S (surface mount) Issue date Manufacturer package code
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1 1. Packag summary Tabl 1. Packag summary plastic, dual in-lin compatibl thrmal nhancd vry thin quad flat packag; 16 trminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body 30 January 2017 Packag information Trminal position cod Packag typ dscriptiv cod Packag typ industry cod Packag styl dscriptiv cod Packag body matrial typ IE packag outlin cod --- JEDE packag outlin cod JEIT packag outlin cod --- Mounting mthod typ Q (quad) DHVQFN16 DHVQFN16 DHVQFN (DIL-compatibl thrmal nhancd vry thin quad flatpack; no lads) P (plastic) MO-241 S (surfac mount) Issu dat Manufacturr packag cod SOT763 Symbol Paramtr Min Typ Nom Max Unit D packag lngth mm E packag width mm satd hight mm 2 packag hight mm nominal pitch mm n 2 actual quantity of trmination
2 2. Packag outlin DHVQFN16: plastic dual in-lin compatibl thrmal nhancd vry thin quad flat packag; no lads; 16 trminals; body 2.5 x 3.5 x 0.85 mm D B E 1 c trminal 1 indx ara dtail X trminal 1 indx ara 1 b 2 7 v M w M B y 1 y L 1 8 E h D h X mm scal DIMENSIONS (mm ar th original dimnsions) UNIT (1) max. 1 b c D (1) D h E (1) Eh 1 L v w y y 1 mm Not 1. Plastic or mtal protrusions of mm maximum pr sid ar not includd. OUTLINE VERSION REFERENES IE JEDE JEIT MO EUROPEN PROJETION ISSUE DTE Fig. 1. Packag outlin DHVQFN16 () ll information providd in this documnt is subjct to lgal disclaimrs. Nxpria B.V ll rights rsrvd Packag information 30 January / 5
3 3. Soldring Footprint information for rflow soldring of DHVQFN16 packag Rfr to th packag outlin drawing for actual layout soldr land soldr past dposit soldr land plus soldr past occupid ara sot763-1_fr Fig. 2. Rflow soldring footprint for DHVQFN16 () ll information providd in this documnt is subjct to lgal disclaimrs. Nxpria B.V ll rights rsrvd Packag information 30 January / 5
4 4. Lgal information Disclaimrs Limitd warranty and liability Information in this documnt is blivd to b accurat and rliabl. Howvr, Nxpria dos not giv any rprsntations or warrantis, xprssd or implid, as to th accuracy or compltnss of such information and shall hav no liability for th consquncs of us of such information. Nxpria taks no rsponsibility for th contnt in this documnt if providd by an information sourc outsid of Nxpria. In no vnt shall Nxpria b liabl for any indirct, incidntal, punitiv, spcial or consquntial damags (including - without limitation - lost profits, lost savings, businss intrruption, costs rlatd to th rmoval or rplacmnt of any products or rwork chargs) whthr or not such damags ar basd on tort (including nglignc), warranty, brach of contract or any othr lgal thory. Notwithstanding any damags that customr might incur for any rason whatsovr, Nxpria aggrgat and cumulativ liability towards customr for th products dscribd hrin shall b limitd in accordanc with th Trms and conditions of commrcial sal of Nxpria. Right to mak changs Nxpria rsrvs th right to mak changs to information publishd in this documnt, including without limitation spcifications and product dscriptions, at any tim and without notic. This documnt suprsds and rplacs all information supplid prior to th publication hrof. ll information providd in this documnt is subjct to lgal disclaimrs. Nxpria B.V ll rights rsrvd Packag information 30 January / 5
5 5. ontnts 1. Packag summary Packag outlin Soldring Lgal information... 4 Nxpria B.V ll rights rsrvd For mor information, plas visit: For sals offic addrsss, plas snd an mail to: salsaddrsss@nxpria.com Dat of rlas: 30 January 2017 ll information providd in this documnt is subjct to lgal disclaimrs. Nxpria B.V ll rights rsrvd Packag information 30 January / 5
S (surface mount) Issue date
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