Modular IPC - Next Generation IPC for Industry 4.0 Applications. Jasper Hsu Product Manager Applied Intelligent System Group

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1 Modular IPC - Next Generation IPC for Industry 4.0 Applications Jasper Hsu Product Manager Applied Intelligent System Group

2 Objectives - Understand product features and applications usage - Prepare you for the webinar part 2 - Choose Next Gen. IPC as focus products on your promo list Agenda - From legacy IPC to Next Gen. IPC - Next Gen. IPC Intro Roadmap update - Case Studies - Appendix - Q & A

3 Legacy IPC V.S Next Gen. IPC

4 Legacy IPC in Traditional Equipment Build Wallmount/Desktop Chassis Rackmount Chassis MB & PICMG 1.3/1.0 SBC/BP PCI/PCIE IO Cards

5 Equipment in Industry 4.0 Smart MFR Ex. SMT Process in PCBA Characteristics: Higher density of product lines Smaller equipment High definition image analysis Higher computing power On-demand IO and sensor added Expandability of add-on card Page 5

6 Next Gen. IPC Introduction: MIC-7XXX Modularize IPC Series

7 Advantech Co., Ltd

8 Modularized Design i-module Supported for Flexible Expansion CTOS Service for Shortening Lead Time

Temperature Wide-range DC Voltage -20 60

EMC protected to 8KV Industrial COM port

9 Ruggedized Design Compact Size and Fanless Design Wide Operating Temperature Wide-range DC Voltage Excellent Thermal Design Wide Range with Fuse Protection System Temp. Monitor* 6 x DP9 COM connector support EMC protected to 8KV Industrial COM port design Protected against a solid object greater than 1 mm such as a wire. * MIC-7000 series supports sensors to monitor system & i-module temperature.

10 Highly Customizable Standard 20 PCIe Lanes for custom IO and Expansion Fast development cycle and simplify validation process PCI Interface Infinite Possibility Mini-PCIE LAN

Performance Maximized Various processor supports to satisfy your requirements CPU Mark

I7-6820EQ (2.8Ghz, up to 3.5Ghz) I7-6822EQ(2.0Ghz, up to 2.8GHz ) I5-6442EQ(1.

11 Performance Maximized Various processor supports to satisfy your requirements CPU Mark Performance test CPU Z Benchmark test for Core D-1559 (1.5Ghz, up to 2.1Ghz) D-1539(1.6Ghz, up to 2.2Ghx) D-1559 (12 Core 24 Thread) D-1539 (8 Core 16 Thread) I7-6820EQ (2.8Ghz, up to 3.5Ghz) I7-6822EQ(2.0Ghz, up to 2.8GHz ) I5-6442EQ(1.9Ghz, up to 2.7 Ghz) I3-6102E (1.9Ghz) I7-6820EQ (4 Core 8 Thread) I7-6820EQ (4 Core 8 Thread) 4328 I5-6440EQ (4 Core 4 Thread) ATOM 3160 (4C/1.6Ghz)

12 MIC-7000 Series I/O Function Introduction (1/4) Serial Ports MIC-7000 series support 6xCOM ports COM1 & 2 supports TX & RX LED 2x RS-232/422/485 2x RS-232 2x RS-232 Note 1: You can fined COM cable in accessory box. Note 2: MIC-7900 needs to replace 2xLAN module for more COM ports.

13 MIC-7000 Series I/O Function Introduction (2/4) USB 3.0 MIC-7500supports 8x USB3.0 MIC-7900 supports 4xUSB.0 (standby power) MIC xUSB3.0 MIC xUSB3.0

MIC-7000 Series I/O Function Introduction (3/4)

Expansion Module 32bit GPIO RS-422/485 Isolation

AIIS-DIO32-00A1E Order information 98R2C48510E

did not support DVI or HDMI cable Note 2 :

Note 3 : 2xLAN module only supports for MIC-7700Q

14 MIC-7000 Series I/O Function Introduction (3/4) Expansion Window Support 2 nd DVI/HDMI cable or Expansion Module 32bit GPIO RS-422/485 Isolation TPM 2 LAN module 2 nd DVI HDMI Order information AIIS-DIO32-00A1E Order information 98R2C48510E Order information PCA-TPM-00A1E Note 1 : MIC-7900 did not support DVI or HDMI cable Note 2 : MIC-7900 Supports on-board TPM. Note 3 : 2xLAN module only supports for MIC-7700Q sku. Order information TDB Order information 98R E Order information 98R E

15 MIC-7 series i-module add-on card space Add-on card Length size = 170mm (for MIC-75M20/MIC-75M11 with FAN) Add-on card Length size = 176mm (for MIC-75M40/MIC-75M13/MIC-75S20 with FAN) Add-on card Length size = 210mm (i-module without FAN) Note : This Add-on card space size is not including extra power connector size.

Assemble 2 nd HDD bracket for 2xSlot i-module 1910000907 x2

Order information : 98R1752010E Note : 2 nd HDD bracket will

16 Assemble 2 nd HDD bracket for 2xSlot i-module x2 SATA/Power Con. Order information : 98R E Note : 2 nd HDD bracket will occupy one slot space. MIC-7xM11 : To occupy PCI slot MIC-7xM20 : to occupy PCIEx4 slot MIC-7xM11 MIC-7xM20

17 MIC-7000 Series Specification table Product MIC-7300 MIC-7500 MIC-7700 MIC-7900 Availability Q3/2017 Now Now Now CPU Intel Apollo Lake Skylake-H Core I CPU Skylake-S Core I CPU Kabe Lake-S Core I CPU Intel Xeon SoC (8c D- 1539/ 12c D-1559) Chipset X QM170 Q170 H110 X Memory 2xSocket DDR3, up to 8G 2xSocket DDR4, up to 32G 2xSocket DDR4, up to 32G Graphic DVI+VGA DVI+VGA DVI+VGA VGA 2x Socket DDR4, up to 32G (Support ECC) LAN Storage 1xSATA 1xSATA/1xCFast/ 1xM-SATA Total HDD Q ty with i-module I/O USB 3.0x4/USB 2.0x4 COM x4 8bit GPIO Audio Jack Remote power con (MIC-75S20) USB 3.0 x 8 COM x4 Audio Jack Internal I/O 1xMini-PCIE 2xMini-PCIE U-SIM 1 x SATA*/1 x CFast/1 x M-SATA 1 x SATA/1 x CFast 1 x M.2 USB 3.0 x 8 COM x4 Audio Jack 2xMini-PCIE U-SIM USB 3.0 x 4/USB 2.0 x4 COM x4 Audio Jack 1xMini-PCIE U-SIM 2 5 (MIC-75S20) USB 3.0 x 4 COM x2 Audio Jack 1xMini-PCIE U-SIM Expansion MIC-73M13 MIC-73M20 MIC-73M11 MIC-75M40 MIC-75M13 MIC-75M20 75M20-01 MIC-75M11 MIC-75S20 MIC-75M40 MIC-75M13 MIC-75M20 MIC-75M20-01 MIC-75M11 MIC-75S20 MIC-75M13 MIC-75M20MIC- 75M11 MIC-75S20 MIC-75M40 MIC-75M13 MIC-75M20 75M20-01 MIC-75M11 MIC-75S20

Comprehensive i-module Expandability on Demand i-module for MIC-7 Series : Compatible with MIC-7 Series System Fan-Less System MIC-75M13

5 Storage Space Dimension with MIC-7000 Series Feature ƒ1x PCIEx16 ƒ3x PCI Feature ƒ1x PCIEx8 ƒ3x PCIEx4 Featureƒ 1x PCIEx16/1x PCIEx4 ƒ2x

=1+4 2 slot i-module needs to order HDD bracket for 2 nd HDD. MIC-7700Q = 1+2 MIC-7700Q =1+3 One expansion socket space will be occupation.

18 Comprehensive i-module Expandability on Demand i-module for MIC-7 Series : Compatible with MIC-7 Series System Fan-Less System MIC-75M13 MIC-75M40 MIC-75S20 MIC-75M20 MIC-75M20-01 MIC-75M Storage Space Dimension with MIC-7000 Series Feature ƒ1x PCIEx16 ƒ3x PCI Feature ƒ1x PCIEx8 ƒ3x PCIEx4 Featureƒ 1x PCIEx16/1x PCIEx4 ƒ2x Hot Swappable HDD tray Featureƒ 1x PCIEx16 ƒ1x PCIEx4 Featureƒ 2xPCIEx8 (PCIEx16 socket) Featureƒ 1x PCIEx16 ƒ1x PCI MIC-7900 =1+2 MIC-7900 =1+4 2 slot i-module needs to order HDD bracket for 2 nd HDD. MIC-7700Q = 1+2 MIC-7700Q =1+3 One expansion socket space will be occupation. MIC-7xM20 : PCIE space will be occupation. MIC-7700Q/MIC-7500 =1+1 MIC-7xM11 : PCI space will be occupation. 163(W)x192(H)x230(D)mm 123(W)x192(H)x230(D)mm Two 2.5 Storage space for 4 slot i-module Advantech Co., Ltd

19 Application Scenarios

20 3D Robot Vision Solution Configuration MIC-7500 (i7; 4C)/MIC-7900 (Xeon; 8C/12C) Benefit Various processor support to provide different CPU performance level for 3D camera program requirement. Fanless and compact design meet space limited requirement for production line. 3D Camera To capture object image MIC-7500 (i7/i5; 4C) 3D objects Even the object is not the same direction, the robot also can grasp it just like has eyes. MIC-7900 (Xeon; 8C/12C)

21 Configuration Wind Farm SCADA Compact Virtual Server MIC-7900+MIC-75S20 (Support 2x hot swappable tray)+5xssd Benefit Xeon BGA CPU design architecture satisfies the low-power with high-performance demand. FAN-less & compact design satisfies stringent environmental demand. i-module provides 5x 2.5 storage rooms, while meeting easy maintains by 2x How swappable try design. Office Client MIC MIC-75S20 Other equipment Office Client 5x SSD inside (2 for Hot swappable) Ethernet MpdBUS TCP/IP Mater RAID card Graphic card Relay

22 Customer- Equipment Builders Customer Application: IC Test Handler Customer Requirement: Compact-sized IPC with 20x PCI Slots for Motion/IO/Field Bus Card CPU performance at least Core i5/ 4 cores

23 Roadmap

Atom Modularize Fanless System Core i Xeon Available Developing Planning MIC-7000 Series Roadmap IPXX IP Level

slot, up to 32GB Support ECC memory Support i-module, idoor IP40 MP MIC-7500 IP40 Intel Skylake H with QM170

(Desktop CPU) 2x DDR4 DOMM slot, up to 32GB Support i-module, idoor -20~50 C or 60 C (TBD) MP MIC-7300 IP40

24 Atom Modularize Fanless System Core i Xeon Available Developing Planning MIC-7000 Series Roadmap IPXX IP Level Fanless Conceptual MIC-7900 AiMC-55M13 4-slot Module Intel Xeon-D SoC (8c / 12c) Support 4xLAN 2x DDR4 DIMM slot, up to 32GB Support ECC memory Support i-module, idoor IP40 MP MIC-7500 IP40 Intel Skylake H with QM170 chipset 2x DDR4 DIMM slot, up to 32G Support i-module, idoor 2x mini-pcie MP MIC-7700 IP40 Intel Skylake-S (Desktop CPU) 2x DDR4 DOMM slot, up to 32GB Support i-module, idoor -20~50 C or 60 C (TBD) MP MIC-7300 IP40 Intel Apollo Lake On-Board 4Gb, 1x slot upgrade to 8G Support i-module, idoor 1x mini-pcie Q3 17 Advantech Co., Ltd Page 24

MIC-73xx i-module 2-slot 4-slot MIC-75/77/79xx i-module 2-slot 4-slot Featured i-module Roadmap Available Developing Planning Conceptual MIC-75S20 2 Hotswap 2.

25 MIC-73xx i-module 2-slot 4-slot MIC-75/77/79xx i-module 2-slot 4-slot Featured i-module Roadmap Available Developing Planning Conceptual MIC-75S20 2 Hotswap 2.5 HDD 1 PCIEx16/ 1 PCIEx4 MP MIC-75M13 MIC-75M40 1 PCIEx16/ 3 PCI HDD Optional FAN module MP 1 PCIEx8/ 3 PCIEx HDD Optional FAN module MP MIC-75M11 MIC-75M20 MIC-75M PCIEx16/ 1 PCI MP 1 PCIEx16/ 1 PCIEx4 MP 2xPCIEx8 MP MIC-73M13 1 PCIEx1/ 3 PCI HDD Optional FAN module Q MIC-73M11 MIC-73M20 1 PCIEx1/ 1 PCI 2 PCIEx1 Q Q Advantech Co., Ltd Page 25

26 Appendix Advantech Co., Ltd

27 Graphic Card Compatibility List for MIC-Series Card Module GPU Name Card Size (mm) Extra Power cable Power computation System Temp. Spec. /FAN Size i-module SKY-NVS-310-1E SKY-NVS-315E NVS NVS 68.91x144.87mm, Single layer 68.91x144.87mm, Single layer X X 19.5W 19.3W 0~50C 0~50C MIC-75M13 MIC-75M40 MIC-75M20 SKY-NVS-510E NVS 69.34x160.02mm, Single layer X 33.4W 0~50C (with FAN module) MIC-75M20-01 MIC-75M11 MIC-75S20 SKY-QUAD-K1200E SKY-QUAD- K1200LPE Quadro 68.83x169.9mm, Single layer X 46W SKY-QUAD-K420-2E SKY-QUAD-K420E Quadro 68.91x160.02mm, Single layer, X 41W SKY-QUAD-K620E Quadro 68.91x160mm, single layer X 45W SKY-QUAD-M2000E Quadro x167.64mm, single layer SKY-TESL-M4E Tesla 68.58x167.64mm, single layer X 75W** X 75W** 0~50C (with FAN module) GTX750 Ti GTX x144.78mm, dual layer X 65W** 0~50C (with FAN module) GTX1050 Ti GTX x144.78mm, dual layer X 75W** MIC-75M13 MIC-75M40* MIC-75M20 MIC-75M11 MIC-75M20-01 MIC-75M40* Note 1 : if customer wants to use more add-on into MIC-75M40 with 75W Graphic card, please choose i7-6822eq 25W CPU for Power commutation risk. Note 2 : Over 60W graphic card, Please use 220W power adapter. Advantech Co., Ltd

28 Advantech Co., Ltd MIC-7000 Series Option List Table (1/3) Power Adapter & Power cord Part number Description Note 96PSA-A220W24P4-1 ADP A/D V 220W 24V Full add-on card with 4 slot i-module 96PSA-A150W19P4-1 ADP A/D V 150W 19V Full add-on card with 2 slot i-module 96PSA-A120W24T2 ADP A/D V 120W 24V System only Note : did not support for MIC Power Cord 3P UL/CSA(USA) 125V 10A 1.83M 180D For USA Power cord PSE 7A 125V 3P 3m DAC-ST01 For Japan Power cord 2P FRANCE 10A/16A 220V 1.83M 90D For Europe Power Cord UK BSI 2P 10A 250V 180cm 18AWG For UK DDR4 Memory Part number Description Note AQD-SD4U4GN21-SG 4G SO-DDR X8 1.2V SAM Transcend AQD-SD4U8GN21-SG 8G SO-DDR X8 1.2V SAM Transcend AQD-SD4U16N21-SE 16GB DDR V SO-DIMM 1GbX8 SAM Transcend AQD-SD4U4GN21-HG 4G SO-DDR X8 1.2V HYX Adata AQD-SD4U8GN21-HG 8G SO-DDR X8 1.2V HYX Adata AQD-SD4U4GE21-SG 4G ECC SO-DDR X8 1.2V SAM ECC AQD-SD4U8GE21-SG 8G ECC SO-DDR X8 1.2V SAM ECC AQD-SD4U16E21-SE 16GB DDR V ECC-SO-DIMM 1GbX8 S ECC

29 MIC-7000 Series Option List Table (2/3) Fan Module for i-module Part number Description Note 98R E 1x8cm FAN module For MIC-75M13/75M40/75S20 Packing List : 1x8cm FAN/1x Filter/Screws 98R E 2x4cm FAN module For MIC-75M20/MIC-75M11 Packing List : 2x4cm FAN/1xFilter/Screws Expansion Function Module Note: It need to replace COM 3 & 4 cable to assemble module. Part number Description Note AIIS-DIO32-00A1E AIIS-32bit GPIO module USB2.0 interface 98R2C48510E Isolation COM module Support 4x RS-422/485 Isolation COM PCA-TPM-00A1E TPM module Other Part number Description Note 98R E 2 nd DVI cable Assemble at MIC-7500 system 98R E 2 nd HDD bracket Only for MIC-75M20/MIC-75m11 Note : These 2 cables did not support MIC-7900 & MIC-7300 Advantech Co., Ltd

MIC-7000 Series Option List Table (3/3) I-Door module Module Type Detail Information Note i-door Module (MOS series module) Please refer Advantech Website below or search "idoor Module Mini PCIe

30 MIC-7000 Series Option List Table (3/3) I-Door module Module Type Detail Information Note i-door Module (MOS series module) Please refer Advantech Website below or search "idoor Module Mini PCIe Expansion Kit". Support i-door module(mos series) except PoE i-door Module (PCM series module) Support i-door module (PCM series) except PoE Please refer Advantech Website below: There need to order a bracket to fix PCM series i-door module. Pleaser refer P/N : N001 i Door_bracket Support i-door module(mos series) except PoE Advantech Co., Ltd

31 Add-on Card List PCI-1750-AEroduct Name Function PM PCI-1761-BE 8-ch Relay and 8-ch Isolated Digital Input PCI Card Sen.Wu PCI-1730U-BE 32-ch Isolated Digital I/O Universal PCI Card Ext PCI-1756-BE PCI-1620A-DE PCI-1612B-DE PCI-1750-AE Product Name Function PM PCIE port PCI Express Intelligent GigE Vision Frame Grabber Neil.Chen PCIE-1674E 4-port 10/100/1000 BaseT(X) 802.3af (PoE) Compliant, Ethernet Ext ports, PCI Express Communication Card Product Name Function PM PCI-1245/1245E/1245L PCI-1285/1285E PCI ch Isolated Digital I/O PCI Card 8-port RS-232 PCI Communication Card 4-port RS-232/422/485 PCI Communication Card 32-ch Isolated Digital I/O and 1-ch Counter PCI Card Vincent Ting Ext Advantech Co., Ltd

32 Marketing Materials Available Now

33 Q & A Thank you!

Features. With SSD: 3 5 ~ 500 Hz, random, 1 hr/axis With 2.5" HDD: 1 5 ~ 500 Hz, random, 1 hr/axis

Features. With SSD: 3 5 ~ 500 Hz, random, 1 hr/axis With 2.5 HDD: 1 5 ~ 500 Hz, random, 1 hr/axis MIC-7500 Compact Fanless System with 6 th Gen Intel Core i Processor Features Intel 6 th Gen Core i7/i5/i3/celeron (BGA-type) processor with Intel QM170 chipset Wide operating temperature (-20 ~ 60 C)