Milwaukee Tech Day - March 30 th, 2017

Transcription

1 Milwaukee Tech Day - March 30 th, 2017 Time Session 8:00-9:00 Registration and Exhibits Open 9:00-10:00 1 Design & Protection of Analog Outputs for Industrial Automation Resolving the Signal: Understanding Noise in ADCs Battery Technology And Portable Management Overview Common general purpose amplifier design problems and solutions Technical Overview of Sitara AM57x Processors 10:00-10:30 Breaks / Exhibits 10:30-11:30 2 Inductive and Capacitive Sensing for Human Machine Interface (HMI) and Event Counting Applications Op Amp Technology overview Ultra-Low : Nano- DC/DC Solutions Rapidly design & prototype your power & signal chain designs using WEBENCH design tools & TINA-TI Debugging Embedded Applications made easy with TI- RTOS 11:30-1:00 Lunch 1:00-2:00 3 Industrial Ethernet Buses: Understanding the Requirements and Choosing the Correct PHY for Your Application Overview Switch-mode power converter compensation made easy Solving Isolated Design Challenges with Isolation Products from TI: Benefits, Applications and Systems Considerations What's new in the Sub-1GHz space? Come and learn the latest and greatest on this untapped opportunity for the IoT 2:00-2:15 Breaks / Exhibits 2:15-3:15 4 Component and End Equipment Isolation Standards for Electrical Safety Understanding and Protecting Against Electrical Overstress (EOS) of Operational- Amplifiers Optimizing EMI Behavior of Low DC-DC Converters Sensing Signal Conditioners for Industrial Applications: From Concept to Production Wi-Fi made easy: Using TI's SimpleLink Wi-Fi CC3220/CC3120 for IoT applications to connect to the cloud quickly 3:15-3:30 Breaks / Exhibits 3:30-4:30 5 Current Sensing Solutions SAR ADCs vs. Delta-Sigma ADCs: Different Architectures for Different Application Needs Modules: A review of different manufacturing techniques and the resulting impact on performance Understanding over-voltage protection and transient protection in a system Developing Bluetooth Low Energy solution with TI SimpleLink Ultra Low *

2 Track Session Title Abstract Design & Protection of Analog Outputs for Industrial Automation Inductive and Capacitive Sensing for Human Machine Interface (HMI) and Event Counting Applications Industrial Ethernet Buses: Understanding the Requirements and Choosing the Correct PHY for Your Application Component and End Equipment Isolation Standards for Electrical Safety Current Sensing Solutions Resolving the Signal: Understanding Noise in ADCs Op Amp Technology overview Overview Analog outputs in industrial automation come in a variety of configurations that each must deliver strong precision while passing stringent EMI/EMC certification tests. This session will address these systems and their challenges by explaining each configuration, walking through example designs for analog outputs, and a discussion of immunity tests and the design of protection circuits for these tests. The presentation will include a look at existing and roadmap TI components that are intended to service analog outputs in industrial automation. Inductive sensing can be used in a variety of applications to improve overall performance and robustness of a system. HMI applications such as buttons, dials, knobs, and sliders can all be accomplished in a contactless manner with TI s wide range of Inductance to Digital converters & Inductive Touch devices. Other HMI applications such as proximity and system wake can be realized with TI s capacitive sensing portfolio. Example HMI demos include: Touch on Metal buttons Contactless 1 degree absolute position dials Temperature stable contactless rotary encoders Open/Close detection This in-depth training will explain what Industrial Ethernet buses are, why they are different than standard IEEE Ethernet and how to choose the best PHY for each application. In addition, the training will explore IEEE fundamentals to aid in board design and debug. Isolation performance at the component or IC level and at the end-equipment or system level is governed by a vast number of regional and worldwide standards. An understanding of these standards is vital to compare different competing isolation solutions, and also to correctly choose the right isolation products for a given end application. In this session we discuss component level isolation standards such as IEC and VDE /11, and end equipment standards such as IEC (AC Motor drives) and IEC (Test and Measurement equipment). The compliance of TI isolation products to these standards will be explained. Latest updates from TI s participation in world-wide isolation standardization efforts will be provided. There are many reasons and many ways to measure current in a system. Learn about the different kinds of dedicated current sensing products available from TI, including shunt and magnetic current sensing. Receive an overview of various TI Designs for current sensing solutions that provide isolation or employ level shifting to reject high common mode voltages. Learn about products integrating overcurrent protection features and ways to implement current sensors in an application. Noise is the single most important characteristic to consider when choosing an ADC. However, many misconceptions surround this fundamental topic. This in-depth training covers important, basic topics including how we measure and specify noise; the difference between noise parameters like ENOB, noise-free bits, and input-referred noise; do you need an external amplifier for your ADC; and how your reference affects your ADC s noise performance. Discover the answers to these questions and more in this introduction to noise in ADCs. What is the difference between a CMOS, Bipolar, and JFET amplifier? When should you use one over another? When should you use an amplifier with no input crossover distortion, and what is input crossover distortion? What about Zero-Drift, Chopper, and auto-zero amplifiers? This presentation will help you better understand the likenesses and differences between op amps technologies, and help you select the one that best supports your application requirements. This seminar will provide an overview and update on data conversion, Op Amps, signal processing, and the entire signal chain.

3 Understanding and Protecting Against Electrical Overstress (EOS) of Operational-Amplifiers SAR ADCs vs. Delta-Sigma ADCs: Different Architectures for Different Application Needs Battery Technology And Portable Management Overview Ultra-Low : Nano- DC/DC Solutions Switch-mode power converter compensation made easy Optimizing EMI Behavior of Low DC-DC Converters Modules: A review of different manufacturing techniques and the resulting impact on performance Common general purpose amplifier design problems and solutions Solving Isolated with Isolation Products from TI: Benefits, Applications and Systems Considerations Electrical overstress (EOS) of operational amplifiers and related integrated circuits is an over-voltage, or over-current condition, that can result in unexpected circuit behavior or even device failure. EOS can happen when the amplifier is handled outside the circuit, or after it is installed and powered in a circuit. The source of the EOS and its conditions are likely very different for those two scenarios. This session discusses what Electrical Overstress and Electrostatic Discharge (ESD) are, internal ESD protection circuits and how they may become involved in EOS events, common EOS scenarios and some case studies, and techniques that provide EOS protection for operational amplifiers and related circuits. This presentation covers the architecture details for the two most common types of precision ADCs that are widely used in industrial applications. While SAR ADCs are based on a traditional binary search algorithm, the Delta-Sigma ADCs employ different configurations of complicated digital filtering to enhance the overall resolution of the ADC. Such differences in architectures lead to differences in specifications and application use cases between the two ADC types. This presentation will cover some key ADC specifications like noise, anti-aliasing requirements, etc. and provide a comparative explanation for these specifications. In this session, we will cover the basic characteristics of different battery systems, and compare their performance. Emphasis will be placed on Li-Ion systems which are the most popular for portable devices due to their high energy density and small / lightweight form factors. From there, we will review how to properly select the key components around the battery pack which are essential for ensuring safety, efficient fast charging, and accurate capacity monitoring in the system. And ultimately, we will review some technology developments from TI such as universal input Buck-Boost charging solutions for USB Type-C / PD power sources. Low power DCDC converters are typically used in applications requiring highest efficiency in a smallest possible solution. To achieve a small solution size, a high switching frequency is used. High efficiency also means lowest switching losses. To get the lowest switching losses, fast switching is required. This results in fast switching edges, which generate high frequencies to take care of in the application design. How to address those new challenges regarding EMI is explained in detail using different application examples. Engineers have been designing switch-mode power converters for some time now, but if you are new to the design field or you don t compensate converters all the time, it will require some research to do correctly. This paper will break down the procedure into a step-by-step process that engineers can follow to compensate a power converter. The theory of compensation and why it is needed will be explained. Lowest power consumers, like the latest MCU's and low power RF standards, change the power requirements for DC/DC regulators to be optimized in the ua load current range. Newest DC/DC Converter developments allow high efficiency power conversions for lowest power, thanks to Iq (quiescent current) as low as 360nA. This session will show different devices, including dedicated power concepts (like Super-Cap Energy Buffer), to solve customer power problems and minimize losses in Ultra-Low applications. We will show dedicated applications and the available Reference Designs. This covers a broad application range from smart-meters or industrial sensors to wearable and consumer applications. This presentation will provide an overview of Modules. Including, what they are, critical factors in Module Development, some of the technologies used to build Modules and ultimately some of the resulting performance benefits. The talk will also provide a brief survey of some of the development technologies and architectures in the latest power modules. This fast paced presentation will cover over a dozen real world amplifier application issues and solutions based on common amplifier design questions. You will learn how to overcome these common design challenges and will gain insight and thinking beyond the information in the product data sheet. General purpose amplifiers will be highlighted as many applications use these economical and popular devices. Isolation products find use in a wide range of industrial and automotive applications including industrial motor drives, industrial automation and PLCs, sensor isolation, power supplies, test and measurement, medical equipment, automotive communications and Electrical Vehicles. This session provides an overview of TI s isolation product portfolio, and discusses their competitive advantages and shortcomings. In particular, we will focus on end applications and systems considerations, and explain how TI products help address customer problems.

4 Rapidly design & prototype your power & signal chain designs using WEBENCH design tools & TINA-TI Sensing Signal Conditioners for Industrial Applications: From Concept to Production Understanding over-voltage protection and transient protection in a system Technical Overview of Sitara AM57x Processors Debugging Embedded Applications made easy with TI-RTOS What's new in the Sub-1GHz space? Come and learn the latest and greatest on this untapped opportunity for the IoT Designing analog systems and sub-systems is challenging. To design modern advanced systems, one needs to have deep and extensive domain knowledge in analog. Real-world designs need to have real-world components and ICs. The circuits and systems need to be laid out on the PCB for optimal performance. Engineers need to powerful design tools to help them create high-performance, reliable designs rapidly. WEBENCH suite of tools offers powerful award-winning tools for power and signal-chain design. These tools have advanced features for fine tuning your designs to your specifications. Additionally, TI also offers a free-form schematic capture and circuit simulator called TINA-TI along with a vast library of models. In this session we will cover the WEBENCH and Signal-chain tools & TINA-TI. We will show how you can use thermal simulations and design your power compensation loops. Using TINA-TI you can fine-tune your design even further. Sensor Signal Conditioners are commonly used in Sensing Systems in order to accept the sense element information and turn it into a meaningful information that will be sent out to the system for further analysis. Further, Sensor signal Conditioners play a key role in removing all sensing nonidealities and process the data in order to get the most precise measurement. The Texas Instruments PGA devices are sensor signal conditioners that can directly connect to sensing element. These highly integrated System-On- Chip ICs measure and apply gain to the signal by using an internal low-noise instrumentation amplifier (IA) and pass it to an analog-to-digital converter (ADC). Further the ADC data is then processed by an internal digital signal processing engine that will compensate for the sensor nonidealities in order to output data that can be extracted by a variety of Output Interfaces that can be Analog or Digital. This presentation explains transient events in a system: what causes them, what damage they can incur, and how to protect against them. Different protection schemes are discussed, including integrated solutions as well as discretes. Pros and cons are analyzed for both options. Texas Instruments combines the Sitara AM57x family of processors with Processor SDK to provide unrivaled integration, scalability, peripherals, and ease-of-use. The unique heterogeneous architecture including ARM Cortex -A15, C66x DSPs, Programmable Real-Time Units (PRU), ARM Cortex-M4 cores, and video and graphic accelerators makes the AM57x processors unmatched in their class. After a short an introduction to the AM57x devices and functional architecture, the session examines the following elements: Technical aspects of the AM57x processor cores: ARM Cortex-A15, ARM M4, and C66x DSP. Peripherals and accelerators that provide high-level connectivity using multiple protocols and standards with minimal processor engagement. The PRU-ICSS (Programmable Real Time Unit - Industrial Communication Subsystem) engine, which provides a real-time deterministic processor optimized for industrial applications. Both perspectives of AM57x software: Processor SDK Linux includes standard Linux drivers to enable the various peripherals and coprocessors on the device. Processor SDK RTOS provides a real-time operating system for the C66x DSP and ARM M4, as well as architectureoptimized utilities and libraries. TI-RTOS has debug capabilities which are invaluable for customers to get their applications up & running and to stay running. Additionally there will demonstrations of hardware enabled debug features such as statistical profiling, data variable trace, interrupt profiling and EnergyTrace that are available for Cortex M based devices such as MSP432, CC3200 and CC2650. Sub 1GHz is very important technology for the industrial IoT. With the newly introduced CC1310 Ultra-low power wireless micro-controllers, TI is now delivering a unique combination of long distance and ultra-low power with 20 km over a coin cell battery. Moreover TI will be the first company to make Sub 1Ghz easy with the new CC1310 Launchpad and the TI MAC networking stack relying on g/e IEEE standards aiming at accelerating development. This session you will leave with the know-how you need to get started with the CC1310 SimpleLink Ultra-low Wireless MCU. In addition, the session will cover the top Sub-1GHz technologies for Europe including the new trend for Low Wide area network SigFox solution that TI supports with the new CC CC1190 booster-pack. Finally the session will review the HW and SW roadmap covering he CC1350 use-cases, industry's first wireless MCU with a dual band solution (Sub 1GHz + BLE)

5 Wi-Fi made easy: Using TI's SimpleLink Wi-Fi CC3220/CC3120 for IoT applications to connect to the cloud quickly Developing Bluetooth Low Energy solutions with TI SimpleLink Ultra Low * TI's new generation of SimpleLink Wi-Fi is here! The CC3220 wireless MCU and CC3120 Wireless Networking Processor are the lowest power Wi-Fi products for enabling secure Internet of Things (IoT) applications. This session will have product overviews, with technical details on key use cases, reference designs and software. We will cover key topics including: New security features, provisioning, power management, and Over-the-Air programming. This session will cover in detail the TI Bluetooth Smart offering. It will address hardware (Wireless MCU, Ultra Low performance, RF performance, integration), software (Robust Bluetooth stack freely available, RTOS, IDEs, OTA (over the air)), development tools including the latest Sensortag which connects to the Cloud in less than 10 minutes.