Massively Parallel Processor Breadboarding (MPPB)
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1 Massively Parallel Processor Breadboarding (MPPB) 28 August 2012 Final Presentation TRP study Gerard Rauwerda CTO, Recore Systems Recore Systems BV P.O. Box 77, 7500 AB, Enschede, The Netherlands
2 Massively Parallel Processor Breadboarding ESA contract: Technical Officer: Dr. Roland Trautner (TEC-EDP, ESA-ESTEC) Objectives 2 Develop and demonstrate reconfigurable multi-core DSP Benchmarking of next-generation space DSP applications Identify reconfiguration mechanisms for reliable and dependable SoCs Project execution Original contract: CCN extension: Contractors: Recore Systems BV, Enschede, The Netherlands University of Twente, Enschede, The Netherlands
3 Massively Parallel Processor Breadboarding Multi-core SoC benchmarking of Recore s reconfigurable DSP technology in FPGA prototype for space applications Activities in original contract ( ): Define MPPB architecture NoC / SoC design and implementation Verification & Validation of MPPB Benchmark application implementation 3
4 Massively Parallel Processor Breadboarding Multi-core SoC benchmarking of Recore s reconfigurable DSP technology in FPGA prototype for space applications Activities in CCN ( ): Extend software with floating-point support Emulation of floating-point in software Analysis of ASIC migration and rad.-hardening effects Feasibility of FDIR (Fault Detection, Isolation & Recovery) 4
5 Recore Systems Fabless semiconductor company Based in The Netherlands Established in September 2005 Business model Semiconductor devices business Intellectual Property (IP) licensing Technology keywords Reconfigurable multi-core Systems-on-Chip Digital Signal Processing Focus markets Digital radio/tv broadcasting (e.g. media players) Wireless communication (e.g. cell phones) Beamforming (e.g. advanced radar systems) 5
6 Products and services providing complete solutions Intellectual Property Hardware Reconfigurable multi-core processors Montium, Xentium and Memtium Manycore IP for stream processing GPP 1 GPP 2 SRAM SRAM I/O I/O I/O I/O bridge bridge bri dge bridge bri dge br idge bridge bridge GPI/O GPI/O GPI/O GPI/O GPI/O GPI/O GPI/O GPI/O T ile Tile Tile Tile T ile T ile Tile Tile T ile Tile Tile Tile T ile T ile Tile Tile T ile Tile Tile Tile T ile T ile Tile Tile T ile Tile Tile Tile T ile T ile Tile Tile T ile Tile Tile Tile T ile T ile Tile Tile T ile Tile Tile Tile T ile T ile Tile Tile T ile Tile Tile Tile T ile T ile Tile Tile T ile Tile Tile Tile T ile T ile Tile Tile bridge bridge bridge bridge bridge bridge bridge bridge bri dge GPI/O GPI/O GPI/O GPI/O GPI/O GPI/O GPI/O GPI/O Software development tools DAC ADC Bridge to analogue front-end 1 Bridge to analogue front-end 2 Industry standard development tools for programming our processors Configware Digital Signal Processing application software for our processors Design tools Eclipse based IDE Semiconductor devices 6 Moon digital radio/tv Reflex embedded DSP Silicon Proven Montium 4-core
7 University of Twente (UT) University from Enschede, The Netherlands Degree programmes range from business administration, psychology to applied physics, engineering and biomedical technology Applied sciences research: nanotechnology, process technology, engineering, information & communication technology and biomedical sciences Computer Architecture for Embedded Systems: 7 Karel Walters Gerard Smit Sabih Gerez PhD-student full professor Computer Architectures for Embedded Systems assistant professor CAD systems
8 CAES group Research focus Energy-efficient Embedded Systems Research themes Efficiency in ICT systems Energy efficient Streaming Architectures (Smit, Kokkeler, Kuper, Bekooij) +/- 15 PhD students Efficient and dependable mixed signal ICs (Kerkhoff) 6 PhD students Using ICT for efficiency Energy management in Smart Grids (Smit) 5 PhD students + 1 PD 8
9 Highlights of CAES Start-up companies Recore Systems Bibix systems Smart Signs solutions HOMA software Strong cooperation with industry Mix of fundamental (NWO) and applied research (STW/EU FP7/BSIK/ direct funded) Research eco system in the group Focus on energy resulted in many funded projects Excellent cooperation with other EWI chairs (EE + CS + MATH) 9
10 Outline MPPB platform hardware MPPB / Xentium software development MPPB validation & benchmarking MPPB FDIR ASIC migration & radiation hardening MPPB lessons learned / future directions MPPB demonstration Q&A 10
11 MPPB features on a Xilinx Virtex-5 FPGA 50 MHz system clock 2 Xentium DSP tiles 1 Leon2 processor Network-on-Chip Heterogeneous memories High speed interfaces 11
12 MPPB architecture 12
13 MPPB architecture On-chip interconnect 13
14 NoC subsystem 14
15 Interconnect NoC Purpose Interconnects NoC components Scalable (#cores, #interfaces, #memories) Features Packet-switched routing 5 port routers 4 services, priority based for throughput and latency guarantees Memory mapped communication protocol layer X-Y routing Deadlock free Design-time layout of tiles based on estimated traffic load 15
16 MPPB architecture High-speed interfaces 16
17 MPPB interfaces Bridges NoC interface bridges to connect external peripherals Memory-mapped network interface Packing/unpacking of data Configuration of external peripherals SpaceWire link NoC bridge Gigabit link NoC bridge ADC & DAC NoC bridge 17
18 MPPB interfaces SpW-NoC Purpose Provides standard interface for space systems Without RMAP support Features Network interface with DMA Using ESA SpW-b IP as back-end Memory mapped transmit and receive buffers Memory mapped status and configuration registers Link speed: 100 Mbps 18
19 MPPB interfaces SpW-AHB Purpose Provides standard interface for space systems RMAP target Useful for debug purposes Data transfer initiated by host Features AHB master/slave Using ESA SpW-RMAP IP as back-end Memory mapped transmit and receive buffers Memory mapped status and configuration registers Link speed: 100 Mbps 19
20 MPPB Interfaces ADC/DAC-NoC bridge Purpose Provides parallel input interface for ADC board Provides parallel output interface for DAC board Features Memory-mapped network interface with DMA Packing/unpacking of samples in/from 32-bit NoC words Configurable sampling rate of ADC Configurable sampling rate of DAC 20 Physical interfaces for ADC and DAC are dedicated for AD6644 Analog Devices, ADC, DAC5662 Texas Instruments, DAC,
21 MPPB Interfaces GigaBit link Purpose Connecting two chips via the NoC Increase resources (interfaces, processors and memory) Features Memory-mapped network interface with DMA Aurora link layer protocol Net throughput measured 1.1 Gbps (board-to-board) 21
22 MPPB architecture Memories 22
23 MPPB architecture Processing cores 23
24 Leon2 processor Purpose Perform control-related tasks Boot system Configure DMA transactions in NoC Control Xentium processors Setup MPPB system (peripherals, interfaces, etc.) Monitor and output status of applications Features Sparc V8 architecture Hardware debug support 24
25 Xentium processing tile Programmable high-performance fixed-point DSP core VLIW architecture with 10 parallel execution units 4 16-bit MACs per cycle 2 32-bit MACs per cycle 2 16-bit complex MACs per cycle 25 Data precision 32/40-bit datapath Block floating-point support
26 MPPB features on a Xilinx Virtex-5 FPGA MHz system clock 2 Xentium tiles (@ 50MHz) bit MMAC/s bit MMAC/s bit complex MMAC/s 2 32 KB data memory 2 8 KB instruction cache 1M FLOPS SP (emulated) 1 Leon2 processor (@ 50MHz) 32-bit SPARC V8 Debug Support Unit / UART Network-on-Chip (@ 50MHz) 32-bit packet-switched 1.6 Gbps per link In each direction Memories 256 KB memory tile on NoC 256 MB SDRAM on NoC 256 MB SDRAM on AHB 128 MB Flash on AHB SpaceWire (100 Mbps link) 3 SpW-NoC interfaces 1 including RMAP-target Gigabit interface 1.1 Gbps full-duplex Aurora link layer protocol ADC/DAC-NoC interface Configurable sampling rate 14-bit, 40 MS/s, ADC 12-bit, 40 MS/s, DAC
27 MPPB box assembly MPPB unit contains: FPGA development board 2 interface extension boards for ADC, DAC, SpW 0 / 1 / 2, GPIO 1 Gigabit interface board ADC evaluation board DAC evaluation board LCD Power supply Internal: 12V, 5V External: 230V 27
28 MPPB Box 3 MPPB boxes delivered to ESA/ESTEC Evaluation by EADS/Astrium Networking/Partnering Initiative (NPI) with Polimi 28
29 Outline MPPB platform hardware MPPB / Xentium software development MPPB validation & benchmarking MPPB FDIR ASIC migration & radiation hardening MPPB lessons learned / future directions MPPB demonstration Q&A 29
30 Xentium software development flow 30 Xentium C compiler ANSI/ISO-standard C Built-in functions for Xentium specific operations Mix C and assembly functions calls Xentium assembler Clean and readable Extensive built-in preprocessor Standard assembler directives Compile, assemble & link a program in a single step Xentium instruction set simulator Trace program execution Program execution cycle count Xentium Eclipse Plug-in Integrates command line Xentium tools into the Eclipse C/C++ IDE
31 Overview Xentium Eclipse Plug-in (1/4) 31
32 Xentium Eclipse Plug-in (2/4) Integrates the command line Xentium tools 32
33 Xentium Eclipse Plug-in (3/4) Use features provided by the Eclipse IDE for C/C++ 33
34 Xentium Eclipse Plug-in (4/4) Diagnostics support for Xentium compiler 34
35 MPPB software development Writing code Leon 35 C or SPARC assembly Xentium C or Xentium assembly Compiling code Leon sparc-elf-gcc Xentium Xentium C-Compiler or Xentium assembler Linking code Xentium binaries are linked in the Leon binary
36 MPPB Programming Scheme Xentium applications DSP Kernel accelerators Seen as tasks, started from the LEON host processor Xentium API Implements synchronization with Xentiums Communication (interrupts/mailboxes) Task queuing Uses DMA to copy data to/from the Xentiums 36
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