USB Type-C Active Cable ECN
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1 USB Type-C Active Cable ECN Christine Krause Active Cable WG Chair (Sponsored by Intel Corporation) USB Developer Days 2017 Taipei, Taiwan October 24 25,
2 Introduction Scope Requirements for active cables Organization ECN to USB Type-C Specification and Thermal Design Considerations Outline Usage Models CC Requirements Active Cable Definition SBU Requirements USB PD Requirements USB 2.0 Response to USB PD Events USB 3.2 Power Requirements Return Loss Thermal Requirements Alternate Modes Shielding Effectiveness Thermal Design Considerations 2
3 Potential Usage Models for <5m Active Cables USB Type-C Full-Featured cable maximum reach USB 3.2 Gen1 ~2m USB 3.2 Gen2 ~1m Use cases where USB Type-C Passive Full Feature Cables may not be long enough Displays Cameras Machine Vision Virtual Reality Active Cables just work Future specification development for longer than 5m active cables as well as optically isolate cables is expected 3
4 Active Cable Definition (5.2) Active cables are designed to just work like passive cables with no discernable difference from the user s perspective. Active cables minimally support USB 3.2 Gen 2x1. As multi-lane USB 3.2 and multi-lane USB 3.2 repeaters become common, all active cables will be required to support two lanes. Active cables support USB PD emarkers and may support Alternate Modes and advertise them as defined in Section Length USB PD VBUS < 5 m SOP Required (SOP Optional) 3 A or 5 A VCONN Wiring Same as passive cable CC USB 2.0 USB 3.2 SBU Same as passive cable Same as passive cable (Repeater) Gen 2x1 Gen 1x2 Gen 2x2 Passive 4
5 USB PD Requirements (5.2.1) Support for emarkers on SOP and optionally SOP Discover Identity Active Cable SBU Supported SBU Type Maximum Operating Temperature Shutdown Temperature USB3 Gen1 U0 Latency USB3 Gen2 U0 Latency USB2 Support USB3 Support, One or two lane support Cable Status Internal Temperature of the plug Thermal Shutdown indicator 5
6 Response to USB PD Events ( ) Power Role Swap Maintain USB3.2 signaling during a Power Role Swap VCONN Swap Maintain USB3.2 signaling during a Vconn Swap Fast Role Swap Active cables will drop USB 3.2 signaling as a side-effect of a Fast Role Swap if VCONN is not maintained during the Fast Role Swap 6
7 Power Requirements (5.2.3 & ) VBUS All active cables meet the limits of the IR Drop on VBUS and ground defined in Section (Same as passive cables) VCONN Be capable of being powered from VCONN from only one port Meet the VCONN sink requirement defined in Table 4-5 (to be updated) and Table Power dissipation targets are lower in active cables than passive cables because U3, Rx.Detect, or ess.disabled for extended periods with VCONN applied. Table 5-10 USB 3.2 U-State Requirements Waivers to 10mW at introduction Goal power dissipation State U0 Requirement Required Maximum Power Consumption VCONN 1.0W 1-lane 1.5W 2-lane Target Power Consumption VCONN Power Consumption Notes Applies to POLLING.LFPS, TRAINING, and RECOVERY states. U1 Logically required U0 power Forwarding U1 LFPS is required U2 Logically required U1 power Forwarding U2 LFPS is required U3 Required 5 mw 2 mw emarker in sleep. Rx.Detect Required 5 mw 2 mw Rx.Detect period may be lengthened when no USB 3.2 terminations have been detected. emarker in sleep. ess.disabled Required 5 mw 1 mw USB 3.2 is disabled. emarker in sleep. 7
8 Mechanical Requirements Same as Passive Cables Plug Spacing Active cables support the USB Type-C vertical and horizontal spacing defined Section when functioning in USB 3.2 x1 operation However, this spacing may impose thermal constraints The Appendix D provides system design guidance to minimize the thermal impact due to connector spacing Products designed for USB 3.2 x2 operation with multiple adjacent USB Type-C connectors should follow Appendix D guidelines to minimize the likelihood the active cable will go into thermal shutdown 8
9 Thermal Requirements ( ) Thermal Shutdown Place USB 3.2 signals in ess.disabled state when plug skin temperature reaches the maximum defined in Table 5-6 Report thermal shutdown in USB PD Cable Status Maximum Skin Temperature The active cable plug s skin temperature should not exceed a maximum operating temperature of 30 C above the ambient temperature for a plastic/rubber housing and 15 C for a metal housing in any operating mode Thermal shutdown occurs when the maximum plug skin temperature reaches the values defined in table 5-6 or lower Compliance will check the cable plug skin temperature with controlled motherboard and ambient temperatures 9
10 Thermal Requirements ( ) Thermal Reporting Report maximum internal operating temperature in the USB PD Discover Identity Command Report current internal temperature in the USB PD Get Status Command. Report in C and monotonic Cable manufacturers correlate the maximum internal operating temperature with the maximum plug skin temperature to ensure shutdown when the maximum plug skin temperature is reached Table 5-6 Cable Temperature Requirements Maximum Internal to Skin Temperature Offset Design specific Maximum Internal Operating Temperature Design specific Maximum Skin Temperature Plastic/Rubber 1 80 C Maximum Skin Temperature Metal 1 55 C Note 1: IEC reduced by 5 C 10
11 Shielding Effectiveness ( ) Same as passive cables 11
12 CC Wire Requirements ( ) Same requirements as passive cables SBU Requirements ( ) Crosstalk same as passive cables ( ) SBU Characteristics Active cable SBU end-to-end connections meet the requirements defined in Table 5-7 when VCONN is present SBUs have no guaranteed performance when VCONN is not provided to the cable The Host or Device should not provide any signal beyond what is defined in Table
13 Table 5-7 Active Cable SBU Characteristics Name Description Min Max Units zcable_sbu tcabledelay_sbu rcable_sbu vcable_sbu Cable characteristic impedance on the SBU wires Cable propagation delay on the SBU wire DC resistance of SBU wires in the cable in USB Cable voltage swing on SBU wires Ω 26 ns 40 Ω V Insertion Loss 1 Cable insertion Loss 0.5MHz 1MHz 10MHz 25MHz 50MHz 100MHz icablesbu Maximum end-to-end current ma db 13
14 USB 2.0 Requirements ( ) Same as passive cables Required to be passive 14
15 USB 3.2 Architectures ( ) Active cables without at least one re-timer are out of scope. Active cables without re-timers connected to TP3 are out of scope. Tx Rx Re-timer Re-timer Re-timer Re-timer Rx Tx Tx Rx Re-timer Re-timer Rx Tx Host/device TP2: Re-timer TP3:Re-timer Host/device Host/device TP2: Passive TP3:Re-timer Host/device Tx Rx Re-driver Re-timer Re-timer Re-driver Rx Tx Tx Rx Re-timer Re-timer Rx Tx Host/device TP2: Re-driver TP3:Re-timer Host/device Host/device Re-timer in center of cable Host/device 15
16 USB 3.2 Power-on and Rx.Detect Active cables perform far-end receiver termination detection per USB 3.2 Appendix E An active cable complete power-on and far-end receiver termination detection through the cable within tfwd_rx.detect Table 5-8 Active Cable Power-on Requirements Parameter Minimum Maximum Units ZRX-HIGH-IMP-DC-POS per USB 3.2 per USB 3.2 RRX-DC per USB 3.2 per USB 3.2 tfwd-rx.detect 42 ms 16
17 USB 3.2 U0 Delay ( ) Repeaters in active cables will meet the U0 delay requirements defined in USB 3.2 Appendix E USB 3.2 U-State Exit Latency ( ) Active cables will meet the U-state exit latency defined in USB 3.2 Appendix E 17
18 Mated Connector Repeater Repeater Mated Connector USB 3.2 Signal Swing ( ) Test Points are defined the same was as in USB 3.2 TP2 mid-point: defined to be after the mated receptacle/plug on the plug side with the plug test board with the traces de-embedded TP3 mid-point: defined to be after the mated receptacle/plug on the receptacle side with the USB Type-C cable test fixture TP1 TP2 TP3 TP4 Test Point TP1 TP2 TP3 TP4 Description Transmitter silicon pad Transmitter port connector mid-point Receiver port connector mid-point Receiver silicon pad Si Pkg + - Txp Txn Active Cable Rxp Rxn + - Si Pkg Figure 5-8 SuperSpeed Electrical Test Points 18
19 USB 3.2 Compliance Test Setup Figure 5-8 SuperSpeed Compliance Test Setup Pattern Generator + - Tx1p T10n TP1 TP2 TP3 Tx Aggressor TP4 Oscilloscope or Error Detector Test Fixture Rx1p Rx1n Rx0n Rx0p Repeater Active Cable Repeater Rx0p Rx0n Rx1p Rx1n Test Fixture TP1 Tx0p + - Tx0n Pattern Generator Tx Aggressor 19
20 USB 3.2 TP1 ( ) Normative (set at the pattern generator for compliance testing) Subset of the USB 3.2 Spec Table 5-11 Active Cable USB 3.2 Stressed Source Swing, TP1 Symbol Parameter Gen 1 (5.0 GT/s) Gen 2 (10 GT/s) Units Comments V TX-DIFF-PP Differential p-p Tx voltage swing 0.8 (min) 0.8 (min) 1.2 (max) 1.2 (max) V Nominal is 1 V p-p Nominal is 3.5 db for Gen 1 operation. Gen 2 V TX-DE-RATIO Tx de-emphasis USB 3.2 Table /-1.0 db transmitter equalization requirements are described in USB 3.2 Section V PRESHOOT Tx Preshoot USB 3.2 Table /-1.0 db Gen 2 transmitter equalization requirements are described in USB 3.2 Section Table 5-12 Active Cable USB 3.2 Stressed Source Jitter, TP1 (Same as USB 3.2) Symbol Parameter Gen 1 (5GT/s) Gen 2 (10GT/s) Units Notes f1 Tolerance corner MHz J Rj Random Jitter UI rms 1 J Rj_p-p Random Jitter peak- peak at UI p-p 1,4 J Pj_500kHZ Sinusoidal Jitter UI p-p 1,2,3 J Pj_1Mhz Sinusoidal Jitter UI p-p 1,2,3 J Pj_2MHz Sinusoidal Jitter UI p-p 1,2,3 J Pj_4MHz Sinusoidal Jitter N/A 0.37 UI p-p 1,2,3 J Pj_f1 Sinusoidal Jitter UI p-p 1,2,3 J Pj_50MHz Sinusoidal Jitter UI p-p 1,2,3 J Pj_100MHz Sinusoidal Jitter N/A 0.17 UI p-p 1,2,3 20
21 USB 3.2 TP2 ( ) Informative (used to check the stressed signal for active cable JTOL testing) Design guidance for active cable input receiver TP1 TP Rx0n Rx0p Tx0n Tx0n Rx1n Rx1p Si Rx0n Rx0p Tx0n Tx0p Full Breakout Rx1n + - Tx1n Tx1p Rx1p Pkg Tx1p Tx1n Table 5-13 Active Cable USB 3.2 Input Swing at TP2 (Informative) Symbol Parameter Gen 1 (5.0 GT/s) Gen 2 (10 GT/s) Units Comments V TX-DIFF-PP Differential p-p Tx voltage swing 250 (min) 1000 (max ) 250 (min ) 850 (max ) mv Nominal is 550mV p-p V TX-DE-RATIO Tx de-emphasis 0 (min) 4.0 (max) 2.1 (min) 4.1 (max) db There is no de-emphasis requirement for Gen1. V PRESHOOT Tx Preshoot NA 1.2 (min) 3.2 (max) db Applicable to USB3.2 Gen2 operation only 21
22 USB 3.2 TP3 ( ) Informative (not used for compliance testing) Design guidance for active cable output driver No De-emphasis required Pkg + - Rx0n Rx0p Rx1n Rx1p Tx0n Tx0p Tx1n Tx1p TP1 Si TP2 Rx0n Rx0p Rx1n Rx1p HF-1C TP3 Rx0p Rx0n Rx1p Rx1n CLB Table 5-14 Active Cable USB 3.2 Output Swing at TP3 (Informative) Symbol Parameter Gen 1 (5.0 GT/s) V RX-DIFF-PP-POST-EQ V TX-DE-RATIO-GEN1 V TX-DE-RATIO + V PRESHOOT-GEN2 Differential Rx peakto-peak voltage Tx de-emphasis Tx de-emphasis + Tx Preshoot 300 (min) 850 (max) 0 (min) 4.0 (max) NA Gen 2 (10 GT/s) 300 (min ) 850 (max ) Units mv Comments Measured after the Rx EQ function (Section 6.8.2). Nominal is 0.5 V p-p NA db No preshoot allowed 0 (min) 3.0 (max) db Sum of the de-emphasis and preshoot. There is no de-emphasis and pre-shoot requirement. 22
23 USB 3.2 TP4 ( ) Normative (tested in compliance) The active cable transmitter output is defined at TP4 for both high and low loss channels The requirements for TP4 are defined in the USB3.2 specification Table 6-20 The input signal for the test will be applied at TP1 per Section The low loss test board will be used to test the maximum output swing The maximum loss test board will be used to test the minimum output swing. Jitter must be met with both test boards The active cable bit-error-rate will be tested at TP4 and meet or exceed a BER of The error detector used will have the ability to remove SKP ordered sets 23
24 USB3.2 Test Points: TP4 (Rx Silicon Pad) Used for Tx eye measurement Eye height TJ (using RJ TP3) In practice, signal is TP3 Compliance board is embedded by Sigtest. TP1 TP2 TP Rx0n Rx1p Rx1n Rx1n Tx0p Tx0n Tx1p Tx1n Si Rx0p Rx0n Rx1p Rx1n HF-1C Active Cable Rx0p Rx0n Rx1p Rx1n CLB Pkg 24
25 Return Loss Still under development 25
26 Alternate Modes Discovery via USB PD Discover SVIDs on SOP only Discover Modes on SOP only Enter/Exit Mode Enter and Exit mode will be communicated on SOP and on SOP when the SOP Controller Present bit is set in the Active Cable Recommend that Enter mode be sent initially to SOP and then SOP if supported and then SOP Recommend Exit mode be sent initially to SOP and then to SOP if supported and then SOP Power In Alternate Mode Maintain the plug s Maximum Skin Temperature below the requirement defined in Table 5-6 Recommended to reduce power in sleep states 26
27 Thermal Design Considerations (Appendix D) Provides case studies to show the thermal impacts of certain factors affecting the active cable maximum plug skin temperature IC power VBUS Current Port Spacing Receptacle heat sinking Active Cable Model (Single Port, Top Mount Receptacle) 27
28 Active Cable Thermal Design Considerations Design the heat sink of cable to tradeoff flow to the cable plug and IC temperature Design for maximum IC Junction temperature This may be lower than the maximum plug skin temperature Design to shutdown at a cable plug skin temperature per Table 5-6 or lower Cable vendors should build in margin to the specification Active cables may shutdown at lower temperatures that the specification allows Passive cables dissipate 250 mw in the plug at 5 A Active x1 cables dissipate 750 mw in the plug at 5 A (500 mw from electronics) Active x2 cables dissipate 1 W in the plug at 5 A (750 mw from electronics) This power has to be dissipated somehow 28
29 USB3.2 x1 Single Port Spacing Simulations Assumptions 500 mw power dissipation in each plug from electronics 35 C Ambient 60 C Thermal Boundary (motherboard temperature) Plastic housing shell Requirements TS (Plug skin temperature) must be less than 30 C above ambient No special design considerations needed if motherboard is 60 C maximum Thermal shutdown occurs by 80 C TS (plug skin temperature) 3 A VBUS 5 A VBUS T S ( C)
30 USB3.2 Multi-Port Spacing Considerations Heat transfers between cables Heat dissipation through natural convection is less effective than in the single port case Radiation is less effective than in the single port case Center cable plug skin surface temperature is the hottest Vertically Stacked Horizontal Connectors 3x1 (VERT) Horizontally Stacked Vertical Connectors 1x3 (HZ90) Horizontally Stacked Horizontal Connectors 1x3 (HORZ)
31 USB 3.2 x1 Multi-Port Spacing Simulations Assumptions 35 C Ambient, 60 C Thermal Boundary (motherboard temperature) 500 mw power dissipation in each plug from electronics USB 3.2 x1 3A Active Cable in 3-port Configuration USB 3.2 x1 5A Active Cable in 3-port Configuration 31
32 USB3.2 x1 Multi-Port Spacing Design Considerations 3 A Ports It is possible to maintain the cable TS (plug skin temperature) at 30 C above ambient at minimum spacing with no special heat spreader or heat sink The board thermal design should be simulated next to the receptacle and a reasonable maximum temperature maintained 5 A Ports It is not possible to maintain the cable TS at 30 C above ambient at minimum spacing in all orientations with no special heat spreader or heat sink in all cases Thermal simulation should be performed and minimum port spacing increased or a heat spreader or heat sink added to the board design The board thermal design should be simulated next to the receptacle and a reasonable maximum temperature maintained 32
33 USB3.2 x2 Single Port Spacing Simulations Assumptions 750 mw power dissipation in each plug from electronics 35 C Ambient 60 C Thermal Boundary (motherboard temperature) Requirements TS (Plug skin temperature) must be less than 30 C above ambient No special design considerations needed if motherboard is 60 C maximum Recommended that 5 A VBUS designs test and verify thermal designs Thermal shutdown occurs by 80 C TS 3A VBUS 5A VBUS T S ( C)
34 USB3.2 x2 Multi-Port Spacing Results Assumptions 35 C Ambient, 60 C Thermal Boundary (motherboard temperature) 750 mw power dissipation in each plug from electronics USB3.2 x2 3A Active Cable in 3-port Configuration USB3.2 x2 5A Active Cable in 3-port Configuration 34
35 USB3.2 x2 Multi-Port Spacing Design Considerations 3 A Ports It is not possible to maintain the cable TS at 30 C above ambient at minimum spacing with no special heat spreader or heat sink Thermal simulation should be performed and minimum port spacing increased or a heat spreader or heat sink added to the board design The board thermal design should be simulated next to the receptacle and a reasonable maximum temperature maintained 5 A Ports It is not possible to maintain the cable TS at 30 C above ambient at minimum spacing with no special heat spreader or heat sink Thermal simulation should be performed and minimum port spacing increased AND a heat spreader or heat sink added to the board design The board thermal design should be simulated next to the receptacle and a reasonable maximum temperature maintained 35
36 Summary of Design Considerations Remember that Hosts, Hubs, and Devices do not control the type of cable connected or the ambient temperature Designers must consider and simulate: Port Spacing and orientation USB Type-C Receptacle heat sink, spreader, or cooling Motherboard temperature VBUS Current per port Number of USB 3.2 lanes (x1 or x2) 36
37 Q&A 37
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