Multi-layer Architecture Synergy-Cooling Masterpiece

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1 AVC NAPOLEON (PLUS)"Crossover Integrated Product Multi-layer Architecture Synergy-Cooling Masterpiece Relying on its good knowledge of cooling technology and consumer demand, AVC worked out systematic planning and developed a variety of coolers with different market positioning. Survived from the survival of the fittest in the market, the NAPOLEON has been the best seller for quite a few years and features excellent cost-effective performance which has made it a representative masterpiece. Now in the generational changing period of processor, AVC endows NAPOLEON even broader application value, enabling consumer to make much better preparation for later computer upgrading. Intel developed an innovative microarchitecture-based new generation processor of Core i7. Socket 1366 aims mainly at high-end market, while Socket 1156 is designed for mainstream grade DT processor, both will provide excellent performance and power energy efficiency and are estimated to achieve the leadership position in future processor market. Meanwhile, the existing Intel Socket 775 and Sockets AMD AM2 & K8 are estimated to fade out. At the time that generation changing of processors is approaching, AVC, by cooperation with leading CPU manufacturers in developing cooling technologies, developed NAPOLEON (PLUS) which can support all types of processor sockets mentioned above, no matter you are a consumer of any brand or a supporter of later upgrade, you should be able to understand the motive of AVC in product planning.

2 NAPOLEON (PLUS) revolutionary cost-effective performance is brought about by its uniqueness in tower type structural design. Some years ago, AVC developed this product from vertical and horizontal perspectives and used three U-shaped high-performance heat tubes combining with total 84 pieces of cooling fins arranged at two sides, forming a complex network of cooling channels spreading all over the cases by the air chutes a 9cm built-in side-blowing smart fan brings about. In this way the cooler does not only carry away quickly waste heat from fins without dead space of cooling, but also blow temperature-rising airflows out of the case, enhancing greatly the cooling effect within the case. [Vertical plane: high-performance heat pipe] NAPOLEON (PLUS) uses three U-shaped (diameter of 6mm) pure copper-sintered heat tubes closely connected with copper base which feature outstanding heat conducting efficacy and long service life and remove waste heat from the copper base promptly and transfer upward uniformly to the multi-layer cooling fins. AVC uses its excellent Fin-punching process technology to eliminate infinitely heat resistance between heat tube and cooling fins, improving the cooling capability.

3 [Horizontal plane: cooling fins arranged separately at two sides] NAPOLEON (PLUS), the layer of fins are separately arranged at two sides of the fan, such design may increase the contact surface of the fins with the air; at the same time, three U-shaped heat tubes uniformly distributed in parallel to fins at the front or behind, may be taken as 6 point heat sources that the waste heat, at the instant of its rising in the tower heat tubes, can be uniformly and effectively transferred from the centers of heat tubes to the rest area of the fins, and the front and back point heat sources may be linked into straight lines just parallel to the cold airflow the side-blowing fan draws, makes the most of air chutes in the case to carry out dense high-efficiency cooling. The side-blowing fan draws cold air to carry directly away waste heat from fins at the right and blows forcefully away waste heat from fins at the left, enhancing the cooling effectiveness of the product and achieving effectively cooling target of air-chute design. Besides the cooling efficacy of the fins and heat tubes enabled by their material features, the NAPOLEON (PLUS) also takes use of the systematic air chutes in the case, together with a temperature-control intelligent fan to provide the cooler triple balance among high cooling performance, energy efficiency and low noise.

4 [Multiple cooling: Intelligent temperature control combining with air chutes in case] <Designed with PWM controlling-temperature intelligent fan> Fan s revolution speed can be adjusted intelligently according to the temperature of ambience and CPU so as to achieve tri-balance of high-efficiency, energy-saving and low noise. <Circulate cool wind expedite to form the optimal wind channel> PWM fan can inhale cool wind all around and blow to heat pipes and fins, bring away extra heat, simultaneously circulate cool wind expedite to form the optimal wind channel and dispersing heat flow speedily and equably by making use of the open space between fins and base, and to cool CPU and the peripheral electric components, by which, the entire system coolness is improved. <Replaceable: Spring turnbuckle or Push-Pin> Equably adjusting the pressure imposed to CPU by cooler achieves the complete integration; special structure makes your installation more simple and easy. For INTEL LGA755/ 1156/ 1366 & AMD AM2/K8) No matter cooling through heat conduction of tower heat tubes in vertical plane, heat radiation of fins in horizontal plane or the side-blowing intelligent temperature-control fan, NAPOLEON (PLUS) pursues high efficient cooling performance through high-density and multiple-perspective integration, and the scientific tower shape can effectively reduce the massive volume and weight of a high-performance cooler, achieve even more outstanding security. In this generation-changing period of coolers, NAPOLEON (PLUS) as the representative masterpiece will be the optimum choice for shrewd consumers who want cost-effective cooler and consider the availability of later upgrade so to make best preparation for future.

5 Product Specification Intel LGA 775/1156/1366 Intel Core i7 processor series Intel Core 2 Extreme processor series Intel Core 2 Duo processor series Intel Core 2 Quad processor series Intel Pentium Extreme edition processor series Support CPU Intel Pentium D processor series Intel Pentium 4 H T/ Celeron D processor series AMD AM2/K8 AMD Athlon FX series AMD Athlon 64x2 series AMD Athlon 64 series AMD Sempron series Heat Sink Dimension Alu Fin. 95x96.5x0.3 mm x48 pcs Heat Sink Material 3U Heat Pipe+ Cu Base+ Alu. Fin Fan Dimension (LxWxH) 92x92x25 mm Fan Speed (RPM) 2800 Fan Airflow (CFM) Bearing Type Hydraulic Fan Controller PWM Fan Speed Adjustment 900~2800 Fan Noise Level (dba) 12~22 Fan Life Expectancy (H) 50,000 Dimension (LxWxH) 115.5x96.5x95 mm Weight (G) 550 For more information, please contact: Alex Cheng Asia Vital Components (AVC) Co., Ltd.

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