Analog ADC2 Input ADC input ACH3 ACH3 Analog Input 1.5V Level Analog ADC3 Input ADC input P1_7 NC digital I/O Port P1.7 Digital I/O P1_6 NC digital I/O Port P1.6 Digital I/O P1_4 P1_4 digital I/O digital I/O or Port P1.4 / QUADZB / Sleep Timer OSC dedicated function Buffer Input port P1_3 P1_3 digital I/O Port P1.3 / QUADZA / Sleep Timer OSC digital I/O or dedicated Buffer Output / RTCLKOUT function port GND GND GND-Logic Ground Ground GND GND GND-Logic Ground Ground GND GND GND-Logic Ground Ground P1_1 P1_1 digital I/O Port P1.1 / TXD1 digital I/O or dedicated function 24 port 24 VCC_3V VCC_3V Power 3.0V Power supply for Analog Internal Voltage Regulator Power Input 7 25 P1_0 P1_0 digital I/O Port P1.0 / RXD1 digital I/O or dedicated function port P3_7 P3_7 digital I/O Port P3.7 / 12mA Drive capability / PWM3 / CTS1 / SPICSN digital I/O with high current capability IC Pin # P3_6 P3_6 digital I/O Port P3.6 / 12mA Drive capability /PWM2 / RTS1 / SPICLK digital I/O with high current capability 28 Note: 1. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance. Page 9

10 MeshConnect I/O Pin Assignments (Continued) Pin # Extended Range 28 P3_5 P3_5 digital I/O Port P3.5 / T1 / CTS0 / QUADYB / SPIDO 29 P3_4 P3_4 digital I/O Port P3.4 / T0 / RTS0 / QUADYA / SPIDI digital I/O or dedicated function port digital I/O or dedicated function port 30 GND GND GND-Logic Ground Ground P3_3 P3_3 digital I/O Port P3.3 / INT1 (active low) 32 P3_2 P3_2 digital I/O Port P3.2 / INT0 (active low) digital I/O or dedicated function port digital I/O or dedicated function port 33 GND GND GND-Logic Ground Ground P3_1 P3_1 digital I/O Port P3.1 / TXD0 / QUADXB 35 P3_0 P3_0 digital I/O Port P3.0 / RXD0 / QUADXA digital I/O or dedicated function port digital I/O or dedicated function port 36 GND GND GND-Logic Ground Ground P0_7 P0_7 digital I/O GPIO 8051 Port P0.7 / I2STX_MCLK digital I/O P0_6 P0_6 digital I/O GPIO 8051 Port P0.6 / I2STX_BCLK digital I/O P0_5 P0_5 digital I/O GPIO 8051 Port P0.5 / I2STX_LRCLK digital I/O P0_4 P0_4 digital I/O GPIO 8051 Port P0.4 / I2STX_DO digital I/O P0_3 P0_3 digital I/O GPIO 8051 Port P0.3 / I2SRX_MCLK digital I/O P0_2 P0_2 digital I/O GPIO 8051 Port P0.2 / I2SRX_BCLK digital I/O P0_1 P0_1 digital I/O GPIO 8051 Port P0.1 / I2SRX_LRCK digital I/O P0_0 P0_0 digital I/O GPIO 8051 Port P0.0 / I2SRX_DI digital I/O DVDD_1_5 (1) NC Power Type Description Functionality Output of Digital Internal Voltage Regulator (1.5V) / 1.5V Power supply for Digital Core(input No REG) Selected as Internal Regulator output or Regulated Voltage supply Input 46 ISP ISP Digital Input Mode Select, Bit #2. Active High In-System Programming (ISP) Input: 0: Normal Mode Programming 15 1: ISP Mode 47 RESET RESET Control Reset (Active Low) Hardware Reset AVDD_1_5 (1) NC Power Selected as Internal Output of Analog Internal Voltage Regulator Regulator output or (1.5V) / 1.5V Power supply for Mixer, VGA, Regulated Voltage and LPF (input No REG) supply Input 6 49 GND GND GND-Logic Ground Ground GND GND GND-Logic Ground Ground GND GND GND-Logic Ground Ground GND GND GND-Logic Ground Ground GND GND GND-Logic Ground Ground NC NC NC No Connect No connect N/A 55 GND GND GND-RF Ground Ground N/A 56 GND GND GND-RF Ground Ground N/A Note: 1. Digital 1.5V regulator output. Sources little current. If it is used by the host board, care must be taken to ensure noise is not introduced as it could degrade RF performance. IC Pin # Page 10

11 MODULE DIMENSIONS / Extended Range w/u.fl Connector for external antenna Pin 1 ZICM2410P R1 C9 C7 C7B C10 R2 R7 U1 R6 ARM C11 L3 C13 L4 C14 L2 EM357 Series R9 R10 C24 C C21 C5B C20 R11 C23 L5 C6A C1 L6 C6B C4A C17 XTAL1 C15 R5 C22 R8 Pin 19 Pin 38 Pin 1 R1 C9 C7 C7B C10 R7 R2 U1 R6 ARM C11 L3 C13 L4 C14 L2 EM357 Series R9 R10 C24 C6 C21 C5B C20 L5 C2 R4 C16 R11 C23 C6A C1 L6 C6B C4A C17 R5 C22 R8 C2 R4 C16 XTAL1 C15 Pin 56 / Extended Range w/pcb Trace Antenna ZICM2410P Pin 56 Pin 19 Pin 38 RF Shield RF Shield For layout recommendation for optimum antenna performance, refer to Antenna section in this document. Page 11

12 MODULE Land footprint Note: Unless otherwise specified. Dimensions are in Inches [mm] DIA KEEPOUT PITCH TYP. 56 X X PAD Page 12

13 PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time sec TLiquidus 217ºC Time above TL sec Tpeak 250ºC Time within 5º of Tpeak sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Achieve the brightest possible solder fillets with a good shape and low contact angle. Pb-Free Soldering Paste Use of No Clean soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations ( half vias ) where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610 "Acceptability of Electronic Assemblies, section Castellated Terminations. Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a no clean soldering paste and eliminate the post-soldering cleaning step. Optical Inspection After soldering the to the host board, consider optical inspection to check the following: Proper alignment and centering of the module over the pads. Proper solder joints on all pads. Excessive solder or contacts to neighboring pads, or vias. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Page 13

14 PROCESSING (Continued) Hand Soldering Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350 C, follow IPC recommendations/ reference document IPC Rework The MeshConnect can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. AGENCY CERTIFICATIONS FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC Rules and Regulations The MeshConnect has been certified per FCC Part 15 rules for integration into products without further testing or certification. To fulfill the FCC certification requirements, the OEM of the MeshConnect must ensure that the information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter FCC ID: W7Z-ICP0 or Contains FCC ID: W7Z-ICP0 The OEM of the MeshConnect must only use the approved antenna, (PCB Trace Antenna) that has been certified with this module. The OEM of the MeshConnect must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules. Page 14

15 AGENCY CERTIFICATIONS (Continued) IC Certification Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: CE Certification Europe The MeshConnect RF module has been tested and certified for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing. OEM Labeling Requirements The `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials CE with the following form: If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. The CE mark must be a minimum of 5mm in height The CE marking must be affixed visibly, legibly, and indelibly. Since the MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the CE marking as shown in the picture SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect s are delivered in trays of 28. Handling The MeshConnect s are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect s contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning According to JEDEC ISP, the MeshConnect s are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40 C and <90% relative humidity. Page 15

16 REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version Page(s) (Issue A) February 05, 2009 Initial preliminary datasheet. N/A (Issue B) June 11, 2009 Updated Development Kit and Agency Certification 2, 14, (Issue C) October 6, 2009 Added New MeshConnect Extended Range All (Issue C) January 29, 2010 Removed "Prelimary" from datasheet and "Pending" from Agency Certification All (Issue C) April 7, 2010 Added SNAP enabled modules to Ordering Information, updated module land footprint (Issue D) December 22, 2010 MeshConnect Extend Range part number change to -2 All (Issue D) February 8, 2011 MeshConnect Extend Range W/connector part number change to (Issue E) June 14, 2012 Changed ZICM2410P2-1C part number to -2C, updated Coaxial Keepout diagram 1, 12 Disclaimer The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. 1 Page 16

17 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: CEL: ZICM2410P2-1C-SN ZICM2410P2-1C ZICM2410P2-1C-B ZICM2410P2-1C-SN-B