Sunridge FPD Series Interconnect & Cabling System for Notebook LCD Panel Display
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1 Sunridge FPD Series Interconnect & Cabling System for Notebook LCD Panel Display Sunridge Corporation U.S.A. Headquarters: 2500 E. Foothill Blvd. #107, Pasadena, CA Tel: (626) Fax: (626) Taiwan Operation: Ridge Technology Corporation 2 Fl., No. 1, Lane 54, Sec 1, Kuang Fu Road. Sanchung City Taipei Hsien, Taiwan Tel: Fax: China Operation: Sudacom (DG), Inc. Shu Xin District, Chang Ping Town, Dong Guan City, Guang Dong Province, China Tel: Fax:
2 Layout Reference: (5.4 ref) (12.8 ref) INTERFACE CONNECTOR Style A: 47.2 Style B: Component Keep-out Zone Interface Connector: Style A: XGA and below: SUNRIDGE FPD-PI-20F-01 or SUNRIDGE FPD-PI-20I-01 Style B: XGA, SXGA+,& UXGA: SUNRIDGE FPD-PIX or SUNRIDGE FPD-PIX or SUNRIDGE FPD-PIX " Industry Std Panel* Version 2 * Ref to SPWG for detailed dimension for 13.3", 14.0" and 15.0" panels, which use the same interface and backlight connectors refered herein. SUNRIDGE FPD-PB-35-2P & SUNRIDGE FPD-PB-35-T 60 SUNRIDGE FPD-PB-40- P SUNRIDGE FPD-PB-40-T BACKLIGHT CONNECTOR 11 SPWG was formed in May/99 by leading notebook OEM s and panel suppliers in effort to establish mechanical and electrical standard of TFT LCD panel. See page 14 of this catalog for further information. Product Highlights: - Conforming to SPWG connector form factor. - Full line coverage: Interface and Backlight connectors for panel side, as well as all components (for both discrete wire and FPC connections) needed for mating cable assembly to notebook side. - Panel interface connector available in wide variety of mounting options. - Panel backlight connectors in two styles: both in 3.50mm pitch as per SPWG recommendation, and in 4.00mm pitch to support legacy system. Complete Cable Assembly Offering: Sunridge Corporation supports complete cable assembly for panel -tonotebook interface application sustained by core competence in captive component supply, in-house volume production capacity and solid engineering competence in EMI signal transmission. 1
3 Signal Interface Connector SPWG Selection guideline: XGA/standard thickness (style A): FPD-PI-20F-01 (flush mounting) or FPD-PI-20I-01 (inset mounting) XGA/ultra thin (style B) or SXGA+, UXGA: FPD-PIX (Standard inset) or FPD-PIX (Standard flush) or FPD-PIX (Reverse inset) LCD Panel Connector: FPD-PI-20 - : 1.25mm, 1 x 20 SMT Pin-Header Features: Metal Shielding to improve signal data integrity High temp housing material and tape & reel package to facilitate robotic SMT process Options in mounting tab dimension to accommodate PCB layout design. Mate with cable connector Sunridge FPD-CWPI-20H or FPD-FCPI-20 Electrical Characteristics: Current Rating: 1 Amp Dielectric Withstanding Voltage: 500 VAC r.m.s. (for one minute) Contact Resistance: 40 milliohms max Insulation Resistance: 100 megohms min Operating Temperature: -40 C to +80 C Material & Plating: Insulator: LCP (UL 94V-0 rated) Shield: Copper Alloy, Tin Plated over Nickel underplate Contact: Copper Alloy Signal Contact: Gold plating over Nickel underplate Solder lead: Tin plating over Nickel underplate 2
4 FPD-PI-20F-01 (Flush Mounting) * PIN # PCB LAYOUT RECOMMENDATION FPD-PI-20I-01 (Inset Mounting) * PIN # PCB LAYOUT RECOMMENDATION * Mounting tab dimension can be modified per customer s design. * Consult with Sunridge Corp for options. 3
5 Cable Connector, 1.25mm 1 x 20 for Discrete Wire Feature: Easy insertion and sturdy mating with FPD-PI series pin-header Applicable for Awg #28 to Awg #32 wire Material & Plating: Housing: Nylon 66 (UL 94V-0 rated) Crimp Contact: Copper Alloy, Gold Plating over Nickel underplate FPD-CWPI-20H (1 x 20 Housing) FPD-CWPI-T (Crimp Contact)
6 Cable Connector, 1.25mm 1 x 20 for FPC Application Feature: Slider wedge to ensure adequate compression preload with FPC Metal shield to improve EMI characteristics for mating with FPD-PI series pin-header Applicable for 1.25mm spacing x 0.14mm thick FPC Mate with FPD-PI-20 - series pin headers Material & Plating Insulator: PPS (UL 94V-0 rated) Wedge Slider: PPS (UL 94V-0 rated) Shield: Copper Alloy, Tin Plating over Nickel underplate Contact: Copper Alloy Pin Header Side: Gold Plating over Nickel underplate FPC Side: Tin Plating over Nickel underplate FPD-FCPI-20 (Standard Mounting) No FPC (COND. AREA) 1.25 R t (COND. AREA) FPC LAYOUT RECOMMENDATION 5
7 LCD Panel Connector FPD-PIX-30- : 0mm, 1 x 30 SMT Connector Features: Grounding tab design & metal shield for EMI characteristics. Above board height of 5mm (flash mount), and of 0mm (inset mount). Options available in standard inset mounting, standard flash mounting, and reverse inset mounting. High temp housing and tape & reel package to facilitate automatic SMT process. Mate with Sunridge FPD-FCPIX-30 series. Electrical Characteristics: Current Rating: 1 Amp Dielectric Withstanding Voltage: 500 VAC r.m.s. (for one minute) Contact Resistance: 40 milliohms max Insulation Resistance: 100 megohms min Operating Temperature: -40 C to +80 C Material & Plating: Insulator: LCP (UL 94V-0 rated) Shield: Copper Alloy, Tin Plated over Nickel underplate Contact: Copper Alloy Signal Contact: Gold plating over Nickel underplate Solder lead: Tin plating over Nickel underplate Grounding Terminal: Tin Plating over Nickel underplate FPD-PIX (Standard Inset) 3 NO NO R PCB LAYOUT RECOMMENDATION 6
8 FPD-PIX (Standard Flush) NO NO PCB LAYOUT RECOMMENDATION FPD-PIX (Reverse Inset) NO NO R PCB LAYOUT RECOMMENDATION 7
9 Cable Connector, 0mm 1 x 30 for FPC Application Feature: Mate with FPD-PIX-30 series panel side SMT connector Options in standard and reverse mating style Metal shield for EMI characteristics Molded tab for sturdy grounding Designed for application with ultra thin coaxial cable or flex circuit Material & Plating Insulator: LCP (UL 94V-0 rated) Grounding Plate: Copper Alloy, Tin Plated over Nickel underplate Contact: Panel Side: Gold Plated over Nickel underplate PFC Side: Tin Plated over Nickel underplate FPD-FCPIX (Standard Mounting) No No FPC R (COND. AREA) t (COND. AREA) FPC LAYOUT RECOMMENDATION FPD-FCPIX (Reverse Mounting) No No (COND. AREA) R t (COND. AREA) FPC LAYOUT RECOMMENDATION 8
10 SPWG 2 - Connector Layout Reference (PCB Side) 1 32 A 2 31 (Cable Side) A Caution No. 1, 32 pins are PCB side only. (For Ground) Industry Std Panel D SECT A-A DETAIL D : FPD-PIX S:Signal Side G:Ground Side S G (LCD) 2 Parts Mounting Side 31 REVERSED (PCB) Parts Mounting Side FPD-PIX S:Signal Side G:Ground Side S G 2 (LCD) 31 STANDARD (PCB) 9
11 Backlight Connector (for SPWG panel) FPD-PB-35 series Features: Housing: Slim profile for 3.2 mm to fit into tight form factor. Smt pin header: Hold-down tabs to sustain strain induced by mating and/or unmating. Interlock provision for polarized insertion and sturdy mating. Crimp contact: Applicable for Awg #28 to Awg #24 wire. Designed for easy housing insertion. Electrical Characteristics: Current Rating: Amp AC, DC when used with Awg #25 wire Voltage Rating: 1,400 V AC, DC Dielectric Withstanding Voltage: 3800 VAC r.m.s. (for one minute) Contact Resistance: 20 milliohms max Insulation Resistance: 1000 megohms min Operating Temperature: -25 C to +85 C Material & Plating: Housing: Nylon 66 (UL 94V-0 rated) Crimp Contact: Copper Alloy, Tin Plating over Nickel underplate Pin Header: Housing: High Temp Plastic (UL94V-0 rated) Pin Contact: Copper Alloy, Tin Plating over Nickel underplate Hold-Down Tab: Copper Alloy, Tin Plating over Nickel underplate FPD-PB-35-2P (1 x 2 Backlight Housing)
12 FPD-PB-35-T (Crimp Contact) Y X Y X Y-Y section X-X section FPD-PB-35-2SMT (1 x 2 SMT Pin Header) PCB LAYOUT RECOMMENDATION /
13 FPD-PB-40 series Features: Housing: Slim profile for 3.2 mm to fit into tight form factor. Smt pin header: Hold-down tabs to sustain strain induced by mating and/or unmating. Options with leaded positions at 4.00mm-multiplier spacing. Interlock provision for polarized insertion and sturdy mating. Crimp contact: Applicable for Awg #28 to Awg #24 wire. Designed for easy housing insertion. Electrical Characteristics: Current Rating: Amp AC, DC when used with Awg #25 wire Voltage Rating: 1,400 V AC, DC Dielectric Withstanding Voltage: 3800 VAC r.m.s. (for one minute) Contact Resistance: 20 milliohms max Insulation Resistance: 1000 megohms min Operating Temperature: -25 C to +85 C Material & Plating: Housing: Nylon 66 (UL 94V-0 rated) Crimp Contact: Copper Alloy, Tin Plating over Nickel underplate Pin Header: Housing: High Temp Plastic (UL94V-0 rated) Pin Contact: Copper Alloy, Tin Plating over Nickel underplate Hold-Down Tab: Copper Alloy, Tin Plating over Nickel underplate FPD-PB-40- P (1 x 2 Backlight Housing) B A Circuits Sunridge P/N A B 2 FPD-PB-40-2P 4.0 mm 9.8 mm 3 FPD-PB-40-3P 8.0 mm 13.8 mm 4 FPD-PB-40-4P 12.0 mm 17.8 mm 12
14 FPD-PB-40-T (Crimp Contact) FPD-PB-40- SMT (Pin Header) CIRCUIT PIN-HEADER CIRCUIT PIN-HEADER P/N: FPD-PB-40-2SMT1 3.2 P/N: FPD-PB-40-3SMT CIRCUIT PIN-HEADER P/N: FPD-PB-40-2SMT P/N: FPD-PB-40-4SMT1 P/N: FPD-PB-40-2SMT3 13
15 About the Standard Panels Working Group The SPWG was formed in May of 1999 by procurement and engineering executives at Compaq Computer Corp., Dell Computer Corp., Hewlett-Packard Company, IBM Corp. and Toshiba Corp. These companies combine to account for more than 50% notebook PC market share. DisplaySearch was asked to coordinate and facilitate the meetings. With today's notebook PC displays suffering from a lack of mechanical compatability, today's notebook PC producers are often forced to use different interface cables, plastic or magnesium enclosures, bezels, bracket assemblies and EMI shields for each panel adopted. As a result, notebook PC producers must undergo significant tooling costs when adopting different panels. In addition, the associated documentation and logistical issues resulting from these different configurations are staggering. As a result, the significant tooling costs and the associated impact on delivery schedules eliminates many panel suppliers from being considered as potential second sources. The purpose of the SPWG is to establish TFT LCD mechanical and electrical standards in order to: Improve display availability so that TFT LCD designs from multiple suppliers can be quickly implemented without significant modification to packaging, interface design and tooling; Reduce development cycles and inventory costs; Reduce quantity of TFT LCD part numbers; Improve utilization of engineering resources at TFT LCD producers; Reduce obstacles to design wins for TFT LCD producers. Through SPWG Standard, electrical and mechanical standards have been set for 13.3" - 15" TFT LCDs which have been agreed to by all major TFT LCD producers. To see the endorsing companies and quotes from executives at endorsing companies, click the Quotes and Endorsements links below. 14
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