Package Technology for Wearable Devices. SungSoon Park Amkor Technology Korea

Transcription

1 Package Technology for Wearable Devices SungSoon Park Amkor Technology Korea

2 Contents 1. What is Wearable Devices? 2. Why Wearable Devices? 3. Applications 4. System Configuration & Requirements Current & Future 5. Summary

3 1. What is Wearable Devices? Devices incorporating computer and advanced electronic technologies and can be worn Typically on human body But can be pet and others well Source:

4 1. What is Wearable Devices? Source: Samsung, Apple, Fitbit, Google, Oculus

5 1. What is Wearable Devices? Smart Watch Fitness Tracker Source:

6 1. What is Wearable Devices? Smart Watch, Fitness Band Source:

7 1. What is Wearable Devices? Number of Devices Average Price(USD) 287 $302 Most Popular Component Accelero meter Source:

8 2. Why Wearable Devices? Consumer Needs Technology Drivers Connected Experience Smart Sensors Connected Health Agents Miniaturization Self Tracking Flexible Electronics Augmented Vision Energy Harvesting Source:

9 2. Why Wearable Devices? 1) Assistance A. Notification Incoming call, Message, , SNS update B. Communication Phone call, Message, , SNS upload 2) Constant monitoring A. Fitness tracking B. Health monitoring C. Policemen Source: NYPD(USA)

10 2. Why Wearable Devices? 3) Instant access to necessary information A. Customer service Source: Virgin Atlantic, Edinburgh airport(uk)

11 2. Why Wearable Devices? B. Navigation Outdoor Store C. Theme Park Ticket Disneyland Source: Disneyland

12 2. Why Wearable Devices? 4) Better productivity in Workplace A. Stock management B. Hand free: Technicians who need to use both hand Source:

13 3. Applications 1) Kids Tracking Smart Wristband Lineable, $5, GPS Use other smartphones as ad hoc GPS Source: Lineable

14 3. Applications 2) Sports Activity Monitoring 6-axis accelerometer, EMG Heart Rate, Breathing Source: Athos

15 3. Applications 3) Smart Sticker Thermometer Temperature Sensor, NFC module Source: VIVALNK

16 3. Applications 4) Dog Activity Monitoring 3-axis accelerometer, Bluetooth 41 x 28 x 11 mm(curved) 8 grams Source: FitBark

17 3. Applications 5) Smart Jewelry Notification Activity Tracking Safety Source: Cuff

18 3. Applications Smart Ring Intel MICA bracelet Source: Smart Ring,Intel

19 4. System Configuration & Requirements 1) System Configuration Current Display Sensor Processor Connectivity Battery

20 4. System Configuration & Requirements A. Display No display Rigid Curved Source: Fitbit, SONY, Samsung

21 4. System Configuration & Requirements B. Sensor Type Package Size Accelerometer, Gyroscope, Magnetometer, Microphone QFN LGA ~ 3x3mm Altimeter, Barometer, Pressure LGA ~ 3x3mm Temperature, Heart Rate, Blood Oxygen, Pulse Oximeter, Perspiration LGA QFN WLCSP ~ 3x3mm ~1x1mm Ambient Light, UV LGA ~5x3mm GPS WLCSP ~ 3x3mm

22 4. System Configuration & Requirements Source: InvenSense, Bosch, ST, Sensirion

23 4. System Configuration & Requirements Amkor Packaging Technology Capability Item Body size I/O pitch MLF(QFN) Min. 0.85x0.85mm Min. 0.3mm Package height Nom. 0.35mm

24 4. System Configuration & Requirements C. Processor Type Package Size AP(Application Processor) PoP ~12x12mm DSP(Digital Signal Processor) BGA ~7x7mm MCU(Micro Controller Unit) WLCSP ~3x3mm

25 4. System Configuration & Requirements Amkor Packaging Technology Capability Item Body size Bottom I/O pitch Memory pitch Package height (Bottom only) Package height (Top* + Bottom) PoP 8~17mm Min. 0.35mm Min. 0.35mm Nom. 0.53mm Max. 1.04mm * Assume Nom. 0.6mm memory

26 4. System Configuration & Requirements D. Connectivity Type Package Size WiFi + Bluetooth + GPS WLCSP ~4x4mm Amkor Packaging Technology Capability Item Body size I/O pitch WLCSP Max. 10x10mm Min. 0.3mm

27 4. System Configuration & Requirements E. Battery Li-Ion Pouch Cell Bare Die(Cymbet Enerchip) Source: Cymbet

28 4. System Configuration & Requirements 3) System Configuration Future A. Sensor Flexible: Printed, Plastic electronics Speech recognition for hands-free functionality: Microphone More sensing B. Display Minimum space for display: Projection Flexible: Product design flexibility Augmented Reality

29 4. System Configuration & Requirements A. Sensor Bio Stamp Temperature Monitoring Flexible: Printed, Plastic electronics Source: MC10

30 4. System Configuration & Requirements B. Display Projection without display panel Projector module Source: Cicret

31 4. System Configuration & Requirements C. Battery Flexible, Printable Source: Enfucell, Blue Spark

32 4. System Configuration & Requirements Energy Harvesting(with future battery) 1 Photovoltaic 2 Thermovoltaic 3 Piezoelectric 4 Biological Reactions Processor & Connectivity Energy Harvesting Sensor Battery

33 5. Summary 1) Current wearable devices use High performance general purpose processor AP or DSP which is Expensive Large size and Consume much of power AP: PoP (~12x12mm) DSP: BGA (~7x7mm) WiFi + Bluetooth + GPS: WLCSP (~4x4mm)

34 5. Summary 2) Future wearable devices will use Specific purpose processor MCU which is Lower cost Smaller size and Consume less of power MCU: WLCSP (Smaller) WiFi + Bluetooth + GPS: WLCSP (Smaller)

35 Thanks