NOT USE THIS MACHINE BEFORE TURNING ON THE COMPRESSED AIR.

Transcription

1 Instructin f use the DISCO DAD321 blade. Lgin n the cmputer DO NOT USE THIS MACHINE BEFORE TURNING ON THE COMPRESSED AIR. Never put yur hands in the area f the blade and the chuck!!! When an alarm rings, reset it with the key [ALRM CLEAR] after acknwledged f the message! During f wafer unlading, d nt let the water flw ut n the chuck! Revlutin: rpm fr the silicn rpm the glass and ceramic Cut speed: 5 mm/s fr the silicium 1 mm/s fr the glass and the ceramic Putting n the DAD321 blade Turn n the cmpressed air the blue handle n the wall which is n the right blade Turn n the demineralize water the purple water tap n the wall Turn n the water cled the tw black handle behind the DISCO. Turn n the main switch n the bx Turn the key n start Press [Sys init], the message "initializatin cmpleted" appears. Chice f the blade Resinid Blade Nickel Blade Revlutin Speed RPM RPM Cut Speed 1 mm/s 5 mm/s Width f Cutting 250 µm t 280 µm 100 µm t 140 µm The width f cutting is accrding t the yuth f the blade.

2 Revlutin speed Main menu F5 (Blade maintenance) F7 (Setup data), nly mdify the spindle parameter (spindle rev) [ENTER], and then return t Main menu with the key [EXIT]. Substitutin f the carrying blade Main menu F5 (Blade Maintenance) F1 (Blade replacement) t remve the carrying blade Turn the key n Axis release and then pen the hd. Remve the carrying blade (black) prtectin by unscrewing the adjuster nut n the right tp f prtectin. Use the right tl. Calibrate at 40. (Fr infrmatin: Step t left). The blade substitutin, because f damage r wear, is exclusively made by the CMI staff! IT IS STRICTLY FORBIDDEN TO UNDO THE ALUMINIUM NUT (33 MM DIAMETER) Blade Substitutin (Sftware) and setup Main menu F5 (Blade maintenance) F1 (Blade replacement) F5 (Blade select), chse the blade [ENTER], nt t frget t update the chice, [ENTER] and [EXIT]. Engage the blade revlutin [SPINDL] and water [CUT WATER] CHECK that the bth flw shwer Blade are 1 l/min Let the blade run at yur selected speed with the water cling fr 10 minutes befre perfrming the setup. Use the time t enter r mdify yur prgram and t place the wafer n its supprt. Prgramming The prgrams that begin with 0 are reserved fr the maintenance. They can be cpied, but nt mdified. Yu can cpy the prgrams Main Menu F4 (Device data list), chse the prgram in the list and cpy it F2 (COPY), enter a number > [ENTER]. Edit the prgram [ENTER], Activate shift t enter the name Mve the prgram t yur flder F3 (mve) Parameter Menu UNIT: mm CUT MODE: A, B, AS A: chuck cmes frm the right, B: cut rund trip, AS: Set several channel CUT SHAPE: Rund r Square SPINDLE REV: Check the value RND WORK SIZE: diameter f the substrat rund. Fresee a certain margin, ~ 2 mm, The reference axis is the center f rtatin f the chuck. OR SQR WORK SIZE: Dimensins f the "wrking rectangle" accrding t the methd belw Put the piece in the center as accurately as pssible Measure and put the values f CH1 and CH2 accrding t the drawing belw.

3 Fresee a certain margin fr 2 dimensins, ~2mm D nt cnfuse bth channels CH1 and CH2 WORK THICKNESS: thickness f the substrate TAPE THICKNESS: thickness f the blue tape BLADE HEIGHT: Distance between the chuck and the bttm f the cutting, put apprximately 80 µm (accrding t the blue tape) FEED SPEED: 5mm/s and fr the Si and 1mm/s fr the glass Y INDEX: Step between cutts (the measure can be made the taken up wafer, see later). Assembly f the wafer n the supprt Beware place the wafer in the center f the supprt accurately. (The reference axis is the center f rtatin f the chuck). The supprt amunts that in a single psitin. Setup (Cmpulsry) Main menu F5 (Blade maintenance) F3 (Setup functins) F1 (Chuck table setup), Cntrl the 4 parameters [ENTER]. Eliminate water drps with the cmpressed air gun during this peratin. Press [ENTER], Cntrl the message at the ft f the screen, press [ENTER], then return in main menu by means f the key [EXIT]. Make sure that the led setup is engaged. If the blade is change the prcess will need t be repeated Lad f the wafer Use a free place n the wafer r use a test wafer fr the adjustment f the blade cut. Psitin the supprt against bth pins. Press the key [VAC] and cntrl that the needle is in the green zne f the vacuum sensr. Adjustment f the blade cut with the micrscpe Main menu F5 (Blade maintenance) F5 (Hairline alignment crrectin) IMPORTANT! Check ALL the values: RND wrk size, SQR wrk size, wrk height, taps height, blade height, cut speed, spindle rev. Values f the wafer where the cutting will be made The values shwn in the screen are frm the last user

4 [ENTER]! The cut is made at the psitin f the blade. [ START] sawing test. Ended sawing, yu have t centre the lines with the key f directin [Y٨ ], [Y٧], and yu have t end by the key [Y٨ ] and cnfirm with [ENTER]. [Hair wide] and [Hair narrw] allws t make a finer regulatin. Pssibly, make a secnd cutting t cnfirm. Remve the wafer Red a setup accrding t the chapter " Setup( cmpulsry) " Sawing Tw menus with chice, AUTOCUT and SEMI AUTOCUT. The alignment f the wafer and the psitin f cutting are identical in 2 menus AUTOCUT: press F1 (channels 4, 3, 2, 1 are successively sawn) Adjust the luminsity f the mnitr and the fcus f the micrscpe by means f the adequate buttns. Alignment f the wafer Use the key [Y ], [Y ] t align the line n an element f the wafer. End by the key [Y ]. Press F5, the tables mves twards the left. Use the key [Y ], [Y ] again t align the line with the element n the wafer, end by tuching [Y ]. Press F5, the table mves autmatically n the right. Cntrl the alignment (adjustment dne). Once the alignment is terminated, adjust the psitin f cutting.

5 Psitin f the cutting If CUT MODE is AS fr several channels, It is always necessary t align n the first cutting (seen since the user) befre ending by [ENTER]. Use the key, [Y ], [Y ] [hair wide] and [hair narrw] t align the line f the center with the center f the cutting, terminate by [Y^] and [ENTER] t cnfirm the psitin f cutting. The wafer turns 90 degrees r the value which s indicated in the prgram Cntrl the alignment, enter the psitin f the cutting fr the channel 2, 3 and if need be, press [START] the cut begins with the channel 4, 3, 2. Once the cut has ended, press n [ALRMCLR] t stp the alarm and then [VAC], the fllwing message " Press [C/T VAC] key t axis mve " appears, [VAC], the chuck mves n the right. the micrscpe mves twards the back and the vacuum is deleted(eliminated). Remve the supprt. When the dr mves away frm the wafer, d nt let the water flw n t the chuck SEMI AUTOCUT: press F 2 (nly the channel 1 is sawed) Adjust the luminsity f the mnitr and the fcus f the micrscpe by means f the adequate buttns. Press F4 (menu single channel alignment). Alignment f the wafer and Psitin f the cutting Mdify # f cut t indicate the number f cuts. (If 0 the cmplete wafer is sawed). Chse F5 Rear r F10 Frnt (directin f cuts). Measure f the step (index) In varius menus it is pssible t use the functin [F8] " MEASURE " and the pssibility f resetting the meter [ F3]. Index + [θ U] turn the chuck f ¼ f revlutin n the left. Stpping the machine Exit the prgram Stp f the blade [SPINDL] when spindle ff, t cut the water, the air, the electricity.