Bringing High Density Embedded Computing To Life

Transcription

1 Bringing High Density Embedded Computing To Life Getting the most PCI Express and device I/O capabilities out of new embedded processors and chipsets

2 Agenda Embedded Computing PCIe and I/O Edge Card Capabilities PICMG 1.0, 1.3, 2.x, 3.x High Density Embedded Computing (HDEC) Series New Processor & Chipset Capabilities Communications and I/O Application Requirements HDEC processor card plug-in architecture details Double-density PCI Express connectors Typical system utilization of 80-lanes of native PCIe 3.0 HDEC backplane and system design details HDEC application examples Military, Big Data, Energy Exploration & Production, Industrial Automation, Cloud Computing Summary and Conclusion

3 I/O Capabilities of Embedded Computing Systems - Pin-n-Socket Standards and COM Express 32-bit PCI/ISA Bus PCI Express Serial Interconnect Capability varies by standard. 16 to 20 native PCIe lanes from the SBC is the typical maximum

4 I/O Capabilities of Embedded Computing Systems - Standard Edge Cards 88 Lanes of PCI Express (std.) with a dual processor HDEC SHB 44 Lanes of PCIe (std.) with a single processor HDEC SHB 32-bit PCI/ISA Bus PCI Express Serial Interconnect PCIe 1.1/2.x/ PCIe Lanes (std.) Expandable to 37 Lanes with a dual-processor PICMG 1.3 SHB

5 Embedded Processor Architecture Changes Driving Additional PCIe and I/O Capabilities Memory Memory Memory Processor(s) Memory Memory Memory Memory Memory Memory Memory Memory Memory Channel(s) Memory Controller Hub Front Side Bus Memory Channel(s) Processor QPI(s) Memory Channel(s) Processor Hub Link PCIe Links (20) DMI I/O Controller Hub PCIe Links (1 to 4) PCIe Links (40+) Platform Controller Hub Device I/O PCIe Links (40+) Device I/O

6 Embedded computer system applications are getting more demanding. More PCI Express Links More Processing Cores Faster Network Interfaces More Device I/O Support Lower Data Latencies Expanded PCIe Plug-in Card Support

7 A High Density Embedded Computer (HDEC) system architecture solves the PCIe lane and I/O connectivity challenges Reduces dependence on PCIe Switch architecture for I/O card slots Greater SHB I/O features available on the backplane 5x increase in aggregate PCI Express 3.0 bandwidth Lowers SHB-to-PCIe card data latencies HDEC Improved system cable management Provides more available power Supports the broadest availability of standard I/O cards New mechanical packaging attributes for rugged environments Maintains industry standard chassis form factors Provides a growth path for future system performance

8 Trenton s new standard and products solve the need for additional PCI Express and device I/O connections An HDEC system is made up of a system host board, backplane and PCI Express edge cards STANDARD PCI EXPRESS PLUG-IN CARDS + + = HDEC SERIES SYSTEM HOST BOARD (SHB) HDEC SERIES BACKPLANE 2U, COMPACT, MIDSIZE OR LARGE FORMAT HDEC maintains the goodness of PICMG 1.3 Supports less expensive card-edge plug-in cards COTS economies of scale for option cards Fast MTTRs without expensive pin and socket SBC and option card designs Highly adaptable backplane designs for a wider variety of system enclosures Segmented backplanes enable multiple systems inside a single 19 rackmount enclosure HDEC SERIES COMPUTERS

9 New high density PCI Express standard edge connectors make the HDEC edge card computing system possible. C5 C4 C3 C2 C1 Two rows of PCIe Card edge fingers more than doubles the PCIe contact density to deliver 960 total contacts to the backplane (4-200 and 1-160) HDEC SHB SHB BP Conn. SHB Card Edge Fingers and Backplane Connector Drawing Detail* End view of the SHB connector Note: PICMG 1.3 full-length SHBs support 426 PCIe contacts plus 98 contacts for legacy serial bus *Connector drawing detail courtesy of SAMTEC

10 HDEC SHB-to-Backplane PCI Express Layout Connector 1 Port 0 x16 Port 1 x16 These 40 Lanes are from CPU 1 Connector 2 Port 2a x8 Port 2b x8 Port 2 may operate as a x16 link in future processors Today edge connectors C1 through C5 deliver 80 lanes of PCIe 3.0 to an HDEC compatible backplane with a built-in expansion capability of up to 88 lanes. Connector 5 Connector 4 Connector 3 Port 3 x16 Port 4 x16 Power Port 5 x8 Ethernet, Device I/O and Miscellaneous These 40 Lanes are from CPU 0 These 8 lanes of PCI Express support future processors

11 HDEC SHB-to-Backplane Pin-out Comparison Feature PICMG 1.3 HDEC SHB Specification Board Size 13.3" x 4.9" (65 in. sq.) " x 5.80" (78 in. sq.) I/O Opening.5" x 3.3" (1.65 in. sq.) 1.4" x 3.3" (4.62 in. sq.) Edge Connector Single-density PCI Express Samtec BEC5 or equivalent double density PCI Express PCI-Express Lanes to backplane with expansion to 88 PCI to Backplane One 32 bit Bus None SATA Routed to Backplane Two SATA 300 Six SATA/SAS 600 USB to Backplane Four USB 2.0 Six USB 3.0 Ethernet LANs Two GigE (to backplane) Two 10GigE & Two GigE (to I/O bracket with one optional BP routing) Ethernet Speed/Activity LEDs None for the backplane LANs Two for each port SMBus Links to backplane One plus one IPMB Two plus one IPMB Power Good Input from BP Yes Yes Power Good LED Output to BP None Yes Reset In from BP Yes Yes Power Button In from BP Yes Yes PSON Out to BP Yes Yes Hard Drive LED Out to BP None Yes JTAG Signals Yes Yes Intruder Alert from BP None Yes SHB Present Detect Pins None Four Speaker Out to BP None Yes Audio Out to BP None Yes Line In from BP None Yes Mic In from BP None Yes RS232/422/485 to/from BP None Yes 1 I/O bracket port & 1 BP interface CMOS Clear Input from BP None Yes Fan PWM output to BP None Eight Fan Tach Input from BP None Eight Fan PWM input to SHB None Three Fan Tach Output from SHB None Three GPIO Pins to/from BP None Eight Additional LED Output to BP None Ten PS2 Mouse/KBD to BP None One PS/2 Mouse + One PS/2 Keyboard Configuration Data EPROM on BP None Required Configuration Data EPROM on SHB None Optional Power Delivery from BP Approximately 500W Approximately 630W

12 HDEC Mechanical Comparison SHB Size HDEC SHBs are approximately ¾ taller than PICMG 1.3 SHBs HDEC SHBs occupy two full, uninterrupted I/O openings in the rear of the chassis PICMG 1.3 SHB HDEC SHB

13 HDEC Mechanical Comparison Rackmount Chassis Considerations HDEC SHBs must be mounted ¾ lower in a standard 19 rackmount chassis Rear I/O fence must allow for double-wide I/O opening for HDEC SHB PICMG 1.3 4U Chassis HDEC 4U Chassis

14 Platform Technology Comparison Intel Processor Codename Intel Platform Codename Embedded Processor Family Processors per board PICMG 1.3, Single Processor SHB (THD8141) Haswell-WS (WorkStation) PICMG 1.3, Dual Processor SHB (BXT7059) Ivy Bridge-EN (ENTRY power optimized processors) Denlow Romley-EN Grantley-EP Intel Xeon 1200 v3 & v4 Series Intel Core i5-4570te and other Intel Core CPUs with ECC* *Not all Intel Core processors support ECC memory Intel Xeon E v2 Series (v2 = Ivy Bridge-EN) HDEC Series Dual Processor SHB (HEP8225) Haswell-EP (Efficient Performance - performance optimized processors) Intel Xeon E v3 Series (Haswell) Intel Xeon E v4 Series (Broadwell) Max. cores per CPU (embedded POR) 14 (non-embedded POR) Memory Four, standard DDR DIMMs 64GB max with 16GB DIMMs Six, DDR Mini-DIMMs 48GB max with 8GB DIMMs Eight, standard DDR DIMMs 256GB max with 32GB DIMMs PCH Intel C226 (Lynx Point) Intel C604 (Patsburg-B) Intel C610 (Wellsburg) PCI Express PCIe 3.0, 21 off-board PCIe links to a PICMG 1.3 backplane to support standard COTS PCIe plug-in cards PCIe 3.0, 40 off-board PCIe links via PCIe expansion boards to a PICMG 1.3 backplane to support std. COTS PCIe plug-in cards PCIe 3.0, 80 off-board PCIe links to an HDEC series backplane to support standard COTS PCIe plug-in cards Device I/O 4-USB 3.0, 6-USB 2.0, 6-SATA/600, 3-GbE LANs, 4-Video, Audio, 2- Serial, 2-PS/2 8-USB 2.0, 6-SATA/600, 3-GbE LANs, Video 4-USB 3.0, 6-USB 2.0, 8-SATA/600, 2-10GbE LANs, 2-GbE LANs, Serial, Video, Audio, PS/2, System fan speed ctrl.

15 HDEC Series Dual Processor System Host Board Dual Haswell-EP SHB (Grantley-EP Platform) HEP8225 SHB is ideal for compute-intensive and extended I/O system applications Available in Q1/Q2, 15 The HEP8225 SHB is based on dual Haswell-EP processors and the Wellsburg PCH Each processor supports as many as 14 processing cores with 28 execution threads via Intel Hyper-threading Technology, Intel AVX 2.0 instructions, and Intel Server Platform Services (SPS) Delivers eighty lanes of PCI Express Gen3 to an HDEC Series backplane Largest PCI Express 3.0 I/O pipe available to maximize data throughput and bandwidth Expands existing rackmount computer chassis support for system I/O and PCIe cards Supports up to 256GB of DDR4 memory Supports dual, on-board 10GbE Ethernet ports plus other on-board interfaces: Two, GbE ports Four USB 3.0 ports Two SATA/600 ports Video, audio and serial ports Enables HDEC series backplane I/O that supports added system performance, improved air flow that enhances system longevity while simplifying cabling Six SATA/600 RAID ports Six USB 2.0 ports System fan speed control lines PS/2 mouse and keyboard lines Plus many other features designed for additional system performance while configuration flexibility & stability USB3.0 and 2.0 ports, SATA/600 RAID, TPM support, video, audio, serial, PS/2, dedicated IPMB, intruder alert, expanded I2C and GPIOs, system fan PWM signals, simplified system I/O connections for fans, LEDs and diagnostics

16 HDEC Series System Host Board Design Details - Dual Processor Block Diagram

17 HDEC Series System Host Board Design Details - Mechanical Layout I/O Bracket BMC Standard DDR DIMMs (256GB max.) 10G E Net (2) 1G E Net (2) USB 3.0 (4) 10G Ethernet Controller Intel C610 PCH Intel Xeon E v3 CPU0 Intel Xeon E v3 CPU VGA & Serial Standard DDR DIMMs Audio C5 C4 C3 C2 C1 Secure Card Edge Connectors for: 80 lanes of PCIe Express Gen3 6 - SATA/600 ports 6 USB 2.0 ports System diagnostics System fan speed control Additional I/O Power

18 HDEC Series System Host Board Design Details - Intel Xeon E v3 Long-Life Processors (Haswell-EP) Intel Brand Name Cores Nominal Core Speed Cache Max DDR4 Supported QPI (2) Max TDP Embedded Intel Xeon E v GHz 35MB DDR GT/s 120W 5-year off roadmap (server) Intel Xeon E v GHz 30MB DDR GT/s 120W Yes Intel Xeon E v GHz 30MB DDR GT/s 105W Yes Intel Xeon E v GHz 20MB DDR GT/s 90W Yes Intel Xeon E v GHz 15MB DDR GT/s 85W Yes Intel Xeon E v GHz 15MB DDR GT/s 85W Yes Intel Xeon E5-2648L v GHz 30MB DDR GT/s 75W Yes Intel Xeon E5-2628L v GHz 25MB DDR GT/s 75W Yes Intel Xeon E5-2618L v GHz 20MB DDR GT/s 75W Yes Intel Xeon E5-2608L v GHz 15MB DDR GT/s 50W Yes

19 HDEC Series System Host Board Design Details - Processor Board Configuration Options Series 1 Choice of 2 Haswell-EP processors, Dual 10GbE and dual 1GbE LANs on the SHB's I/O bracket, No backplane LAN routings, and no IPMI support Series 2 Choice of 2 Haswell-EP processors, Dual 1GbE LANs only on the SHB's I/O bracket, No backplane LAN routings, and no IPMI support Series 3 Choice of 2 Haswell-EP processors, Dual 10GbE and dual 1GbE LANs on the SHB's I/O bracket, No backplane LAN routings, and with IPMI support Series 4 Choice of 2 Haswell-EP processors, Dual 1GbE LANs only on the SHB's I/O bracket, No backplane LAN routings, and with IPMI support

20 HDEC Backplane Design Formats Accommodate a variety of standard system enclosures 2U Butterfly Backplane - 2U 19 Rackmount Chassis Midsize Format BPs - 4U 19 Rackmount Chassis Shoebox Format BP Multi-system and Cabinet-mountable Chassis Large Format BPs - 4U and 5U 19 Rackmount Chassis

21 HDEC Series Backplane Design Details - PCIe Bandwidth Increases and Data Latency Decreases More native PCIe links from the CPUs on the SHB reduces PCIe switch data hops Reduces backplane cost, lowers latencies, increases bandwidth between the option cards and the SHB PICMG 1.3 Backplane HDEC Series Backplane PICMG 1.3 backplane 1 PCIe switch and 1 switch hop Aggregate slot bandwidth* = 32GB/s (both directions) *Assumes PCIe Gen3 switch and eight card slots communicating at once to the SHB HDEC Series backplane No PCIe switches or switch hops Aggregate slot bandwidth* = 160GB/s (both directions) *All direct PCIe Gen3 links to the CPUs on the SHB eliminates slot contention issues

22 HDEC Series 2U Butterfly Backplane Design Details - Block Diagram 2U butterfly, form factor backplane completely free of expensive PCIe switches and optimized for 2U rackmount computers - 4, x16 PCIe card slots (1 on Side A and 3 on Side B) - HDEC I/O support and intelligent EEPROM for PCIe Gen3 link optimization Side A Side B 2U Butterfly Backplane

23 HDEC Series Midsize Format Backplane Design Details - Block Diagram Midsize format backplane free of expensive PCIe switches and optimized for 4U rackmount computers - Four, x16 PCIe card slots plus four x4 card slots - HDEC I/O support and intelligent EEPROM for PCIe Gen3 link optimization - Six USB 3.0 headers - Six SATA 600 headers - POST code LEDs - Reset/Power Button Headers - Power, Disk Activity, Error LED headers Midsize Format Backplane

24 HDEC Series Large Format Backplane Design Details - Block Diagram Large Format Backplane Large format BP designed for 5U rackmount computers and select 4U chassis - Twelve, x16 + four x4 PCIe Gen3 card slots driven directly from an HDEC Series system host board - via direct connects and two PCIe 3.0 switches - PICMG 1.3 design would require four switches - HDEC I/O support and intelligent EEPROM for PCIe Gen3 link optimization - Six USB 3.0 headers - Six SATA 600 headers - POST code LEDs - Reset/Power Button Headers - Power, Disk Activity, Error LED headers

25 HDEC Series Shoebox Format Backplane Design Details - Block Diagram Shoebox format backplane free of expensive PCIe switches and designed for designed for single-segment 4U and multi-segment 5U rackmount computers, plus machine and cabinet-mounted enclosures. - Enables dual SHB segments with one x8 and four x16 PCIe Gen3 card slots per segment, 10 slots total in a dual-segment 5U enclosure - HDEC extended I/O support and intelligent EEPROM for PCIe Gen3 link optimization Shoebox Format Backplane

26 HDEC System Design Formats Accommodate a variety of standard system enclosures 2U Rackmount Computer 4U Rackmount Computer 5U Rackmount Computer (single segment) 5U Rackmount Computer (multi segment) 4U MIL-STD Rackmount Computer

27 HDEC Series System Design Details - 2U Rackmount Computer + = HDEC Series HEP8225 System Host Board HDEC Series HDB8227 2U Butterfly Backplane THS2085 2U HDEC Series Rackmount Computer 19 Rackmount, 18 /457mm depth Supports HDEC Series SHBs and 2U butterfly form factor backplane (HDB8227) Supports three, standard x16 PCIe Gen3 cards via HDB8227 backplane Up to four removable HDD/SDDs Fixed and removable, redundant power supply options Built-in system fan speed control Rear LED lighting strip option Front status display option HDEC Series THS2085 2U Rackmount Computer

28 HDEC Series System Design Details - 4U Rackmount Computer (midsize format backplane configuration) + = HDEC Series HEP8225 System Host Board HDEC Series HDB8228 or HDB8230 Midsize Format Backplane HDEC Series THS4086 4U Rackmount Computer THS4086 4U HDEC Series Rackmount Computer 19 Rackmount, 16.4 /417mm depth Supports HDEC Series SHBs and midsize format backplanes Supports up to four, standard x16 and four x4 PCIe Gen3 cards via HDB8228 Up to eight removable HDD/SDDs Removable, redundant PS options Rear LED lighting strip option Built-in system fan speed control Front status display option Front removable fan option Door/No Door option

29 HDEC Series System Design Details - 4U Rackmount Computer (large format backplane configuration) Large Format Backplane + = HDEC Series HEP8225 System Host Board HDEC Series HDB8229 or HDB8231 Large format Backplane HDEC Series THS4095 4U Rackmount Computer THS4095 4U HDEC Series Rackmount Computer 19 Rackmount, tbd depth of 26 or less Supports HDEC Series SHBs and large format backplanes Supports up to eighteen, standard PCIe Gen3 cards via an HDB8231 Up to eight removable HDD/SDDs Front access PS options Rear LED lighting strip option Built-in system fan speed control Front status display option Front removable fan option Door/No Door option

30 HDEC Series System Design Details - 5U Rackmount Computer (single-segment configuration) + Large Format Backplane = HDEC Series HEP8225 System Host Board HDEC Series HDB8229 or HDB8231 Large format Backplane HDEC Series THS5087 5U Rackmount Computer THS5087 5U HDEC Series Rackmount Computer 19 Rackmount, 23 /584mm depth Supports HDEC Series SHBs and large format backplanes Supports up to twelve, standard x16 and four x4 PCIe Gen3 cards via HDB8229 Up to eight removable HDD/SDDs Removable, N+1 power supply Rear LED lighting strip option Built-in system fan speed control Front status display option Front removable fan option Door/No Door option

31 HDEC Series System Design Details - 5U Rackmount Computer (multi-segment configuration) + = HDEC Series HEP8225 System Host Board HDEC Series HDB8237 Large Format Backplane or 2, HDB8238 Shoebox Backplanes THS5088 5U HDEC Series Rackmount Computer 19 Rackmount, 23 /584mm depth Supports Two or Four HDEC Series SHBs in a 5U system Supports up to ten PCIe cards in a dual-segment and up to four cards in a quad-segment Up to eight removable HDD/SDDs Removable, N+1 power supply Rear LED lighting strip option Built-in system fan speed control Front status display option Front removable fan option Door/No Door option HDEC Series THS5088 5U Rackmount Computer

32 HDEC Series Application Example - Airborne Battlefield Intelligence Application Requirements SWaP is critical High-end multi-core processors are required, but cannot be power hogs Large fly crew limits system weight and size Demands consolidation of multiple application into a single system enclosure High-end data gathering requirements Speed, different data inputs, lots of data inputs FLOPs speed & capacity requirements demand extensive AVX logic Multiple levels of data security makes virtualization key Standard PCI Express plug-in option cards required the fastest available PCIe interfaces Why use an HDEC Series design approach? Maximizes sensor-to-cpu-to-decision point speed and accuracy Must be able to take advantage of the latest plug-in, PCI Express, COTS option cards available Multi-segment systems save on aircraft operating expense Enables deployment of systems having long-life processors with ten or more processing cores without the need for complex operating systems Typical field deployment scenario 15 to U and 5U multi-segment systems depending on the aircraft type, airframe configuration and mission profile requirements

33 HDEC Series Application Example - Energy Exploration & Production Application Requirements Large data gathering requirements Multiple data sensors Complex geologic and seismic data algorithm processing Demands consolidation of multiple application into a single system enclosure Exploration platforms are mobile Rugged and high shock and vibration Need to be compact Production platforms are in hostile environments Maritime environmental system certifications may be required Why use an HDEC Series design approach? Mix of purpose built option cards and standard PCI Express option cards Pin-n-socket cards are too expensive for tight ROI calculations for this aggressive profit-margin driven business model 2U, 19 rackmount systems are the ideal for mounting in the exploration trailers The more cores the better for specialized energy application software Enables deployment of systems having long-life multi-core processors without the need for complex operating systems Typical field deployment scenario Exploration trailers Usually three to five 2U 19 rackmount systems Production platform A combination of 10 to 14 shoebox or 2U 19 rackmount systems depending on the platform s production capacity and control room configuration

34 HDEC Series Application Example - Industrial Automation Application Requirements Data gathering and process control requirements vary widely Motion control, wafer processing machines, material handling, etc. Need base systems to be easily scalable and upgradable From no plug-in option cards to 10+ cards in the same rackmount platform Platforms can be mounted inside a machine, in a 19 component rack or on a shelf located on the factory floor Office environments to high shock and vibration locations High-end data gathering requirements Speed, different data inputs, lots of data inputs Why use an HDEC Series design approach? Heavy reliance on standard COTS plug-in PCI Express option cards Pin-n-socket cards are too expensive and do not offer the breadth of functionality needed in these diverse system applications 4U, 19 rackmount systems are the ideal for mounting for supporting the typical number of cards used in one of these applications The more cores the better for specialized energy application software Systems having long-life embedded processors maximize system re-use when the application software changes to accommodate new production requirements Typical field deployment scenario Varies greatly from application to application Material handling usually require larger number of lower-end systems Wafer making machines are usually board-level applications where the SHB and backplane is integral to the machine design

35 HDEC Series Application Example - Big Data & Cloud Computing Application Requirements Support for a large number of plug-in PCI Express data storage cards Support for a large number of plug-in PCI Express RAID cards for HDD/SDD arrays Support for number of plug-in PCI Express NIC cards FLOPs speed & capacity requirements demand extensive AVX logic Multiple levels of data security makes virtualization key Must be long-life embedded hardware Cannot tolerate EOL-driven downtime associated with commercial desktop hardware platforms Why use an HDEC Series design approach? Maximizes sensor-to-cpu-to-decision point speed and accuracy The additional number of device I/O interfaces such as USB 3.0, SATA/600 made available with the HDEC architecture is needed in most of these applications Must be able to take advantage of the latest plug-in, PCI Express, COTS option cards available Enables deployment of systems having long-life processors with ten or more processing cores without the need for complex operating systems Typical field deployment scenario 25 to 100 SHB and backplane board sets are oftentimes integrated into an OEMs system hardware platform for larger applications Smaller applications tend to involve 5 to 10 4U or 5U 19 rackmount computer systems

36 HDEC Series Application Example - Video Capture & Display Application Requirements Scalable video capture and display systems ASICs on the standard PCI Express plug-in video and graphics cards perform the majority of the video manipulation tasks Applications are all about the number of x16 PCIe links supported in the system and not necessarily the SHB s processor capabilities PCIe data latencies cannot be tolerated Causes image quality and processing manipulation issues Backplane needs to account for the mechanical size differences between video capture and GPU cards Why use an HDEC Series design approach? Provides the most native PCI Express 3.0 links available Backplane card slot designs can handle the mechanical variations between video capture and GPU cards Large format backplanes can enable very larger video display walls configurations with a minimal 19 component rack footprint 2U butterfly backplanes enable high-performance video capture and display systems to be mounted in mobile transit cases for use in military field deployments Typical field deployment scenario Varies greatly from a single 2U rackmount system in one transit case to multiple transit cases for a battalion-level deployment One or two 5U rackmount systems are generally used to control larger video walls seen in commercial centers such as those found in Times Square, Las Vegas and other large cities such as London and Tokyo

37 High Density Embedded Computing - Summary & Conclusion The HDEC Series architecture builds on the goodness of the PICMG 1.3 standard Expands PCI Express native linking capability to 88 lanes Expands device I/O capabilities in standard rackmount systems Takes full advantage of the latest processor innovations Industry standard, double-density PCI Express connectors on the SHB are the key design element in an HDEC Series SHB HDEC backplanes enhance the support for industry standard, COTS PCI Express plug-in cards HDEC systems come in a wide variety of shapes and sizes and utilize industry standard, 19 rackmount enclosures HDEC application examples include Military, Big Data, Energy Exploration & Production, Industrial Automation, Cloud Computing