The TechNexion Difference
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- Roderick Black
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1 EDM
2 The TechNexion Difference Faster Time-to-market Through Open Design System on Modules are designed to speed up and reduce the cost of development for embedded devices. But these benefits are only possible, if you have easy access to the source code, design guides and development start kits essential for building your device EDM Compact Open Source Software EDM Standard All TechNexion s SoMs come with open source code and binary images that are easily accessible, not hidden behind sign up pages or passwords EDM Extended Open Hardware 45 If you decide to create your own carrier board, it is crucial to be able to learn about your SoM board s layout as soon as possible. TechNexion makes that possible with frictionless access to our carrier boards specifications, design guides, and schematics. 8 Plug and Play Development Kits Finding the right tools and software to develop and test your solution can take time, or sometimes not even be available. TechNexion SoMs come pre-loaded with plug and play working software including all the necessary tools to validate and develop your application s features and functions. Product Longevity through Support and Scalability Embedded devices are often the core of large-scale industrial, medical and commercial systems with rigorous certification requirements and costs making it is necessary they are able to operate reliably for many years. TechNexion makes that possible in many ways: Scalability For every product in a product series, we use the same number of pins enabling you to upgrade to a more powerful CPU easy. Longevity All our products have a guaranteed -year lifetime. Component strategy All our components are sourced only from strategic partners who support our product roadmap guarantees and quality standards. YEARS Custom Carrier Board Design Customers can leverage TechNexion s exceptional hardware and software open resources to quickly design their own carrier boards or take advantage of our in-house design and customization services. We have successfully delivered thousands of projects for our customers, ranging from small modifications to one of our standard products to projects that needed carrier boards and single board computers completely designed from the ground up with extremely complex requirements. For example, a drone project needing 9-axis sensors with CAN. Our experience and expertise mean we can add value to all the stages of the development process including hardware design, software, mechanical, manufacturing, and project design and management.
3 EDM Series The EDM System on Module series is a multi-functional, highly integrated ARM SoM with best in class performance, low power consumption and both wired and wireless connectivity. Additionally, it follows the EDM standard, the first truly x86 and ARM compatible pin-to-pin standard, enabling support for a wide range of CPU architectures including power efficient ARM Cortex A7 all the way up to 64-bit multicore processor modules. EDM Type Power LAN LVDS/ edp st TTL HDMI/ DP st GPMC st OTG I S nd Host SPDIF I S st CANBus SD I C Buttons + GPIO RSVD RTC EDM Type Power LAN LVDS/ edp nd LVDS/ edp st HDMI/ DP nd HDMI/ DP st x4 nd st LPC OTG HDA Host SPDIF I S st CANBus SD I C Buttons + GPIO RSVD RTC Highly Customizable Range of Options Its extremely wide choice of processing power, memory, and connectivity options means there is a version to meet your product application requirements whether it is voice control, multimedia, digital signage, industrial usage, and general automation or low cost. ARM Cortex-A7 / A9 / A7+M4 / A53+M4F architecture. NXP i.mx6, i.mx7 and i.mx8m processors including options for single, dual or quad core. 080/70 powerful video encoding/decoding capabilities. Fast Ethernet or Gigabit LAN, WiFi 80. a/b/g/n/ac and Bluetooth v4. options. Production TechNexion has its own manufacturing facilities with factory and design teams working together, communicating and sharing expertise in a way not possible when they were in separate businesses with separate priorities. It means that each stage of the transition to manufacturing can go smoother and faster, the unique aspects of your design can be realized more cost-effectively, and production line capacity planned for with better timing. It also means you will not fall victim to the production scheduling priorities of contract manufacturers and the larger orders that might push you down the queue. Complete IoT solution Designed to support as wide a range of signals as possible, it combines ARM Cortex architecture with the EDM connector standard. It has a range of evaluation boards with ready-to-use sensors and I/Os allowing the development of applications that take advantage of the full range of opportunities in today s connected world. That IoT focus extends to software with several editions certified by Google for its IoT operating system, Android Things.
4 OVERVIEW Model Name EDM-CF-IMX6 EDM-IMX6PLUS EDM-IMX6UL EDM-IMX7 Core System Signalling EDM EDM EDM EDM Architecture ARM Cortex-A7 ARM Cortex-A7 + M4 NXP i.mx6 Solo GHz NXP i.mx6 DualLite GHz NXP i.mx6 Dual GHz NXP i.mx6 Quad GHz NXP i.mx6 Solo GHz NXP i.mx6 DualLite GHz NXP i.mx6 Dual GHz NXP i.mx6 Quad GHz NXP i.mx6 QuadPlus GHz NXP i.mx6 UltraLite 58MHz NXP i.mx7 Solo 800MHz NXP i.mx7 Dual GHz NXP MMPF000 NXP PF3000 NXP PF3000 up to GB DDR3 up to GB DDR3L up to GB DDR3L emmc emmc/microsd (optional) NAND Flash emmc Debug Interface Connectivity Network LAN x Gigabit LAN x Gigabit LAN x LAN x Gigabit LAN WiFi 80. b/g/n/ (optional) 80. a/b/g/n/ac (optional) 80. a/b/g/n/ac (optional) 80. a/b/g/n/ac (optional) BT 4.0 (optional) BT 4. (optional) BT 4. (optional) BT 4. (optional) Internal Headers FPC Connector / ADC Signals Signaling HDMI LVDS Single Channel Single Channel Single Channel (optional) Single Channel (optional) RGB TTL OTG I²S SDIO CAN I²C GPIO Mechanical 8 x 60 mm 07-. All specifications are subject to change without notice. 8 x 60 mm 8 x 60 mm 8 x 60 mm
5 Model Name EDM-IMX8M EDM-CF-IMX6 EDM-IMX6PLUS Core System Signalling EDM EDM EDM Architecture ARM Cortex-A53 + M4F ARM Cortex-A9 ARM Cortex-A9 NXP i.mx8m Solo.5GHz NXP i.mx8m Dual.5GHz NXP i.mx8m QuadLite.5GHz NXP i.mx8m Quad.5GHz NXP i.mx6 Solo GHz NXP i.mx6 DualLite GHz NXP i.mx6 Dual GHz NXP i.mx6 Quad GHz NXP i.mx6 Solo GHz NXP i.mx6 DualLite GHz NXP i.mx6 Dual GHz NXP i.mx6 Quad GHz NXP i.mx6 QuadPlus GHz NXP MMPF40 NXP MMPF000 up to 4GB DDR4 up to GB DDR3 up to GB DDR3 emmc/microsd (optional) emmc emmc Debug Interface Connectivity Network LAN x Gigabit LAN x Gigabit LAN x Gigabit LAN WiFi 80. a/b/g/n/ac (optional) 80. b/g/n/ (optional) 80. a/b/g/n/ac (optional) BT 4. (optional) BT 4.0 (optional) BT 4. (optional) Internal Headers FPC Connector Signaling HDMI LVDS Dual Channel Dual Channel RGB TTL OTG I²S SDIO CAN I²C GPIO Mechanical 8 x 60 mm 8 x 60 mm 8 x 60 mm
6 Model Name Core System Compatible SoM Expansion Interfaces EDM-GNOME EDM-FAIRY EDM-GOBLIN EDM Type compact EDM Type compact EDM Type compact mini- + SIM Internal Headers LVDS Single Channel Single Channel RGB TTL GPIO I²C CAN External Connectors HDMI Audio x CTIA 3.5mm audio jack 3x 3.5mm jack 3x 3.5mm jack S/PDIF x S/PDIF (optical) x S/PDIF (optical) Gigabit LAN OTG x Type-C Serial x RS-3/4/485 x RS-3/4/485 MicroSD Others Touch Connector x (6-pin) I²C x (4-wire) x (4-wire) Audio Codec Speaker W pre-amplified (stereo) W pre-amplified (stereo) Sensors RTC Power Input Power Connector Mechanical Dimensions V DC +/-0% V DC +/-0% V DC +/-0% -pin Micro-Fit 3.0 -pin 5.08mm Terminal Block -pin 5.08mm Terminal Block 00 x 7 m 47 x 0 mm 47 x 0 mm
7 Model Name Core System Compatible SoM Expansion Interfaces mini- + SIM Internal Headers LVDS RGB TTL GPIO I²C CAN External Connectors HDMI Audio S/PDIF Gigabit LAN OTG Serial MicroSD Others Touch Connector Audio Codec Speaker Sensors RTC Power Input Power Connector Mechanical Dimensions EDM-GREMLIN EDM Type compact Dual Channel x CTIA 3.5mm audio jack x Type-C x (6-pin) I²C +x (6-pin) V DC +/-0% -pin Micro-Fit x 7 mm EDM-ELF EDM Type compact Dual Channel 3x 3.5mm jack x S/PDIF (optical) x RS-3/4/485 x (4-wire) W pre-amplified (stereo) V DC +/-0% -pin 5.08mm Terminal Block 47 x 0 mm
8 INNOVATORS OF TECHNOLOGY TechNexion Ltd. 6F-5, No. 736, Zhongzheng Rd., Zhonghe Dist., New Taipei City,35,Taiwan. Tel: Fax:
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