FUJITSU Component Wireless module

Transcription

1 FUJITSU Component Wireless module Bluetooth Smart Module MBH7BLZ02 Datasheet Rev DEC 15, 2014 The above Product is designed, developed and manufactured as contemplated for general use, including without limitation, general office use, personal use, household use, and ordinary industrial use, but is not designed, developed and manufactured as contemplated (1)for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite), hereinafter referred to as "High Safety Required Use". You shall not use this Product without securing the sufficient safety or reliability required for the High Safety Required Use. If you wish to use this Product for High Safety Required Use, please consult with our sales representatives in charge before such use. Fujitsu Component Limited All specifications are preliminary which may be changed without any prior notice

2 1. Summary Features Applicable Standard Block Diagram Electrical Characteristics General Features Absolute Maximum Rating Recommendable Operating Condition Operating Temperature Operating Voltage (Using Internal LDO Regulator) I/O Terminal Characteristics Internal kHz RC Oscillator External kHz Crystal Oscillator Current Consumption General radio characteristics Transmitter Specifications Receiver sensitivity Receiver specifications Interface Specification Host Connection UART Interface Supply voltage rise time (Power on reset function) Supply voltage rise time (Reset by external Reset pin) Initialization Software Interface Specification Pin Description Pin assignment and Pin Description Pin State on Reset Mechanical Characteristics Appearance and Dimensions Marking Recommended Land Pattern

3 9-4. Layout of other components around antenna Module layout guideline Appearance specification Recommended Reflow Profile Storage Conditions Packing Specification in shipment Carrier Tape Appearance and Dimensions Reel Appearance and Dimensions Taping Direction and Packing Quantity Tape Reel Strength Bar code label Package Revision History

4 1. Summary This datasheet applies to the Bluetooth Smart module MBH7BLZ Features This product is an antenna integrated surface-mount module compliant with Bluetooth Specification Version 4.1, and is possible to communicate in an ISM(Industrial Scientific Medical) band. Since the upper level protocol stacks, Services and Profiles are incorporated in this module, you can control Bluetooth low energy radio through text-based simple commands. Therefore, you can reduce development time and cost to develop Bluetooth low energy enabled applications. The followings are the key features. Bluetooth Specification Version 4.1 (single mode low energy radio) Compliant Nordic Semiconductor nrf51822 based Hardware Interface: UART Software Interface: Fujitsu Component proprietary commands/events Power Supply: 1.9 ~ 3.6V * Please refer to the section 5-3 for details. RoHS Compliant Surface mount type Small footprint (15.7mm x 9.8mm x 2.0mm ) Integrated Antenna The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by FUJITSU COMPONENT LIMITED is under license. Other third-party brands and names are the property of their respective owners

5 3. Applicable Standard Bluetooth Specification Version 4.1 QDID: FCC,IC certification FCC ID:SQK-7BLZXX IC ID :337L-7BLZXX CE Marking ARIB STD-T66 Radio Act(Japan)Certification No. 007-AB0237 (Certificated by the combination of MBH7BLZ01 and antenna.) 4. Block Diagram MBH7BLZ01 VDD UART GPIO SWDCLK SWDIO/nRESET nrf51822 Crystal 16MHz Matching Component Antenna MBH7BLZ02-5 -

6 5. Electrical Characteristics 5-1. General Features Bluetooth Specification Version 4.1 Compliant Carrier Frequency: 2400 MHz ~ MHz Modulation: GFSK Symbol Rate: 1 Mbps Data Rate: 1 Mbps Channel: 40 channels Channel Spacing: 2 MHz Output power: +4 dbm max - 6 -

7 5-2. Absolute Maximum Rating Items Symbol Min Max Unit Supply voltage (VDD) VDD V Supply voltage (GND) GND - 0 V Supply voltage (I/O) VIO -0.3 VDD+0.3 V Storage Temperature Tstg C 5-3. Recommendable Operating Condition Operating Temperature Items Symbol Min Typ Max Unit Operating Temperature Topr C Operating Voltage (Using Internal LDO Regulator) Items Symbol Min Typ Max Unit VDD VDD V * Supply power to VDD pin, and VDD1.8 pin should be floating I/O Terminal Characteristics Items Symbol Min Typ Max Unit Input high voltage V IH 0.7VDD - VDD V Input low voltage V IL GND - 0.3VDD V Output high voltage (std. drive, 0.5 ma) V OH VDD VDD V Output high voltage (high-drive, 5 ma) V OH VDD VDD V Output low voltage (std. drive, 0.5 ma) V OL GND V Output low voltage (high-drive, 5 ma) V OH GND V Pull-up resistance R PU kω Pull-down resistance R PD kω - 7 -

8 5-5. Internal kHz RC Oscillator Description Symbol Min. Typ. Max. Unit Nominal frequency fnom,rc32k khz Frequency tolerance ftol,rc32k ±2 % Frequency tolerance (Calibration interval 4s) ftol,cal,rc32k ±250 ppm Run current IRC32k μa Startup time tstart,rc32k 100 ms 5-6. External kHz Crystal Oscillator Description Symbol Min. Typ. Max. Unit Crystal frequency fnom,x32k khz Frequency tolerance, Bluetooth low energy applications ftol,x32k,ble ±250 ppm Load capacitance CL,X32k 12.5 pf Shunt capacitance C0,X32k 2 pf Equivalent series resistance RS,X32k kω Drive level PD,X32k 1 μw Input capacitance on XL1 and XL2 pads Cpin 4 pf Run current for khz crystal oscillator IX32k μa Startup current for khz crystal oscillator ISTART,X32k μa Startup time for khz crystal oscillator tstart,x32k s Note: This product embedding kHz RC Oscillator, external kHz Crystal Oscillator is not necessarily required. It is possible to add external kHz Crystal Oscillator satisfying above-mentioned specification to increase accuracy of clock, or to reduce power consumption Current Consumption Ta=25±2 C Description Symbol Typ. Max. Units TX P OUT = +4 dbm I TX,+4dBm ma TX P OUT = 0 dbm I TX,0dBm ma TX P OUT = -4 dbm I TX,-4dBm ma TX P OUT = -8 dbm I TX,-8dBm ma TX P OUT = -12 dbm I TX,-12dBm ma TX P OUT = -16 dbm I TX,-16dBm ma RX current I RX ma Sleep Mode current I SLEEP 5 ua *Inrush current is not included in the maximum rating

9 5-8. General radio characteristics Ta=25±2 C Items Condition Min Typ Max Unit Operating frequencies 2MHz channel spacing MHz PLL programming resolution 1 MHz Frequency deviation ±225 ±250 ±275 khz 5-9. Transmitter Specifications Ta=-25 C~75 C Items Condition Min Typ Max Unit Output power dbm Step size of RF power control 4 db RF power control range db 20 db bandwidth for modulated carrier khz 1st Adjacent Channel Transmit Power 1MHz -20 dbc 2nd Adjacent Channel Transmit Power 2MHz -40 dbc Maximum consecutive transmission time 16 ms f0-fn 50kHz (n=2,3,4 k) khz Carrier frequency offset and drift f1-f0 20kHz khz fn-fn-5 n=6,7,8 k 20kHz khz Receiver sensitivity Ta=-25 C~75 C Items Condition Min Typ Max Unit Maximum received signal strength < 0.1% PER 0 dbm Receiver sensitivity Ideal transmitter -93 dbm Dirty transmitter -91 dbm Receiver specifications Ta=25±2 C Items Condition Min Typ Max Unit C/I co-channel db 1st ACS, C/I 1 MHz db 2nd ACS, C/I 2 MHz db RX selectivity ACS, C/I (3+n) MHz offset [n = 0, 1, 2,...] db lmage blocking level db Adjacent channel to image blocking level (±1 MHz) db RX intermodulation IMD performance, 3rd, 4th and 5th offset channel dbm - 9 -

10 6. Interface Specification 6-1. Host Connection Host UART MBH7BLZ02 This module connects to Host via UART, and is controlled with our proprietary commands and events. Application Customer or 3 rd Vendor Proprietary Commands/Events FDC (*1) GATT ATT GAP SM MBH7BLZ02 L2CAP Link Layer (LL) Physical Layer (PHY) *1) FDC (Fujitsu Component Data Communication) profile. (Fujitsu Component proprietary profile)

11 6-2. UART Interface GPIO_1(U_TX) GPIO_3(U_RX) GPIO_0(U_RTS) GPIO_2(U_CTS) Figure 6-2-1: UART Interface Four signal lines are used for the UART (Universal Asynchronous Receiver Transmitter) interface, as shown in Figure When the module is connected to the host system, U_RX and U_TX are used to transfer data between the module and the host. The remaining two signals (U_CTS and U_RTS) can be used for hardware flow control. You can prevent overflow by following procedure. 1) When the module cannot receive data anymore, it outputs High to U_RTS. 2) The module can transmit data only when the input from U_CTS is Low. All UART connections are implemented using CMOS technology and have signaling levels of 0V and VDD. The timing diagram for hardware flow control is shown in Figure U_RTS U_RX 4 Byte Max U_CTS U_TX 2 Byte Max Figure 6-2-2: UART hardware flow control timing

12 UART setting parameters such as baudrate and data format are listed in Table Table 6-2-1: UART Setting Item Possible Values Baud Rate 1.2k, 2.4k, 4.8k, 9.6k, 14.4k, 19.2k, 28.8k, 31.25k, 38.4k, 57.6k, 76.8k, 115.2k, 230.4k, 250.0k, 460.8k, 921.6k, 1M bps Data 8 bit Flow Control Hardware flow control (RTS/CTS) Parity bit None Number of Stop Bits

13 6-3. Supply voltage rise time (Power on reset function) At starting power supply, supply voltage rise time(time to reach 1.9V) should be less than 60 ms.the power-on reset circuitry may not work correctly if the rise time is longer than 60 ms. 1.9V VDD 0V Supply voltage rise time ( tr_vdd ) Figure 6-3-1: Supply voltage rise time Item Max t R_VDD Supply voltage rise time (time to reach 1.9V) 60 ms 6-4. Supply voltage rise time (Reset by external Reset pin) VDD VDD 0V VIO nreset 0V Reset input time ( tr ) Figure 6-3-2: Supply voltage rise time (Reset by nreset pin) Item Min tr Reset input time 0.2 us

14 6-5. Initialization This product initializes the firmware after power-on or reset. Any commands are not received during the initialization. The completion of initialization can be detected by the following boot message. Boot message: "Welcome to FCL FDC Module!!" VDD 0 UART_RTS UART_TX Sending start-up message Initialization period (t) Figure 6-4-1: Boot sequence Normal operation t Item Condition Max Initialization time In case SKIP_CRC_CHECK parameter of (from power-on to WRITE_BOOT_MODE_NV command is "0". 200 ms Completion of In case SKIP_CRC_CHECK parameter of boot message) WRITE_BOOT_MODE_NV command is "1". 25 ms *Note: If your system cannot detect the boot message due to the use of EVENT suppression function and so on, initialization time should be set to more than above-mentined time

15 7. Software Interface Specification Refer to the document of Bluetooth Smart module (FDC Peripheral) Firmware Specification. 8. Pin Description 8-1. Pin assignment and Pin Description <TOP View> MBH7BLZ02 I/O Description / No Name External Connection 1 GND - Ground 2 VDD1.8 - Should be floating 3 GND - Ground 4 GPIO_17 I/O General purpose I/O pin 5 GPIO_19 I/O General purpose I/O pin 6 GPIO_18 I/O General purpose I/O pin 7 GPIO_20 I/O General purpose I/O pin 8 GPIO_16 I/O General purpose I/O pin 9 GPIO_15 I/O General purpose I/O pin 10 GPIO_14 I/O General purpose I/O pin 11 GPIO_13 I/O General purpose I/O pin 12 GPIO_12 I/O General purpose I/O pin 13 GPIO_27 I/O General purpose I/O pin Connection for khz crystal oscillator or external khz crystal reference. 14 GPIO_26 I/O General purpose I/O pin Connection for khz crystal oscillator. 15 GND - Ground 16 GPIO_21 I/O General purpose I/O pin 17 GPIO_22 I/O General purpose I/O pin 18 GPIO_23 I/O General purpose I/O pin 19 GPIO_24 I/O General purpose I/O pin 20 GPIO_6 I/O General purpose I/O pin 21 GPIO_5 I/O General purpose I/O pin 22 GPIO_4 I/O General purpose I/O pin

16 MBH7BLZ02 I/O Description / No Name External Connection 23 GPIO_3 (U_RX) I UART_RX (UART data input) Connect to UART_TxD of Host 24 GPIO_2 (U_CTS) I UART_CTS ( Clear To Send) Connect to UART_RTS of Host 25 GPIO_1 (U_TX) O UART_TX (UART data output) Connect to UART_RxD of Host 26 GPIO_0 (U_RTS) O UART_RTS ( Request To Send) Connect to UART_CTS of Host 27 GND - Ground 28 VDD - Power supply 29 GND - Ground 30 GPIO_25 I/O General purpose I/O pin 31 GPIO_29 I/O General purpose I/O pin 32 GPIO_28 I/O General purpose I/O pin.33 GPIO_30 I/O General purpose I/O pin 34 GPIO_7 I/O General purpose I/O pin 35 GPIO_8 I/O General purpose I/O pin 36 GPIO_9 I/O General purpose I/O pin 37 GPIO_10 I/O General purpose I/O pin 38 GPIO_11 I/O General purpose I/O pin 39 SWDIO/nRESET I System reset. (Input must be low for > 0.2μs.) Also HW debug and flash programming 40 SWDCLK I HW debug and flash programming 41 GND - Ground 42 GND - Ground 43 GND - Ground 44 GND - Ground 45 GND - Ground 46 GND - Ground 47 GND - Ground 48 GND - Ground 49 GND - Ground 50 GND - Ground 51 RF RF I/O RF Input/Output 52 GND - Ground 53 GND - Ground 54 GND - Ground 55 GND - Ground 56 GND - Ground *It is required SWDCLK pin to keep in Low level during reset. It automatically perfoms reset in power-on by power-on-reset fuction in this module. In case external reset is not used, the SWDIO/nRESET pin may be floating. However, if the power supply voltage does not reach 1.9V within 60 ms, the power-on-reset circuit may not work correctly. *GPIO pin may be floating if it is not assigned function by WRITE_GPIO_CONFIG_NV command. *UART_RX and UART_CTS pin do not have internal pull-up/pull-down. Pay attention not to input midpoint potential

17 8-2. Pin State on Reset No Name State 4 GPIO_17 Input with disconnect input buffer 5 GPIO_19 Input with disconnect input buffer 6 GPIO_18 Input with disconnect input buffer 7 GPIO_20 Input with disconnect input buffer 8 GPIO_16 Input with disconnect input buffer 9 GPIO_15 Input with disconnect input buffer 10 GPIO_14 Input with disconnect input buffer 11 GPIO_13 Input with disconnect input buffer 12 GPIO_12 Input with disconnect input buffer 13 GPIO_27 Input with disconnect input buffer 14 GPIO_26 Input with disconnect input buffer 16 GPIO_21 Input with disconnect input buffer 17 GPIO_22 Input with disconnect input buffer 18 GPIO_23 Input with disconnect input buffer 19 GPIO_24 Input with disconnect input buffer 20 GPIO_6 Input with disconnect input buffer 21 GPIO_5 Input with disconnect input buffer 22 GPIO_4 Input with disconnect input buffer 23 GPIO_3 (U_RX) Input with disconnect input buffer 24 GPIO_2 (U_CTS) Input with disconnect input buffer 25 GPIO_1 (U_TX) Input with disconnect input buffer 26 GPIO_0 (U_RTS) Input with disconnect input buffer 30 GPIO_25 Input with disconnect input buffer 31 GPIO_29 Input with disconnect input buffer 32 GPIO_28 Input with disconnect input buffer 33 GPIO_30 Input with disconnect input buffer 34 GPIO_7 Input with disconnect input buffer 35 GPIO_8 Input with disconnect input buffer 36 GPIO_9 Input with disconnect input buffer 37 GPIO_10 Input with disconnect input buffer 38 GPIO_11 Input with disconnect input buffer 39 SWDIO/nRESET Pull-up 40 SWDCLK Pull-down

18 9. Mechanical Characteristics 9-1. Appearance and Dimensions Unit: mm 9-2. Marking Indentification number Lot No.: 4 X 00 Serial No.: 00~ Month: 1~9, X, Y, Z Year: The last digit of year Revision number: AA ~ Example

19 9-3. Recommended Land Pattern Following land pattern is recommended for your board design. However, you may have to modify it according to your soldering conditions. In such case, please peform evaluation sufficiently Layout of other components around antenna If any components containing metal conductor or conductive substance are placed close to the antenna, it might obstruct radio wave radiation, which causes in reducing communication distance significantly. Keep the antenna away from metal conductors in accordance with below. Prohibited area for metal conductors More than 20mm Antenna More than 20mm More than 20mm More than 20mm More than 20mm

20 9-5. Module layout guideline The layout for the module on your PCB should be designed according to the following guidelines. 4.5mm Pattern prohibited area More than 20mm 1. Protrusion More than 20mm More than 20mm 2. Notch 3. On board A large ground plane is needed in any layer of PCB. More than 20mm 4.5mm More than 5mm 10. Appearance specification Item Contents Criterion Shield Case Scratch No illegible character by scratch. Discoloration No illegible character by discoloration PAD Foreign substance adhesion No foreign substance. (Gold-plated) Solder adhesion 25% or less of each Pad area. Marking Marking specification Identical to the marking written in approval specifications for each customer. Readability Legible

21 11. Recommended Reflow Profile Following profile is recommended for your reflow soldering. However, this profile may vary according to the density of components, package types of components, a solder material, or size of your printed circuit board, etc. Please perform evaluation sufficiently. Temp. (degc) D3 D D1 T1 T2 50 Heating Preheat Soldering Cooling Time (Sec) *Note: Reflow soldering is recommended two times maximum. If your soldering conditions are different from our recommendation, please contact our local sales. No Item Temperature ( C) Time (sec) 1 Pre-heat D1: 140 to D2: 200 T1: 60 to Soldering D2: >= 200 T2: 80 max 3 Peak-Temp. D3: 250 C max

22 12. Storage Conditions Moisture Sensitivity Level: IPC/JEDEC Standard J-STD-020D Level 3 Handling of unopened moisture proof bag: It is recommended that the modules is stored at 30 C and < 60% RH, and is used within 6 months from the delivery date. Handling of opened moisture proof bag: The modules should be stored at 30 C and < 60% RH, and be used within 7 days after opening the bag. If it exceeds 7 days after opening, perform the baking process (at 125 C, 24 hours) before mounting. Do not store this modules in the environments exposed to shock or vibration. It may result in damage, malfunction, or deterioration of quality. Do not throw or drop cartons containing the modules during transportation. It may result in damage, malfunction, or deterioration of quality. Keep the modules in original packing condition until just before use. Store the modules at recommended storage condition. When deviated from the condition, check the appearance and function of the modules prior to use

23 13. Packing Specification in shipment Carrier Tape Appearance and Dimensions A B W F E P0 P1 P2 T Dimensions Tolerance +/-0.1 +/-0.1 +/-0.3 +/-0.1 +/-0.1 +/-0.1 +/-0.1 +/-0.1 +/-0.1 Unit : mm

24 13-2. Reel Appearance and Dimensions PS A B D C W1 W2 A B C D W1 W2 Dimensions Tolerance ±2.0 ±1.0 ±0.2 ±0.8 ±1.0 ±1.0 Unit : mm Taping Direction and Packing Quantity

25 13-4. Tape Reel Strength Bar code label RoHS Pb-free MSL3-25 -

26 13-6. Package Carrier tape Cover tape Reel Humidity Indicator Moisture proof bag Inner box Outer box Polystyrene+Styrenebutadiene Polyester Polystyrene+Carbon Paper PET/Al/PE 3Layer bag cardboard cardboard

27 14. Revision History Revision Contents change Date Rev Created first edition. MAY 13, 2013 Rev Changed the size and Pin assignment. JUN 14, 2013 Rev Section 5 was revised. Section 8-2 was revised. AUG 23, 2013 Rev Changed the description of high safety notice. SEP 30, 2013 Rev Section 3, 5, 9-1, 9-2 and 13-6 was revised. Added section 10. FEB 10, 2014 Rev Section 5, 6, 7 and 8-1 was revised. MAR 31, 2014 Rev Section 2, 5-3, 6-2, 6-3 and 8-1 was revised. JUL 9, 2014 Rev Changed the version of Bluetooth Specification. Section 5-5 and 5-6: Added kHz oscillator specifications. Section 6-4: Added External reset specifications. Section 8-1 and 9-2 was revised. DEC 15,