Introducing the FX-14 ASIC Design System. Embargoed until November 10, 2015
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1 Introducing the FX-14 ASIC Design System Embargoed until November 10, 2015
2 Market Forces Are Driving Need for a New Breed of Semiconductor By 2019: Bandwidth Roughly one million minutes of video will cross the network every second Data Explosion Mobile data traffic will reach 24.3 Exabytes/month Power-optimized Higher performance By 2020: Mobility 90% of world s population over six years old will have a mobile phone Smaller, denser Cost-effective Connectivity 70% of the world s population will have smartphone ~90% will be covered by mobile broadband networks System-level differentiation Sources: Cisco Visual Networking Index: Forecast and Methodology, , May 2015; Ericsson Mobility Report, June
3 Company Highlights Post IBM Microelectronics Acquisition REVENUE MORE THAN ~6B* 25,000 2nd Largest Foundry Patents & Applications 250 Customers 18,000 Employees FAB LOCATIONS FAB CAPACITY Burlington Dresden East Fishkill Malta Singapore Trusted Foundry 300mm 200K Wafers/Mo 200mm 133K Wafers/Mo *Based upon analysts estimates 3
4 Business Unit Structure CMOS Platforms BU RF BU ASIC BU Broad technology portfolio across Leading-Edge & Mainstream nodes. Accelerating RF leadership and manufacturing scale. Differentiated RF portfolio solutions such as RFSOI, RFCMOS, and SiGe. Richest portfolio of best-inclass IP for Wired, Wireless infrastructure applications in the Foundry Industry. GLOBALFOUNDRIES Confidential 4
5 FX-14 ASIC Offering Intellectual Property World-class memory, 56G SERDES & multi-generation ARM core support.. Scale FX-14 ASIC Offering Is Ready High-capacity, state-ofthe-art semiconductor manufacturing facility. Technology Leadership Cost-effective 14LPP technology for differentiated power, performance & area. Expertise More than a decade of industry leadership in ASICs. 5
6 FX-14 ASIC Offering Leverages 14LPP Technology Helping customers keep pace with evolving marketplace demands High performance computing Servers, IT infrastructure Network infrastructure Switches/routers, packet processing Next-generation mobile Small cells, application processors FX-14 14LPP FinFET architecture delivers breakthrough performance & power: More performance per watt for connect, compute and store applications Fewer watts per GHz for mobility and wireless applications Qualified in 3Q15, Volume production in 2016 Enables differentiated ASIC solutions across a broader range of applications than ever before 6
7 Snapshot of the FX-14 ASIC Offering Leading-edge, true 14 nm technology platform around 14LPP Industry-standard design tools/flows Multiple Vt libraries for power/performance tradeoffs Enhanced IP portfolio for more design flexibility & optimization -55% Up to 55% area reduction* -85% -50% Up to 50% active power reduction* Up to 85% less leakage* *Compared to GLOBALFOUNDRIES Cu-32 ASIC. Results will vary with design. 7
8 FX-14 ASIC IP Portfolio Highlights 64-bit ARM processors SERDES roadmap extended to 56G ARM Cortex cores including A53 and A72 now available in the ASIC library 32-bit ARM cores also available Leading-edge TCAM 56Gbps ultra-high performance SERDES combo design for next-gen systems Multiple 30Gbps SERDES designs also available Highest density & performance SRAMs Industry s densest, lowest power TCAM Proprietary noise mitigation Fastest networking TCAM in industry Aggressive gate pitch used to achieve industry s smallest SRAM bitcell Performance-optimized SRAM offers exceptional memory core performance 8
9 FX-14 ASIC High-Speed SERDES and Memory Offerings Best in class high-speed SERDES (HSS) offerings, supporting more than a dozen industry standards Array of density- & performanceoptimized memory compilers for design flexibility HSS Memory compilers Array of HSS offerings for system optimization: 56G ultra-high-performance design Multiple 30G Serdes for backplane and chip to chip applications PCI-Express Gen4 support Dense SRAMs: Industry s smallest memory cell results in outstanding density Performance-tuned architecture enables fast random cycle times Performance SRAMs: High-performance SRAMs leverage performance-optimized memory cell Compilers include custom memory arrays for highperformance ARM cores ROM, register array, register files Industry-leading TCAM 9
10 A Closer Look at the FX-14 ASIC TCAM +60% Up to 60% better performance* + More than 15 years of TCAM design experience More than 6 generations of embedded TCAM design, qualification and debug -55% + More than 50 ASICs with TCAM in production -80% Approximately 55% less area* Up to 80% less leakage* Highest search-bandwidth (fastest) networking TCAM in the industry billions of searches per second FX-14 TCAM features include: Improved search throughput Highest density, lowest power consumption *Compared to GLOBALFOUNDRIES Cu-32 ASIC. Results will vary with design. 10
11 FX-14 ASIC Builds On Continued Industry Leadership Deep, long-term engagements with industry leaders in wired and wireless communications 11 consecutive years as the #1 ASIC supplier for wired communications* Successfully enabled, designed & released some of industry s most complex ASICs Outstanding record of enabling first pass design success Worldwide ASIC Design Centers Access to industry-leading R&D for continued pipeline of innovation North America: Austin, Burlington, Raleigh, Rochester, Santa Clara, other China: Beijing, Shanghai *Gartner, India: Bangalore, Hyderabad 11
12 ASICs Portfolio Bulk FinFET FX-14 (14nm) Next generation Cu-32 (32nm) SOI Cu-45 (45nm) Bulk CMOS Cu-65 (65nm) Cu-08 (90nm) 12
13 ASIC Business: Provide Complete Turnkey Solution Multiple engagement points through the value chain Customer Engagement Backend Assembly/ Test Management Packaging Wafer Fab Wafer Fab Chip Design IP Design Pre-Acquisition Post-Acquisition 13
14 FX-14 Unites ASIC Expertise, Technology Leadership and Manufacturing Scale Enhanced customer experience Decades of experience collaboratively solving customer design challenges Industry-standard EDA tool suite Increased customer engagement points throughout the design value chain Best-in-class IP offering 64-bit ARM cores 56G backplane-capable SERDES and optimized 30G SERDES solutions Industry-leading embedded TCAM; highest density/bandwidth esrams Leading-edge technology and high-volume fab Advanced 14LPP technology; next-generation development ongoing Leading-edge 2.5D/3D packaging Record of success Deep, long standing relationships with industry leaders Ranked top ASIC supplier for wired comms for more than a decade 14
15 Thank you Trademark Attribution GLOBALFOUNDRIES, the GLOBALFOUNDRIES logo and combinations thereof, and GLOBALFOUNDRIES other trademarks and service marks are owned by GLOBALFOUNDRIES Inc. in the United States and/or other jurisdictions. All other brand names, product names, or trademarks belong to their respective owners and are used herein solely to identify the products and/or services offered by those trademark owners GLOBALFOUNDRIES Inc. All rights reserved.
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