LX3044/LX3045/LX Gbs GaAs PIN PHOTODIODE AND PHOTODIODE ARRAY

Transcription

1 LX3044/LX3045/LX Gbs GaAs PIN PHOTODIODE AND PHOTODIODE ARRAY Manufactured by: Microsemi Integrated Products Garden Grove, CA Telephone: More than solutions enabling possibilities

2 INTRODUCTION CONFIDENTIAL INFORMATION This new product introduction guide is intended for use only by Microsemi s sales people and authorized representatives and distributors. This material can be adapted for customer presentations, but the sales strategy and summary [pricing, availability, etc.] is confidential and should not be shown to customers. DESCRIPTION Microsemi s GaAs Coplanar PIN Photodiode chips are ideal for high bandwidth 850nm multimode-fiber optical networking applications. The device family offers superior responsivity performance and high bandwidth with large active area in single die, 1x4 array die, or 1x12 array die. The G-S-G coplanar waveguide allows very low cross-talk within the array. The LX304X family of photo diodes are currently offered in die form allowing manufacturers the versatility of custom assembly using either bond wire or flip chip configurations. This device is ideal for manufacturers of optical receivers, transponders, optical transmission modules and combination PIN photo diode transimpedance amplifier. Copyright 2001 Page 2

3 KEY PRODUCT INFORMATION BLOCK DIAGRAM LX3044 KEY FEATURES LX3045 LX3046 LX3044 single die LX3045, 1x4 array die LX3046, 1x12 array die Coplanar Waveguide, 50 ohm characteristic impedance High Responsivity Low Dark Current High Bandwidth Anode/Cathode on Illuminated Side 125µm Pad pitch Die good for bond wire or flip chip applications Copyright 2001 Page 3

4 TYPICAL APPLICATION 10 Gigabit Ethernet, telecom, datacom, fibre channel, storage application. Low Cost SONET/SDH OC192/STM64 Connections Internal Telecom and Datacom Switch/Router Connection Multi-Processor Computer Internal Connections Any optical link over multimode fiber at a maximum distance of 1 km Good for any data rate 1.25/2.5/3.125/10 Gbps Copyright 2001 Page 4

5 COMPETITIVE ANALYSIS LX3044/5/6 Competitor Device Aperture Diameter (µm) (A/W) Capacita nce (pf) BW (GHz) Dark Current Microsemi LX Emcore Luxnet Responsivity 10 Gbs GaAs PIN MG3B (na) < Microsemi LX Emcore Hamamatsu 4 Channel G Notes 60µm apeture is too small for 62.5µm fiber Gbs max Gbs max Microsemi LX Emcore 12 Channel Alternative Microsemi Solutions On submount only Gbs max Device Description Notes MXP7001 MXP7002 Ga As PIN Photodiodes Ga As PIN Photodiodes Different Pad configuration for the single 10Gbs PIN Different Pad configuration for the single 3.125Gbs PIN Copyright 2001 Page 5

6 SALES STRATEGY Parallel Optics has a list of companies and products that will need to use the array versions of the GaAs photodiodes. Potential Customers Agilent Technologies ( Alvesta ( AraLight ( Blaze Network Products ( Corona Optical Systems ( Cypress ( Gore Electronics Products ( Infineon ( Molex ( Optobahn ( Paracer/Stratos Lightwave ( Picolight ( TeraConnect ( Xanoptix ( Zarlink Formerly Mitel Semiconductor ( Primarion ( Copyright 2001 Page 6

7 SUMMARY Pricing Device Package Industrial (-40 to 125 C) DC LX3044 Die $ 3.00 $ 3.68 LX3045 Die $ 8.18 $ LX3046 Die $ $ Note: Availability Options Samples: Production: Packages: Now Now Die Only Temperature: I Industrial -40 to 85 Technical Support Datasheet: Application Note: Evaluation Board: Factory Contacts Technical Questions: Marketing Manager: See Microsemi s Website See Datasheet N/A Truc Vu (714) tvu@microsemi.com Paul Bibeau (949) X 240 pbibeau@microsemi.com Copyright 2001 Page 7