G450C Briefing and Supply Chain Collaboration on 450mm Transition. SEMI Northeast Forum Sept. 11,2013

Transcription

1 G450C Briefing and Supply Chain Collaboration on 450mm Transition SEMI Northeast Forum Sept. 11,2013

2 G450C Background Building 450mm wafer / equipment development environment Consists of 5 member companies (Intel, TSMC, GLOBALFOUNDRIES, IBM, Samsung) and New York State partnering with CNSE New York based consortium Built on the base program started under ISMI s 450 Program Collaboratively work with suppliers to develop 450mm equipments Using wafers, equipments, people and cleanroom to develop and test equipment and build up infrastructure to meet industry needs 2

3 Key Messages Suppliers are developing the 450mm tool set with ~ more than 25 tools being delivered to G450C in 2013 Significant progress in wafer quality Automation and carriers are working Notchless wafer and 1.5mm Edge exclusion Collaboration between IC makers, Tool suppliers, Material suppliers, and Facility group is key to the future 450mm success. 3

4 Supply Chain Collaboration Supply chain collaboration enables efficient and effective 450mm transition Material Poly Silicon Parts Platform Robot Pump Laser Wafer Supplier Tool Supplier Facility & Automation Semiconductor Manufacturing Company End Customer

5 Test Wafer Center for Tool Development Collaboration among IC makers and equipment suppliers Focused resources + share the cost + share the risk IC Makers Interaction G450C - EPM -Test wafer - DTM Etch and Plasma Strip CMP, IMP,.. EPM-Equipment Performance Matrix DTM-Demonstration Test Methodology

6 Development and Technology Intercept Targets G450C Program Early 450mm Development Early Development of Silicon and Infrastructure Test Wafers to support development and demo ISMI 32/22nm Equipment Performance Metrics Tools for Consortium Demonstrations (unit process) 14nm G450C Demonstrations 450mm and 300mm tools progress synchronously through technology generations 10nm and beyond Nominal nm = ITRS M1 Half Pitch Ready for IC Makers Full set of process and metrology, automation

7 G450C Equipment Delivery Plan Accumulated Tool Numbers

8 G450C Lithography Tool Roadmap 300mm Coupon 450mm Directed Selfassembly (DSA) 450mm Imprint 193i patterning service at Nikon site Coupon + DSA + minimal Imprint Nikon 193i Move-in 8

9 Wafer Quality Roadmap & Reclaim Capability Wafer quality roadmap H 2H 1H 2H 1H 2H 1H 2H 1H 2H Mechanical Wafer M74 Spec Test / Mon Wafer Prime Wafer Q3, 2013 SFQR meet (~95% 98% area) Particle (~90% 100% pass rate) Q2, 2014 M76 Spec M1 Spec Epi Wafer G450C Monitor Wafer reclaim capability G450C On-site ready Q1, 2015 M62 Spec Wafers meet SEMI spec Process Film Q Q Q Q Q Q FEOL Oxide / Poly / SiN Photo Resist BEOL Metal (Ni/TiN/W/TaN/Cu) Lk film 9

10 Wafer Quality Continues to Improve Year-to-year defect improvement Defects on / both Wafer defect size and defect density 2010 > 90nm defects/ wafer 2011 ~ 90nm defects/ wafer 2012 ~ 38nm defects/ wafer Q nm Most recent ~ defects/ 38nm sensitivity wafer 10

11 Thermal/CMP Module Data Demonstrate Thermal OX capability U%(3s)1.97% (EPM<2%) Demonstrate OX CMP capability U%(3s) 3.8% (EPM<4%) Thermal OX OX CMP 3sigma (3.8%) 1000A Thermal OX 11

12 Film Test Wafer Availability Schedule : on-site : off-site availability Jun Jul Aug Sep Oct Nov Dec Q1, 14 Q2, 14 Thermal Oxide off site on site PE CVD SiN / SiO2 on site Photo Resist off site LP CVD SiN, Poly on site ALD SiN on site Low k Dielectric on site Ni on site TiN off site Tungsten off site on site TaN Cu seed & Cu off site off site Cu seed Cu on site 12

13 Metrology Readiness Bare Wafer Particle SE/OCD Tool Type On-Site Tool Status Applications 1 st Tool Operational 2 nd Tool Ready Thickness - Operational OCD Ready to Measure bare Si or films particle dielectric or thin metal film thickness 4P Probe Ready sheet resistance 3DAFM Operational surface roughness, pattern CD and depth TXRF Operational metal ion concentration XRR/XRF Opaque Film Thickness Operational metal thickness Macro Inspection Operational macro defect inspection, EBR distance Defect Review SEM Ready defect review, pattern CD - All basic metrologies for demonstrations are ready now - Advanced wafer geometry working on supplier s site - Overlay Tool Q1,

14 G450C Operations - Status 2013 WAFER INVENTORY WAFER MOVES 50% wafer increases Q1-> Q4 (onsite + offsite) Wafer moves are also increase rapidly 14

15 G450C Operations - NFN Cleanroom 15 tools installed in NFN cleanroom 3 Process 8 Measurement 4 Ops Support 15

16 G450C Operations - NFX Cleanroom 450mm OHT is ready for inter-fab transfer 15 tools in-fab (2 metro, 7 process, 6 stocker/sorter) +3 tools ODD 3Q2013, +10 tools ODD 4Q2013 STOCKERS VEHICLE OHT to STOCKER FAB-to-FAB OHT SCRUB BARE SI DEFECT TXRF CLEAN 16

17 Notchless Wafer Standardization Key dates: June Start tests to select the design of laser fiducial marks July TF submit SNARF to Si committee (North America) Sep MC review to start supplier engagement Oct ~ Jan 14 Submit ballot at SEMI ~ Mar 14 Ballot adjudication by Si Committee Member company representatives: GLOBALFOUNDRIES Dave Gross Intel John Williams IBM Gerd Pfeiffer Samsung Samjong Choi tsmc Vincent YH Chou G450C staff Participating companies: Applied Materials, ASML, KLA-Tencor, Lam Research, Nikon, Tokyo Electron, Sumco, GSI Group, Cognex, Sinfonia, Keyance, Brooks, etc. March April May June July Aug. Sep. Oct Set up framework to collaborate Prepare 300mm wafers; Define, setup, evaluate alternative laser marks Submit SNARF (SEMICON WEST) Prepare ballot for standards Cost / benefit analysis Collect proposals for alternative laser marks (T7 code & others) First tests on alternative laser mark IC process at CNSE and fiducial marks selection Supplier solution development 17

18 Other Standardization activities 1.5mm Edge Exclusion - M1 FQA Radius from 223mm to 223.5mm - Collaborating with SEMI Si committee and AWG TF Industry Alignment on Component Lifting - Productivity - Safety - Discussing industry guidelines- development of reference designs and/or relevant standard

19 Precompetitive Cooperation for Cost Reduction SEMI Standards F450C Subcomponent Suppliers Equipment Suppliers Prototypes Facilities Systems, Component, Service Suppliers Reference designs for nondifferentiating components Standard connections Streamlined installation EHS improvements Optimized sizing Effective base build/fit-up Standardization WG Facilities Council Identify focus areas / concepts Define pilot work Demo feasibility of approaches Drive timely adoption Device Makers Test Bed Guidelines 19

20 Summary G450C has launched with full industry momentum Significant progress is continuing in all areas of the supply chain Suppliers are developing the 450mm tool set with >25 new tools being delivered in 2013 Significant progress in wafer quality Automation and carriers are working Global collaboration is picking up steam 20

21 Questions and Discussion