TECHNOLOGY DATA SHEET & SPECIFICATIONS

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1 Features PLCC-2 package. White package. Wide viewing angle. Computable with automatic placement equipment. Pb-free Descriptions The 3528 series has wide viewing angle and optimized light coupling by inter reflector. This feature makes TOP LED ideal for light pipe application. The low current requirement makes this device ideal for portable equipment or any other application where power is at a premium. Usage Notes: Surge will damage the LED When using LED, it must use a protective resistor in series with DC current about 20mA Applications Automotive: backlighting in dashboard and switch. Telecommunication: indicator and backlighting in telephone and fax. Flat backlight for LCD, switch and symbol. Light pipe application. General use. Device Selection Guide LED Part No. Material Chip Emitted Color Lens Color 3528G3C-KHC-A InGaN Green Water clear Page 1 of 7

2 Package Dimensions Notes: Other dimensions are in millimeters, tolerance is 0.25mm except being specified. Protruded resin under flange is 1.5mm Max LED. Bare copper alloy is exposed at tie-bar portion after cutting. Page 2 of 7

3 Absolute Maximum Rating (Ta=25 ) Parameter Symbol Absolute Maximum Rating Unit Peak Forward Current (Duty I F 100 ma Forward Current I FM 25 ma Reverse Voltage V R 5 V Power Dissipation P D 110 mw Operating Temperature Topr -40~+80 Storage Temperature Tstg -40~+100 Soldering Temperature Tsol Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. Page 3 of 7

4 Electro-Optical Characteristics (Ta=25 ) Parameter Symbol *Chip Rank Min. Typ. Max. Unit Test Condition Luminous Intensity Iv B mcd IF=20mA (Note1) Viewing Angle 2θ 1/ Deg (Note 2) Peak Emission Wavelength λp nm IF=20mA Spectral Line Half-Width λ nm IF=20mA Forward Voltage V F V IF=20mA Reverse Current I R µa VR=5V *3528G3C-K-X Chip Rank Note: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. Page 4 of 7

5 Reliability Test Items And Conditions No Item Test Condition Sample Number Criteria for Judging Ac/Re 1 Solder ability T=235±5 T=5sec. 15 Good wetting 2 Soldering heat T=260±5 T=10sec. 15 IV LSL* VF USL* IR USL L:-40 10min (2~3)min 3 H: min Rapid change of IV LSL 5cycle temperature followed by: 11 VF USL T=(25~55) damp heat,cyclic IR USL RH:(90~95)% 2cycle 48h recovery time 2h 4 Damp heat,cyclic T=(25~55) IV 0.7LSL RH=(90~95)% 11 VF 1.1USL 6 cycle 144h IR 2USL recovery time 2h IV 0.7LSL I =30mA 5 Electrical endurance F 22 VF 1.1USL T=1000h IR 2USL 6 IV LSL Storage at T =100±2 stg 15 VF USL high temperature t=1000h IR USL 7 Terminal strength Tensile: W=5N t= 30s Bending: W=2.5N 2times 15 No damage *U.S.L.: Upper Standard Level * L.S.L.: Lower Standard Level Page 5 of 7

6 APPLICATION NOTES: 1)Soldering: 1 Manual soldering by soldering iron: The use of a soldering iron of less than 25W is recommended and the temperature of the iron must be kept at no higher than Reflow soldering: a. The temperature profile as shown in Fig.3 is recommended for soldering SMD LED by the reflow furnace. b. Care must be taken that the products be handled after their temperature has dropped down to the normal room temperature after soldering. 2)Post solder cleaning: When cleaning after soldering is needed,the following conditions must be adhered to. Page 6 of 7

7 1 Cleaning solvents:freon TF or equivalent or alcohol. 2 Temperature:50 Max.for 30 seconds or 30 Max.for 3 minutes 3 Ultrasonic:300W Max. 3) OTHERS: a. Care must be taken not to cause stress to the epoxy resin portion of SMD LED while it is exposed to the high temperature. b. Care must be taken not to the rub the epoxy resin portion of SMD LED with a hard or sharp edged article such as the sand blast and the metal hook as the epoxy resin is rather soft and liable to be damaged. Page 7 of 7