Silicon Photonics and the Future of Optical Connectivity in the Data Center
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1 Silicon Photonics and the Future of Optical Connectivity in the Data Center ECOC MARKET FOCUS September 19, 2016 Robert Blum Director, Strategic Marketing and Business Development 1
2 Data Center Traffic Is doubling every 12 months Source: Estimates based on Facebook and Google publications 2
3 waves of compute 1960S 1990S 2000S Mainframes Client + Server Web Cloud Terminals Personal Computers Mobile Things & Machines 3
4 Data is the next disrupter PC 90 MB / day Smartphone 30 MB / day Connected Car 4 TB / day Connected Plane 40 TB / day Connected Factory 1 PB / day Machine to Machine (M2M) connections will be 47% of total devices & connections Source: 4
5 Emergence of Hyper Scale Data Centers Data center networks are struggling to keep up with exponential data growth Google Data Center Facebook Data Center Fort Worth, Texas Facebook Data Center Network Design 5 ZB >$1B 45%+ Worldwide Annual Data Center Traffic (~5X global internet traffic) >200K Servers 10K+ switches Optical Connectivity as % of Networking Spend Other names and brands may be claimed as the property of others Source: Estimates from Facebook, Google, Cisco publications, and Intel network model 5
6 Data center connectivity TAM Data Center 100G+ TAM $5.1B Between DC $2.1B Across DC Data Center total spend on 100G and 400G interconnects $1.2B Across row Connected world, machine-tomachine traffic, data analytics & machine learning driving exponential data growth In rack Continual innovation needed to support data growth Source: 2015 Intel market model based in part on Dell Oro, Crehan and Lightcounting 2015 reports 6
7 THE Data Center network 7
8 Network Architecture TODAY Core Network / Inter Data Center Super Spine/Core DEPLOYED TODAY UPGRADING NOW Spine Inter Data Center 10km-metro 10G/40G/100G DWDM 100/200/400G DWDM Spine-Core 500m-2km 40G SMF Leaf Leaf-Spine 300m-2km 40G MMF or SMF 100G SMF ToR TOR-Leaf 100m-500m 40G MMF or SMF Server-Top of Rack (TOR) 1m-30m 10G Cu or AOC 25G Cu or AOC 8
9 Worldwide Server Market Network Metrics Dell Oro Group July % 90% 80% 70% 60% 50% 40% 30% 20% 10% Worldwide Enterprise Server Market Segment 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% Worldwide Cloud Server Market Segment 0% % GbE 10GbE 25GbE 40GbE 50GbE 100GbE Source: Dell Oro worldwide server market, July 2016 Other names and brands may be claimed as the property of others 9
10 Disaggregation of resources Source: M. Kumar, M. Nachimuthu, Intel, Next Generation Rack Scale Design, IDF
11 MICROSOFT VIEw Intra DC Generation 2 Intercity Metro >80km Connections 100/150/200Gb (400G FlexE) Tier 3 Switch X by 400Gb Tier 2 Switch X by 400Gb Tier 1 Switch X by 400Gb TOR Xx100Gb Servers <3m DAC 50/100Gb Tier 3 Tier 3 Tier 2 Tier 2 Tier 1 Tier 1 ToR ToR <80km Connections 100/200Gb (400G FlexE) <2,000m Connections 400Gb <2,000m Connections 400Gb <20m AOC Connections 400Gb Tier 1 Tier 1 Optical Fan-Out <20m Connections 100Gb 400Gb ecosystem Primarily 50Gb attached servers with initial 100Gb deployments Optics to the server likely with 100Gb deployments All links above the TOR are 400Gb 500m DR optics used for all links FlexEtherent allows 400Gb inter DC links 400Gb ecosystem looks like a good time to transition to on-board optics Tom Issenhuth, Microsoft. Panel discussion at IDF. IDF16 CLDPN01 Silicon Photonics and the Future of Optical Connectivity in the Data Center Other names and brands may be claimed as the property of others 11
12 MICROSOFT VIEw Optics to the server Today copper is only used intra rack so a TOR is required for every server rack TORs keep getting larger but the number of servers per rack keeps reducing due to increased power consumption so the architecture is getting increasingly inefficient As server NICs keep increasing in speed (25Gb to 50Gb to 100Gb to?) at some point copper will not be suitable for intra rack connections so optics will be required It is not a question if optics to the server will be required but when The use of optics would dramatically increase but at a much lower $/Gb Tier 1 Tier 1 Tier 1 Tier 1 <20m <20m Servers <3m DAC Cables to ToRs ToR ToR Servers <20m Optical Links to tier 1 Optical Fan-Out Tom Issenhuth, Microsoft. Panel discussion at IDF. IDF16 CLDPN01 Silicon Photonics and the Future of Optical Connectivity in the Data Center Other names and brands may be claimed as the property of others 12
13 BEYOND 100G - NEXT GENERATION INTERFACES for 400G+ FOUNDERS/PROMOTERS QSFP-DD QSFP-DD NEW MODULE SIMILAR TO CURRENT QSFP, BUT WITH AN ADDITIONAL ROW OF CONTACTS PROVIDING FOR AN EIGHT LANE ELECTRICAL INTERFACE COBO Consortium for On-Board Optics Developing specifications for interchangeable and interoperable optical modules that can be mounted onto printed circuit boards FOUNDING MEMBERS Intel Optical Engine QSFP-DD image from: Other names and brands may be claimed as the property of others 13
14 Ethernet switch history and Package Limitations I/O Bandwidth is becoming a network constraint Continued bandwidth growth requires increasing the number of physical I/O ports on the switch to support radix and bandwidth requirements This drives the need for embedded and integrated optics Source: Rob Stone, OFC 2016 Executive Forum Panel 4. Other names and brands may be claimed as the property of others 14
15 Future of optical connectivity in Data centers Expected form factor evolution G MSA Pluggable 400G MSA Pluggable 2018 / /800G embedded High density integrated Technology development for miniaturization, high-temp operation, low power process Enabling transition to 100G switch-to-switch connectivity Supporting next-generation switch 12.8Tb/s and 50G I/O Embedded optics for density, signal integrity, and power Address electrical I/O constraints Highest density Lowest system power QSFP-DD image from: Other names and brands may be claimed as the property of others 15
16 Requirements for integrated optical I/O Size 100x Bandwidth Density (Gbps/mm 2 ) Power <10 Power per Bit (pj/bit) Cost <$1 Cost per Bit ($/Gbps) Temperature >100C High-temperature laser operation 16
17 Intel Silicon Photonics 17
18 INTEL Silicon Photonics Silicon integration Silicon scale Silicon manufacturing INTEL Silicon Photonics New high-speed I/O connectivity based on photonics Intel wafer-scale manufacturing with hybrid laser Platform for future high-density switch integration 18
19 Intel Silicon Photonics Wafer Scale Processing; lithographically defined laser CMOS process High-speed modulators and receivers for 25G and 50G Scalable to multiple frequencies for high bandwidth, high density 19
20 High Temperature Reliability and PErformance 5000 hours HTOL 70C PERFORMANCE (>35% MM) See product data sheet for complete performance specifications 20
21 HIGH volume manufacturing STATISTICAL PROCESS CONTROL LOT ID# (8 wafers each) DESIGN OF EXPERIMENTS Design Target DOE ID# 21
22 Enabling Bandwidth Growth with intel Silicon Photonics Driving Industry Form Factor Evolution Shipping to customers now for 100G data center ramp Supporting open standard 100G optics and beyond Today Pluggable 100G Tomorrow Pluggable/Embedded 400G/800G Next Integrated Optics to Switch & Server Future Requirements for Optical Interconnects <$1 Cost per Bit ($/Gbps) 100x Bandwidth Density (Gbps/mm 2 ) >30 <10 Power per Bit (pj/bit) Intel Silicon Photonics True wafer-scale integration and manufacturing with hybrid laser Most flexible optical integration platform including WDM Other names and brands may be claimed as the property of others 22
23 Thank you! 23
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