SPECIFICATIONS. Laser Diode GH3S225D2B

Transcription

1 Laser Diode Sep, 06 SPECIFICAIONS Laser Diode GHS5DB Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc. LIGHING BUSINESS UNI ELECRONIC COMPONENS AND DEVICES BU SHARP CORPORAION sharp LDAE96A

2 hese specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent.. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) () Please do verify the validity of this part after assembling it in customerʼ s products, when customer wants to make catalogue and instruction manual based on the specification sheet of this part. () his product is designed for use in the following application areas ; OA equipment Audio visual equipment Home appliances elecommunication equipment (erminal) Measuring equipment ooling machines Computers If the use of the product in the above application areas is for equipment listed in paragraphs () or (), please be sure to observe the precautions given in those respective paragraphs. () Appropriate measures, such as failsafe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; ransportation control and safety equipment (aircraft, train, automobile etc.) raffic signals Gas leakage sensor breakers Rescue and security equipment Other safety equipment () Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; Space equipment elecommunication equipment (for trunk lines) Nuclear power control equipment Medical equipment (5) Please contact and consult with a Sharp sales representative if four are any questions regarding interpretation of the above four paragraphs.. Please contact and consult with a Sharp sales representative for any questions about this product. sharp LDAE96A

3 Operating and handling precautions () his product has its life. he product life which is described in ". Reliability" should be taken into account when using it. () his product will be damaged by electrostatic discharge (ESD). Following precautions should be taken to avoid ESD damage. Workers, workbenches and other equipment should always be grounded. Workers should always wear an antistatic wrist strap and an antistatic smock on them. When handling this product, workers should always wear antistatic gloves or finger covers. A stable DC power supply which is free from electrical transients should always be used when operating this product. A slow starter circuit should always be inserted between the power supply and this product in order to protect it from DC power surges. Optical power output of this product should be set with a highly reliable and high quality variable resistance. his product should always be connected to the driving circuit by soldering directly or through highly reliable connectors. While this product is being operated, be sure to avoid touching the driving circuit or the terminals of this product with electrical probes from a synchroscope or a voltmeter. An antistatic package should be used when storing this product. his product should be processed in the rooms where relative humidity is kept at 5070%RH. () Process products in clean rooms, and avoid touching with bare hands. Because laser beam is highly coherent, dust traces or fingerprints on the window glass are sufficient to interfere with the passing beam, causing ripples in the far field pattern. () A sufficient heat sink should be attached to this product when operating so that its case temperature is to be maintained at the same level as that of the surrounding. (5) Even if the drive current supply has an automatic power control (APC), automatic current control (ACC), or both, be sure to monitor the optical power output with an optical power meter while setting it. Never estimate the optical power output only from the drive current because it is likely to be decreased by temperature rise of the surrounding. (6) If the window glass of this product should become soiled, gently clean it with a cotton swab dipped in ethyl alcohol. (7) Do not allow the heat sink to apply excessive pressure to the package cap. Because a window glass is as thin as 0.5mm. (8) Although the beam emitted by this laser diodes is nearly invisible, it will be harmful to the human eyes. So the following precautions should be taken. When this product is being operated, the emitting surface of a chip should not be viewed either directly or through a lens, microscope or optical fibers. When operating this product, wear safety glasses. o adjust the optical axis of this laser diode and peripheral devices, use an IR scope or a fluorescent screen that converts infrared light to visible light. (9) When soldering this product, heat lead pins only using a soldering iron. Avoid heat the whole package using preheat or reflow soldering. sharp LDAE96A

4 Outline dimensions and erminal connections Y Note ) ±0.5 Note ) 0.±0. C 0.MAX. Emission point X φ. MAX. φ.55 ±0. φ MIN. Note )90 ± Note ) φ Z (unit:mm) Stem back engraved 注 ) (.77) (5 ) 0.5 ±0.0 Y Note ) 0.±0. Note ) φ (.77) X Enlarged drawing around the emission point Y 0±0.08 X LD 0±0.08 LD Center of the imaginary circle which goes through the three point around the stem Point distance ( ) Unit:µm symbol MIN. YP. MAX. L 0 Measured value in our holdings inspection machine erminal connections stem L. ±0.5.7 ± MIN. Reference plane. ± ± MAX. φ. MAX. 0.MAX. 0.6MIN. LD PD LD Mass of the product: 0.g(reference value) φ0.5 ±0., Note ) Dimension of the bottom of leads. Note ) hese dimensions are valid only in the range of 0 ~ 0.6mm below from the reference plane. Note ) hese dimensions are defined from the imaginary circle which goes through the three points around the stem to the bottom of cut off parts. Note ) Check with the naked eye sharp LDAE96A

5 Ratings and Characteristics Absolute Maximum Ratings (c = 5 (Note )) Parameter symbol Value Unit Optical power output Po 5 mw Reverse voltage Laser diode Photo diode Vrl Vrd 0 V V Operating temperature (Case temperature) op(c) 0 ~ +60 Storage temperature Soldering temperature (Note ) stg sld 0 ~ (Note ) c : Case temperature (Note ) Soldering temperature means soldering iron tip temperature(he power 0W) while soldering. Soldering position is.6mm apart from bottom edge of the case. (Immersion time s) Electrooptical Characteristics (c = 5 ) Parameter hreshold current (Note 6) symbol Ith Conditions Min. yp. 5 5 Relative difference Ith(LD) Ith(LD) Max. 5 Unit ma hreshold power P th I =Ith F mw Operating current Operating voltage Wavelength Half Intensity Angle (Note,) Ripple (Note ) Misalignment angle (Note ) Differential efficiency Kink (Note 6) Droop (Note 7) Visibility (Note 5) Photo diode output current Iop Vop λp Θ Θ Rl ΔΘ ΔΘ ηd KLI P α Im ID 5mW I(0mW)I(5mW) P=5mW, P=5mW P=5mW Po=mW,f=kHz Duty=50%, Vrd=5V Relative difference λp(ld) λp(ld).8.8 Parallel Relative difference Perpendicular Relative difference Parallel Perpendicular Relative difference Θ (LD) Θ (LD) Θ (LD) Θ (LD) Im(LD) Im(LD) ma V nm % mw/ma % % ma Photo diode dark current Vrd = 5V 50 na sharp LDAE96A

6 Note )Initial value, Continuous Wave Operation Note )Angle of 50% peak intensity (Full angle at halfmaximum) Note )Parallel to the junction plane (XZ plane) Perpendicular to the junction plane (YZ plane) Note )Rl ΔP/P ΔP:the maximum deviation of the far field pattern from its approximate curve P:the peak of the approximate curve Note 5)Visibility is measured by optical spectrum analyzer model Q8A (ADVANES Corp.). Note 6)Refer to the measurement method described in page 5 Note 7)ΔP=(PP)/P 00[%] P mean maximum power, between after μs from rise up point and fall down point. Conditions:c=5, Po=mW f=khz, Duty=50% μs P Duty 50% P f=khz(period=ms) Note 6)Definition of KLI KLI=(PP)/P P P Least squares linear fit between P and P real IL Data Optical Output P P Ith Ip Ip Ip Driving Current 5 sharp LDAE96A

7 (Notice) In the absence of confirmation by device technical sheets. SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device technical sheets before using any SHARP device. technicals are subject to change without notice for improvement. sharp LDAE96A