COMPREHENSIVE CHIPSET SYSTEM SOLUTION PORTFOLIO

Transcription

1 COMPREHENSIVE CHIPSET SYSTEM SOLUTION PORTFOLIO

2 APPLICATION SHAPING CONVERGED COMMUNICATIONS Leveraging over two decades of leadership in semiconductor development and innovation in signal processing, wireless communications and unique voice expertise, DSP Group offers a comprehensive portfolio of System-On-Chip (SoC) solutions for consumer electronics (CE) end products at home, in the office and on-the-go. Our complete solutions enable OEMs/ODMs introduce innovative products that embed smart processing and converged communications, addressing the growing demand for more cost-effective design, innovative applications/technologies and low-power processing. Our complete SoC solutions include hardware development kits (HDKs), embedded software packages, and software development kits (SDKs) everything you need to develop innovative, cost-effective and power-efficient products. Our advanced technologies are positioning DSP Group as an enabler in the burgeoning Internet of things, smart voice processing, voice user interface for consumers, mobile and wearable devices, and enterprise telephony markets. SOLUTIONS DSP Group continues to play a key role in the rapidly-changing communications arena. OEMs/ODMs, telecommunication operators, and service providers use our market-leading solutions to rapidly bring to market innovative products for home, enterprise and mobile environments. Complementing our traditional offering, our new solutions for voice and audio enhancement (HDClear ), always-on voice activation and sensor hub, IoT applications, home automation and security (ULE), and enterprise telephony (VoIP) are enabling our customers to develop a new wave of products by raising the bar in both voice processing and converged communications. HDClear Voice and Audio Enhancement for Mobile HDClear by DSP group is a revolutionary technology for enabling voice user interface and enhancing voice quality. In smart audio, mobile phones, wearable devices, PCs and tablets, HDClear enables the device to be alwayson and always-listening, suppresses background noise with voice barge-in and promotes high speech intelligibility for unparalleled voice communications and user experience, all in extremely low power consumption. HDClear is an ideal solution for smart speakers, mobile and wearable devices, bringing a better user experience to voice communications, command and activation all with ultra-low power consumption. DSP Group s solution is based on DSP Group s SoC and embedded software and advanced voice activation and sensor fusion algorithms, providing simultaneous analysis of data from multiple sensor sources in addition to voice activation. Our solutions include reference designs for the following applications: Smart speakers IoT applications Mobile phones Wearable devices 3

3 APPLICATION Always-On Voice Activation and Sensor Hub Functions for Smartphones, Wearables and IoT DSP Group s solution for smartphones, wearable and IoT devices provides excellent performance of always on voice-trigger, voice command and sensor hub functions while maintaining extremely low power consumption. Sensor hub functions include capturing data from multiple sensors such as microphones, biometrics, accelerometers, gyroscopes, and magnetometers, and also from environmental sensors such as light level, color, temperature, pressure, and humidity gauges. Our solution includes reference designs for smartphones and wearables devices and can be used for voice activation in other appliances. Enterprise V2oIP The leading VoIP silicon provider for enterprise voice and video, DSP Group offers comprehensive, best-in-class, yet highly-affordable V2oIP solutions. Powering the full range of IP desktop phones, Video phones, conferencing systems and analog telephone adapters (ATAs), DSP Group s scalable, green solutions are ideal for all enterprise segments. Our solutions deliver enterprise-grade acoustics and exceptional HD voice quality, while featuring the industry s lowest power consumption. We offer reference designs for the following applications: Low to high-end IP Phones Video Phones Conferencing phone IP doorphones and Intercoms ATAs APPLICATION Home Gateways, CAT-iq and FMC DSP Group s DCX DECT/CAT-iq/ULE SoC solution for home gateways and fixed-mobile convergence (FMC) provides advanced DECT cordless capabilities including HD voice quality, multi call, multi-line, and ULE functionality. Our DCX solutions support multiple lines and handsets while complying with the CAT-iq 2.0, 2.1, 3.0 (SUOTA) and ULE standards. Our solutions include reference designs for the following applications: DECT cordless phones DECT/CAT-iq/ULE Gateways, OTT and FMC Cordless Leading the cordless phone market with over 70% market share, DSP Group continues to offer cost-effective, fully-featured and comprehensive solutions - delivering unrivaled range, unmatched listening experience and robust processing power, while enabling rich GUI functionality. For entry-level to high-end applications, our products feature the industry s smallest footprint, the highest level of integration, and the lowest power consumption. Our solutions include reference designs for the following applications: HD Voice CAT-iq reference design with advanced GUI HD Voice CAT-iq / ULE reference for Home Gateways and OTTs Wireless audio and cordless headset PSTN cordless phone Video Monitoring over DECT Internet of Things applications (IoT) Based on best-in-class ULE technology, our IoT solutions offer low cost of ownership together with market-leading performance. Utilized in a wide variety of sensors, ULE is an ideal wireless technology for variety of IoT applications including security, safety, smart home, industrial and healthcare connected via consumer premise equipment (CPE) such as home gateways and over the top boxes (OTT s). Combination of ULE with Voice and Video capabilities places DECT/ULE in the unique position in IoT world, supporting also variety of VUI use cases. Our solutions include reference designs for the following applications: ULE reference design and startup kits, including SDK and EVM for: Nodes / Devices Gateways and OTTs 4 5

4 Targeting home, enterprise, and mobile markets, DSP Group s comprehensive chipset portfolio reduces development risk costs, and shortens time to market. ODMs and service providers use our system-on-chips (SoCs), hardware reference packages (HDKs) and software development packages (SDKs) to rapidly and cost-effectively develop cuttingedge consumer electronics and business products. CHIPSET PRODUCT FAMILIES Home Enterprise Mobile Cordless Gateways IoT Voice & Video Over IPV 2 oip) HDClear VOICE ENHANCEMENT AND ALWAYS-ON HDClear FAMILY DSP Group s HDClear family of SoCs offers enhanced voice enhancement, voice activation and sensor hub functionality, enabling ultra-low power, always-on capabilities in smartphones, wearable devices and other mobile devices. HDClear chipsets dramatically suppress background noise for far-end users, enhance privacy for near-end speakers, and maximize performance of Automatic Speech Recognition (ASR) engines. The DBMD4 chip is DSP Group s most advanced solution for voice communications. It supports a rich set of voice processing features to significantly enhance voice call quality, intelligibility and speech recognition accuracy, including: Noise suppression for the far-end listener Noise reduction and speech conditioning for the near-end listener Acoustic Echo Cancellation (AEC) Flexispeech variable speech playback for the hearing impaired Flexible Listening Experience (FLE) automatic adjustment of incoming voice when the near-end listener is in a noisy environment Ultra-low power voice activation and voice command Sensor hub functions DCX (ARM9) DECT BB, DECT RF Voice AFE, PMU DCE (DSP) DECT BB Voice AFE, PMU RF19 DECT RF RF24 2.4DECT RF DCX (ARM9) DECT BB, DECT RF PMU DHX91 (ARM9) DECT ULE BB, DECT ULE RF Voice AFE, PMU DVF99 (2xARM9) DECT ULE BB, DECT ULE RF VoIP DSP, Voice AFE, PMU DCX (ARM9) DECT ULE BB, DECT ULE RF Voice AFE, PMU DVF99 (2xARM9) VoIP DSP, Voice AFE, Security HW, 2D GPU PMU, Opt: DECT BB DVF101 (A9+ARM9) VoIP DSP, Voice AFE, Security HW, 3\2D GPU PMU, Opt: DECT BB DVF1100 (2xA9) Video ENC/DEC, 4xGPU, Security HW, FHD Display pipe, HDMI IN&OUT, USB3.0, PCIe DBMD2 (DSP) Noise Cancellation AEC Voice Trigger Voice Authentication Voice Command Sensor Hub DBMD4 (DSP) Beam Forming Noise Cancellation AEC Voice Trigger Voice Authentication Voice Command Sensor Hub DBMD5 (Dual-core DSP) Beam Forming Noise Cancellation AEC Voice Trigger Voice Authentication Voice Command Sensor Hub DBMD2 DBMD4 DBMD5 Function Far-end noise cancellation Enhanced 2nd generation Near-end noise reduction Enhanced 2nd generation Maximized ASR AEC FLE Speaker improvements and protection Optinal Supported voice bandwidth NB, WB NB, WB, Super WB, Fullband NB, WB Voice activation and voice commands Sensor-Hub Segment Mobile phone BT headset Cordless headset/ handset Wired headset Tablets Wearable devices Smart speakers DSP Processor DSP 32 bits DSP 32 bits Dual DSP 32 bits Program memory RAM RAM RAM I/O GPIO UART PCM/ I2S 4 2 I2C SPI SLIMbus AFE Audio In 4 Digital, ADC 3 Digital, ADC 7 Digital, 2-ADCs Audio Out Digital Digital Digital Package Size 3 x 3 mm 2.1 x 1.8 mm 10 x 10 mm 6 7

5 ENTERPRISE VOICE DVF FAMILY As the leading silicon vendor for enterprise voice, DSP Group offers the DVF chipset family. Our DVF SoCs family is a comprehensive solution for developing affordable, scalable and green V 2 oip home and office products. DVF enables development of low-power enterprise IP Phones, Video Phones, analog terminal adapters (ATAs) and home IP terminals that offer superb acoustic echo cancellation, high-quality HD voice, multi-line capabilities, and an enhanced user interface (UI). Built on an open platform with ARM processors running on Linux OS, DVF includes IPfonePro, an extensive SDK for IP phones and ATAs. DVF9xxx provides outstanding cost/performance value for low to mid-end IP phones. Designed especially to meet Tier 1 requirements, DVF99 fully complements existing DSP Group solutions. DVF101x is a two cores (Cortex-A9+ARM926 co-processor) processor, provides outstanding performance for Highend Voice centric IP phones. Designed especially to meet Tier 1 requirements, DVF101 fully complements existing DSP Group solutions, including DVF9xx VoIP processors for mid- and low-range applications DVF1100 is a dual-core System on a Chip (SoC) for Video and Voice over IP (V 2 oip) solutions. It provides an ideal solution for high-end voice and video conferencing terminals with rich GUI, HD Video streaming and other multimedia content targeting media IP phones. It implements a high-performance, dual-core architecture with advanced memory support, while reducing power consumption and supporting green features. DVF1100 integrates high-quality HD video engines, hardware-based security and advanced graphics. DVF9x Family Product Ultra-Low-End IP-Phone Low-End IP-Phone Mid-End IP-Phone High-End IP-Phone DSPG SoC DVF97 DVF9918 DVF9929 DVF9919 APP L1$ ARM926@250MHz ARM926@400MHz ARM926@500MHz ARM926@600MHz L2$ None None None None CSS L1$ TCM DRAM ARM926@250MHz 16KB I$, 16KB D$ 224KB I, 64KB D SDRAM 125MHz ARM926@400MHz 16KB I$, 16KB D$ 272KB I, 128KB D SDRAM 133MHz ARM926@460MHz 16KB I$, 16KB D$ 272KB I, 128KB D DDR3 / DDR2 / mddr 375MHz ARM926@500MHz 16KB I$, 16KB D$ 272KB I, 128KB D DDR3 / DDR2 / mddr 375MHz Flash QSPI NAND, QSPI NAND, QSPI NAND, QSPI Internal BUS AHB AHB AHB AHB GPU None None None GC200 2D LCDC B&W (SPI only) Monochrome (CPU I/F or SPI) Up to WQVGA (CPU I/F) Video Ethernet I/F RMII GMAC MII/RMII/RGMII GMAC MII/RMII/RGMII GMAC 60Hz (24-bit RGB) Capable of QVGA 30fps/ VGA 20fps H.264 DEC by SW (<200MHz/<400MHz) MII/RMII/RGMII GMAC USB - FS USB 2.0 HS USB 2.0 FS+HS USB 2.0 WiFi I/F - SDIO 2.0 SDIO 2.0 SDIO 2.0 Package DR-QFN 164-pin 12x12mm 2 0.5mm pitch TFBGA 225-ball 2.5x12.5mm 2 0.8mm pitch TFBGA 361-ball 16x16mm 2 0.8mm pitch TFBGA 361-ball 16x16mm 2 0.8mm pitch DVF1xxx Family Product Voice Featured IP-Phone High-End Voice Featured IP-Phone Video Phone DSPG SoC DVF1018 DVF1019 DVF1100 APP L1$ Cortex-A9@1.0GHz Cortex-A9@1.2GHz Dual Cortex-A9@1.5GHz L2$ 256KB 256KB 1MB CSS L1$ TCM DRAM ARM926@500MHz 272KB I, 128KB D DDR3/3L ARM926@600MHz 272KB I, 128KB D DDR3/3L TBD) Utilizing 2nd Cortex-A9 for frame based processing DDR3 Flash NAND / emmc NAND / emmc NAND + emmc Internal BUS AXI AXI AXI GPU LCDC Video MALI-300 SP 2D/3D (w/ OpenGL 60 Hz DPI & MIPI/DSI 4L MALI-300 SP 2D/3D (w/ OpenGL 60 Hz DPI & MIPI/DSI 4L Capable of 720p/VGA30 H.264 DEC by SW MALI-400 4MP 2D/3D (w/ OpenGL ES) 60 Hz DPI & HDMI-OUT 1080p60 H.264 ENC+DEC & H.265 DEC, VP8, etc. Camera I/F USB USB USB, HDMI-IN Ethernet I/F MII/RMII/RGMII GMAC MII/RMII/RGMII GMAC RMII/RGMII GMAC USB 2x HS USB 2.0 2x HS USB 2.0 2x HS USB 2.0, 1x USB 3.0 WiFi I/F SDIO 3.0 SDIO 3.0 SDIO 3.0, PCIe G2 Analog Front-End DVFA101 with 2x ADC/DAC + 2W Class D PA for 4x MIC IN & 4x SPK OUT DVFA101 with 2x ADC/DAC + 2W Class D PA for 4x MIC IN & 4x SPK OUT External PCM/I2S Codecs Package TFBGA 409-ball 19x19mm 2 0.8mm pitch TFBGA 409-ball 19x19mm 2 0.8mm pitch FCBGA 700-ball 25mm x 25mm 1.0/0.8 pitch Process 40nm 40nm 28nm 8 9

6 IoT ULE (ULTRA LOW ENERGY) FAMILY DSP Group is leading the ULE revolution to meet the growing demand in the Home Area Network (HAN) market for efficient low-power, wireless IoT solutions. An extension of DECT, the new ULE standard enables development of multi-year, battery-run HAN applications that enjoy all of the advantages of DECT, such as interference-free connectivity, extended range, voice and video support and more. Leveraging its long-term technological and market leadership in DECT applications, DSP Group designed the architecture for ULE and is driving its adoption, together with the DECT Forum and the ULE Alliance. DSP Group offers an advanced ULE family of chips, as well as a comprehensive ULE and HAN FUN (Transport and Application layer) protocol. The DHX91 is a low-power chipset solution for home automation and security. Equipped with audio capabilities and a powerful ARM926 processor, it implements hibernation features to deliver advanced ULE. The ULE base utilizes existing and proven cordless SoCs, functioning as a standalone ULE over the top box (DVF99) and embedded module for home gateways (DCX81). Base Node Function DVF99 DCX81 DHX91 Segment ULE Radio Frequency DECT (EUR) DECT 6.0 (US) K-DECT J-DECT Memory Internal RAM External QSPI Flash Processing and Features Processor 2 x ARM926 ARM926 ARM926 MIPS 2 x 400MHz 208MHz 208MHz Cache I+D I+D I+D Hardware Accelerators Security JPEG MLSE JPEG MLSE Non-Blind Slot Hibernation Integration RF PA RF Switches I /O Keypad GPIO UART USB PCM/IOM/TDM I2S SPI PWM External Bus 8-bit ULE I/O DHAN-S MODULE FOR IOT ULE APPLICATIONS DSP Group s DHAN-S module offers application developers a turn-key platform for Ultra Low Energy (ULE) applications, whether battery or AC-powered. Built around the company s DHX91 chipset, DSP Group s DHAN-S module is easily integrated into the smallest of Smart Home nodes. The module can serve as a wireless connectivity channel for an application running on an external MCU or can act as a standalone solution using the DHX91 s internal ARM926 processor. The complete platform includes everything an IoT designer needs HW, SDK, API GUI and documentation to bring competitive applications rapidly to market. Home automation, security, monitoring, metering and healthcare customers benefit not only from readily available applications but from DECT s outstanding wireless range and ULE s lowest power consumption. Benefits: In-Production ULE modules to Fast Time-To-Market and easy integration and implementation Full SW stack, requiring no prior knowledge of the ULE or HAN-FUN standards. Straightforward application reference design, HW and SW DHAN-S Module Block Diagram: 10 11

7 HD-VOICE & ULE- ENABLED HOME GATWAY (HGW) DSP Group s DCX81 SoC for HGW and FMC provide advanced DECT cordless capabilities including HD voice, multiline, multi-handset and ULE support, while integrating the most advanced CAT-iq 2.0, 2.1, 3.0 (SUOTA) stack. The DCX81 is a low-power flash-based SoCs based on an open powerful ARM9 core processor with unsurpassed range, capable of advanced HD voice processing for multi-line, multi-call applications together with support of ULE standard for home automation applications. Function Standards ULE DECT Radio Frequency DECT (EUR) DECT 6.0 (US) K-DECT J-DECT Memory External QSPI Flash Internal RAM Processing and Features Processor MIPS Cache Non-Blind Slot Integration RF PA RF Switches I/O Keypad GPIO UART USB PCM/IOM/TDM SPI DCX81 Single Chip ARM MHz I+D DECT CORDLESS DCE AND DCX FAMILIES A market leader in DECT and next-generation CAT-iq cordless technology, DSP Group offers a wide range of costeffective, highly-integrated SoC solutions. Delivering high-quality audio with notably low power consumption, our fieldproven chipset solutions are ideal for totally integrated digital cordless telephony, home automation and security, and DECT-enabled gateways. DSP Group s cordless chipset solutions are available in two chipset families: DCE DE56/DCE58/9 + RF19Z/RF24 DCX DCX79 DCX81 DCXD1 + DRF1912 Function Baseband + RF Single Chip Single Chip Baseband + RFAPU Segment Entry Level Mid-Range High-End Radio Frequency DECT (EUR) RF19Z DECT 6.0 (US) RF19Z K-DECT RF19Z J-DECT RF19Z 2.4 GHz RF24 Memory External QSPI Flash External SRAM Internal RAM Internal Flash ROM Processing and Features Processor TeakLite ARM968 ARM926 ARM926 MIPS MHz 124MHz 208MHz 208MHz Cache I+D I+D Hardware Accelerators MLSE JPEG DMA MLSE JPEG DMA MLSE Non-Blind Slot Integration RF PA RF Switches Embedded LCD Controller 14-Segment Dot Matrix I /O Keypad GPIO UART USB PCM/IOM/TDM I2S SPI PWM External Bus 8-bit 16-bit The DCE family is a highly integrated, low-power ROM-based chipset solution, delivering enhanced audio and extended range for entry-level applications. The DCX SoC family is a low-power, Flash and ROM-based chipset solution targeting mid-to-high-range cordless applications. The cost-effective DCX is based on an open powerful ARM9 core platform capable of advanced HD voice processing for multi-line and multi-call use cases as well as support for large LCDs and video applications

8 TECHNOLOGIES CUSTOMERS TECHNOLOGIES DSP Group offers a broad portfolio of integrated technologies for diverse voice, audio, data and multimedia applications maintaining extensive expertise and a leading position in DECT/DECT6.0/JDECT, CAT-iq 1.0/2.0/2.1/3.0 (SOUTA), 2.4GHz, PSTN, and VoIP. We also leverage 25 years of audio processing experience to an array of new technologies that are shaping converged communications at home, in the office and in mobile devices. These advanced technologies include a revolutionary HDClear algorithm for the mobile applications, Ultra Low Energy (ULE) and VoIP. Voice and Audio Providing the wireless industry s most advanced chipset solutions, DSP Group offers innovative voice/audio technologies and advanced algorithms that extend the effective range of clear voice communications for CAT-iq and worldwide DECT - without increasing power and emission levels. In addition, we implement noise-reduction, acoustic echo cancellation and voice-enhancement algorithms that improve voice intelligibility and provide better user experience. ULE (Ultra Low Energy) DSP Group is spearheading development of ULE for home area network (HAN) applications, including home automation, security and safety, energy management, climate control and healthcare. Leading design of the ULE architecture, we are driving ULE s adoption by ETSI, DECT Forum, and the ULE Alliance. DSP Group is one of the founding companies of the ULE Alliance, continues to be a promoter member, holding a position on the board and chairing the Technical Working Group. CUSTOMER ADVANTAGES AND BENEFITS Advantages Reflecting DSP Group s two decades of leadership in wireless semiconductor development, our offering features a number of advantages for CE manufacturers and OEMs: Comprehensive product portfolio of complete reference designs of HW, SW and System Mature, field-proven chipset solutions Highly integrated SoCs Operational excellence anoutstanding customer support Broad international standards compliance and support Green, low-power offering Benefits DSP Group s chipset solutions offer CE manufacturers and OEMs a range of benefits to help them better compete in today s rapidlyevolving residential communications market: Low development effort, risk and cost Fast time to market Small design footprint Easy customization and integration of features Supply reliability Innovative revenue-generating applications Expanded market opportunities Voice Intelligibility and Noise Reduction HDClear technology eliminates the traditional tradeoff between voice intelligibility and noise reduction. It delivers measurably higher and more consistent voice quality and intelligibility to mobile users, even in noisy surroundings. HDClear low power and small footprint enable easy integration in mobile and wearable devices. HDClear technology extends voice data acquisition from multi microphones. After the combined input is processed, our Vocal algorithm is applied to the acquired data to enable diverse voice processing tasks such as: echo and background noise cancellation, maximized effectiveness of automatic speech recognition (ASR) engines, loudness equalization, and general voice enhancement. Customers DSP Group is a customer-centric company that proactively partners with our consumer electronics (CE) manufacturer customer base. We also team with service providers who are focused on bringing innovative residential and enterprise converged communications solutions to market. Based on a deep understanding of market needs, we encourage customer involvement in our roadmap development, and offer customers access to our internal R&D resources. A reliable long-term industry supplier, DSP Group maintains a proven track record of operational excellence and successful delivery. With office across Asia, Europe and North America, we provide our customers with outstanding local service and support worldwide. Cordless Telephony The world leader in cordless telephony for over two decades, DSP Group promotes both traditional and next-generation cordless technologies. The company is an active member of the DECT Forum, holding a position on the board and chairing a number of key working groups (WGs), including WG USA, WG Marketing and WG Japan.. This involvement is complemented by our active participation in other relevant Forum working groups, as well as in the ETSI Technical Committee for DECT (TC DECT). CAT-iq DSP Group has been deeply involved in all stages of defining CAT-iq since its inception, including participating in the DECT Forum and defining ETSI DECT NG specifications. DSP Group is also supports CableLabs specification activities. VoIP DSP Group is recognized for its worldwide leadership in VoIP, maintaining the fastest growing market share in this domain and offering the advantage of seamless scalability to DECT. DSP Group provides best-in-class audio quality and cost-effective solutions for low-to-mid-range VoIP applications, which can be seamlessly extended to high-end applications. Radio Frequency (RF) DSP Group is a leading provider of RF chips, covering all RF bands used in cordless and wireless applications. These bands include 1.7 GHz-1.9 GHz (DECT for the EU, US, LATAM Japan-DECT and Korea), 2.4 GHz (EDCT/WDCT and FHSS DECT), 5.8 GHz (EDCT/WDCT), and Wi-Fi (2.4 GHz and 5 GHz). Designed with CMOS technology, DSP Group s new generation of chips incorporates all required RF functionality on a single chip, including RF transceiver, LNA, PA and channel filters

9 DSP Group, Inc. (NASDAQ: DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit Copyright 2014, DSP Group, Inc. All rights reserved. DSP Group, Inc. and DSP Group Logo are trademarks of DSP Group, Inc. Other third party trademarks are property of their respective owners. All product information, dates and figures are not warranted as accurate or complete, and may be revised based on further information without notice. DSP Group, Inc. 161 S San Antonio Rd, Suite 10, Los Altos CA Tel: Fax: