AMC to PCIe Adaptor Schematic

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1 M to PIe daptor Schematic SHEMTI PGE ESRIPTION : 0 : OVER SHEET 0 : LOK IGRM 0 : INTERFES 0 : REVISION HISTORY & UMMY PRTS MJOR REVISION HISTORY : P REV. SH. REV. ESRIPTION TE.0.0 Proto uild -March-0.0. Release For Production of 0-May-0.. Release For Production of -July-0 P Mechanical etails : P LYER STK-UP ETILS :. P SIZE:." x.". P MTERIL: FR0. MER OF LYERS: 0. IMPENE ONTROL: YES NOTES, UNLESS OTHERWISE SPEIFIE :. RESISTNE VLUES RE IN OHMS.. PITNE VLUES RE IN MIROFRS.. PRTS NOT INSTLLE RE INITE WITH ''.. SIGNL NET NMES WITH "#" SUFFIX, RE TIVE LOW SIGNLS. M to PIe daptor OVER SHEET esigned for TI by ocument Number ate: Thursday, July, 0 of

2 LOK IGRM M to PIe daptor LOK IGRM esigned for TI by ocument Number ate: Thursday, July, 0 of

3 V TP V_PIe V R.K T + 0uF,0V V._PIe 0--F V. V. V J TSW-0-07-S-S Green LE SML-LX0GW-TR PIe x Edge Fingers V._PIe PIe_RX0P PIe_RX0N PIe_RXP PIe_RXN PIe_RXP PIe_RXN PIe_RXP PIe_RXN V_PIe J PIe x V. PRSNT# +V +V JTG JTG JTG JTG +.V +.V REFLK+ REFLK- PERP0 PERN0 RSV PERP PERN PERP PERN PERP PERN RSV R KEY +V +V RSV SMLK SMT +.V JTG.VUX WKE# RSV PETP0 PETN0 PRSNT# PETP PETN PETP PETN PETP PETN RSV PRSNT# m 00LW-7-F V_PIe V._PIe R0 R R7 ENLE# R R PIe_TX0P PIe_TX0N PIe_TXP PIe_TXN PIe_TXP PIe_TXN PIe_TXP PIe_TXN SM_SL_IPML SM_S_IPML TP T + 00uF,0V R SML-LX0GW-TR R.K Green LE PS# M Socket onnector J FLK TLK / PORT 7 PORT PORT PORT PORT PORT PORT PORT 0 JTG PORT 0 PORT PORT PORT 7 TLK / PORT PORT PORT PORT PORT PORT 0 PORT PORT PS# G0 M0_SGMII0_TX_P M0_SGMII0_TX_N M0_SGMII0_RX_P M0_SGMII0_RX_N G G ENLE# SM_SL_IPML SM_S_IPML TM_LK_P TM_LK_N TM_LK_P TM_LK_N PS0# TP V. V M Edge Fingers J M Edge Fingers Rx+ Rx- _ PWR_V_ PS MP G0 RSRV _ RSRV PWR_V Tx0+ Tx0- _ Rx0+ Rx0- _ G PWR_V Tx+ Tx- _7 Rx+ Rx- _ G PWR_V Tx+ Tx- _0 Rx+ Rx- _ Tx+ Tx- _ Rx+ Rx- _ ENLE PWR_V Tx+ Tx- _ Rx+ Rx- _ Tx+ Tx- _7 Rx+ Rx- _ SL_L PWR_V Tx+ Tx- _0 Rx+ Rx- _ Tx7+ Tx7- _ Rx7+ Rx7- _ S_L PWR_V_7 _ TLK+ TLK- _ TLK+ TLK- _ FLK+ FLK- _7 PS0 PWR_V 70 _ TI TO 7 TRST TMS TK _ Tx0+ Tx0- _ Rx0+ Rx0- _ 7 Tx+ Tx- _ Rx+ Rx- _ Tx+ 0 Tx- _0 Rx+ 7 Rx- _ Tx7+ Tx7- _ Rx7+ Rx7-0 _7 TLK+ TLK- 7 _ TLK+ TLK- _ Tx+ Tx- _ 0 Rx+ Rx- _ 7 Tx+ Tx- _ Rx+ Rx- _ Tx+ 0 Tx- _0 Rx+ 7 Rx- _ Tx+ Tx- _ Rx+ Rx- 0 _7 0 Tx+ 0 Tx- 07 _ 0 Rx+ 0 Rx- 0 _ 0 Tx0+ 0 Tx0-0 _ 00 Rx0+ Rx0- _ Tx+ Tx- _ Rx+ Rx- _ Tx+ Tx- _0 Rx+ Rx- _ JTG_TI JTG_TO JTG_TRST# JTG_TMS JTG_TK Rx7+ Rx7- Tx0+ Tx0- Rx0+ Rx0- Tx+ Tx- Rx+ Rx- Tx+ Tx- Rx+ Rx- Tx7+ Tx7- Rx+ Rx- TM_LK_P TM_LK_N TM_LK_P TM_LK_N Tx+ Tx- PIe_LK+ PIe_LK JTG_TI JTG_TO 7 JTG_TRST# 7 JTG_TMS JTG_TK Tx0+ Tx0- Rx0+ Rx0-7 Tx+ 7 Tx- Rx+ Rx- Tx+ 0 Tx- 0 Rx+ 7 Rx- 7 Tx7+ Tx7- Rx7+ Rx7-0 0 TM_LK_P TM_LK_N 7 7 TM_LK_P TM_LK_N Tx+ Tx- 0 Rx+ 0 Rx- 7 Tx+ 7 Tx- Rx+ Rx- M_P_TM_TX 0 M_P_TM_TX 0 M_P_TM_TX 7 M_P_TM_TX0 7 M_P_TM0_TX M_P_TM0_TX M_P_TM0_TX M_P_TM0_TX M_P_SRIO_TXP 0 0 M_P_SRIO_TXN M_P_SRIO_RXP 0 0 M_P_SRIO_RXN M_P0_SRIO_TXP 0 0 M_P0_SRIO_TXN M_P0_SRIO_RXP 00 M_P0_SRIO_RXN M_P_SRIO_TXP M_P_SRIO_TXN M_P_SRIO_RXP M_P_SRIO_RXN M_P_SRIO_TXP M_P_SRIO_TXN M_P_SRIO_RXP M_P_SRIO_RXN G0 M0_SGMII0_TX_P M0_SGMII0_TX_N M0_SGMII0_RX_P M0_SGMII0_RX_N G Tx+ Tx- Rx+ Rx- G Tx+ Tx- Rx+ Rx- Tx+ Tx- Rx+ Rx- ENLE# PIe_RX0P PIe_RX0N PIe_TX0P PIe_TX0N PIe_RXP PIe_RXN PIe_TXP PIe_TXN SM_SL_IPML PIe_RXP PIe_RXN PIe_TXP PIe_TXN PIe_RXP PIe_RXN PIe_TXP PIe_TXN SM_S_IPML TM_LK_P TM_LK_N TM_LK_P TM_LK_N PIe_LK+ PIe_LK- PS0# Tx+ Tx- Rx+ Rx- Tx+ Tx- Rx+ Rx- Tx+ Tx- Rx+ Rx- Tx+ Tx- M_P_TM_TX M_P_TM_TX M_P_TM_TX M_P_TM_TX0 M_P_TM0_TX M_P_TM0_TX M_P_TM0_TX M_P_TM0_TX0 M_P_SRIO_TXP M_P_SRIO_TXN M_P_SRIO_RXP M_P_SRIO_RXN M_P0_SRIO_TXP M_P0_SRIO_TXN M_P0_SRIO_RXP M_P0_SRIO_RXN M_P_SRIO_TXP M_P_SRIO_TXN M_P_SRIO_RXP M_P_SRIO_RXN M_P_SRIO_TXP M_P_SRIO_TXN M_P_SRIO_RXP M_P_SRIO_RXN G S Q N700 00m/V R 0K % NOTE: When = 0; Q = OFF; MM in Reset When = ; Q = ON; MM out of Reset MM (MSP0) in EVM shall assert POR (MM_POR_IN_M#) each time it is out of Reset. TP TP MT MT MT MT MT MT M to PIe daptor INTERFES ocument Number esigned for TI by. F F F ate: Thursday, July, 0 of

4 REVISION HISTORY P REV. SH. REV. HNGE ESRIPTION TE UTHOR 0. Initial raft March 0, R and R are removed, now single net of V. March, 0 0. Two Power diodes and are added on PIe powers. Shunt-post J added. Extra cap T removed. M Ports,,,,7,,,0 and JTG from socket connector connected with M edge fingers. I bus of PIe is connected to IPM bus of M Port used as SERES port March 0, 0 Issue.0 Released for P Fabrication March, onnection provision added for J.7 to connect with net M ENLE# connected to through Open rain Inverter May, 0. Resistor connected on Pin J. (PRESNT#) May 0, 0 Issue. Released for P Fabrication May, 0. Issue. Layer stack-up changed from layer to layer. ielectric material changed from FR to ISOL FR0HR. V. UX isolated from V. power plane using resistor. Released for P Fabrication. July, 0 UMMY OMPONENTS M I/O racket M oard Spacer M oard Spacer M oard Screw M M M M7 oard Screw oard Screw oard Screw M M0 M M to PIe daptor REVISION HISTORY ocument Number esigned for TI by. oard Stud oard Stud oard Stud oard Stud ate: Thursday, July, 0 of

5 IMPORTNT NOTIE FOR TI REFERENE ESIGNS Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers ( uyers ) who are developing systems that incorporate TI semiconductor products (also referred to herein as components ). uyer understands and agrees that uyer remains responsible for using its independent analysis, evaluation and judgment in designing uyer s systems and products. TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted any testing other than that specifically described in the published documentation for a particular reference design. TI may make corrections, enhancements, improvements and other changes to its reference designs. uyers are authorized to use TI reference designs with the TI component(s) identified in each particular reference design and to modify the reference design in the development of their end products. HOWEVER, NO OTHER LIENSE, EXPRESS OR IMPLIE, Y ESTOPPEL OR OTHERWISE TO NY OTHER TI INTELLETUL PROPERTY RIGHT, N NO LIENSE TO NY THIR PRTY TEHNOLOGY OR INTELLETUL PROPERTY RIGHT, IS GRNTE HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI REFERENE ESIGNS RE PROVIE "S IS". TI MKES NO WRRNTIES OR REPRESENTTIONS WITH REGR TO THE REFERENE ESIGNS OR USE OF THE REFERENE ESIGNS, EXPRESS, IMPLIE OR STTUTORY, INLUING URY OR OMPLETENESS. TI ISLIMS NY WRRNTY OF TITLE N NY IMPLIE WRRNTIES OF MERHNTILITY, FITNESS FOR PRTIULR PURPOSE, QUIET ENJOYMENT, QUIET POSSESSION, N NON-INFRINGEMENT OF NY THIR PRTY INTELLETUL PROPERTY RIGHTS WITH REGR TO TI REFERENE ESIGNS OR USE THEREOF. TI SHLL NOT E LILE FOR N SHLL NOT EFEN OR INEMNIFY UYERS GINST NY THIR PRTY INFRINGEMENT LIM THT RELTES TO OR IS SE ON OMINTION OF OMPONENTS PROVIE IN TI REFERENE ESIGN. IN NO EVENT SHLL TI E LILE FOR NY TUL, SPEIL, INIENTL, ONSEQUENTIL OR INIRET MGES, HOWEVER USE, ON NY THEORY OF LIILITY N WHETHER OR NOT TI HS EEN VISE OF THE POSSIILITY OF SUH MGES, RISING IN NY WY OUT OF TI REFERENE ESIGNS OR UYER S USE OF TI REFERENE ESIGNS. TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JES, latest issue, and to discontinue any product or service per JES, latest issue. uyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. ll semiconductor products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI s terms and conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of uyers products. uyers are responsible for their products and applications using TI components. To minimize the risks associated with uyers products and applications, uyers should provide adequate design and operating safeguards. Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. uyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. uyer represents and agrees that it has all the necessary expertise to create and implement safeguards that anticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriate remedial actions. uyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in uyer s safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in F lass III (or similar life-critical medical equipment) unless authorized officers of the parties have executed an agreement specifically governing such use. Only those TI components that TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. uyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at uyer's risk, and uyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS.IMPORTNT NOTIE Mailing ddress: Texas Instruments, Post Office ox, allas, Texas 7 opyright 0, Texas Instruments Incorporated

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