SP1050 Series for Power-over-Ethernet PSE Protection

Transcription

1 SP1050 Series for Power-over-Ethernet PSE Protection RoHS Pb GREEN Description The SP BTG provides over-voltage protection for Power-over-Ethernet PSE equipment in a space saving SOIC-8 package. It incorporates four TVS Diodes each with their own decoupling capacitor to stabilize power supplies. The SP1050 is compatible with IEEE 802.3af and IEEE 802.3at requirements while allowing PoE based systems to be protected against damaging threats such as lightninginduced surges (IEC nd edition, electrical fast transients (IEC , and Electrostatic Discharges (IEC The low clamping voltage of 96V makes it compatible with PSE controller technologies. Functional Block Diagram GND PS1 1 PS2 4 Absolute Maximum Ratings Parameter Rating Units Peak Pulse Current (8/20µs 24 A Peak Pulse Power (8/20µs 2700 W IEC , Contact Discharge, (Level 4 30 kv IEC , Air Discharge, (Level 4 30 kv CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. PS3 5 PS4 8 Features Peak pulse power: up to 2.7 kw (8/20 μs Lightning protection, IEC nd edition, 24A (t p =8/20µs ESD protection of ±30kV contact discharge, ±30kV air discharge, (IEC Stand-off voltage of 58 V Low clamping voltage of 96V (MAX at 24A Applications Power-over-Ethernet Additional Information Low leakage current of 0.1 μa at 25 C and 1 μa at 85 C Operating Tj max: 150 C JEDEC registered package outline Embeds four decoupling capacititors Meets most stringent environment RoHS compliant and leadfree Datasheet Resources Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

2 Electrical Characteristics (T OP = 25 C Parameter Symbol Test Conditions Min Typ Max Units Leakage Current I RM 25 C, V PoE = 58V µa 85 C, V PoE = 58V µa Breakdown Voltage V BR I R = 1mA V Clamping Voltage 2 V C I PP = 24A, t p =8/20 μs V Dynamic Resistance 2 R DYN TLP, t P =100ns, I/O to GND Ω Capacitance 1 C V PoE = 58V pf Note: 1 Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns 8/20µs 8/20μS Pulse Waveform Capacitance vs. Reverse Bias 110% 100% 90% 80% Percent of I PP 70% 60% 50% 40% Capacitance (pf % 20% 10% 0% Time (μs Bias Voltage (V Clamping Voltage vs I PP Non-Repetitive Peak Pulse Power vs. Pulse Time Clamp Voltage (VC Peak Pulse Power (kw Peak Pulse Current -I PP (A Peak Pulse Dura on -t P (µs

3 Temperature TVS Diode Arrays (SPA Diodes Transmission Line Pulse (TLP TLP Current (A TLP Voltage (V Soldering Parameters Reflow Condition - Temperature Min (T s(min 150 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP Pre Heat - Temperature Max (T s(max 200 C - Time (min to max (t s secs Average ramp up rate (Liquidus Temp (T L to peak T S(max to T L - Ramp-up Rate 3 C/second max 3 C/second max T L T S(max T S(min t S Preheat t L Ramp-down Reflow - Temperature (T L (Liquidus 217 C - Temperature (t L seconds 25 time to peak temperature Time Peak Temperature (T P /-5 C Time within 5 C of actual peak Temperature (t p seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P 8 minutes Max. Do not exceed 260 C

4 Application Schematic Figure 1: Typical application circuit with fully integrated PSE controller Figure 1 shows typical application of power sourcing equipment (PSE allowing communication and power sourcing for several powered devices (PD. The SP BTG is optimized for space savings as there is generally a multiple of 4 present. This protection device complies with IEEE 802.3af and the IEC (Level 4 standard.

5 Package Dimensions of SOIC-8 FL o Recommended Soldering Pad Outline (Reference Only Package SOIC Pins 8 JEDEC MS-012 Millimetres Inches Min Max Min Max A A A B c D E E e 1.27 BSC BSC L Embossed Carrier Tape & Reel Specification SOIC Package User Feeding Direction Pin 1 Location Millimetres Inches Min Max Min Max E F P D D Min Min P P / / W P A B K t / / Part Numbering System TVS Diode Arrays (SPA Diodes Series Number of Channels SP B T G G= Green T= Tape & Reel Package B = SOIC Ordering Information Part Number Package Marking Min. Order Qty. SP BTG SOIC Tape & Reel SP