NAN YA PCB CORPORATION COMPANY BRIEFING. September 2011 PAGE NYPCB, All Rights Reserved.

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1 COMPANY BRIEFING September 2011 PAGE 1

2 Safe Harbor Notice Nan Ya PCB s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. Except as required by law, we undertake no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise. PAGE 2

3 Vertical Integration within FPG FPG Introduction Copper Copper Ore Ore Crude Crude Oil Oil Sand Sand Copper Copper Refinery Refinery Oil Oil Refinery Refinery Naphtha Naphtha Cracker Cracker Glass Glass Yarn Yarn Wafer Wafer External Procurement Copper Copper Foil Foil Epoxy Epoxy Glass Glass Cloth Cloth DRAM DRAM Copper Copper Clad Clad Laminate Laminate Nan Ya PCB Mass Prod. (in FPG) LCD LCD PCB PCB Substrate Substrate Electronic Electronic Field Field PAGE 3

4 Milestone Company Introduction Year 1985 Start up PCB mass production Year 1997 Establish Na Ya PCB Corporation Year 2000 Start up wire bond substrate mass production Year 2001 Start up flip chip substrate mass production Year 2002 Start up Kunshan PCB mass production Year 2006 IPO (TWSE Ticker No.: 8046) Year 2010 Start up flip chip substrate back-end process production for CPU products PAGE 4

5 Company Introduction Production Allocation and Monthly Capacity Flip Chip P1+P5 15M Units + P6 8M Units + P7 7M Units + P8 (Potential 15M Units) Wire Bond P2 180KSF + KS 300KSF PCB, HDI + P3 145KSF KS 1.65MSF Note: KS=Kunshan Kunshan China manufacturing campus PAGE 5

6 Structure of Shareholders Orbis Asia Fund excl. Japan Chunghwa Post Cathay Life Insurance 2.1% 2.0% 1.7% Others 22.1% The Boston Company AM Emerging Market Fubon Life Insurance Shin Kong Life Insurance 1.2% 1.1% 0.7% Nan Ya Plastics 67.3% Taiwan Labor Pension Fund 0.6% Taiwan Public Service Pension Fund DIF First Emerging Market Fund 0.6% 0.6% Total Shares: 643,027,487 shares Date: August, 2011 PAGE 6

7 Company Current Status NT$ M 4,500 4,000 3,500 3,000 2,500 2,000 1,500 1, ~2011 Monthly Revenue in Taiwan ,958 2,949 3,240 3,190 2,998 3,013 3,015 3,016 3,180 3,429 2,993 2,979 3,159 3,352 2,855 3,070 2,671 2,600 2,364 Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec 2011 July Sales = NT$ 3.4 Billion;MoM MoM=+7.5% =+7.5%;YoY=+7.8% Accumulated 2011 Sales = NT$ 21.2 Billion ; YoY=+4.8% PAGE 7

8 Company Current Status 2011 Sales Breakdown by Application Automotive 3% Consumer 4% Networking & Communication 4% PC & Peripheral 15% IC Substrate 74% PAGE 8

9 NAN YA PCB CORPORATION Products & Applications-PC GPU FC-BGA 35mm*35mm PCH FC-BGA 25mm*25mm CPU FC-PGA/LGA 37.5mm*37.5mm DRAM (WB-BGA) DRAM Module (PCB) PAGE 9

10 Company Current Status Products & Applications-Game Console A B MPU FC-BGA 27mm*27mm 2/2/2 Integrated Chipset FC-BGA 35mm*35mm 3/2/3 C Integrated Chipset FC-BGA 42.5mm*42.5mm 3/2/3 MPU FC-BGA 33mm*33mm 2/2/2 MPU FC-BGA 21mm*21mm 2/2/2 Integrated Chipset FC-BGA 31mm*31mm 2/2/2 PAGE 10

11 Company Current Status Products & Applications-Others Set-Top Box 37.5mm*37.5mm 2/2/2 HDTV Chipset 35mm*35mm 2/2/2 Set-Top Box and HDTV started to migrate to flip-chip design in 2007, and annual demand has been expected to increase dramatically in PAGE 11

12 Thank You Q & A PAGE 12

13 Appendix 1 IC Substrate Introduction Wire Bonding Substrate Outline: By using gold wires to connect electrical pads with the so-call wire bonding substrate which plays the function as the buffer between chips and motherboard. Wire Bond Substrate Motherboard Flip Chip Substrate Outline: The die is directly attached to the substrate which plays as the connections between the chip and motherboard by using solder bumps rather than gold wires. Flip Chip Substrate Motherboard PAGE 13

14 Appendix 2 Types of Wire Bonding Substrates Ball Grid Array (BGA) Plastic Ball Grid Array (PBGA) Window BGA Chip Scale Package (CSP) Wire Bonding CSP (WB-CSP) Flip Chip CSP (FC-CSP) PAGE 14

15 Appendix 3 Types of Flip Chip Substrates FC-Pin Grid Array (FC-PGA) FC-Land Grid Array (FC-LGA) FC-Ball Grid Array (FC-BGA) PAGE 15

16 CPU Development (GHz) 3.33 FC Substrate Development Trend Multi-Chipset Packaging Status 1 Integrated-Chipset Packaging Status 2 Integrated Package Appendix Dual-Core Multi-Core x37.5mm x37.5mm x37.5mm Pentium mmSQ mmSQ (Mainly for high-end product) Chip on Board FCCSP-PoP mmSQ 0.40 Wafer Process Technology Evolution (Nanometer) / (Source: Intel Web, DigiTimes Lab) PAGE 16