Reverse DDS Kit Construction
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- Imogene Bridges
- 5 years ago
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1 Reverse DDS Kit Construction This kit is only recommended for home constructors experienced with Surface Mount construction so these notes are for guidance only. Mark out and drill the holes for the SMA connectors and feed through capacitors using the sketches in Fig 1, Fig 2 and the PCB as a template and guide. Note that the two Loop Through SMA connectors are positioned below the plane of the PCB whilst the reference input SMA is positioned above the plane of the board and that the board is offset from the centre of the box to provide more space above the board for headers and connectors. Note that if your final application requires that additional I/O from the PIC is taken outside the box, you should provide holes for additional feed through capacitors. Bringing I/O, including the RS232 lines, out through the walls of the enclosure, whilst perfectly OK during a development phase, may result in higher levels of spurious output unless they are suitably decoupled. If you wish to bring I/O out on a ribbon cable you will need to cut a suitable slot in the end of the box and you will need to verify that this has not introduced any unacceptable spurious output. A 2x10 20 pin header may be added for easier connection and disconnection of I/O if required. Normally it is recommended that you should start assembling and soldering the smallest smd components onto the PCB first including the DDS IC then solder the PCB into the box before finally adding the larger parts. Adding all larger parts to the PCB first will make soldering the board into the box more difficult. Depending on the technique you adopt you should start by soldering SMD IC pins at opposite corners then careful check all pin-pad alignments before proceeding to the soldering of remaining pins. Note that you will have to observe normal anti static precautions from the outset. Once you have soldered these two smd IC s into place, carefully re-checked their alignment and removed any unwanted solder bridges between pins, using fresh, clean solder wick. Carefully clean the area around these two devices with flux solvent and a stiff brush (I cut the bristles on a half inch paint brush down to about ½ in length for this purpose) then inspect again for proper alignment and absence of unwanted solder bridges. With the SMA sockets fitted to the box for alignment of the PCB it can now be soldered into the box. Alternative assembly is with the bare board soldered into the box first as it is then harder to loose components but soldering smd parts maybe more difficult due to the obstruction of the box walls. The wire ended resistor R36, 100 ohms, voltage control output to varicap(s) in the OCXO is wired from the PCB to the feed through capacitor. (track from IC3 pin 6)
2 The table below shows the supplied 16 Memory PIC pre programmed contents. A selection is made by wiring links to Connector 1 pads (Con 1) on the PCB or alternatively adding a 20 pin header and using handbag links. 0 in the table = link fitted, 1 = no link. 0 = Link Fitted 1 = No Link Memory Band I.F. Mult XTAL PB7 Con1 4-3 PB6 Con1 6-5 PB5 Con1 8-7 PB4 Con
3 Set Up The kit will normally be supplied with a 10MHz PIC clock crystal for 16 Memory LO use. For beacons the MHz crystal can be used as an alternative and gives improved JT4 timings. Select C6,C7 values as shown in the parts table according to crystal. PICs for a 10MHz clock end with -00 and those for 11MHz clock end -01 Code can be downloaded from the G4NNS website. It is recommended that RDDS is first tested with the 16 memory PIC when used for JT4 since there are a number of pre-programmed PIC parameters for JT4 which if incorrectly set will prevent correct operation and may make fault finding difficult in an otherwise untested RDDS unit. For Local Oscillator applications using the supplied PIC ensure that you have selected the correct frequency for the DDS by the appropriate wired links, or by fitting the optional 20 pin Con 1 connector or pin strip to accept handbag links. CON1 pins 3,5,7 and 9 are the frequency select inputs and these pins are linked to ground, see the table above. Leave all other pins open for LO Application with the supplied PIC. With all components fitted, including the PIC with the appropriate program. Fit JP1 and apply power to the RDDS. Consumption should be circa 60mA at 12V nominal. Give your reference source enough time to stabilise and set it s level at about 0dBm using appropriate attenuation as required. With the Reference source connected the signal level at the Ref Test Point should be mV p-p. With the OCXO connected the voltage at the DDS i/p Test Point should be 3-4V p-p using an oscilloscope and there should then be a signal at the DDS o/p Test point with a frequency similar to the reference at an amplitude of 2-3V p-p. Measure all these points with an oscilloscope with an input impedance of 1M Ohm and adequate bandwidth (200MHz). With the RDDS OCXO control output pin 2 connected to the varicap control input at the OCXO using screened cable, adjust the OCXO coarse tuning until the control voltage stabilises at about 3-5V for lock. Parts List Resistors Pack 1 Size Col Code QTY 0R0- link R R7 R R R R R25,R R R R R R R9,R R R4,R12,R R R24 1 1K0 R1,R2,R13,R20 4 1K2 R15,R23 2 2K7 R22 1 3K9 R8,R10 2 4K7 R16,R18,R29,R30 4 5K6 R3,R5 2 10K R6,R19,R K R31 1 2M2 R R R36 Wire ended resistor between PCB and F thro 1 Capacitors Pack 2 15pF C6,C7 when using Q1 10MHz 1206 GN 2 33pf Alternative C6,C7 when using Q1 11 MHz OR-OR 2 1nF C18,C20,C22,C27 BN-OR 4 1n5 C14,C15 BN-GN 2 10nF C16,C17,C21,C28 BN-YL 4 100nF / 82nF C2,C3,C5,C8,C9,C10,C11,C12,C13,C19,C24 VIOLET nF C23 BLUE 1 10uF/22uF C1,C4,C25,C26, C4532 4
4 Component Circuit Ident(s) Mark Qty per RevDDS PCB 1 Semiconductors Pack 3 AD9851 AD LM7805 IC1 1 PIC16F628A IC2 1 NE5532 IC3 1 NE/SA602 IC4 1 10MHz HC49S Q MHz HC49S Q1 Alternative Xtal Select xtal according to PIC function BFT93 Q2,Q3 PNP X1W 2 BFR92 Q4 NPN P2W or GF 1 1N4003/4 D1 1 P6KE16A D2 1 BZX84C7V5 D3 Z62 1 LED Red LED1 1 LED Green LED2 1 Miscellaneous Pack 4 Feed Through Caps For DC 2 Solder Tag For DC mount under feedthro' 2 Headers 2 way PIC +5v 1 Jumper PIC +5v 1 Header 3 way RS DIP SKT 18 pin For PIC 16F628A 1 SMA Jacks 2 hole Signal Inputs 3 M3 x 6mm screw 1 M3 Nut M3 for Regulator 1 M2.5 x 6mm screw 6 M2,5 nut M2.5 for SMA 6 Enclosure BOX 55 x 110 x 30mm 1 Additional Notes For minimum spurious output, all RF signals should be run in semi rigid or equivalent 50 Ohm coax with all SMA connectors tightened to the correct Torque. The Control voltage from the RDDS module to the OCXO should be run in coax and all covers should be in place. OCXO varicap frequency control sensitivity for best results is Hz/V at the crystal frequency When fully re-programming the PIC in situ using Con 2 the power jumper JP1 should be removed and jumpers should not be fitted at Con or 5-6. For re-programming of the EEPROM only, via RS232, the power jumper JP1 should remain fitted. Power up with RS232 connected, use Hyperterm at 2400 baud and follow the on screen instructions. Remove RS232 after completion and before next power up. A new frequency is best added to memory 16 (F) of the PIC if possible as no links are required to Con 1 for its selection. See table on page 2. If programming for an FSK beacon then use memories 15,16 (E,F) and an external TTL CW keyer wired to Con 1 pin 9 (PB4) will toggle between the two memories. Reverse the entries in memories 15,16 if the keying is inverted ie. wrong TTL keyer output polarity. Where components are marked on the PCB but do not occur in the parts list or kit these are not required to be fitted for normal operation. e.g. R14, L1, C29, C30, C31, Con 2, etc. Con1 20 pin maybe fitted at the constructors discretion for handbag selection of PIC options rather than wired link(s) or can be used for a ribbon cable connection to further expansion modules e.g. GPS.
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