COM Express Standard. New PICMG standard for Computeron-Modules (COM) in x86 technology
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2 COM Express Standard New PICMG standard for Computeron-Modules (COM) in x86 technology Based on latest serial differential signalling technology Incorporates interfaces incl. PCI Express, PEG, Serial ATA, USB 2.0, LVDS, Serial DVO Delivers highest performance available on the smallest state of the art embedded module form factor Platform lineage Standardization 2
3 COM Express Dimensions Compact (95mm x 95mm) Perfect for limited space apps. Suitable for ultra low voltage CPUs Ideal for SOC variants Not yet specified by PICMG!!! Basic (125mm x 95mm) Intended for mobile and space constrained stationary systems More powerful CPUs, SO-DIMM Extended (155mm x 110mm) High performance CPUs, DIMM Dual channel memory applications For high end market applications For all modules the connector pinout is the same! 3
4 COM Express Technology Type 2 features include but are not limited to: PICMG Standard: COM Express Spec. 1.0, Pinout Type 2) Connector: 1x or 2x 220-Pin Power: 12V Heatspreader Up to 8 USB ports 4x SATA Up to 22 PCI Express Lanes (16 can be used for PCI Express Graphics) Dual LVDS channels SDVO option (pins shared with PCI Express Graphics) VGA TV-Out: Composite, Component or S-Video LPC Interface AC'97 digital audio interface (external codec) 32bit PCI Interface IDE port for legacy ATA devices Gigabit Ethernet 4
5 Pinout Types Defines 5 different pinout types Future proof for buses not even designed yet Allow customers transition from legacy parallel buses to PCI Express, SATA, Gigabit Ethernet, SDVO, etc. Type 2 pinout dominating also used by congatec Best suitable for today s chipset functionality, supporting PCI Used by all major embedded companies Module Type Connectors A, B A, B, C, D A, B, C, D A, B, C, D A, B, C, D PCI Bus 32bits, 33MHz No Yes Yes No No PATA IDE No Yes No Yes No Lan (max) Rows PCI-Express Lanes (max) 5
6 Benefits Faster time-to-market Cost effective customization alternatives Improved form-fit-function, minimizing current and future design risks Lower product life cycle costs Module scalability Interchangeability Smooth transition from legacy to legacy free (PCI, IDE) (PCI Express, SATA) (PCI Express, SATA) Headroom for growth of emerging technologies (2.5 GHz PCI Express, SATA-150) (5 GHz PCI Express, SATA-300) Promotes innovation PICMG embedded standard Safeguards R&D investment and lowers total cost of ownership 6
7 Target Market Segments Industrial Automation Test & measurement Gaming & entertainment Medical Security Storage/Logistics Transportation/Traffic Retail & advertising Military/Aerospace/Aviation POS & POI 7
8 Product Roadmap ETX is a registred trademark of Kontron Embedded Modules GmbH 8
9 conga-clx Form Factor: COM Express (Pinout type 2, Size compact) CPU: AMD Geode LX 0.9W (500MHz, 128kB L2 Cache) SDRAM: up to 1GByte (SO-DIMM DDR333) Companion chip: AMD CS5536AD Graphic controller Up to 256MB Video RAM (UMA) VGA, LCD (LVDS or TTL) Resolution up to 1920x1440 (CRT) and 1024x768 (LCD) EPI support (Embedded Panel Interface) Power management ACPI 2.0, APM 1.2 Suspend to RAM Operating systems WinXP, 2000, XPe, CE 5.0 and 6.0, Linux, VxWorks, QNX Max. Power consumption (approx. 10W) 9
10 conga-clx COM Express Features 2 Serial ATA Channel PCI Bus (Rev. 2.1) 4 USB 2.0 Ports AC'97 Interface LPC Bus Ethernet (100/1000Base-Tx) 1 EIDE Channel (UDMA-66/100) I²C Bus (400kHz Fast Mode, Multimaster) SM Bus congatec Embedded Features Embedded BIOS Board Controller Multistage Watchdog Battery Management 10
11 conga-b915 Form Factor: COM Express (Pinout type 2, Size basic) CPUs: Intel Pentium M (up to 1.8 GHz, 2 MB Cache, FSB 400 MHz), Celeron M Chipset: Intel 82915GM I/O Controller Hub 82801GBM (ICH6M) Graphic controller Up to 256MB Video RAM (UMA) VGA, LCD (LVDS), TV Out PEG Graphics Interface, shared with SDVO Resolution up to 2048x1536 (CRT) and 1920x1200 (LCD) DRAM: up to 2 GByte physical memory (SO-DIMM DDR2, 400 MHz) EPI support (Embedded Panel Interface) Power management ACPI 2.0, APM 1.2 Suspend to RAM Operating systems Windows XP, 2000, XPe, CE 5.0, Linux, VxWorks, QNX Max. Power consumption (approx. 25 W for Pentium M 1.8 GHz) 11
12 conga-b915 COM Express Features 2 Serial ATA Channel 3 PCI Express Lanes PEG shared with SDVO PCI Bus (Rev. 2.3) 8 USB 2.0 Ports (EHCI) LPC Bus 1 EIDE (UDMA-66/100) I²C Bus (400kHz Fast Mode, Multimaster) Audio HDA/AC 97 Interface Gigabit Ethernet (PCIe) Intel GMA900 Integrated Graphics Engine Dual Independent Display Support CRT Interface Flat Panel Interface TV-Out SDVO 12 congatec Embedded Features Embedded BIOS Board Controller Multistage Watchdog Battery Management optional SIO support
13 conga-b945 Form Factor: COM Express (Pinout type 2, Size basic) CPUs: Intel Core 2 Duo (up to 2.16 GHz, 4 MB Cache, FSB 667 MHz), Core Duo and Celeron M Chipset: Intel 82945GME I/O Controller Hub 82801GBM (ICH7M) Graphic controller Up to 256MB Video RAM (UMA) VGA, LCD (LVDS), TV Out PEG Graphics Interface, shared with SDVO Resolution up to 2048x1536 (CRT) and 1920x1200 (LCD) DRAM: up to 4 GByte physical memory (SO-DIMM DDR2, 667 MHz) EPI support (Embedded Panel Interface) Power management ACPI 2.0, APM 1.2 Suspend to RAM Operating systems Windows Vista, XP, 2000, XPe, CE 5.0, Linux, VxWorks, QNX Max. Power consumption (approx. 40W for Core 2 Duo 2.16 GHz) 13
14 conga-b945 COM Express Features 2 Serial ATA Channel 5 PCI Express Lanes PEG shared with SDVO PCI Bus (Rev. 2.3) 8 USB 2.0 Ports (EHCI) LPC Bus 1 EIDE (UDMA-66/100) I²C Bus (400kHz Fast Mode, Multimaster) Audio HDA/AC 97 Interface Gigabit Ethernet (PCIe) Intel GMA950 Integrated Graphics Engine Dual Independent Display Support CRT Interface Flat Panel Interface TV-Out SDVO 14 congatec Embedded Features Embedded BIOS Board Controller Multistage Watchdog Battery Management optional SIO support
15 conga-b<ng> Form Factor: COM Express (Pinout type 2, Size basic) CPU: Intel next generation Core 2 Duo processor Chipset: Intel next generation mobile chipset (More detailed information will be added after Intel has launched the next generation mobile platform) 15
16 conga-b<ng> COM Express Features 3 Serial ATA Channel 6 PCI Express Lanes PEG shared with SDVO PCI Bus (Rev. 2.3) 8 USB 2.0 Ports (EHCI) LPC Bus 1 EIDE (UDMA-66/100) I²C Bus (400kHz Fast Mode, Multimaster) Audio HDA/AC 97 Interface Gigabit Ethernet (PCIe) Intel Gen. 4 Integrated Graphics Engine Dual Independent Display Support CRT Interface Flat Panel Interface TV-Out SDVO 16 congatec Embedded Features Embedded BIOS Board Controller Multistage Watchdog Battery Management optional SIO support
17 COM Express Positioning ETX Modules Highly successful concept with widest market distribution (>> 1 Mio. installations) Limited in technology, does not support the latest I/O technologies ISA bus is rarely used for new designs ISA phase out accelerated due to EOL of chips: VIA, ST, National, Transmeta Additional pressure due to lead free requirements engineering bottleneck Customers need a quick alternative for transition to new technologies ETX is a registred trademark of Kontron Embedded Modules GmbH 17
18 XTX and COM Express Positioning XTX Cost efficient switch-over from ETX to new I/O technologies such as PCI Express, SATA No application redesign of chassis/box and thermal solution necessary, no tooling costs Drop in replacement for existing ETX designs if ISA-bus is not used Mechanically well proven concept COM Express New form factor - considering future I/O technology advances Ability to achieve even higher I/O and CPU performance levels Offers 3 form factor dimensions and 5 pinout types, allows performance scalability, suitable for all kind of applications 18
19 Comparison ETX COM Express XTX PCI Express PCI Express Graphics PEG Serial ATA USB 2.0 (8 Ports) (6 Ports) (4 Ports) LVDS Serial DVO () Gigabit Ethernet Express Card Digital Audio Interface Audio onboard LPC ISA Legacy free (I/O controller on module) Yes No No Max. Power Consumption > 30 W < 30 W < 30 W ETX is a registred trademark of Kontron Embedded Modules GmbH 19
20 Thank you for your interest! 2005 Congatec AG 20
21 Extract from PICMG/COM Express Present. continue 21
22 Extract from PICMG/COM Express Present. Platform lineage continue 22
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