LM910 Bluetooth v4.0 Dual Mode Module Host Controller Interface (HCI) via USB Interface
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1 Bluetooth v4. Dual Mode Module OSX XP Vista 7 8 Revised 3/JAN/ mm m m m m Features Bluetooth v4. wireless technology < 35mA Current Consumption (Continuous Tx mode) PCB Antenna Voice and Data Application support (including VoIP over Bluetooth ) Stereo Audio supported 18mm x 9.7mm X 2.5mm 1 dbm (Bluetooth v2.1 + EDR) and 9 dbm (Bluetooth v4.) Tx Output Power SMT Side and Bottom Pads for easy production -85 dbm (Bluetooth 2.1 +EDR) and -9 dbm (Bluetooth v4.) Rx Sensitivity See our website for this products certifications. USB 2. (Full Speed) for data and power source RoHS, REACH and WEEE Host Controller Interface (HCI) Plug and Play (OSX, Linux and Windows XP to Windows 1 compatible) Overview The Bluetooth v4. module is a small, simple and highly compatible solution. A plug and play module, compatible with Linux, MAC OSX and Windows XP to Windows 1 platforms. Allowing your embedded system to wirelessly communicate with other nearby Bluetooth and Bluetooth v4. enabled devices (such as the iphone and Android devices). Providing a low energy connection and high quality data stream. The has many possible uses e.g. within an ibeacon and a data logger. Typically used in industries such as EPOS, M2M and automotive. And is ideal for developing voice and data applications. The module has a Host Controller Interface (HCI) for a simple connection via USB to a host computer or MCU. Designed with a PCB antenna for a cost effective solution providing a high antenna gain. It s SMT side and bottom pads allows for easy integrations into your embedded system. Simplifying the production and manufacturing phase. Page 1 of () sales@lm-technologies.com
2 Bluetooth v4. Dual Mode Module General Wireless Bluetooth Standard v4. low energy technology and v2., v.2.1 wireless technology Module Type Host Controller Interface (HCI) OS Compatibility OSX (Apple s Bluetooth Stack), Linux (BlueZ) and Windows XP 1 (Widcomm) Hardware Chipset Broadcom Antenna PCB Antenna Interfaces USB 2. (Full Speed) Power Supply 5V DC (USB powered) Crystal Oscillators 2 MHz RF Characteristics Tx Output Power 1 dbm (Bluetooth v2.1 + EDR) and 9 dbm (Bluetooth v4.) Rx Sensitivity -85 dbm (Bluetooth v2.1 + EDR) and -9 dbm (Bluetooth v.4.) Current Consumption (Continuous Tx) <35 ma (Typical) Current Consumption (Continuous Rx) 27 ma (Typical) Data Rate Up to 3Mbps Frequency 2.4 GHz to GHz Modulation Scheme GFSK for 1 Mbps, π/4-dqpsk for 2 Mbps, 8-DPSK for 3 Mbps Spread Spectrum FHSS (Frequency Hopping Spread Spectrum) Physical Characteristics Operating Temperature -2 C to +75 C Dimensions (L x W x H) 18mm x 9.7mm x 2.5mm Weight.61g +/-.25g tolerance Certifications See our website for this products certifications. Compliance RoHS, REACH and WEEE Page 2 of () sales@lm-technologies.com
3 Bluetooth v4. Dual Mode Module HCI Architecture User Application Within the Host Controller Interface (HCI) Architecture, the runs the HCI Firmware, Link Manager Firmware and baseband controller. BLUETOOTH HOST Other High Layer Drivers (optional) Host Computer / MCU eg: Virtual COM Port, Printer Driver The host operating system runs the Bluetooth v2.1 + EDR / v4. user application. It also runs the Bluetooth Stack (HCI Driver), USB Driver and other necessary drivers. HCI Driver Bluetooth Stack: BlueZ, Widcomm, OSX Stack USB Driver The Bluetooth Stack (HCI Driver) exchanges data and commands with the HCI firmware via the USB interface. PHYSICAL BUS USB Port USB Firmware The is plug and play and compatible with the OSX, Linux and Windows XP 1 platforms. USB Type A Connector HARDWARE BLUETOOTH CONTROLLER The Bluetooth Stack is in-built into the operating system. With the Widcomm Bluetooth Stack Software specifically designed for the Broadcom chipset within the. HCI Firmware Link Manager Firmware Baseband Controller The table below shows the tested OS version numbers: Firmware Software Hardware Host Operating System Bluetooth Stack * LM Tested OS Version Number MAC OSX OSX Bluetooth Stack OSX 1.11 (El Capitan) Linux BlueZ Ubuntu 15.1 (Kernel generic) and Ubuntu (Kernel generic) Windows Widcomm Win 1 (64-bit), Win 1 (32-Bit), Win 8/8.1 (64-bit), Win 8/8.1 (32-Bit), Win 7 (64-bit) and Win XP (32-bit) *NOTE: Third-party Bluetooth Stack Software can be used as an alternative to the in-built Bluetooth Stack for more supported profiles. Page 3 of () sales@lm-technologies.com
4 Bluetooth v4. Dual Mode Module Radio Frequency Characteristics Transmit Power s Crystal Trim Frequency Offset ±3 KHz KHz Output Power Class Ppk <23dBm 1 Pav Packet Type dbm< Pave<2dBm DH5 242MHz (CH) Pav 1.26 Ppk MHz (CH39) Pav 1.6 Ppk MHz (CH78) Pav 1.24 Ppk 1.47 dbm Receive s Maximum Usuable Level Class Packet Type BER.1% for receiving power is -2 dbm or greater. 1 DH1 Sensitivity 2441MHz (CH39) 248MHz (CH78) Class Packet Type 248MHz (CH78) % DH5 % Packet Type BER.1% Page 4 of MHz (CH39) Class Minumum Sensitivity 1 242MHz (CH) % DH1 BER.1% for receiving power is -75 dbm or better MHz (CH) DH1 242MHz (CH) MHz (CH39) MHz (CH78) -85 dbm +44() sales@lm-technologies.com
5 Bluetooth v4. Dual Mode Module EDR - Bit Error Rate (BER) Floor Performance DH3 242MHz (CH) BER.7% for receiving power is -6 dbm or better Class MHz (CH39) 248MHz (CH78) 2Mbits/sec % 3Mbits/sec % Bluetooth low energy - Limitation Sensitivity Low Energy 242MHz (CH37) PER 3.8% for finding receiving the lowest power. Current Consumption Test MHz (CH18) MHz (CH39) -9 dbm Figure Test Condition (BDR DM1 PRBS9 Channel 2442MHz) Continuous TX: <35 ma (typ.) (See Figure) Continuous RX: 27 ma (typ.) Page 5 of () sales@lm-technologies.com
6 Bluetooth v4. Dual Mode Module Module Block Diagram VDD_USB PCB ANT Filter BT_RF Broadcom Chipset USB XTAL Page 6 of 12 2MHz +44() sales@lm-technologies.com
7 Bluetooth v4. Dual Mode Module Physical Dimensions Top View Pin Spacing 4 GND 2.5mm 3 D+ 4.84mm 9.395mm 9.7mm 2.mm 2 D1 V+ 2.5mm Pin Description 4 GND 3 D+ 2 D- 1 V+ 1.4 (x4) 4.24mm mm 18mm Front View 2.5mm 18mm Side View 2.5mm 9.7mm Page 7 of () sales@lm-technologies.com
8 Bluetooth v4. Dual Mode Module Soldering Reflow Chart Page 8 of () sales@lm-technologies.com
9 Bluetooth v4. Dual Mode Module Tape and Reel Packaging Tape Dimensions 16mm.15mm 4mm 19.3mm 32mm.32mm 1.9mm 3.11mm Reel Dimensions 33mm Notes Carton Dimensions (L x W x H): 36mm x 29mm x 37mm Quantities 15 modules per Tape 4 Boxes per Carton 6 modules per Carton 36mm 92mm Page 9 of () sales@lm-technologies.com
10 Bluetooth v4. Dual Mode Module Tray Packaging Tray Dimensions LM117 6X1 LM TECHNOLOGIES 11mm 19mm Notes Quantities Anti-Static PS Tray, Black. 6 modules per Tray Electrical Resistance: 1 MΩ< R< 1MΩ. 6 modules per Box Thickness: T=.8 mm 4 Boxes per Carton Carton Dimensions (L x W x H): 24 modules per Carton 36mm x 325mm x 16mm Page 1 of () sales@lm-technologies.com
11 Bluetooth v4. Dual Mode Module Packaging for Tape & Reel / Tray The trays/reels are stacked and inserted into an anti-static vacuum bag and the Anti-Static Label, Model Name Label and Moisture Sensitive Labels stuck on. drying agent Humidity Indicator Card Reels are place within a vacuum bag. Anti-static aluminium vacuum bag. Trays are stacked up with an empty tray on the top. The vacuum bag is placed inside the box and a Model Name Label stuck on the front-side of each box. Model name label Anti-static aluminium vacuum bag. box ) b ox carton carton label Each carton contains 4 boxes. Page 11 of () sales@lm-technologies.com
12 Bluetooth v4. Dual Mode Module See Below Packaging Options Module MOD SMT HCI BT Mbps/25Kbps USB 5V 9dBm PC-ANT TRAY Module MOD SMT HCI BT Mbps/25Kbps USB 5V 9dBm PC-ANT T&R Module MOD SMT HCI BT Mbps/25Kbps USB 5V 9dBm PC-ANT PCS User Guides, Manuals and Configuration Software is available to download via our website - Page 12 of () sales@lm-technologies.com
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