QuickSpecs. HP Z2 Small Form Factor G4 Workstation. HP Z2 Small Form Factor G4 Workstation. Overview. Front View

Transcription

1 Overview Front View 1. Power button 6. (Optional) SD Card Reader 2. Combo Microphone/Headphone 7. External/internal shared 3.5" bay 3. 1 USB 3.0 port 8. Slim ODD bay 4. 1 USB 3.0 Battery Charging Port 5. (Optional) 1 USB 3.1 Gen2 Type-C Battery Charging Port c DA Worldwide Version 5 January 17, 2019 Page 1

2 Overview 1. Optional WLAN/BT antenna 2. 1 Audio Line In, 1 Audio Line Out Rear view 3. 2 DisplayPort (DP 1.2) outputs from Intel UHD graphics (available on specific processors only) 4. Flex IO module (supports VGA/HDMI/DisplayPort /2 nd RJ-45/ USB-C 3.1 Gen2 Charging Port with Alt mode/thunderbolt 3.0) (Thunderbolt requires PCIe x4 Add-In card) 5. Optional Serial port 6. RJ-45 to integrated GBE 7. 2 USB USB 3.0 c DA Worldwide Version 5 January 17, 2019 Page 2

3 Supported Components Form Factor Operating Systems Small Form Factor Preinstalled: Windows 10 Home 64* Windows 10 Pro 64* Windows 10 Pro (National Academic License)* Windows 10 Pro for Workstations HP recommends Windows 10 Pro* HP Linux -ready Supported: Red Hat Enterprise Linux Workstation (1 year paper license available; Preinstall not available) * Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. See NOTE: For detailed OS/hardware support information for Linux, see: Processors Name Intel Xeon processor E-2176G 1 Intel Xeon processor E-2174G 1 Intel Xeon processor E-2144G 1 Intel Xeon processor E Intel Xeon processor E-2126G 1 Intel Xeon processor E-2124G 1 Intel Xeon processor E-2104G 1 Intel Core TM i7-8700k processor 1 Intel Core TM i7+8700k processor (Core i7 and 16GB Intel Optane memory) 1,2, * Intel Core TM i processor 1 Cores Clock Speed (GHz) Intel Turbo Cache Boost Technology 3 (MB) Memory Speed (MT/s) Hyper- Threading Y Y Y Integrated Graphics Intel UHD Graphics Intel UHD Graphics Intel UHD Graphics Featuring Intel vpro Technology 4 16GB Intel Optane memory 2, * c DA Worldwide Version 5 January 17, 2019 Page 3 TDP (W) Y N 80W Y N 71W Y N 71W Y N/A Y N 80W N N N/A N Y Y Y Intel UHD Graphics Intel P630 UHD Graphics Intel P630 UHD Graphics P630 Intel UHD Graphics 630 Intel UHD Graphics 630 Intel UHD Graphics 630 Y N 80W Y N 71W Y N 65W Y N 95W Y Y 95W Y N 65W

4 Supported Components Intel Core TM i processor (Core i7 and 16GB Intel Optane memory) 1,2, * Y Intel UHD Graphics 630 Y Y 65W Intel Core TM i processor N Intel UHD Graphics Y N 65W Intel Core TM i processor (Core i7 and 16GB Intel Optane memory) 1,2, * N Intel UHD Graphics 630 Y Y 65W Intel Core TM i processor N Intel UHD Graphics Y N 65W Intel Core TM i processor (Core i7 and 16GB Intel Optane memory) 1,2, * N Intel UHD Graphics 630 Y Y 65W Intel Core TM i processor 1 Intel Pentium TM G5400 processor N/A N N/A Y Intel UHD Graphics Intel 630 UHD Graphics 610 N N 65W N N 54W 1 Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel s numbering, branding and/or naming is not a measurement of higher performance. 2 Intel Optane memory system acceleration does not replace or increase the DRAM in your system. *16GB Intel Optane memory Available Fall The specifications shown in the Intel Turbo Boost Technology column represent the maximum turbo frequency with one core active. Turbo boost stepping occurs in 100MHz increments. Processors that do not have turbo functionality are denoted as N/A. Intel Turbo Boost performance varies depending on hardware, software and overall system configuration. See for more information. 4 vpro. Some functionality of this technology, such as Intel Active management technology and Intel Virtualization technology, requires additional 3rd party software in order to run. Availability of future virtual appliances applications for Intel vpro technology is dependent on third-party software providers. Compatibility of this generation of Intel vpro technology-based hardware with future virtual appliances is yet to be determined. NOTES: Integrated Intel UHD graphics P630 is supported on select Intel Xeon E processors Intel Xeon E, Intel Core TM i3 and Intel Pentium processors can support either ECC or non-ecc memory; Intel Core TM i5/i7 processors only support non-ecc memory. Processor numbers differentiate features within each processor family, not across different processor families. See: for details. NOTE: In accordance with Microsoft s support policy, HP does not support the Windows 8 or Windows 7 operating system on products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7 drivers on c DA Worldwide Version 5 January 17, 2019 Page 4

5 Supported Components Color Convertibility Black The Z2G4 SFF can either be placed flat on the desktop or made to stand on the desk with the optional tower stand. Expansion Slots 1 PCIe Gen3 x16 slot (see system board section 1 PCIe Gen3 x1 slot /x4 connector for more details) 1 PCIe Gen3 x1 slot /x4 connector 1 PCIe Gen3 x4 slot /x16 connector 2 M.2 storage (PCIe Gen3 x4)* 1 M.2 Wlan (PCIe Gen3 x1+ intel CNVI)* (all slots are Low Profile) NOTE: The PCIe Gen 3 x16 slot is meant for HP qualified cards, configured or after market. HP does not provide warranty support for 3rd party cards. * M.2 storage supports compatible devices at 80mm Expansion Bays Front I/O Internal I/O 1 shared internal/external 3.5" bay. 1 internal 3.5" bay 1 internal 2.5" bay (for SSD only) 1 USB-A 3.0, 1 USB-A 3.0 Charging Data Port, 1 Combo Microphone/Headphone, and 1 USB-C 3.1 Gen2 Charging Data Port (Optional). SD card reader (Optional). 1 USB 3.0 and 2 USB 2.0 ports available as 2 separate 2x6 (3.0 x1, 2.0 x1) and 1x6 (2.0 x1) header: supports one USB 3.0 Media Card Reader. Rear I/O 2 DisplayPort (DP 1.2) outputs from Intel UHD graphics (available on specific processors only); 4 USB-A 3.0 ports, 2 USB-A 2.0 ports, 1 serial port (standard), RJ-45 (LOM), 1 Audio Line-in, and 1 Audio Line-out, Optional PS/2 ports, Flex IO port (3 rd DisplayPort /HDMI/VGA/2 nd 1GbE LAN/ USB-C 3.1 Gen2 Charging Port with Alt mode/thunderbolt 3.0 (Thunderbolt uses Flex IO connection but will be a PCIe Gen 3 Add-in card) Interfaces Supported SD Media Card Reader (optional), USB-C 3.1 Gen2 Charging Port (optional) Chassis Dimensions (H x W x D) Weight Standard desktop orientation: 100 x 338 x 381 mm (3.95 x 13.3 x 15.0 in); Optional SFF Tower orientation (excluding stand dimension): 338 x 100 x 381 mm (13.3 x 3.95 x 15.0 in) Exact weights depend upon configuration Minimum Weight: 5.5 kg (12.12 lb) Typical Weight*: 6.3 kg (13.82 lb) Maximum Weight: 7.8 kg (17.17 lb) Max Supported Weight (desktop orientation): 35 kg (77 lb) Packaging (H x W x D): 499 x229 x 518 mm(19.65 x 9.02 x in) Shipping Weight: 9.35 kg(20.6 lb) c DA Worldwide Version 5 January 17, 2019 Page 5

6 Supported Components * Configured with 1 3.5" hard drives, 1 optical drive, 2 DIMMs and 1 NVIDIA Quadro P620 graphics card Power Supply 310W 90% Efficiency wide-ranging, active Power Factor Correction (PFC) 250W 92% Efficiency wide-ranging, active PFC Power Supply option available in some countries. NOTE: The Power Supply Efficiency Report may be found at this link: Backup Devices Chipset Memory Workstation ISV Certifications For a complete listing of compatible DAT tape drives, LTO tape drives and RDX Removable Disk Backup System offerings, please visit Intel C246 chipset 4 DIMM slots, supporting up to 64GB ECC/non-ECC, DDR MT/s speed depending on the CPU selection. See the latest list of certifications at Processors Intel Xeon processor E-2100 family 2 Factory Configured Option Kit Intel Xeon processor E-2176G Y N Intel Xeon processor E-2174G Y N Intel Xeon processor E-2144G Y N Intel Xeon processor E-2136 Y N Intel Xeon processor E-2126G Y N Intel Xeon processor E-2124G Y N Intel Xeon processor E-2104G Y N 8th generation Intel Core processor family 3 Intel Core TM i7-8700k C CPU Y N Intel Core TM i7+8700k (Core i7 and 16GB Intel Optane memory*) C CPU Intel Core TM i C CPU Y N Intel Core TM i (Core i7 and 16GB Intel Optane memory*) C CPU Intel Core TM i C CPU Y N Intel Core TM i (Core i7 and 16GB Intel Optane memory*) C CPU Intel Core TM i C CPU Y N Intel Core TM i (Core i7 and 16GB Intel Optane memory*) C CPU 8th generation Intel Core i3/pentium processor family 2 Intel Core TM i C CPU Y N Intel Pentium G C CPU Y N Y Y Y Y N N N N c DA Worldwide Version 5 January 17, 2019 Page 6

7 Supported Components NOTE 1: Intel Integrated Graphics P630 for Xeon processors support workstation-specific graphics drivers for improved compatibility and performance on select professional applications, compared to Intel UHD Graphics 630. NOTE 2: These processors support either ECC or non-ecc memory NOTE 3: These processors support only non-ecc memory NOTE 4: Intel Optane memory system acceleration does not replace or increase the DRAM in your system. *16GB Intel Optane memory Available Fall 2018 Monitors / Displays Factory Configured Option Kit Option Kit Part Number HP Z Display Z27n G2 27-inch IPS LED Backlit Monitor Y 1JS10AA HP Z Display Z24n G2 24-inch IPS LED Backlit Monitor Y 1JS09AA HP Z Display Z24nf G inch IPS Backlit Monitor Y 1JS07AA HP Z Display Z23n G2 23-inch IPS LED Backlit Monitor Y 1JS06AA HP Z Display Z22n G inch IPS LED Backlit Monitor Y 1JS05AA Supported by all Operating Systems available from HP Screen Size Diagonally Measured SATA Hard Drives Factory Configured Option Kit Option Kit Part Number 500GB SATA 7200 rpm 6Gb/s 3.5" HDD Y Y LQ036AA 1TB SATA 7200 rpm 6Gb/s 3.5" HDD Y Y LQ037AA 2TB SATA 7200 rpm 6Gb/s 3.5" HDD Y Y QB576AA 4TB SATA 7200 rpm 6Gb/s 3.5 HDD Y Y K4T76AA 6TB SATA 7200 rpm 6Gb/s 3.5 HDD Y Y 3DH90AA 500GB SATA 7.2K SED SFF HDD Y N 1TB SATA 7200 rpm 6Gb/s 3.5" HDD (Enterprise Class) Y Y W0R10AA SATA Solid State Drives Factory Configured Option Kit Option Kit Part Number HP 256GB SATA 6Gb/s SSD Y Y A3D26AA HP 512GB SATA 6Gb/s SSD Y Y D8F30AA HP 1TB SATA 6Gb/s SSD Y Y F3C96AA HP 2TB SATA 6Gb/s SSD Y Y Y6P08AA HP 256GB SATA 6Gb/s SED Opal 2 SSD Y Y G7U67AA HP 512 GB SATA 6 Gb/s SED Opal 2 SSD Y Y 16GB Intel Optane memory*, ** Y Y 2EB68AA c DA Worldwide Version 5 January 17, 2019 Page 7

8 Supported Components *Intel Optane memory (cache) is sold separately. Intel Optane memory system acceleration does not replace or increase the DRAM in your system. Available for HP commercial desktops and notebooks and for select HP workstations (Z2 Tower/SFF/Mini G4, ZBook Studio, 15 and 17 G5) and requires a SATA HDD, 7th Gen or higher Intel Core processor or Intel Xeon processor E V6 product family or higher, BIOS version with Intel Optane supported, Windows 10 version 1703 or higher, M.2 type 2280-S1-B-M connector on a PCH Remapped PCIe Controller and Lanes in a x2 or x4 configuration with B-M keys that meet NVMe Spec 1.1, and an Intel Rapid Storage Technology Intel RST 16.5 driver. **16GB Intel Optane memory Available Fall 2018 PCIe SSDs PCIe SSDs for HP Workstations HP Z Turbo Drv G2 1TB TLC PCIe SSD ** Y Y TBD HP Z Turbo Drv G2 256GB TLC PCIe SSD ** Y Y Note 2 HP Z Turbo Drv G2 512GB TLC PCIe SSD ** Y Y Note 2 Intel 905p Series SSD (Optane SSD) Intel Optane SSD 905p 280GB AiC*** Y Y 2SC47AA Intel Optane SSD 905p 480GB AiC*** Y Y 2SC48AA * PCIe card installed in standard PCIe x4 slot ** Installed in native M.2 storage slot Z2G4 *** Intel Optane SSD Available Fall 2018 NOTE 1: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows 10) of system disk is reserved for system recovery software. NOTE 2: The HP Z2G4 TWR is capable of configuring up to 2 Z Turbo Drives. By default, the Z Turbo Drive configured will be installed in the M.2 storage slots on the system s motherboard. Hard Drive Controllers Integrated SATA Controller (Z2G4) Factory Configured Option Kit Integrated SATA Controller, RAID 0,1 supported: 4x 6 Gb/s ports Y N Factory integrated RAID on motherboard for SATA drives RAID 0 Data Configuration Y N RAID 1 Data Configuration Y N Factory integrated RAID on motherboard for Z Turbo Drive RAID 0 Boot or Data Configuration Y N RAID 1 Boot or Data Configuration Y N NOTE: SATA hardware RAID is not supported on Linux systems. The Linux kernel, with built-in software RAID, provides excellent functionality and performance. It is a good alternative to hardware-based RAID. All drives must be identical in type and capacity. Boot volume/raid array must be less than 2 TB ( NOTE 1: Requires identical drives (speeds, capacity, and interface). c DA Worldwide Version 5 January 17, 2019 Page 8

9 Supported Components Graphics Integrated Graphics Integrated Intel HD Graphics (Z2G4) Factory Configured Option Kit Option Kit Part Number Supported # of cards Intel UHD Graphics P630 Y N 1 Intel UHD Graphics 630 Y N 1 Intel UHD Graphics 610 Y N 1 Graphics DisplayPort Cable Adapters HP DisplayPort To DVI-D Adapter Y Y FH973AA 1 HP DisplayPort To DVI-D Adapter (2-Pack) Y N 1 HP DisplayPort To DVI-D Adapter (4-Pack) Y N 1 HP DisplayPort To VGA Adapter N Y AS615AA 1 HP DisplayPort to Dual Link DVI Adapter Y Y NR078AA 1 HP Display to HDMI Adapter N Y HP minidp to DP Adapter N Y HP USB-C to VGA Adapter N Y HP USB-C to HDMI Adapter N Y HP USB-C to DP Adapter N Y Entry 3D NVIDIA Quadro P400 2GB Graphics Y Y 1ME43AA 2 NVIDIA Quadro P620 2GB Graphics Y Y 3ME25AA 1 AMD Radeon Pro WX3100 4GB Graphics Y Y 2TF08AA 1 Mid-range 3D AMD Radeon Pro WX4100 4GB Graphics N Y Z0B15AA 1 NVIDIA Quadro P1000 4GB Graphics Y Y 1ME01AA 1 NOTE 1: Intermixing integrated Intel UHD Graphics and discrete graphics cards in order to drive more than three displays can be enabled using the Computer (F10) Setup Utility. However, HP recommends using only discrete graphics when four or more displays are required to be supported. Utility. c DA Worldwide Version 5 January 17, 2019 Page 9

10 Supported Components Memory DDR ECC Unbuffered DIMMs - CTO 8GB DDR ECC (1x8GB) RAM 16GB DDR ECC (2x8GB) RAM 32GB DDR ECC (4x8GB) RAM 32GB DDR ECC (2x16GB) RAM 64GB DDR ECC (4x16GB) RAM DDR non-ecc Unbuffered DIMMs - CTO 4GB DDR necc (1x4GB) RAM 8GB DDR necc (2x4GB) RAM 8GB DDR necc (1x8GB) RAM 16GB DDR necc (2x8GB) RAM 32GB DDR necc (2x16GB) RAM 32GB DDR necc (4x8GB) RAM 64GB DDR necc (4x16GB) RAM NOTES Intel Xeon E, Intel Core i3 and Intel Pentium can support either ECC or non-ecc memory; Intel Core i5/i7 processors only support non-ecc memory. Two channels of DDR4 memory are supported. To realize full performance at least one DIMM must be inserted into each channel. The CPUs determine the speed at which the memory is clocked. If a 2666 MT/s capable CPU is used in the system, the maximum speed the memory will run at is 2666 MT/s regardless of the specified speed of the memory. Transfer rates up to 2666 MT/s AMO DDR ECC Unbuffered DIMMs - AMO HP 8GB (1x8GB) DDR ECC Unbuffered RAM HP 16GB (1x16GB) DDR ECC Unbuffered RAM Option Kit Part Number 3TQ39AA 3TQ40AA DDR non-ecc Unbuffered DIMMs - AMO HP 4GB (1x4GB) DDR necc Unbuffered RAM HP 8GB (1x8GB) DDR necc Unbuffered RAM 16GB (1x16GB) DDR necc Unbuffered RAM 3TQ31AA 3PL81AA 3PL82AA NOTE: Only unbuffered DDR4 DIMMs are supported. The CPUs determine the speed at which the memory is clocked. If a MHz capable CPU is used in the system, the maximum speed the memory will run at is 2666 MHz regardless of the specified speed of the memory. c DA Worldwide Version 5 January 17, 2019 Page 10

11 Supported Components Multimedia and Audio Devices Factory Configured Option Kit Integrated Conexant CX HDA codec Y N Option Kit Part Number Optical and Removable Storage HP SlimTray Optical Drives Factory Configured Option Kit Option Kit Part Number HP 9.5mm Slim DVD Writer Y N K3R64AA HP 9.5mm Slim DVD-ROM Drive Y Y K3R63AA HP 9.5mm Slim BDXL Blu-Ray Writer Y Y K3R65AA HP SD Media Card Reader HP SD Media Card Reader Y Y HDD Frame/Carriers HP DP25 Removable 2.5" HDD Frame/Carrier N Y W3J84AA HP DP25 Removable 2.5" HDD Spare Carrier N Y W3J85AA Actual speeds may vary. Does not permit copying of commercially available DVD movies or other copyright protected materials. Intended for creation and storage of your original material and other lawful uses. Double Layer discs can store more data than single layer discs. However, double-layer discs burned with this drive may not be compatible with many existing single-layer DVD drives and players. With Blu-ray, certain disc, digital connection, compatibility and/or performance issues may arise, and do not constitute defects in the product. Flawless playback on all systems is not guaranteed. In order for some Blu-ray titles to play, they may require a DVI or HDMI digital connection and your display may require HDCP support. HD-DVD movies cannot be played on this workstation. Controller Cards Factory Configured Option Kit Option Kit Part Number HP Thunderbolt 3 PCIe I/O Card Y Y 4CX35AA Note 1: Utilizes Flex IO port internal connection for video output Note: HP Thunderbolt 3 PCIe I/O Card is not available until September 2018 Networking and Communications Integrated Intel I219LM PCIe GbE Controller (Intel vpro with Intel AMT 12.0) Factory Configured Option Kit Option Kit Part Number Intel X710-DA2 2-Port 10GbE SFP+ NIC Y Y 1QL47AA HP 10GbE SFP+ SR Transceiver Y Y C3N53AA Intel X550-T2 2-Port 10GbE NIC Y Y 1QL46AA Intel a/b/g/n/ac with Bluetooth 5 M.2 Y N Intel I350-T2 2-Port 1GbE (3) NIC Y Y V4A91AA Intel I350-T4 4-Port 1GbE (3) NIC N Y W8X25AA Aquantia AQN Port 5GbE NIC Y Y 1PM63AA Y N c DA Worldwide Version 5 January 17, 2019 Page 11

12 Supported Components NOTE 1: The integrated network connection is required to support Intel vpro Technology. NOTE 2: If AMT is provisioned, then network teaming with the integrated LAN port is not possible. NOTE 3: "Gigabit" Ethernet indicates compliance with IEEE standard 802.3ab for Gigabit Ethernet, and does not connote actual operating speed of 1 Gb/sec. For high speed transmission, connection to a Gigabit Ethernet server and network infrastructure is required. Racking and Physical Security Factory Configured Option Kit Kensington Lock N Y Option Kit Part Number HP Solenoid Lock and Hood (SFF) Sensor Y Y J6L43AA HP Business PC Security Lock Kit* N Y PV606AA HP UltraSlim Cable Lock Kit N Y T1A62AA * The HP Business PC Security Lock Kit does not work with the Integrated Work Center stand. Input Devices Factory Configured Option Kit Option Kit Part Number HP USB Optical Mouse Y Y QY777AA HP PS/2 Mouse N Y QY775AA HP USB Hardened Mouse SpaceMouse Pro USB 3D Input Device Y N Y Y P1N77AA B4A20AA 3Dconnexion CADMouse N Y M5C35AA HP USB Business Slim CCID SmartCard Keyboard Y Y HP USB Business Slim Keyboard Y Y N3R87AA HP PS/2 Business Slim Keyboard N Y HP Wireless Business Slim Keyboard & Mouse Y Y N3R88AA Other Hardware Factory Configured Option Kit Option Kit Part Number HP Power Cord Kit N Y DM293A HP Workstation Mouse Pad (Japan only) Y N HP Serial Port Adapter HP Serial + PS/2 Adapter HP ENERGY STAR Qualified Configuration Y N Y Y Y Y 3TK82AA 1VD82AA HP PCIe x1 Parallel Port Card N Y N1M40AA HP (SFF) Tower Stand Y Y VN569AA HP Z2 SFF G4 Bezel w/ Dust Filter option N Y 4KY90AA HP Z2 SFF G4 Dust filter only N Y 3TQ23AA Flex Module (Rear IO) Factory Configured Option Kit HP Flex IO module (VGA) Y Y 3TK80AA HP Flex IO module (HDMI) Y Y 3TK74AA HP Flex IO module (DP) Y Y 3TK72AA HP Flex IO module (USB-C) Y Y 4KY84AA c DA Worldwide Version 5 January 17, 2019 Page 12

13 Supported Components HP Flex IO module (1 Gbe LAN) Y Y 3TQ26AA Software Factory Configured Option Kit Support Notes HP Performance Advisor Y N See Note 1 HP Velocity Y N HP Remote Graphics Software (RGS) 7.x Y N HP PC Hardware Diagnostics UEFI (Windows OS only) Y N See Note 2 NOTE 1: Supports, and preinstalled with Windows 10 only. Also available as a free download from NOTE 2: Windows OS only Operating Systems Windows 10 Home 64 Windows 10 Pro 64 Windows 10 Pro (National Academic License) Windows 10 Pro for Workstations HP recommends Windows 10 Pro Red Hat Enterprise Linux (RHEL) Workstation Paper License (1yr) NOTE: For detailed OS/hardware support information for Linux, see: HP BIOS Key features of the HP BIOS include: Deployment and manageability HP BIOS provides several technologies that help integrate the HP Z2 G4 Workstation into the enterprise, such as PXE, remote recovery, remote configuration, remote control, and BIOS (F10) Setup support for 14 languages. Network firmware updates Update your BIOS via the cloud or standardize on a BIOS version hosted on an Enterprise network. Stability HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and advanced change notification. UEFI specification version 2.6 Absolute Persistence agent For tracking and tracing services, available in select countries, separate software and purchase of a subscription is required. Thermal and power management The HP BIOS provides and enables thermal and power management technologies so component temperatures are managed for high reliability and to assist in operating the HP Workstation computer in any enterprise environment. Acoustic performance Industry leading acoustic emissions across the range of operating conditions. Serviceability HP BIOS provides diagnostic and detailed service information. Upgrades and recovery HP BIOS provides numerous ways to upgrade HP Workstation computers, including BIOS updates from within Windows (HP Firmware Update and Recovery), c DA Worldwide Version 5 January 17, 2019 Page 13

14 Supported Components HP Client Manager, and fail-safe recovery. In addition, the HP BIOS Configuration Utility enables replication of BIOS settings within Windows while the Replicated Setup feature provides the same capability within BIOS (F10) Setup. The BIOS Configuration Utility is available from the HP support website. HP BIOS uses PKI signing of the BIOS for trusted BIOS upgrades and recovery. Additional HP BIOS Features: Power-On password Helps prevent an unauthorized user from powering on the system. Administrator password Also known as the BIOS Setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS cannot be updated and changes cannot be made to BIOS settings using BIOS Setup or under the OS. S4/S5 Maximum Power Savings setting supports EU Lot6 requirement and allows the computer to power down below 0.5W in S4/S5 (when turned off). When S4/S5 Maximum Power Savings feature is enabled below features are turned off: -Power to expansion connectors / slots -Wake events other than power buttons (such as wake on LAN) -USB charging ports HP Sure Start Gen4 Start BIOS Integrity checking Sure Start protection ensures that only trusted BIOS code is executed and not rootkits, viruses and malware. Verification is done upon boot up, shutdown and while the system is on. Sure Start is set by default to automatically repair the BIOS if corrupted or compromised but is policy driven for better manageability. Protecting beyond BIOS Integrity checking and repair is extended to other data that should be protected such as network configuration parameters, platform specific information (i.e. system IDs), secure boot credentials, and other code the system needs to boot. Audit enabled System Audit via Sure Start Event Logs capture data such as incident, repair date and time for troubleshooting and investigating HP Sure Start Gen4 is available on HP Workstation products equipped with Intel 8th generation processors. c DA Worldwide Version 5 January 17, 2019 Page 14

15 Supported Components SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS BIOS HP BIOSphere Gen4 17 HP DriveLock & Automatic DriveLock BIOS Update via Network Master Boot Record Security Power On Authentication Secure Erase 18 Absolute Persistence Module 19 Pre-boot Authentication HP Wireless Wakeup Software HP Performance Advisor HP Velocity HP Remote Graphics Software (RGS) 7.x Manageability Features HP Driver Packs 22 HP System Software Manager (SSM) HP BIOS Config Utility (BCU) HP Client Catalog HP Manageability Integration Kit Gen2 23 Client Security Software HP Client Security Suite Gen4 25 including: HP Security Manager 26 (including Credential Manager, HP Password Manager, HP Spare Key) HP Device Access Manager HP Power On Authentication Microsoft Defender 27 Security Management Secure Erase 18 TPM 2.0 Embedded Security Chip shipped with Windows 10 (Common Criteria EAL4+ Certified) 32 SATA port disablement (viabios) RAID configurations 33 Serial, USB enable/disable (viabios) Power-on password (viabios) Setup password (viabios) Support for chassis padlocks and cable lock devices Integrated hood sensor HP Sure Click 37 HP Sure Start Gen4 30 HP Sure Run 35 HP Sure Recover HP BIOSphere Gen4 features may vary depending on the Workstation platform and configurations requires 8th Gen Intel processors. 18. Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication Supported on Workstation platforms with BIOS version F.03 or higher. 19. Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription. Subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. The Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit: computrace-agreement. Data Delete is an optional service provided c DA Worldwide Version 5 January 17, 2019 Page 15

16 Supported Components by Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to use the Data Delete service, customers must first sign a Pre-Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens from Absolute Software. 22. HP Driver Packs not preinstalled, however available for download at HP Manageability Integration Kit can be downloaded from HP Client Security Suite Gen 4 requires Windows and Intel or AMD 8th generation processors. 26. HP Password Manager requires Internet Explorer or Chrome or FireFox. Some websites and applications may not be supported. User may need to enable or allow the add-on / extension in the internet browser. 27. Microsoft Defender Opt in and internet connection required for updates. 30. HP Sure Start Gen4 is available on HP Workstation products equipped with Intel 8th generation processors 32. Firmware TPM is version Hardware TPM is v RAID configuration is optional and does require a second hard drive. 35. HP Sure Run is available on HP Workstation products equipped with 8th generation Intel or AMD processors. 36. HP Sure Recover is available on HP Workstations with 8th generation Intel or AMD processors and requires an open, wired network connection. You must back up important files, data, photos, videos, etc. before using HP Sure Recover to avoid loss of data. 38. HP Sure Click is available on select HP platforms and supports Microsoft Internet Explorer and Chromium. Check for all compatible platforms as they become available c DA Worldwide Version 5 January 17, 2019 Page 16

17 System Technical Specifications System Board System Board Form Factor ATX x mm (9.6 x 9.6 inches) Processor Socket Single LGA 1151 CPU Bus Speed DMI Chipset Intel PCH C246 Memory Expansion Slots 4 DDR4 memory slots Memory Type Supported DDR4, UDIMM (Unbuffered), ECC& non-ecc Memory Modes Non-Interleaved for single channel. Interleaved when both channels are populated. Memory Speed Supported 2666MT/s DDR4 Memory Protection ECC available on data Maximum Memory 64GB Memory Configuration (Supported) 4GB, 8GB and 16GB non-ecc/ 8GB and 16GB ECC unbuffered DIMMs are supported. ECC and non-ecc memory DIMMs cannot be mixed on the same system. NOTE: * Maximum memory capacities assume 64-bit operating systems, such as Windows 7 Professional 64-Bit or Red Hat Linux 64-bit. 32-bit Windows Operating Systems support up to 4 GB. PCI Express Connectors 1 PCI Express Gen3 slot x16 mechanical/ x16 electrical (LP, half length) 1 PCI Express Gen3 slot x4 mechanical/ x1 electrical (LP, half length) 1 PCI Express Gen3 slot x4 mechanical/ x1 electrical (LP, half length) 1 PCI Express Gen3 slot x16 mechanical/ x4 electrical (LP, half length) 2 M.2 storage (PCIe Gen3 x4) 1 1 M.2 WLAN (PCIe Gen3 x1+ Intel CNVi) NOTE: LP = Low Profile NOTE: In the PCIe Gen3 slot (x16 electrical/x16 mechanical) slot, if it is not being used for a graphics card, only cards certified as After Market Options for this platform are supported. Supported Drive Interfaces NOTE 1: M.2 storage slot supports compatible devices up to 80mm SATA Integrated (4) Serial ATA interfaces (6Gb/s SATA). RAID 0 and 1 supported. Factory integrated RAID for Microsoft Windows only. Serial Attached SCSI None Integrated RAID NOTE: Requires identical hard drives (speeds, capacity, interface) Integrated Graphics Intel UHD Graphics 610 (on Pentium Gold-5xxx processors); Intel UHD Graphics 630 (on Core i3/i5/i7-8xxxx processors); Intel Integrated Graphics for Xeon E processors Based on Unified Memory Architecture (UMA) - A region of system memory is reserved and dedicated to the graphics display. Support for Microsoft DirectX 12, OpenGL 4.4 and OpenCL 2.0 on Intel UHD Graphics P630; 2 DP 1.2 graphics ports integrated on motherboard; Supports up to three simultaneous displays across DP outputs. 2 DP are native on the system, 3 rd DP is optional via Flex IO port Max. resolution supported: c DA Worldwide Version 5 January 17, 2019 Page 17

18 System Technical Specifications Network Controller IDE connector Floppy connector Serial 2nd Serial Integrated Ethernet PHY Connection I219LM. Management capabilities: WOL, PXE 2.1 and AMT 12.0 No No Yes- requires optional Serial Port Adapter Kit Yes- requires optional Serial Port Adapter Kit IEEE 1394 Connector(s) USB Connector(s) Front 2 USB-A 3.0, 1 USB-C 3.1 Gen2 (optional) Rear 4 USB-A 3.0, 2 USB-A 2.0 Internal 1 USB 3.0, 2 USB 2.0 HD Integrated Audio Yes Flash ROM Yes Chassis Fan Header Yes Front Control Yes Panel/Speaker Header CMOS Battery Holder - Lithium Yes Integrated Trusted Platform Module Power Supply Headers Power Switch, Power LED & Hard Drive LED Header Clear Password Jumper Keyboard/Mouse System Configurations Z2G4 SFF Configuration #1 (TBD) Integrated TPM 2.0 Convertible to FIPS Certified mode through firmware v7.80 Yes Yes Yes USB or PS/2 (Option) Processor Info Memory Info 1x Intel Core TM i MB 65W CPU 8GB (1x 8GB) 2666 MHz DDR4 non-ecc Graphics Info Intel UHD Integrated Graphics 630 Energy Consumption (Watts) Heat Dissipation (Btu/hr) Disks/Optical/Floppy 1x SATA 500 GB 7.2k rpm/ 1x 9.5mm Slim ODD PSU 250W 92% Other 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (EuP) VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled c DA Worldwide Version 5 January 17, 2019 Page 18

19 System Technical Specifications Z2G4 SFF Configuration #2 (TBD) ENERGY STAR CERTIFIED Energy Consumption (Watts) Heat Dissipation (Btu/hr) Z2G4 SFF Configuration #3 (TBD) Windows Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (EuP) Processor Info 1x Intel Core TM i MB 65W CPU Memory Info 16GB (2x 8GB) 2666 MHz DDR4 ECC Graphics Info 1x NVIDIA Quadro P620 2GB Graphics Disks/Optical/Floppy 1x SATA 1 TB 7.2k rpm/ 1x9.5mm Slim ODD PSU 310W 90% Other 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (EuP) VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (EuP) Processor Info 1x Intel Xeon E MB 80W CPU Memory Info 64GB (4x16GB) 2666 MHz DDR4 ECC Graphics Info 1x AMD Radeon Pro WX GB Graphics Disks/Optical/Floppy 1x 4TB 7.2k rpm Enterprise SATA PSU 310W 90% Other Energy Consumption (Watts) 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows long Idle (S0) c DA Worldwide Version 5 January 17, 2019 Page 19

20 System Technical Specifications Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (EuP) Heat Dissipation (Btu/hr) 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (EuP) Power Supply 310W, 90% efficiency, wide-ranging, active PFC Power Supply; 250W, 92% efficiency, wide-ranging, active PFC Power Supply; The Z2G4 SFF 92% PSU Efficiency Report can be found at this link: Operating Voltage Range VAC Rated Voltage Range VAC Rated Line Frequency Hz Operating Line Frequency Hz Range Rated Input Current V Heat Dissipation Typical: TBD btu/hr (TBD kcal/hr) Maximum: TBD btu/hr (TBD kcal/hr) Power Supply Fan 70mm x 70mm x 25 mm 4-wire PWM ENERGY STAR certified Yes (Config Dependent) FEMP Standby Power Yes, with Wake-on-LAN disabled: <1W in S4/S5- Power Off Compliant Surge Tolerant Full Yes Ranging Power Supply (withstands power surges up to 2000V) ErP Lot 6- Tier 1 Yes 230V (<1W in S4/S5- Power Off) ErP Lot 6- Tier 2 Yes 230V (<0.5W in S4/S5- Power Off) c DA Worldwide Version 5 January 17, 2019 Page 20

21 System Technical Specifications Declared Noise Emissions (Entry-level, Mid-level, and High-end configurations) System Configuration (Entry level) Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Test Unit on ISO Table System Configuration (Mid-level) Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Test Unit on ISO Table Processor Info Memory Info Graphics Info Disks/Optical Intel Core TM i C CPU 64GB DDR necc (4x16GB) RAM Intel UHD Graphics 1 TB SATA 6Gb/s SSD No Optical Sound Power (LWAd, bels) Deskside Sound Pressure (LpAm, decibels) Idle Hard drive Operating (random reads) Processor Info Intel Xeon processor E-2136 Memory Info 64GB DDR necc (4x16GB) RAM Graphics Info NVIDIA Quadro P1000 4GB Disks/Optical 2 x 2TB SATA 7200 rpm 6Gb/s 3.5" HDD No Optical Sound Power (LWAd, bels) Deskside Sound Pressure (LpAm, decibels) Idle Hard drive Operating (random reads) System Configuration (High-end) Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Test Unit on ISO Table Processor Info Memory Info Graphics Info Disks/Optical Intel Core TM i7-8700k C CPU 64GB DDR necc (4x16GB) RAM NVIDIA Quadro P1000 4GB 2 x 2TB SATA 7200 rpm 6Gb/s 3.5" HDD No Optical Sound Power (LWAd, bels) Deskside Sound Pressure (LpAm, decibels) Idle Hard drive Operating (random reads) c DA Worldwide Version 5 January 17, 2019 Page 21

22 System Technical Specifications Environmental Requirements Temperature Operating: 5 to 35 C (40 to 95 F) Above 1524 m (5,000 feet) altitude, the maximum operating temperature is reduced by 1 C (1.8 F) for every 305 m (1,000 feet) increase in elevation Non-operating: -40 to 60 C (-40 to 140 F) Maximum rate of change: 10 C/hr Humidity Maximum Altitude Shock (non-repetitive) Operating: 10% to 85% RH, non-condensing, 35 C maximum wet bulb Non-operating: 10% to 90% RH, non-condensing, 35 C maximum wet bulb Operating (with Rotational Hard Drives): 3,048 m (10,000 feet) Operating (with only Solid-State Drives): 5,000 m (16,404 feet) Non-operating: 12,192 m (40,000 feet) Maximum operating temperature is reduced as altitude increases. See Temperature for details. Operating ½-sine: 40g, 2-3ms (~62 cm/sec) Non-operating ½-sine: 160 cm/s, 2-3 ms (~105 g) Non-operating square: 422 cm/s, 20 g Vibration Operating random: 0.5 g (rms), Hz, up to g²/hz Non-operating random: 2.0 g (rms), Hz, up to g²/hz Physical Security and Serviceability Access Panel Tool-less Includes system board and memory information Hard Drives Tool-less (Internal bay with installed carrier ) Expansion Cards Tool-less Processor Socket Tool-less, except for the processor heatsink. Blue User Touch Points Yes, on tool-free internal chassis mechanisms Color-coordinated Cables Yes and Connectors Memory Tool-less System Board Screw-In Dual Color Power and HD Yes LED on Front of Computer Configuration Record SW Yes Over-Temp Warning on Yes Screen Restore CD/DVD Set Consists of an operating system DVD (OSDVD) and a driver DVD (DRDVD). OSDVD restores the original operating system. DRDVD will provide all drivers for the system. The DRDVD may also contain applications that originally shipped with the system for optional installation. Applications can also be obtained from HP.com. OSDVD and DRDVD are orderable with the system and available from HP Support. Dual Function Front Yes, causes a fail-safe power off when held for 4 seconds Power Switch Padlock Support Yes (optional): Locks side cover and secures chassis from theft c DA Worldwide Version 5 January 17, 2019 Page 22

23 System Technical Specifications Cable Lock Support Universal Chassis Clamp Lock Support Solenoid Lock and Hood Sensor Rear Port Control Cover Serial, USB, Audio, Network, Enable/Disable Port Control Removable Media Write/Boot Control Power-On Password Setup Password NIC LEDs (integrated) (Green & Amber) CPUs and Heatsinks Power Supply Diagnostic LED Front Power Button Front Power LED Front Hard Drive Activity LED Front ODD Activity LED Internal Speaker System/Emergency ROM Flash Recovery Cooling Solutions Power Supply Fans CPU Heatsink Fan Chassis Fan Memory Heatsink Fan HP PC Hardware Diagnostics UEFI Access Panel Key Lock ACPI-Ready Hardware Trusted Platform Module Chip 0.22-in diameter padlock loop at rear of system Yes, Kensington Cable Lock (optional): Locks side cover and secures chassis from theft 3 mm x 7 mm slot at rear of system Yes (optional): Locks side cover and locks cables to chassis. Secures chassis from theft and allows multiple units to be chained together when used with optional cable Threaded feature at rear of system Yes (optional) The Solenoid Hood Lock eliminates the need for a physical key by making the chassis lockable through software and a password. You can also lock and unlock the chassis remotely over the network. The Sensor Kit detects when the access panel has been removed. Yes, locks rear IO cables to prevent cable theft Yes, enables or disables serial, USB, audio, and network ports Yes, prevents ability to boot from removable media on supported devices (and can disable writes to media) Yes, prevents an unauthorized person from booting up the workstation Yes, prevents an unauthorized person from changing the workstation configuration Yes A T-15 Torx or flat blade screwdriver is needed to remove the CPU heatsink before the CPU can be removed. CPU removal is tool-less No Yes, ACPI multi-function Yes, white (normal), red (fault) Yes, white Yes Yes Recovers corrupted system BIOS. Air cooled forced convection 70mm x 70mm x 25mm 4-wire PWM (non-serviceable) Mainstream (<=65W): 93mm x 86mm 75.8mm Performance (<=95W): 93mm x 102.7mm x 75.8mm Not applicable. CPU heatsink fan also operates as the chassis fan. No HP PC Hardware Diagnostics (UEFI) enables hardware level testing outside the operating system on many components. The diagnostics can be invoked by pressing F2 at POST, and is available as a download from HP Support. No Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode. Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system Yes c DA Worldwide Version 5 January 17, 2019 Page 23

24 System Technical Specifications Integrated Chassis Handles Power Supply PCI Card Retention Flash ROM Diagnostic Power Switch LED on board Clear Password Jumper Clear CMOS Button CMOS Battery Holder DIMM Connectors No Requires T15 Torx or flat blade screwdriver Yes, rear (all), middle (none), front (none) Yes Yes Yes Yes Yes Yes c DA Worldwide Version 5 January 17, 2019 Page 24

25 System Technical Specifications Environmental Data Eco-Label Certifications & declarations System Configuration This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks: IT ECO declaration US ENERGY STAR EPEAT Gold registered in the United States. See for registration status in your country. Search keyword generator on HP s 3rd party option store for solar energy accessory at The configuration used for the Energy Consumption and Declared Noise Emissions data for the Notebook model is based on a Typically Configured Notebook. Energy Consumption (in accordance with US ENERGY STAR test method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz Normal Operation (Short W W W idle) Normal Operation (Long W W W idle) Sleep 1.40 W 0.62 W W Off 0.62 W 0.24 W 0.23 W Note: Energy efficiency data listed is for an ENERGY STAR compliant product if offered within the model family. HP computers marked with the ENERGY STAR Logo are compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR specifications for computers. If a model family does not offer ENERGY STAR compliant configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows operating system. Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz Normal Operation (Short 42 BTU/hr 75 BTU/hr 76 BTU/hr idle) Normal Operation (Long 64 BTU/hr 63 BTU/hr 64 BTU/hr idle) Sleep 5 BTU/hr 2 BTU/hr 5 BTU/hr Off 2 BTU/hr 1 BTU/hr 1 BTU/hr *NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Typically Configured Idle Fixed Disk Random writes Longevity and Upgrading Sound Power (LWAd, bels) Sound Pressure (LpAm, decibels) This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include: c DA Worldwide Version 5 January 17, 2019 Page 25

26 System Technical Specifications 3 USB ports 1 PC card slot (type I/II) 1 ExpressCard/54 slot 1 IEEE 1394 Port 2 SODIMM memory slots Optional expansion base docking station 1 multi-bay II storage port Interchangeable HDD?? Spare parts are available throughout the warranty period and or for up to 5 years after the end of production. Batteries This battery(s) in this product comply with EU Directive 2006/66/EC Batteries used in the product do not contain: Mercury greater the1ppm by weight Cadmium greater than 20ppm by weight Battery description: CR2032 (coin cell) Battery type: Lithium Additional Information This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive /65/EC. This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). This product is in compliance with the IEEE 1680 (EPEAT) standard at the gold level, see Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043. This product contains 13.2% post-consumer recycled plastic (by wt.) This product is 94.3% recycle-able when properly disposed of at end of life. Packaging Materials External: PAPER/Corrugated 1210 g Material Usage Internal: PLASTIC/Polyethylene Expanded - EPE 207 g PLASTIC/Polyethylene low density - LDPE 43 g The plastic packaging material contains at least 0% recycled content. The corrugated paper packaging materials contains at least 35% recycled content. This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at Asbestos Certain Azo Colorants Certain Brominated Flame Retardants may not be used as flame retardants in plastics Cadmium Chlorinated Hydrocarbons Chlorinated Paraffins Formaldehyde Halogenated Diphenyl Methanes c DA Worldwide Version 5 January 17, 2019 Page 26

27 System Technical Specifications Lead carbonates and sulfates Lead and Lead compounds Mercuric Oxide Batteries Nickel finishes must not be used on the external surface designed to be frequently handled or carried by the user. Ozone Depleting Substances Polybrominated Biphenyls (PBBs) Polybrominated Biphenyl Ethers (PBBEs) Polybrominated Biphenyl Oxides (PBBOs) Polychlorinated Biphenyl (PCB) Polychlorinated Terphenyls (PCT) Polyvinyl Chloride (PVC) except for wires and cables, has been voluntarily removed from most applications. Radioactive Substances Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) Packaging Usage End-of-life Management and Recycling HP follows these guidelines to decrease the environmental impact of product packaging: Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. Eliminate the use of ozone-depleting substances (ODS) in packaging materials. Design packaging materials for ease of disassembly. Maximize the use of post-consumer recycled content materials in packaging materials. Use readily recyclable packaging materials such as paper and corrugated materials. Reduce size and weight of packages to improve transportation fuel efficiency. Plastic packaging materials are marked according to ISO and DIN 6120 standards. Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. c DA Worldwide Version 5 January 17, 2019 Page 27