What is Your Modular Strategy?

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1 What is Your Modular Strategy? Anthony Ambrose, General Manager, Modular Platform Programs, Intel Corporation Macro Conditions driving Modularity IP CAGR 67% through 2007* Data Network Demand Scale Infrastructure Capex Moore s Law Voice Global Traffic * RHK: Carriers Detail Strategies for Network Redesign, December 2003 New Service Revenue Efficient and Scalable 07 Mobility Presence Triple Play Enterprise

2 Transition to Modular Building Blocks 1990 Today Future Server Vendors Services Telecom Equipment Vendors Software Platforms Proprietary, In-house systems Outsourced, Custom, Components Standards based Semi-custom Silicon & Tools Standards-based Off The Shelf Telecom Equipment Manufacturers Will focus investment on Software and Solution Equipment Provider Cost of Goods* Validation & Test Increased Innovation Validation & Test Software & Solution R&D Platform R&D Software & Solution R&D Increased Investment* in solution value Proprietary Hardware and ASICs Platform R&D Commercial Processors and Building Blocks Platforms built on standard silicon & optical building blocks *Actual Investment will vary conceptual chart based on Yankee Group report, 2/03: Packet Processing Blades Value Proposition Study

3 AdvancedTCA* Products 50+ Product demos at Supercomm th Interoperability Workshop completed 33 Companies, 122 Products* Force* blades Intel Product suite DTI* UP Platform Kontron Announces plans Fujitsu- Siemens* Announces plans Force system ADLink* blades Portwell* blades RadiSys* Quad svr blades CCPU* strategy Kontron* launches blades **Based on product roadmaps and stated product plans from ecosystem companies, which are subject to change. Ecosystem growth is a directional estimate. *Other brands and names may be claimed as the property of others. Carrier Grade Linux* Momentum TEMs / SPs Developing & Deploying Products Shipping 2H 04 1H 05 Specification Targeted for 1H 05 CGL CGL CGL CGL CGL CGL Carrier Grade Linux Working Group POSIX APIs Hardened Drivers Event Logging Soft Real-time Monitoring & Debugging IPv6 Clustering Security SA Forum* APIs Protocol Stacks New Platform Support Under Discussion Clustering + SA Forum APIs (full) Security + And more CGL Momentum Continues to Grow

4 Standard High Availability Interfaces Service Availability Forum* Initiative Fostering an ecosystem to enable the use of commercial off-the-shelf building blocks in the creation of high availability network infrastructure products, systems and services Key interfaces within telecom equipment stack Hardware Platform Interface Specification Launched 10/7/02, New version released 5/3/04 Separates the hardware from the management middleware and makes each independent of the other Application Interface Specification Launched 4/14/03 Standardizes the interface between Service Availability Forum compliant High Availability middleware and service applications TEMs Adopting Modular Platforms Cellular Phone Siemens* 3G Mobile Platform for Mobile Core (AdvancedTCA*) Alcatel* Proxy Relay Multimedia Messaging Rack Mount Servers PDA Smart Device 3G Node B RNC MSC Wireless Services Intel Centrino Laptop Residential Gateway Access Point WiMax Base Station NEC* 3GSN/SGSN AdvancedTCA* Platform Intel Xeon Processor SGSN Gateway Voice Data

5 Modularity: Economic benefits Faster service deployment TTM (3) Months HW Dev up to 40% reduction Price/Performance (1) 3x Power/Space (2) 5x/12x Intel Confidential 1. Tolly Group 1/ Intel / TEM 2002, 3. Yankee Group 2/03 Switch-Based Telco Network Infrastructure NEBS Compliant Modular Platforms Positioning Server based Telco Network xsp Datacenter Infrastructure Increasing ISV Choice Common OS & Mgmt Hooks Rack Mount Servers Enterprise Commercial AdvancedTCA* COEM Modular IO Optimized Optimized around I/O IO & Compute Capable Open Industry Standard Building blocks Infrastructure Services Increasing Momentum for Open Standards Compute Optimized Server Optimized Compute Intensive Targeted Eco-system Integrated solutions Data Center

6 AdvancedTCA* in the Next Generation Network OLG CDN PTT CRBT VoD UM Application HSS NMS/OSS Control Network Services CSCF DNS AAA GCF GWs RNC Node-B GGSN SGSN User WAG Network Resources DSLAM/MxU Switch B-RAS GWs Modularity Enables Building Block Re-Use Compute & I/O Intensive Network Elements OLG Service CDN PTT CRBT VoD UM Elements: Elements: B-RAS, B-RAS, Service Service Router, Router, SGSN, SGSN, Application GGSN, GGSN, RNC RNC Processing several Processing of ofhss several layers layers of of complex complex user security NMS/OSS CSCF user plane plane protocols, protocols, QoS QoS and and security GCF DNS AAA Heavy Heavy signalling signalling & & application application layer layer Control processing processing requirements requirements Control M/BGWs Node-B RNC User DSLAM/MxU MSPP Switch SGSN GGSN Example Example Configuration: Configuration: N IXP2400/2800 Network Intel N ** single single or or dual dual Intel Intel IXP2400/2800 Network WAG Processors Processors for for Data Data Path Path B-RAS 22 ** Dual Xeon processor Intel Xeon Dual Intel Intel Xeon processor based based blade blade for for compute (incl. redundancy) compute (incl. redundancy) M/BGWs M/BGWs 22 ** Base Base Fabric Fabric (redundant) (redundant) 22 ** Extended Extended Fabric Fabric (redundant) (redundant) 6

7 Modularity Enables Building Block Re-Use Compute Intensive Network Elements Service Control OLG CDN PTT CRBT VoD UM Elements: Call Servers, SIP-servers, HSS, Application NMS, Application Servers Server type IO-requirements HSS NMS/OSS CSCF Heavy GCF application layer DNS processing, possibly with AAA storage interfaces and some media processing Control User Node-B MSPP DSLAM/MxU Switch RNC M/BGWs SGSN GGSN Example Configuration: N * dual Intel Xeon processor WAG based blade 2 * Base Fabric (redundant) B-RAS Optional Extended Fabric Optional Intel IXP processor M/BGWs based blades for I/O (storage, etc.) Driving AdvancedTCA* Interoperability Testing Increasing Platform re-use Ecosystem Enabling MCP Profile Documents Access Profile Edge Profile Component Development Telco Server Profile MCP Design Guide Refine the specifications Specifications PICMG 3.x Specification has flexibility, but many different approaches. Industry & Intel define common, re-usable solutions.

8 MCP Design Guide A tool to aid designers in developing common, interoperable communications platforms 2 nd Edition Narrowing of AdvancedTCA* variables to achieve interoperability Overall architecture aligned AdvancedTCA* HW and MCP SW framework Fabric & manageability guidance provided Authored by Intel, and reviewed by major OEMs and System Integrators Reducing industry fragmentation risk Lowering Implementation Costs across the supply chain Intel Confidential What s Next for Modular Comms Platforms? Modular Adoption Accelerating. AdvancedTCA* product deployments will ramp through 2H04 TEM announcements through 2004 New segments targeted; AMC spec ratified Interoperability demanded. 2nd Ed. AdvancedTCA* Design Guide Q304 AdvancedTCA* Interop Workshops OSDL release of CGL spec 3.0 Programmable processing within MCP through NPF, IETF Maintaining interoperability is the key to long term volume and cost targets

9 Advanced Mezzanine Card (AMC) Next gen Mezzanine Standard Optimized for AdvancedTCA* Robust system Management Hot Swap Capability Increased throughput 21 duplex upto 12.5Gb/s each. Designed to enabled SPI-4.2 PICMG* Driven 95 Participating Companies D0.9 (spec) posted 14+ vendors investing Product demos at Supercomm 2004 AMC.1 AMC.1 PCI PCI Express Express & AS AS Mechanical Form Factor Power Thermal envelope AMC.2 AMC.2 GbE GbE PICMG* AMC.0 AMC Base Specification AMC.3 AMC.3 Storage Storage Connector definition IPMI System Management Data Transport Framework Intel Confidential * Photo courtesy of Artesyn Technologies Intel processors and components Modular Communications Platforms Common platform across multiple network elements Industry Standards Carrier Grade Rack Mount Servers AdvancedTCA* platforms Scalable, Innovative New Services Standard Hardware Standardized OS Standardized API Equipment Provider Solutions modular communications platforms for scalable, quick service delivery Faster Time to Market

10 Summary Modularity is here: The industry is rapidly adopting modular communications platforms based on Intel processors and building blocks Modular Communications Platforms deliver value across the supply chain Opportunity: Move to Modular Communications Platforms for faster service delivery and platform cost reduction Support AdvancedTCA* design guide and interoperability efforts Continue to support standards efforts Focus on delivery and interoperability across the supply chain

11 Copyright Intel Corporation Intel, Intel NetStructure, Intel Pentium, Intel Xeon, Intel Itanium, and the Intel logo are trademarks or registered trademarks of Intel or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. All rights reserved /04

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