PIC design across platforms. Ronald Broeke Bright Photonics

Transcription

1 PIC design across platforms Ronald Broeke Bright Photonics

2 OUTLINE Introduction PIC applications & designs MPW Materials & platforms Design modules PICs in Phoxtrot

3 Design House for Photonics ICs Custom PIC design Design libraries MPW & custom fab Prototyping InP Silicon (SOI) SiN/Triplex Silica/PLC Polymer multi-wavelength Rx multi-wavelength Tx fiber optical sensing radio over fiber mux/demux modulators switches (C)WDM QAM AWG FTTH BOTDR O-CDMA amplifiers ring-lasers 90-deg hybrids FM-IM conversion MZI interferometers wavelength conversion power splitters/combiners Application driven design

4 PhoxTroT 3 rd Symposium on Optical Interconnect in Data Centers PIC design across platforms Ronald Broeke Session: COMPONENTS & SYSTEMS FOR DATA CENTERS

5 5 PICs, a plethora of applications PIC: Photonic Integrated Circuit Horizontal business model provides commercial access to ASPIC technology:

6 6 Design for products Sensor PICs for spectrometers, scanners, airplanes,... Flexible prototyping World record: atto-meter sensing Design for package

7 Hybrid packaging fiber feed through TE C carrier substrate TriPle X chip Hybrid packaging: Best of 2 worlds InP chip Triplex (SiN) InP wire bonds fiber array electrical connections 8 BRIGHT photonics, LioniX, SMART photonics, PhoeniX Software, VLC photonics, XiO Photonics

8 9 Application example: 100 channel InP Rx (5 THz) InP wafer (HHI) Single AWG, sim vs meas. 99% < 3 na GDS + photo Measured response Dark current PD

9 channel receiver: design A Options for a 1x100 demux across 100 nm 12 mm Simulated 1x100 1x drawn to scale B 1x 10x Cascading principle: spectra Simulated cascade 1x10x10

10 11 Application example: SOI beam former Integrated step-wise true time delay for beam formers in-home. Re-circulating AWG loop GDS + photo Performance lambda design measured nm ps ps

11 12 Manufacturing PICs Custom foundry MPW services in Europe MPW = multi project wafer In a MPW a foundry fabricates PICs InP Silicon SiN InP ~10 MPW/y Silicon ~10 MPW/y SiN ~2 MPW/y ~2 MPW runs per month!

12 13 MPW prototyping timeline 1-2 months Design Submission 3-6 months Fabrication in Foundry Testing+Packaging Time Timing depends on foundry and MPW schedule Align with packaging during design Custom fabrication faster but costly

13 14 Material platforms a waveguide comparison

14 Chip design based on functional BBs Application Functional BB Technological BB Material A. Passives B. Phase control C. Amplification couplers phase modulator gain or non-linear mixing true-time delay amplitude modulator tunable DBR lasers AWG-demux WDM add-drop multiwavelength lasers 15 ring filters tunable ring filters picosecond pulse laser

15 Comparison of platforms 16 RF: Tx, Rx All-in-one Data centers 4x25 Gbit High volume True-time delay Microwave photonics High quality passives Demux. splitters Telecom Tx low voltage RF modulators Modulators Cheap hybrid

16 Supported MPW Foundries (design + modules) 17 + many custom foundries

17 18 Design time line A. Design BBs from physics up without IP-blocks PDK Physical level design Interconnect BBs BBs layout time B. Re-use BBs + IP-blocks PDK PDK design module Time gained BBs layout time

18 19 MPW prototyping timeline 1-2 months Design Submission 3-6 months Fabrication in Foundry Testing+Packaging Time Timing depends on foundry and MPW schedule Align with packaging during design Custom fabrication faster but costly

19 20 Multi-platform design modules AWG MMI Interconnects Tapers Etc. Interface Logic Foundry

20 21 Design modules Design new BB, extend PDK Available for external users Re-use default BBs Add design functionality & design speed Control AWG MMI Taper Diodes Laser Slab Bus Material

21 BB material library Indices EIM Foundry-1 process D Layers (CS) Measured Material library AWG Indices MMI Foundry-1 Taper Diodes process Layers (CS) overview BrightModules Material Laser M Slab M Bus 2... N 2... N Material underpins BB modules Multiple processes / Foundry Multiple Index models / process 22 mat mat 2 D E I M

22 AWG design (Mux - demux) 23 BrightAWG (GUI PhoeniX OptoDesigner)

23 24 Design for manufacturing Logic to GDS DRC Underetch correction Multiple GDS layers Grid adaptation Logic GDS

24 25 Design across platforms User application specs (AWG example) lambda central = 1.55 um channel spacing = 0.8 nm FSR = 3.2 nm #in x #out = 1 x 4 BB-module Platform LioniX, SiN HHI, InP IMEC, SOI Footprint 2 mm 2 mm 1.4 mm Spectra

25 MMI design (power splitters) 26 BrightMMI (GUI PhoeniX OptoDesigner)

26 27 MMI libraries 2x3 2x3 asym. 2x2, 72/28 2x4, 85/15 2x2 1x5 2x4, 90deg-hybrid 1x4 3x3 PDK extension for MMIs: Initialized scripted MMIs Predefined MMIs (GDS) Templates with MMI rules 1x2 1x3 100 um

27 28 Bright-BB circuit simulation in Aspic BBs Symbolic AWG parameter block Spectra in Aspic GUI BrightAWG in GUI Aspic Circuit simulator Via S-matrix

28 29 Bright-BB circuit simulation in VIP-photonics Circuit in VPI: 1+10 AWGs PDs Spectra in GUI 100 channels cw Spectra in GUI 4 channels modulated at 5 GHz

29 PICs and optical routing in Phoxtrot Materials: InP, SOI, Polymer, glass PICs (SOI, InP): Linecard OAC, Optical interconnects (polymer, glass): Linecard SM OBP SM, MM 30 EU-FP7-Phoxtrot Functions: Mux, demux Power plittting Routing Tx (VCSEL), Rx (PD)

30 31 SOI, Monolithic Photonic-Electronic integration Challenges Tooling interfaces 3D CAD tools Electronics design tools Photonics design tools Routing and element placement DRC Photonics level integration: Use electronics GDS as ref. in photonics design (vias, metal) Integrate routing electrical elements BB in library Add DRC on electronic GDS layers Opto-electonic SOI chip Optical and electronic BB library

31 32 Thank You BrightPhotonics.eu BrightPhotonics.eu