STULZ Micro DC. with Chip-to-Atmosphere TM Liquid to Chip Cooling

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1 STULZ Micro DC with Chip-to-Atmosphere TM Liquid to Chip Cooling

2 STULZ Micro DC Data center professionals and communication service providers (CSPs) face an increasingly difficult world. The continued deluge of connected devices finds the modern IT professional facing the reality of internet traffic surging by as much as 50 percent each year, not to mention the need of networks to handle more bandwidth intensive operations with minimal latency. The STULZ Micro DC provides a cost-effective solution needed. This modular, and highly efficient solution can easily scale to accommodate the needs of today and the rapid growth of tomorrow, even in space constrained environments. Each micro data center can be configured for low/ mid density IT loads and scale up to higher density workloads with a combination of integrated precision air cooling and Direct Contact Liquid Cooling (DCLC). for rapidly deploying IT capacity exactly where it is Features & Benefits Quick configuration & delivery Drop-in solution (ease of install and expansion) Scalable from low to high density using precision air and liquid-to-chip cooling options Modular design with removable Integrated Cooling Solution (ICS) to fit through standard doorway Configured, tested, and shipped from Frederick, MD USA Worldwide sales and service network Suitable for non-data center environments Why Choose STULZ For over 50 years, STULZ has engineered and manufactured mission critical environmental control equipment for data centers, computer rooms, and mission critical IT spaces on a global scale. The success of our company is driven by listening to our customers and delivering innovative solutions.

3 The STULZ Micro DC is a cost effective way to provide scalable IT resources in proximity to demand, retrofit existing critical infrastructure, or simply add additional compute and storage at the edge of your network. Edge to DC on Demand Retail Traditional DC or Austere Facility Finance Micro Data Center Solutions Industry 4.0 Oil, Gas & Mining Server Room Optimization High Density Three Rack Sizes IT Rack Alone IT Rack with Side ICS Rack with 2x Side ICS Additional Configurations and Multi-Rack Solutions Upon Request 48U Standard

4 Modular and Scalable Solution Common Accessories / Features Each modular system can be configured with all of the necessary critical power, distribution, rack security, and cooling integrated to your requirements. All configurations of the STULZ Micro DC feature a standard 19 rack which can be easily outfitted with standard accessories including UPS, PDU, cable management, LED lighting, environmental monitoring software and more. Cable Management Universal Cable Runway with Horizontal Cable Management Rack Construction Heavy Duty Steel Construction with Powder Coat Finish Power Distribution econnect PDU s with Environmental Probe & Temperature Humidity Sensor Monitoring & Security Remote Infrastructure Management Configurable Options Fire Suppression Spring Open Door Security Alarms UPS E-Access Lighting STULZ state-of-the-art E 2 Microprocessor with a range of BMS interface options Available with optional black or white paint

5 Liquid-to-Chip Cooling The time has come for your Data Center Higher kw per rack by massively parrallel computing in one compute center or data center Not just for high performance data centers - Leading chip manufacturers are designing processors that must be liquid cooled - By running the processor cooler at lower temperatures there is a greater level of reliability - Artificial intelligence, VR and massive data aquisition applications are driving high performance parallel computing Patented coldplate technology supports CPU, GPU, ARM and ancillary interposers, heat pipes, or heat spreaders Reliable stainless steel manifolds employing dry break, quick connect technology in horizontal or vertical chassis Servers from HP, Lenovo, Dell, Huawei, NEC, Intel, SuperMicro and others are supported Servers from almost any rack can be adapted Retrofit or new builds What is Chip-to-Atmosphere Liquid-to-Chip Cooling? STULZ and CoolIT have partnered to combine Air Cooling and Direct Contact Liquid Cooling TM (DCLC) technology. This unique combination creates Chip-to-Atmosphere TM Cooling. DCLC uses the exceptional thermal conductivity of liquid to provide concentrated cooling to the hottest components inside a server, enabling very high density configurations. CoolIT s centralized pumping liquid cooling solutions can be tailored to any server layout and have already been adopted by many server manufacturers as a reliable technology.

6 Modular Configuration Examples Utilizing & Liquid Cooling Side Mounted: Integrated Cooling Solutions (ICS) Side Mount provides up to 27 kw of cooling = 48U Available Minimal energy consumption Provides precise temperature control Available in chilled water, air, water and glycol cooled systems EC Fans can be controlled independently of each other for optimum adaptation to different return air and supply air temperatures (ICS Side Mount) STULZ state-of-the-art E 2 Microprocessor with a range of BMS interface options Liquid Rack w/ics Space Used for Cooling: 6U Remaining Space: 42U Rack w/side ICS Space Used for Cooling: 0U Remaining Space: 48U Rack w/ics & DCLC Space Used for Cooling: 10U Remaining Space: 38U Scalable and Modular - Small Servers to High Density

7 Internally Mounted: Integrated Cooling System (ICS) Internal Mount with 3 kw (6U) per unit for additional cooling = 42 U Remaining Minimal energy consumption Provides precise temperature control Available in chilled water, air, water and glycol cooled systems STULZ state-of-the-art E 2 Microprocessor with a range of BMS interface options Liquid Direct Liquid to Chip Cooling (DCLC) 80 kw of chip level cooling per rack (@ 30C facility water) Internal mount utilizes 4U = 44U Remaining Manages 120+ servers Quick and easy service Uses only 652W Servers remain hot-swappable for service High temperature return water can be used for heat re-use Liquid Liquid * Multiple N + 1 Solutions for each Cabinet will Increase Capacity Rack w/side ICS + DCLC Space Used for Cooling: 4U Remaining Space: 44U Rack w/multi-side 2xICS + DCLC Space Used for Cooling:4U Remaining Space: 44U

8 Solutions Portfolio Perimeter Row Direct Expansion (DX) Chilled Water (CW) Air-Side Economizer Water-Side Economizer Controls & Monitoring Multiple Color Options Indoor Cooling Ceiling Custom Air Handler Micro Data Center Liquid Chip Cooling Packaged Rooftop AHU Outdoor Cooling Indirect Evaporative Air Handler Custom Air Handler Modular Retrofit & Replacement Humidity Control EC Fan Retrofit Drop-in Replacement Ultrasonic Humidification E 2 Controller Retrofit Desiccant Dehumidification STULZ AIR TECHNOLOGY SYSTEMS (STULZ USA), INC Tilco Drive Frederick, MD Tel Fax info@stulz-ats.com QC-MDC STULZ USA All rights reserved

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