The TechNexion Difference

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2 The TechNexion Difference Faster time-to-market through Open Design System on Modules are designed to speed up and reduce the cost of development for embedded devices. But these benefits are only possible, if you have easy access to the source code, design guides and development start kits essential for building your device. Open Source Software All TechNexion s SoMs come with open source code and binary images that are easily accessible, not hidden behind sign up pages or passwords Open Hardware If you decide to create your own carrier board, it is crucial to be able to learn about your SoM board s layout as soon as possible. TechNexion makes that possible with frictionless access to our carrier boards specifications, design guides, and schematics Plug and Play Development Kits Finding the right tools and software to develop and test your solution can take time, or sometimes not even be available. TechNexion SoMs come pre-loaded with plug and play working software including all the necessary tools to validate and develop your application s features and functions.

3 PICO Series The PICO System on Module series is an ultra-compact SoM optimized for mobile devices and IoT. It is based on NXP s i.mx6 and i.mx7 application processors with options for single, dual and quad-core versions; making it ideal for everything from multimedia to low-cost IoT devices. Product Longevity through Support and Scalability Embedded devices are often part of large scale industrial and commercial systems meaning they need to be able to operate reliably for many years. TechNexion makes that possible in many ways: Scalability For every product in a product series, we use the same number of pins enabling you to upgrade to a more powerful CPU easy. Longevity All our products have a guaranteed 12-year lifetime. 12 Component strategy All our components are sourced only from strategic partners who support our product roadmap guarantees and quality standards. YEARS Custom Carrier Board Design Customers can leverage TechNexion s exceptional hardware and software open resources to quickly design their own carrier boards or take advantage of our in-house design and customization services. We have successfully delivered thousands of projects for our customers, ranging from small modifications to one of our standard products to projects that needed carrier boards and single board computers completely designed from the ground up with extremely complex requirements. For example, a drone project needing 9-axis sensors with CAN. Our experience and expertise mean we can add value to all the stages of the development process including hardware design, software, mechanical, manufacturing, and project design and management. Production TechNexion has its own manufacturing facilities with factory and design teams working together, communicating and sharing expertise in a way not possible when they were in separate businesses with separate priorities. It means that each stage of the transition to manufacturing can go smoother and faster, the unique aspects of your design can be realized more cost-effectively, and production line capacity planned for with better timing. It also means you will not fall victim to the production scheduling priorities of contract manufacturers and the larger orders that might push you down the queue. Complete IoT solution Designed to support as wide a range of signals as possible, it combines ARM Cortex architecture with the Intel Edison connector standard. It has a range of evaluation boards with ready-to-use sensors and I/Os allowing the development of applications that take advantage of the full range of opportunities in today s connected world. That IoT focus extends to software with several editions certified by Google for its IoT operating system, Android Things.

4 OVERVIEW Model Name PICO-IMX6 PICO-IMX6POP PICO-IMX6UL-NOR Core System Architecture ARM Cortex-A7 NXP i.mx6 Solo 1GHz NXP i.mx6 DualLite 1GHz NXP i.mx6 Quad 1GHz NXP i.mx6 Dual (PoP) 1GHz NXP imx6 Quad (PoP) 1GHz NXP i.mx6 UltraLite 528MHz NXP PF3000 up to 1GB DDR3L emmc/microsd (optional) emmc/microsd (optional) QSPI (NOR) Connectivity Network LAN RMII WiFi Signaling a/b/g/n/ac (optional) a/b/g/n/ac (optional) BT 4.1 (optional) BT 4.1 (optional) a/b/g/n/ac (optional) BT 4.1 (optional) RGB TTL MIPI CSI MIPI DSI (Quad only) Mechanical All specifications are subject to change without notice.

5 Model Name Core System Architecture PICO-IMX6UL-NAND PICO-IMX6UL-EMMC PICO-IMX7 ARM Cortex-A7 NXP i.mx6 UltraLite 528MHz ARM Cortex-A7 NXP i.mx6 UltraLite 528MHz ARM Cortex-A7 + M4 NXP i.mx7 Solo 800MHz NXP i.mx7 Dual 1GHz Connectivity Network LAN NXP PF3000 up to 1GB DDR3L NAND Flash RMII NXP PF3000 up to 1GB DDR3L emmc RMII NXP PF3000 up to 2GB DDR3L emmc/microsd (optional) WiFi Signaling a/b/g/n/ac (optional) a/b/g/n/ac (optional) BT 4.1 (optional) BT 4.1 (optional) a/b/g/n/ac (optional) BT 4.1 (optional) RGB TTL MIPI CSI MIPI DSI Mechanical

6 Model Name Core System Compatible SoM Connectivity Network LAN Internal Headers PICO PICO RGB TTL M.2 MIPI CSI MIPI DSI GPIO I²C SPI UART CAN External Connectors HDMI Audio USB USB OTG MicroSD Others Audio Codec Sensors RTC Power Input Power Connector 5V DC +/-5% 5.5/2.1mm barrel jack 5V DC +/-5% 5.5/2.1mm barrel jack Battery Charging Circuit Mechanical Dimensions 95 x 95 mm 100 x 45 mm

7 Model Name Core System Compatible SoM Connectivity Network LAN Internal Headers PICO PICO-PI PICO RGB TTL VGA TTL + TOUCH M.2 MIPI CSI MIPI DSI GPIO I²C SPI UART CAN External Connectors HDMI Audio USB USB OTG MicroSD Others Audio Codec Sensors RTC Power Input Power Connector Battery Charging Circuit Mechanical Dimensions 12V DC +/-10% 5V DC +/-5% 2-pin Micro-Fit 3.0 USB Type-C 100 x 72 mm 85 x 56 mm

8 INNOVATORS OF TECHNOLOGY TechNexion Ltd. 16F-5, No. 736, Zhongzheng Rd., Zhonghe Dist., New Taipei City,23511,Taiwan. Tel: Fax:

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