Samsung System LSI Business
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1 Samsung System LSI Business NS (Stephen) Woo, Ph.D. President & GM of System LSI Samsung Electronics 0/32
2 Disclaimer The materials in this report include forward-looking statements which can generally be identified by phrases such as Samsung Electronics (SEC) or its management "believes," "expects," "anticipates," "foresees," "forecasts," "estimates" or other words or phrases of similar implications. Similarly, such statements that describe the company's business strategy, outlook, objectives, plans, intentions or goals are also forward-looking statements. All such statements are subject to certain risks and uncertainties that could cause actual results to differ materially from those in the presentation files above. For us, particular uncertainties which could adversely or positively affect our future results include: The behavior of financial markets including fluctuations in exchange rates, interest rates and commodity prices Strategic actions including dispositions and acquisitions Unanticipated dramatic developments in our major businesses including CE (Consumer Electronics), IM (IT & Mobile communications), DS (Device Solutions) Numerous other matters at the national and international levels which could affect our future results These uncertainties may cause our actual results to be materially different from those expressed in this report. 1/32
3 System Semiconductor Industry Samsung System LSI : Now Looking Forward
4 Market of Mobile Device Smartphone Tablet (billion units) % 22% (E) 2015(E) (billion units) % 58% (E) 2015(E) Premium Mid + Low Premium Mid + Low * Source : Gartner, Strategy Analytics, Q * Source : Gartner, Q 3/32
5 Computing/Bandwidth Computing Power New applications require higher computing/bandwidth Dual Camcording 1080p Video Single Camcording Voice Command Location Based Service Web browsing 4/32 Resolution
6 Resolution Display Trend Higher resolution Display FHD-class Display UHD (3,840x2,160) HD (1,280x720) FHD (1,920x1,080) WQHD (2,560x1,440) HD-class Display (E) 5/32
7 Resolution Camera Sensor Trend Image quality enhancement is also improving Camera Sensor 16Mp 20Mp Wide Dynamic Range 13Mp Image Stabilization 8Mp Wide Dynamic Range Face Detection 3Mp 5Mp Face Detection Image stabilization (E) 6/32
8 System Semiconductor Industry Samsung System LSI : Now Looking Forward
9 Three business areas SOC LSI AP Connectivity Foundry Image Sensor Display Driver IC Smart Card IC Power Management IC Foundry 8/32
10 Product Portfolio Powerful CPU/GPU Low Power Camera Sensor Pixel Leadership Slim Solution Power Sequence Control & I2C Interface PMIC line: AP & OLED High Efficiency High Accuracy PMIC WiFi/BT GPS vt NFC SIM World s Best Performance Low Power Consumption High Density e-se Module Smartphone IoT Display Driver IC T-Con Full line up for next FHD Lower Power solution Fast Speed (New Architecture) edram T-con Backlight control 9/32
11 1. AP (Application Processor) Focusing on high performance with low power consumption CPU Leadership Powerful GPU Low Power Game changing technology : big.little octa core Richer 3D graphics with Energy efficiency Advanced mobile process & design methodologies Low High big LITTLE Low High 10/32
12 Computing Power Has been leading AP industry since 2009 Innovation in both Architecture & Silicon Technology (DMIPS) 30,000 20,000 Cortex-A9 Quad 1.4GHz Cortex-A15 Octa 1.6GHz Cortex-A15 2.xGHz 10,000 ARM11 800MHz Cortex-A8 1.0GHz Cortex-A9 Dual 1.2GHz * Source : Samsung Electronics Co., Ltd., ARM *DMIPS : Dhrystone Million Instructions Per Second 11/32
13 big.little Architecture Best of both worlds: high performance and low energy Heterogeneous architecture for energy efficiency big C-A15 LITTLE C-A /32
14 big.little Architecture 20% gain at performance and energy, respectively Performance Higher is Better + 20% Energy Lower is Better -15 ~ 20% big.little Conventional big.little Conventional *Source : Samsung Electronics Co., LTD, Q *Source : Samsung Electronics Co., LTD, Q *Conventional : big CPU only 13/32
15 Advanced Silicon Process Leadership in low-power, advanced silicon process Vdd 90/65nm 45nm 32nm 28nm Strained Si 1.2V ULK 1.1V 1 st Gen HK/MG 1.0V 2 nd Gen HK/MG 1.0V 20nm m 1 st Gate Last HK/MG 0.9V 14nm 1 st Gen FinFET 0.8V 10nm 2 nd Gen FinFET 2006, (E) 0.7V * Source : Samsung Electronics Co., Ltd. *Vdd : Supplying voltage of drain 14/32 Process Node
16 2. Image Sensor Higher resolution & smaller pixel have driven sensor industry 5.6 Pixel Pitch (um) Back-side Illumination Pixel 5Mp 8Mp 13Mp 12Mp ISOCELL Wide Dynamic Range Resolution Mp 1.8 VGA 1.3Mp 2Mp Standard Mobile Imaging Architecture (SMIA) Sub 1um * Source : Samsung Electronics Co., Ltd. 15/32
17 Pixel Architecture To increase sensitivity and decrease light loss & crosstalk Gap-less u-lens Increase sensitivity Deep PD Reduce loss in Si Light-guide Reduce metal layer reflection u-lens C/F Without color interference ISOCELL No light loss Metal Photo-diode Conventional Light-guide Back-side illumination Remove metal layer reflection With color interference G R G R Photo Diode Photo Diode Back-side illumination Photo Diode Photo Diode ISOCELL 16/32 Front-side illumination Back-side illumination
18 New Products for Mp ISOCELL Sensor with 1.12um pixels - Main sensor for smartphones - Wide dynamic range & Auto focus Next APS-C sensor - Sensor for mirror-less cameras 17/32
19 3. Foundry Advanced technology and continuous capacity growth Customers One stop IP shopping and design support Technology & Capacity IP & Design Support Best service for development and mass production Service Partnership with customers 18/32
20 14nm Achievement World s leading 14nm FinFET solution via collaboration Samsung : 14nm FinFET test sample & Design Infrastructure ready ARM, Cadence, Synopsys & Mentor FinFET Design Enablement Platform First Cortex-A7 implementation 19/32
21 Technology & Capacity Samsung IBM ISDA STMicro. Giheung, KR GlobalFoundries Austin, Texas, USA Hwaseong, KR * ISDA : International Semiconductor Development Alliance 20/32
22 System Semiconductor : Introduction Samsung System LSI : Now Looking Forward
23 1 Widcon & TSV (Through Silicon Via) 2 64-bit CPU 3 FinFET Process 22/32
24 Widcon with TSV Wide connection between logic and memory Higher bandwidth, lower power consumption Memory Stacking with TSV Short Connection with TSV Micro Bump u-bump DRAM AP Package PCB 23/32
25 Widcon in reality World s 1 st AP using Widcon & TSV Performance Power Higher is Better 14% 33% Lower is Better 60% 43% Widcon1 LPDDR3 Widcon2 LPDDR4 Widcon1 LPDDR3 Widcon2 LPDDR4 *Source : Samsung Electronics Co., Ltd., JEDEC, Q 24/32
26 64-bit CPU core for Smart Devices 2-step approach: AP with ARM s 64-bit core AP with Samsung s own 64-bit core Samsung 25/32
27 14nm FinFET Technology Delay FinFET technology leadership Lower Vdd and delay than a planar process Structure Advantage Source Gate Drain FinFET Less Delay 20nm Planar Lower Vdd Vdd 26/32
28 New Business 1 ModAP (Cellular Modem + AP) 2 IoT 3 Foundry /32
29 1. ModAP (Modem + AP) Dual tracks for modem collaboration High-end : 2-chip strategy with Tier-1 modem suppliers Mid/low-end : ModAP using system company s modem Existing Products Additional Products AP Modem AP ModAP Modem Memory Memory Memory 28/32
30 ModAP System LSI s 1 st ModAP was shipped in 3Q 13 Exynos 4 Quad + System Company s Modem 29/32
31 2. IoT (Internet of Things) Smart building, Smart community,... Total connectivity solutions Air conditioning and Temperature control Energy Generation Energy Storage Lighting Control Control of Elevators and Escalators Total Solutions Disaster Prevention Security Control Monitoring Cameras 30/32
32 3. Foundry 2.0 Technical leadership 14FF and beyond Foundry Follower Technology Leadership 2 Tier 1 only Tier 1 + Tier 2/3 3 Silicon Silicon + IP Provider 31/32
33 Foundry nm FinFET Leadership SRD Schedule Performance, power and area *SRD: Semiconductor Research & Development ISDA Early EUV Adoption 32/32
34 Concluding Remarks Samsung S.LSI provides total solution for connected world Mobile AP (Application Processor) Image Sensor ModAP IoT Samsung S.LSI offers attractive foundry solution Leading-edge technology: 14FF Capacity 33/32
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