BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

Transcription

1 217 SERIES Surface Mount D 2 PAK,, SOT-223, SOL-2 Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. FEATURES AND BENEFITS: No interface material is needed Copper with matte tin plating for improved solderability and assembly Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for Tape & Reel and Tube formats EIA standards and ESD protection are specified Can be used with water soluble or no clean SMT solder creams or other pastes Standard PC Board Dimensions Package Package Natural Forced P/N in. (mm) in. (mm) Format Quantity Convection Convection) CTE6.36 (9.1).6 (15.2) x.74 (18.8) Bulk W LFM CTTE6.36 (9.1).6 (15.2) x.74 (18.8) Tube W LFM CTRE6.36 (9.1).6 (15.2) x.74 (18.8) Tape & Reel W LFM Material: Copper, Matte Tin Plated 217 HEAT SINK WITH DDPAK DEVICE THERMAL PERFORMANCE 6 LAYER BOARD, D' PAK 125 C LEAD, 4 C AMBIENT Device Tab dt, C CT6 Device Power Dissipation. W KEY: Device only, NC Device + HS, NC Device + HS, 1 lfm Device + HS, 2 lfm Device + HS, 3 lfm SECTION A-A NOTES 1. Material to be ESD 2. Approximately 6 Meters per Reel Pieces per Reel. TAPE DETAILS CTR6 REEL DETAILS Dimensions: in. 22

2 217 SERIES Surface Mount D 2 PAK,, SOL SERIES BOARD LAYOUT RECOMMENDATIONS TUBE DETAILS TUBE: Inches Long, Min. ESD Material with Nail Stops 2 Pieces per Tube CTT6 SOL 2 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 (DD PAK) CT6 Dimensions: in. 218 SERIES Surface Mount Heat Sink SMT Devices Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 218-4CTE3.4 (1.2).9 (22.9) x.315 (8.) 62 C 2W 21 2LFM 218-4CTE5.4 (1.2) 1.3 (26.2) x.5 (12.7) 62 C 2W 21 2LFM Material: Copper, Matte Tin Plated HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) 218-4CT CT5 Solid line = 218-4CT5 Dashed Line = 218-4CT

3 26 SERIES Vertical Mount Heat Sink Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 26-1PABEH 1.18 (3.) 1. (25.4) x.5 (12.7) 56 C 4W 7.3 2LFM HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 23 & 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking PATENT PENDING Height Above Footprint Solderable Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Tab Mounting Natural Forced P/N in. (mm) in. (mm) Configuation Option Style Convection Convection) 23-75AB.75 (19.1).57 (14.5) x.5 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 57 2W LFM 23-75ABE-1.75 (19.1).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 57 2W LFM 23-75ABE-5.5 (12.7).75 (19.1) x.57 (14.5) Horizontal 5 Clip/Mtg Hole 57 2W LFM 23-75ABE (22.2).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 57 2W LFM AB.79 (2.).57 (14.5) x.5 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 57 2W LFM ABE-1.79 (2.).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 57 2W LFM ABE-5.5 (12.7).79 (2.) x.57 (14.5) Horizontal 5 Clip/Mtg Hole 57 2W LFM 23-75AB AB-1 23 AND 234 SERIES 23-75AB-5 23 SERIES 234 SERIES AB AB AB SERIES 24

4 241 SERIES Horizontal Mount Heat Sink Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection ABE-3.39 (9.9).86 (21.8) x.69 (17.5) 77 C 4W 12 2LFM HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) SERIES Horizontal and Vertical Mount Heat Sink Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection ABE-5.53 (13.4).75 (19.1) x.5 (12.78) 8 C 2W 1 2LFM ABE-1.75 (19.1).53 (13.4) x.5 (12.7) 8 C 2W 1 2LFM HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C)

5 233 & 236 SERIES Self-Locking Wavesolderable PATENT PENDING 233-6AB.6 (15.2).57 (14.5) x.5 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 58 2W LFM 233-6ABE-1.6 (15.2).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 58 2W LFM 233-6ABE-5.5 (12.7).6 (15.2) x.57 (14.5) Horizontal 5 Clip/Mtg Hole 58 2W LFM 233-6ABE (18.4).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 58 2W LFM AB 1.5 (38.1).57 (14.5) x.5 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 4 2W LFM ABE (38.1).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 4 2W LFM ABE-5.5 (12.7) 1.5 (38.1) x.57 (14.5) Horizontal 5 Clip/Mtg Hole 4 2W LFM ABE (41.3).57 (14.5) x.57 (12.7) Vetrical 1 Clip/Mtg Hole 4 2W LFM 233 AND 236 SERIES 233-6AB AB AB AB AB AB AB 233-6AB 275 & 231 SERIES Compact, Stress-Free Labor-Saving Locking-Tab PATENT AB.75 (19.1).835 (21.2) x.4 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 44 2W LFM ABE-1.75 (19.1).835 (21.2) x.4 (12.7) Vertical 1 Clip/Mtg Hole 44 2W LFM ABE (12.7).835 (21.2) x.4 (14.5) Vertical 1 Clip/Mtg Hole 44 2W LFM PAB.69 (18.4).835 (21.2) x.4 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 45 2W 8 4 LFM PABE.4 (1.1).69 (17.5) x.835 (12.7) Horizontal 13H Clip/Mtg Hole 45 2W 8 4 LFM PABE-XXX.69 (17.5).835 (21.2) x.4 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 45 2W 8 4 LFM PAB.75 (19.1).835 (21.2) x.4 (14.5) Vert./Horiz. No Tab Clip/Mtg Hole 43 2W LFM PABE.4 (1.1).75 (19.1) x.835 (12.7) Horizontal 13H Clip/Mtg Hole 43 2W LFM PABE-XXX.75 (19.1).835 (21.2) x.4 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 43 2W LFM PAB (35).835 (21.2 x.4 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 32 2W LFM PABE.4 (1.2) (34.9) x.835 (12.7) Horizontal 13H Clip/Mtg Hole 32 2W LFM PABE-XXX (35).835 (21.2) x.4 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 32 2W LFM Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB) MECHANICAL DIMENSIONS 275 AND 231 SERIES TAB 13H All versions No Tab TAB 14V TAB 13V TAB 1 TAB 1 TAB 15V TAB 13H 26

6 235 SERIES Compact, Stress-Free Labor-Saving Locking-Tab PATENT AB.85 (21.6) 1. (25.4) x.5 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 4 2W LFM ABE-1.85 (21.6) 1. (25.4) x.5 (12.7) Vertical 1 Clip/Mtg Hole 4 2W LFM ABE-5.5 (12.7).85 (21.6) x 1. (25.4) Horizontal 5 Clip/Mtg Hole 4 2W LFM ABE (24.8) 1. (25.4) x.5 (12.7) Vertical 1 Clip/Mtg Hole 4 2W LFM AB 235 SERIES AB AB AB SERIES Labor-Saving Clip-On 243-1PAB 1. (25.4).8 (2.3) x.27 (6.9) Vert./Horiz. No Tab Clip 5 C@ 2W LFM 243-3PAB.8 (2.3).8 (2.3) x.27 (6.9) Verl./Horiz. No Tab Clip 78 C@ 2W LFM Material: Aluminum, Pre-anodized Black 243 SERIES SECTION A-A VIEW B-B 239 SERIES Snap-Down Self-Locking PATENT PENDING AB.75 (19.1) 1.12 (28.4) x.435 (11.) Vert./Horiz No Tab Clip/Mtg Hole 38 2W 6 4 LFM ABE-3.75 (19.1) 1.12 (28.4) x.435 (11.) Vertical 3 Clip/Mtg Hole 38 2W 6 4 LFM ABE-4.75 (19.1) 1.12 (28.4) x.435 (11.) Vertical 4 Clip/Mtg Hole 38 2W 6 4 LFM AB SECTION A-A 239 SERIES AB AB-4 27

7 265 SERIES Vertical Mount Heat Sink Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection ABHE (3.) 1. (25.4) x.5 (12.7) 56 C 4W 7. 2LFM HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) 286DB SERIES Vertical Mount Heat Sink Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 286DBE.95 (24.1) 1. (25.4) x.5 (12.7) 65 C 4W 9. 2LFM HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) 28

8 273 SERIES Low-Cost, Low-Height Wavesolderable TO-218, 273-AB.375 (9.5).75 (19.1) x.75 (19.1) Vert./Horiz. No Tab Mtg Hole 49 2W LFM 273-ABE (9.5).75 (19.1) x.75 (19.1) Vertical 1 Mtg Hole 49 2W LFM 273-ABE (9.5).75 (19.1) x.75 (19.1) Vertical 2 Mtg Hole 49 2W LFM 273 SERIES 273-AB 273-AB AB-2 Material: Aluminum, Black Anodized 274 & 281 SERIES Low-Cost, Low-Height Wavesolderable 274-1AB.375 (9.5).52 (13.2) x.75 (19.1) Vert./Horiz. No Tab Mtg Hole 56 2W 8. 4 LFM 274-1ABE (9.5).52 (13.2) x.75 (19.1) Vertical 1 Mtg Hole 56 2W 8. 4 LFM 274-1ABE (9.5).52 (13.2) x.75 (19.1) Vertical 2 Mtg Hole 56 2W 8. 4 LFM 274-2AB.5 (12.7).52 (13.2) x.75 (19.1) Vert./Horiz. No Tab Mtg Hole 5 2W 7. 4 LFM 274-2ABE-1.5 (12.7).52 (13.2) x.75 (19.1) Vertical 1 Mtg Hole 5 2W 7. 4 LFM 274-2ABE-2.5 (12.7).52 (13.2) x.75 (19.1) Vertical 2 Mtg Hole 5 2W 7. 4 LFM 274-3AB.25 (6.4).52 (13.2) x.75 (19.1) Vert./Horiz. No Tab Mtg Hole 62 2W 9. 4 LFM 274-3ABE-1.25 (6.4).52 (13.2) x.75 (19.1) Vertical 1 Mtg Hole 62 2W 9. 4 LFM 274-3ABE-2.25 (6.4).52 (13.2) x.75 (19.1) Vertical 2 Mtg Hole 62 2W 9. 4 LFM 281-1AB.375 (9.5).52 (13.2) x.75 (19.1) Vertical No Tab Mtg Hole 56 2W 8. 4 LFM 281-2AB.5 (12.7).52 (13.2) x.75 (19.1) Vertical No Tab Mtg Hole 5 2W 7. 4 LFM 274 SERIES 274 SERIES 274-XAB XAB SERIES 24 SERIES Labor-Saving Twisted Fin ABEH (3.) 1. (25.4) x.5 (12.7) Vertical 22 Clip/Mtg Hole 55 4W LFM ABES (3.) 1. (25.4) x.5 (12.7) Vertical 22 Clip/Mtg Slot 55 4W LFM 24 SERIES ABS ABH-22 29

9 242 SERIES Low-Height, Low-Profile Twisted Fin ABE (32.6).875 (22.2) x.25 (6.4) Vertical 22 Mtg Hole 48 2W LFM AB SERIES 232 & 238 SERIES Staggered Fin for Vertical Mounting TO-22, Material: Aluminum, Black Anodized 232-2AB 2. (5.8) 1.38 (35.1) x.5 (12.7) Vertical 2, Twisted Clip/Mtg Hole 48 4W LFM 232-2ABE (5.8) 1.38 (35.1) x.5 (12.7) Vertical 2, Solderable Clip/Mtg Hole 48 4W LFM 238-2AB 2. (5.8) 1.38 (35.1) x.5 (12.7) Verlical 2, Twisted Mtg Slot 48 4W LFM 238-2ABE (5.8) 1.38 (35.1) x.5 (12.7) Verlical 2, Solderable Mtg Slot 48 4W LFM 238-2AB 238-2AB AB 232-2AB SERIES 232 AND 238 SERIES 251 SERIES Slim-Profile With Integral Clips 15 Lead Multiwatt AB.62 (15.7).91 (23.1) x.38 (9.7) Vert./Horiz. No Tab Clip 66 3W 66 4 LFM 251-8AB.845 (21.5).91 (23.1) x.38 (9.7) Vert./Horiz. No Tab Clip 64 3W 66 4 LFM 251-8ABE (22.2).91 (23.1) x.38 (9.7) Vertical 19 Clip 64 3W 66 4 LFM 251 SERIES AB 251-8AB 251-8AB-19 3

10 BOARD LEVEL HEAT SINKS FOR, TO-218 AND MULTIWATT COMPONENTS Board Level 244 SERIES Low Height, Slim Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.45 (36.8) 1.3 (33.) x 48 (12.1) Vert/Horiz, No Tab 44 4W LFM.16 (7.25) ABE (41.9) 1.3 (33.) x 48 (12.1) Vertical W LFM.17 (7.2) 245 SERIES Low Height, Slim Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.45 (36.8) 1.75 (44.5) x.38 (9.7) Ver.t/Horiz. No Tab 38 4W LFM.16 (7.25) ABE (41.9) 1.75 (44.5) x.38 (9.7) Vertical W LFM.17 (7.2) 246 SERIES Medium Height, Slim Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB (5.) (5.4) x 3.75 (9.5) Vert./Horiz. No Tab 35 4W LFM.24 (1.9) ABE (55.1) (5.4) x 3.75 (9.5) Vertical W LFM.25 (11.4) Order SpeedClip 285SC or 33SC separately. (See 248 Series section). 31

11 BOARD LEVEL HEAT SINKS FOR, TO-218 AND MULTIWATT COMPONENTS 247 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.95 (49.5) 1.9 (48.3) x.95 (24.1) Vert./Horiz. No Tab 25 4W LFM.33 (15.1) ABE (49.5) 1.9 (48.3) x.95 (24.1) Vertical 5 25 C@ 4W LFM.34 (15.6) Order SpeedClip 285SC or 33SC separately. (See 248 Series section). 248 SERIES Low Height, Medium Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.62 (41.1) 2. (5.8) x.75 (19.1) Vert/Horiz. No Tab 35 4W LFM.26 (11.6) ABE (41.1) 2. (5.8) x.75 (19.1) Vertical W LFM.27 (12.2) Order SpeedClip 285SC or 33SC separately. Order SpeedClips separately for use with Series 246, 247, 248 or SERIES Medium Height, Deep Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.13 (28.7) 1.9 (48.3) x.95 (24.1) Vert./Horiz, No Tab 35 C@ 4W LFM.2 (8.9) ABE (28.7) 1.9 (48.3) x.95 (24.1) Vertical 5 35 C@ 4W LFM.21 (9.4) Order SpeedClip 285SC or 33SC separately. (See 248 Series section). 32

12 288 SERIES Compact Wave-Solderable Low-Cost, TO-22 Height Above Maximum Thermal Performance at Typical Load Standard PC Board Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 288-1ABE 1.25 (31.8).875 (22.2) x.215 (5.5) 85 4W 12 2 LFM.57 (2.59) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of and TO-22 semiconductor packages. These heat sinks are designed for use where minimum PC board space is available. The 288-1AB is a stamped aluminum heat sink, black anodized, designed for applications requiring good heat dissipation from a heat sink occupying minimum space, available at minimum cost. 288 SERIES 271 SERIES Top-Mount Booster for Use with 27/272/28 Series Horizontal Height Above Mounting Footprint Thermal Performance at Typical Load Standard Semiconductor Case Dimensions Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 271-AB.5 (12.7) 1.75 (44.5) x.7 (17.8) 62 4W (NOTE A) LFM.52 (2.36) 31 4W (NOTE B) 1.8 C/W 4 LFM (NOTE B) This top-hat style booster heat sink can be added to any of the 27, 272, or 28 Series for improved performance. NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type. 271 SERIES 33

13 27/272/28 SERIES Small Footprint Low-Cost, TO-22 Height Above Horizontal Mounting Thermal Performance at Typical Load Standard PC Board Maximum Footing Solderable Natural Forced Weight P/N in. (mm) in. (mm) Tab Options Convection Convection lbs. (grams) 27-AB.375 (9.4) 1.75 (44.5) x.7 (17.8) 7 4W 6. 4 LFM.52 (2.36) 272-AB.375 (9.4) 1.75 (44.5) x 1.45 (36.8) 1,2 42 4W LFM.15 (5.72) 28-AB.375 (9.4) 1.75 (44.5) x.7 (17.8) 7 4W 6. 4 LFM.48 (2.18) These exceptionally low-cost heat sinks can be mounted horizontally under a or TO-22 case style with a maximum height of only.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissipation. The 27-AB and 28-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix O1 or 2 to the standard part number (i.e. 272-AB1 or 272-AB2). 27 SERIES 28 SERIES 272 SERIES 272AB1 272AB2 289 & 29 SERIES Low-Cost Single or Dual Package TO-218, TO-22, Height Above Horizontal Mounting Thermal Performance at Typical Load Standard PC Board Maximum Footing Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 289-AB.5 (12.7) 1. (25.4) x.71 (18.1) 5 2W 9. 4 LFM.55 (2.49) 289-AP.5 (12.7) 1. (25.4) x.71 (18.1) 5 2W 9. 4 LFM.55 (2.49) 29-1AB.5 (12.7) 1. (25.4) x 1.18 (3.) 44 2W 7. 4 LFM.82 (3.72) 29-2AB.5 (12.7) 1. (25.4) x 1.18 (3.) 44 2W 7. 4 LFM.81 (3.67) Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with no finish (289-AP). Two semiconductors can be mounted to the 29-2AB style. 289 SERIES 29 SERIES 34

14 25 SERIES High-Performance Slim Profile With Integral Clips MULTIWATT AB 1.22 (31.) 1. (25.4) x.5 (12.7) Vert./Horiz. No Tab Clip 5 4W LFM ABE (31.) 1. (25.4) x.5 (12.7) Vertical 9 Clip 5 4W LFM ABE (35.1) 1. (25.4) x.5 (12.7) Vertical 25 Clip 5 4W LFM 25 SERIES AB AB AB 237 AND 252 SERIES 237 & 252 SERIES High-Performance, High-Power Vertical Mount AB (42.5) 1. (25-4) x 1. (25.4) Vertical 2, Twisted Clip/Mtg Slot 46 4W LFM AB (42.5) 1. (25.4) x 1. (25.4) Vertical 3, Twisted Clip/Mtg Slot 46 4W LFM ABE (42.5) 1. (25.4) x 1. (25.4) Vertical 2, Solderable Clip/Mtg Slot 46 4W LFM AB (42.5) 1. (25.4) x 1. (25.4) Vertical 2, Twisted Clip/Mtg Slot 4 4W LFM AB (42.5) 1. (25.4) x 1. (25.4) Vertical 3, Twisted Clip/Mtg Slot 4 4W LFM ABE (42.5) 1. (25.4) x 1. (25.4) Vertical 2, Solderable Clip/Mtg Slot 4 4W LFM Order SpeedClips 285SC or 33SC separately for rapid component installation, lowering manufacturing costs AB AB AB AB AB AB AB AB3 237 AND 252 SERIES 291 SERIES Labor-Saving Clip-on Vertical Height Above Mounting Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Natural Forced Weight P/N in. (mm) in. (mm) Style Convection Convection lbs. (grams) 291-C236AB.86 (21.)9 1.1 (27.) x.36 (9.1) (Clip) 8 2W 24 6 LFM.26 (1.18) 291-H36AB.86 (21.9) 1.1 (27.) x.36 (9.1) (Mtg. Hole) 68 2W 16 6 LFM.26 (1.18)) Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks employ a unique clip for attachment of case styles. One type is available with a locking clip and one with a.14 in. (3.6) diameter mounting hole only. 291 SERIES 291-C2 291-H 35

15 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable See also 286DB Series on Page 7. Height Above Thermal Performance at Typical Load Standard PC Board Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Material Convection Convection lbs. (grams) 286-AB 1.19 (3.2) 1. (25.4) x.5 (12.7) Aluminum, Anodized 58 4W LFM.85 (3.86) 286-CBTE 1.19 (3.2) 1. (25.4) x.5 (12.7) Copper, Black 58 4W LFM.25 (11.34) 286-CTE 1.19 (3.2) 1. (25.4) x.5 (12.7) Copper, Tinned 58 4W LFM.25 (11.34) Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre-drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stability. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned). 286 SERIES 287 SERIES Wave-Solderable Low-Cost Height Above Maximum Thermal Performance at Typical Load Standard P/N PC Board Footprint A Natural Forced Weight Mounting Slot Mounting Hole in. (mm) in. (mm) Convection Convection lbs. (grams) 287-1ABE 287-1ABH 1.18 (3.) 1. (25.4) x.5 (12.7) 65 4W LFM.9 (4.8) 287-2ABE 287-2ABH 1.18 (3.) 1. (25.4) x 1. (25.4) 55 4W LFM.14 (6.35) Mount these cost-effective heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the board. A.375 in. (9.5 mm) mounting slot allows for correct positioning of TO- 22 and similar semiconductor packages. 287 SERIES Standard P/N Dim. A 287-1AB.5 (12.7) 287-2AB 1. (25.4) 287-1ABH.5 (12.7) 287-2ABH 1. (25.4) 285 & 33 SERIES 285 SC and 33 SC SpeedClips Zif Socket 8 And 387 SPGA LIF Standard Nominal Installed For Use Weight P/N Loading Force With Series Material lbs. (grams) 285 SC 1 lbs 232, 237, 24, 252, 667 Carbon Steel.53 (.24) 33 SC 4 lbs 232, 237, 24, 252, 667 Stainless Steel.74 (.34) SpeedClips employ a locking safety tab for mounting. Must be ordered separately for these heat sink series. Use these SpeedClips with our 237, 24, and 252 Series heat sinks for the lowest production assembly time and cost. Order one SpeedClip for each heat sink purchased. Must be purchased with heat sinks. Speed Clip 33 SC 4 lb (17.8N) Nominal Force Installed Speed Clip 285 SC 1 lb (44.5N) Nominal Force Installed 36

16 695 SERIES Space-Saving for Small Stud-Mounted Diodes STUD-MOUNT Maximum Thermal Performance at Typical Load Standard Width Height Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 695-1B 1.33 (33.8).53 (13.7) 72 4.W LFM.8 (4.) Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with an.2 in. (5.1) dia. mounting hole centered in the base. The folded fin design provides good heat dissipation for use where height is limited above the printed circuit board or base plate. MECHANICAL DIMENSIONS 695 SERIES 26 SERIES Cup Clips for TO-5 Case Style Semiconductors TO-5 Characteristics TO-5 Thermal Resistance Epoxy Insulated 14 C/W Breakdown Voltage Epoxy Type (VAC), 6 Hz 5 Recommended Operating Voltage, AC or DC Clean Conditions: % Hipot Rating 5 Dusty Conditions: % Hipot Rating 3 Dirty Conditions: % Hipot Rating 1 to 2 Temperature Range Continuous (C ) -73/+149 Depth of Model Tapped Base 26-4T5E.93 (2.36) 26-4TH5E.125 (3.18) Thread Size: 4 = #4-4 UNC Base Style: H = hex 6 = #6-32 UNC Semiconductor Mounting T = tapped Case Style: 5 = TO-5 Style: S = stud Insulation E = epoxy P = plain TO-5 CASE STYLE CUP CLIPS ORDERING GUIDE Outline Dimension Standard Insulation L x W x I.D. Weight Case P/N Type in. (mm) lbs. (grams) Style 26-4T5E Epoxy Insulated.37 (9.4) x.38 (9.7) dia. x.29 (7.4).24 (1.9) TO TH5E Epoxy Insulated.4 (1.2) x.37 (9.4) hex. x.29 (7.4).31 (1.41) TO SH5E Epoxy Insulated.557 (14.1) x.37 (9.4) hex. x.29 (7.4).37 (1.68) TO-5 Materials and Finish: Cups beryllium copper, black ebonol C ; Bases brass, black ebonol C Base Mounting Configurations TO-5 Plain Type Epoxy bonded, or used with #4 pan head screws. Tapped Base #4-4 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness Stud Mounting Base. #6-32 UNC. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. To determine the correct mounting screw lengths, add dimensions as follows: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness 37

17 26 SERIES Epoxy Insulated For TO T5E 26-4TH5E 26-6SH5E 258 SERIES Thermal Links for Fused Glass Diodes Standard Dimensions Weight P/N in. (mm) Material Finish lbs. (grams) (12.7) x.25 (6.4) x.34 (8.6) Aluminum DeltaCoate 151 on all surfaces.18 (.82) except solder pads and base DIODES The thermal resistance from diode leads to chassis or heat sink is 12 C/watt, when unit is mounted with TYPE 12 Joint Compound. If a 1 C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 15 C/watt to 22 C/watt. 258 SERIES 292 SERIES Heat Sink for Single TO-92 TO-92 Height Above Overall Standard PC Board Fin Width Thermal Performance Weight P/N in. (mm) in. (mm) Natural Convection Finish lbs. (grams) 292-AB.75 (19.1). 6 (15.3).225 W Black Anodized.49 (.22) Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The 292-AB is effective over the typical power range of such devices. 292 SERIES 38