isensetek Technology, Inc

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1 isensetek Technology, nc Approval Sheet Model : 1810 Wireless Module (nrf52840) Part No : SBLE1810-P52840CCA Datasheet Version : v1.0 Date : 2017/04/12 Approved Checked Designed Customer Name : Model : P/N : Checked Received 1

2 ndex 1. Overall ntroduction Applications Features P/N Number Define Module Descriptions Product Dimensions Pin Descriptions PCB Layout Guide Main Chip Solution Shipment Packing nformation Specification Absolute Maximum Ratings Operation Conditions Electrical Specifications Radio Transceiver General Radio Characteristics Radio current consumption (Transmitter) Radio current consumption (Receiver) Transmitter Specifications Receiver Operation Radio Timing Parameters RSS Specifications CPU Specifications Reference Circuit Circuit Configuration Circuit Configuration Circuit Configuration Circuit Configuration Circuit Configuration Circuit Configuration Development Kit Antenna Forbidden Zone Description SMT Reflow Solder Guide Document History

3 1. Overall ntroduction isensetek s SBLE series is a wireless module designed based on Nordic Semiconductor solution. The module include printed antenna, frequency on the 2.4GHz band. This module is have RF high output power NFC function USB interface and support low energy or BLE function. Please see below of the feature: Based on the Nordic nrf52840 SoC Multiple protocol of BLE & RF 2.4GHz & ANT+ upon customer preference Dimension: Length Width Height 18 ± 0.3mm 10 ± 0.3mm 1.95 ± 0.2mm Low power requirements, Ultra-low peak, Average and idle mode power Consumption Compatible with a large installed based of mobiles phones, tablets and computers Fully coverage of wireless applications BLE & RF transmission switching may help products to fit all operation system BLE & RF transmission switching may help products to fit all kinds of hardware 1.1 Applications Computer peripherals and /O devices Mouse Keyboard Multi-touch trackpad nteractive entertainment devices Remote control Gaming controller Beacons Personal area networks Health/fitness sensor and monitor devices Medical devices Key-fobs + Wrist watch Remote control toys 3

4 1.2 Features 2.4GHz transceiver -96 dbm sensitivity in Bluetooth low energy mode 125 kbps, 500 kbps, 1 Mbps, 2 Mbps supported data rates TX Power -20 to +8 dbm in 4 db steps RSS (1 db resolution) ARM Cortex -M4F 32 bit processor Serial Wire Debug (SWD) Memory 1 MB embedded flash program memory 256 kb RAM Flexible Power Management Supply voltage range 1.7 V to 5.5 V On-air compatibility with nrf52 nrf51 nrf24l and nrf24ap series 12 bit /200K SPS ADC - 8 configurable channels 48 General Purpose /O Pins SP Master/Slave Low power comparator Temperature sensor Two-wire Master (2C compatible) UART (CTS/RTS) USB interface CPU independent Programmable Peripheral nterconnect (PP) Quadrature Decoder (QDEC) AES HW encryption Real Timer Counter (RTC) 4

5 2. P/N Number Define Figure 1 : P/N Number Define 5

6 3. Module Descriptions 3.1 Product Dimensions Figure 2 : Product Dimensions 3.2 Pin Descriptions Figure 3 : Module Pin Descriptions 6

7 Pin NO. Name Pin function Description 0 P1.14 Digital /O General-purpose /O 1 GND Ground The pad must be connected to a solid ground plane 2 GND Ground The pad must be connected to a solid ground plane 3 GND Ground The pad must be connected to a solid ground plane 4 P0.03 Digital /O General-purpose /O AN1 Analog input Analog input 5 P0.28 Digital /O General-purpose /O AN4 Analog input Analog input 6 P0.02 Digital /O General-purpose /O AN0 Analog input Analog input 7 P0.30 Digital /O General-purpose /O AN6 Analog input Analog input 8 P0.29 Digital /O General-purpose /O AN5 Analog input Analog input 9 DCCH Power DC/DC converter output 10 P0.31 Digital /O General-purpose /O AN7 Analog input Analog input 11 DEC4 Power 1.3V regulator supply decoupling 12 DCC Power DC/DC converter output 13 VDD_NRF Power Power supply 14 VDD_HV Power High voltage power supply 15 GND Ground The pad must be connected to a solid ground plane 16 GND Ground The pad must be connected to a solid ground plane 17 P0.00 Digital /O General-purpose /O XL1 Analog input Connector for KHz crystal 18 P0.01 Digital /O General-purpose /O XL2 Analog input Connector for KHz crystal 19 P0.26 Digital /O General-purpose /O 20 P0.04 Digital /O General-purpose /O AN2 Analog input Analog input 21 P0.06 Digital /O General-purpose /O 22 P0.08 Digital /O General-purpose /O 23 P0.12 Digital /O General-purpose /O 24 P0.27 Digital /O General-purpose /O 25 P1.08 Digital /O General-purpose /O 26 P0.11 Digital /O General-purpose /O 7

8 Pin NO. Name Pin function Description 27 P0.07 Digital /O General-purpose /O 28 P0.05 Digital /O General-purpose /O AN3 Analog input Analog input 29 GND Ground The pad must be connected to a solid ground plane 30 VBUS Power 5V input for USB 3.3V regulator 31 D- Digital /O USB D- 32 D+ Digital /O USB D+ 33 P0.18 Digital /O General-purpose /O RESET / Configurable as system RESET 34 P0.19 Digital /O General-purpose /O 35 P0.21 Digital /O General-purpose /O 36 P0.23 Digital /O General-purpose /O 37 P0.17 Digital /O General-purpose /O 38 P0.20 Digital /O General-purpose /O 39 P0.22 Digital /O General-purpose /O 40 SWDO Debug Debug serial data 41 SWDCLK Debug Serial wire debug clock input for debug and programming 42 P1.00 Digital /O General-purpose /O 43 P0.09 Digital /O General-purpose /O NFC1 NFC input NFC antenna connection 44 P0.10 Digital /O General-purpose /O NFC2 NFC input NFC antenna connection 45 GND Ground The pad must be connected to a solid ground plane 46 GND Ground The pad must be connected to a solid ground plane Table 1 : Pin function for half hole pad 8

9 Pin NO. Name Pin function Description A01 P1.03 Digital /O General-purpose /O A02 P1.02 Digital /O General-purpose /O A03 P1.01 Digital /O General-purpose /O A04 P0.25 Digital /O General-purpose /O A05 P0.24 Digital /O General-purpose /O A06 P0.15 Digital /O General-purpose /O A07 P0.13 Digital /O General-purpose /O A08 P0.16 Digital /O General-purpose /O A09 P0.14 Digital /O General-purpose /O A10 P1.09 Digital /O General-purpose /O A11 P1.11 Digital /O General-purpose /O A12 P1.15 Digital /O General-purpose /O A13 P1.12 Digital /O General-purpose /O A14 P1.13 Digital /O General-purpose /O A15 P1.10 Digital /O General-purpose /O A16 P1.07 Digital /O General-purpose /O A17 P1.06 Digital /O General-purpose /O A18 P1.05 Digital /O General-purpose /O A19 P1.04 Digital /O General-purpose /O Table 2 : Pin function for LGA pad Note: The module other LGA pad is for production test. 9

10 3.3 PCB Layout Guide Figure 4 : PCB Layout Guide 4. Main Chip Solution RF C Nordic nrf52840-qaa Crystal Frequency 32MHz Table 3 : Main Chip Solution 10

11 5. Shipment Packing nformation Part Number SBLE1810-P52840CCA Package 500 PCS/BOX Table 4 : Shipment Packing nformation Figure 5 : Packing nformation 11

12 6. Specification 6.1 Absolute Maximum Ratings Maximum ratings are the extreme limits to which the chip can be exposed for a limited amount of time without permanently damaging it. Exposure to absolute maximum ratings for prolonged periods of time may affect the reliability of the device. Symbol Note Min. Max. Units Supply voltages VDD V VDDH V VBUS V VSS 0 V /O pin voltage V O ; VDD 3.6V -0.3 VDD+0.3 V V O ; VDD > 3.6V V NFC antenna pin current NFC 1/2 80 ma Radio RF input level 10 dbm Environmental AQFN package Storage temperature C MSL Moisture Sensitivity Level 2 ESD HBM Human Body Model 4 kv ESD CDM QF Charged Device Model 750 V Flash memory Endurance Write / erase cycles Retention 10 years at 40 C Table 5 : Absolute maximum ratings 12

13 6.2 Operation Conditions The operating conditions are the physical parameters that the chip can operate within. Symbol Description Min. Typ. Max. Units VDD VDD supply voltage, independent of DCDC enable V VDDH VDDH supply voltage, independent of DCDC enable V VBUS VBUS USB supply voltage V t R_VDD Supply rise time (0 V to 1.7 V) 60 ms t R_VDDH Supply rise time (0 V to 3.7 V) 100 ms T A Operating temperature C Table 6 : Operating conditions 6.3 Electrical Specifications Radio Transceiver General Radio Characteristics Symbol Description Min. Typ. Max. Units f OP Operating frequencies MHz f PLL,CH,SP PLL channel spacing 1 MHz f DELTA,1M Frequency 1 Msps ±170 khz f DELTA,BLE,1M Frequency BLE 1Msps ±250 khz f DELTA,2M Frequency 2 Msps ±320 khz fsk sps On-the-air data rate kbps f chip,eee Chip rate in EEE mode 2000 Kchip/s Table 7 : General radio characteristics Radio current consumption (Transmitter) Symbol Description Min. Typ. Max. Units TX,PLUS9dBM,DCDC TX only run current (DCDC, 3V) P RF =+9 dbm 13.6 ma TX,PLUS9dBM TX only run current P RF = +9 dbm 29.2 ma TX,PLUS8dBM,DCDC TX only run current (DCDC, 3V) P RF =+8 dbm 12.8 ma TX,PLUS8dBM TX only run current P RF = +8 dbm 27.6 ma 13

14 Symbol Description Min. Typ. Max. Units TX,PLUS4dBM,DCDC TX only run current (DCDC, 3V) P RF =+4 dbm 8.7 ma TX,PLUS4dBM TX only run current P RF = +4 dbm 18.9 ma TX,0dBM,DCDC,5V,REG0HGH. TX,0dBM,DCDC,5V,REG0LOW TX only run current (DCDC, 5V, REG0 out = 3.3 V)P RF = 0dBm 6.0 ma TX only run current (DCDC, 5V, REG0 out = 1.8 V)P RF = 0dBm 5.2 ma TX,0dBM,DCDC TX only run current (DCDC, 3V)P RF = 0dBm 5.3 ma TX,0dBM TX only run current P RF = 0dBm 11.6 ma TX,MNUS4dBM,DCDC TX only run current DCDC, 3V P RF = -4dBm 3.4 ma TX,MNUS4dBM TX only run current P RF = -4 dbm 7.3 ma TX,MNUS8dBM,DCDC TX only run current DCDC, 3V P RF = -8 dbm 3.0 ma TX,MNUS8dBM TX only run current P RF = -8 dbm 6.4 ma TX,MNUS12dBM,DCDC TX only run current DCDC, 3V P RF = -12 dbm 2.7 ma TX,MNUS12dBM TX only run current P RF = -12 dbm 5.7 ma TX,MNUS16dBM,DCDC TX only run current DCDC, 3V P RF = -16 dbm 2.5 ma TX,MNUS16dBM TX only run current P RF = -16 dbm 5.3 ma TX,MNUS20dBM,DCDC TX only run current DCDC, 3V P RF = -20 dbm 2.3 ma TX,MNUS20dBM TX only run current P RF = -20 dbm 5.0 ma TX,MNUS40dBM,DCDC TX only run current DCDC, 3V P RF = -40 dbm 2.0 ma TX,MNUS40dBM TX only run current P RF = -40 dbm 4.0 ma START,TX,DCDC TX start-up current DCDC, 3V, P RF = 4 dbm 5.2 ma START,TX TX start-up current, P RF = 4 dbm 11.0 ma 0dBm (DCDC, 3V) 2dBm (DCDC, 3V) 4dBm (DCDC, 3V) 9dBm (DCDC, 3V) 0dBm (3V) 9dBm (3V) TX current (DCDC 3V) 1Msps BLE measured from VBAT with P RF =0dBm 6.4 ma TX current (DCDC 3V) 1Msps BLE measured from VBAT with P RF =2dBm 8.9 ma TX current (DCDC 3V) 1Msps BLE measured from VBAT with P RF =4dBm 10.6 ma TX current (DCDC 3V) 1Msps BLE measured from VBAT with P RF =9dBm 15.5 ma TX current (3V) 1Msps BLE measured from VBAT with P RF =0dBm 11.2 ma TX current (3V) 1Msps BLE measured from VBAT with P RF =9dBm 30.7 ma Table 8 : Radio current consumption (Transmitter) 14

15 Radio current consumption (Receiver) RX,1M,DCDC RX,1M RX,2M,DCDC RX,2M START,RX,1M,DCDC Symbol Description Min. Typ. Max. Units RX only run current (DCDC, 3V) 1Msps / 1Msps BLE 5.4 ma RX only run current (LDO, 3V) 1Msps / 1Msps BLE 11.7 ma RX only run current (DCDC, 3V) 2Msps / 2Msps BLE 5.4 ma RX only run current (LDO, 3V) 2Msps / 2Msps BLE 12.9 ma RX start-up current (DCDC 3V) 1Msps / 1Msps BLE 3.7 ma START,RX,1M RX start-up current 1Msps / 1Msps BLE 6.7 ma Table 9 : Radio current consumption (Receiver) Transmitter Specifications Symbol Description Min. Typ. Max. Units P RF Maximum output power 8 dbm P RFC RF power control range 28 db P RFCR RF power accuracy ±4 db P RF1.1 P RF2.1 P RF1.2 P RF2.2 1st Adjacent Channel Transmit Power 1 MHz (1 Msps) -23 dbc 2nd Adjacent Channel Transmit Power 2 MHz (1 Msps) -50 dbc 1st Adjacent Channel Transmit Power 2 MHz (2 Msps) -24 dbc 2nd Adjacent Channel Transmit Power 4 MHz (2 Msps) -50 dbc E VM Error Vector Magnitude EEE %rms P harm2nd, EEE nd Harmonics in EEE mode dbm P harm3rd, EEE rd Harmonics in EEE dbm Table 10 : Transmitter specifications 15

16 6.3.3 Receiver Operation Symbol Description Min. Typ. Max. Units P RX,MAX Maximum received signal strength at < 0.1% PER 0 dbm P SENS,T,1M Sensitivity, 1Msps nrf mode -93 dbm Sensitivity, 1Msps BLE ideal transmitter, <=37 dbm P SENS,T,SP,1M,BLE -96 bytes BER=1E-3 Sensitivity, 1Msps BLE ideal transmitter >=128 dbm P SENS,T,LP,1M,BLE -95 bytes BER=1E-4 P SENS,T,2M Sensitivity, 2Msps nrf mode -89 dbm P SENS,T,SP,2M,BLE Sensitivity, 2Msps BLE ideal transmitter, Packet dbm -92 length <=37bytes P SENS,T,BLE LE125k Sensitivity, 125ksps BLE mode -103 dbm P SENS,T,BLE LE500k Sensitivity, 500ksps BLE mode -99 dbm P sense, EEE Sensitivity in EEE mode -100 dbm Radio Timing Parameters Table 11 : Receiver specifications Symbol Description Min. Typ. Max. Units t TXEN t TXEN,FAST t TXDSABLE t TXDSABLE,2M t RXEN t RXEN,FAST t RXDSABLE Time between TXEN task and READY event after channel FREQUENCY configured Time between TXEN task and READY event after channel FREQUENCY configured (Fast Mode) Time between DSABLE task and DSABLED event when the radio was in TX and mode is set to 1Msps Time between DSABLE task and DSABLED event when the radio was in TX and mode is set to 2Msps Time between the RXEN task and READY event after channel FREQUENCY configured in default mode Time between the RXEN task and READY event after channel FREQUENCY configured in fast mode Time between DSABLE task and DSABLED event when the radio was in RX us 40 us 6 us us 140 us 40 us 0 us

17 Symbol Description Min. Typ. Max. Units t TXCHAN TX chain delay 0.6 us t RXCHAN RX chain delay 9.4 us t RXCHAN,2M RX chain delay in 2Msps mode 5 us t RXCHAN,LR 125k RX chain delay in BLE LR125ksps mode us t RXCHAN,LR 500k RX chain delay in BLE LR500ksps mode us t RX-to-TX turnaround Maximum TX-to-RX or RX-to-TX turnaround time in EEE mode Table 12 : Radio timing us RSS Specifications Symbol Description Min. Typ. Max. Units RSS ACC RSS Accuracy Valid range -90 to -20 dbm -2 db RSS RESOLUTON RSS resolution 1 db RSS PEROD Sample period 8 Us RSS min, EEE Minimum RSS sensitivity in mode dbm CPU Specifications Table 13 : RSS specifications W FLASH W FLASHCACHE Symbol Description Min. Typ. Max. Units CPU wait states, running CoreMark from flash, cache disabled 2 CPU wait states, running CoreMark from flash, cache enabled 3 W RAM CPU wait states, running CoreMark from RAM 0 DDFLASHCACHE DDFLASHCACHEDCDC DDFLASH DDFLASHDCDC CPU current, running CoreMark from flash, cache enabled, LDO 6.5 ma CPU current, running CoreMark from flash, cache enabled, DCDC 3V 3.6 ma CPU current, running CoreMark from flash, cache disabled, LDO ma CPU current, running CoreMark from flash, cache disabled, DCDC 3V ma DDRAM CPU current, running CoreMark from RAM, LDO ma DDRAMDCDC CPU current, running CoreMark from RAM, DCDC ma 3V 17

18 Symbol Description Min. Typ. Max. Units DDFLASH/MHz DDFLASHDCDC/MHz CM FLASH CM FLASH/MHz CM FLASH/mA CPU efficiency, running CoreMark from flash, cache enabled, LDO CPU efficiency, running CoreMark from flash, cache enabled, DCDC 3V CoreMark, running CoreMark from flash, cache enabled CoreMark per MHz, running CoreMark from flash, cache enabled CoreMark per ma, running CoreMark from flash, cache enabled, DCDC 3V Table 14 : CPU Specifications 102 µa/mhz 56 µa/mhz 212 CoreMa 3.3 CoreMa MHz 59 CoreMa ma 18

7. Reference Circuit Module reference circuit list : NO Supply configuration VDDH VDD EXTSUPPLY DCDCEN0 DCDCEN1 USB NFC Circuit 1 USB (VDDH = VBUS) N/A Yes No No Yes No Circuit 2 Battery/Ext.

19 7. Reference Circuit Module reference circuit list : NO Supply configuration VDDH VDD EXTSUPPLY DCDCEN0 DCDCEN1 USB NFC Circuit 1 USB (VDDH = VBUS) N/A Yes No No Yes No Circuit 2 Battery/Ext. regulator N/A Yes No No Yes No Circuit 3 N/A Battery/Ext. regulator No No No Yes No Circuit 4 Battery/Ext. regulator N/A Yes Yes Yes Yes No Circuit 5 N/A Battery/Ext. regulator No No Yes Yes Yes Circuit 6 N/A Battery/Ext. regulator No No No No No Table 15 : Module reference circuit list 7.1 Circuit Configuration 1 Figure 6 : Circuit 1 19

20 7.2 Circuit Configuration 2 Figure 7 : Circuit Circuit Configuration 3 Figure 8 : Circuit 3 20

21 7.4 Circuit Configuration 4 Figure 9 : Circuit Circuit Configuration 5 Figure 10 : Circuit 5 21

22 7.6 Circuit Configuration 6 Figure 11 : Circuit 6 22

8. Development Kit The SBLE1810-EV nrf52840 is a versatile single board development kit for isensetek 1810 BLE module nrf52840.

23 8. Development Kit The SBLE1810-EV nrf52840 is a versatile single board development kit for isensetek 1810 BLE module nrf The kit gives access to all module /O and interfaces via connectors and has 4 LEDs and 4 buttons which are user-programmable. Using the SBLE1810-EV nrf52840 it enables setting up of a peer device that you can use to test the connection of your application, it provides a complete solution, allowing faster time to market. Figure 12: Development Kit FEATURES Support USB to UART for DTM use All GPO and interfaces available at edge connectors Button *4 and LED *4 CR2032 battery holder *1 Molex NFC connector ( ) *1 Support module test & program socket USB interface micro-b connector *1 23

$Figure 13 : Antenna Forbidden Zone Description Material \ Dimension (mm) A B C D FR4 (without Copper) 1 3 1 3 FR4 (with Copper) 4 7 10 4 Metal 4 3.$

24 9. Antenna Forbidden Zone Description The PCB and mechanism design need to meet antenna forbidden zone description Table. Otherwise affect the efficiency of the antenna. Figure 13 : Antenna Forbidden Zone Description Material \ Dimension (mm) A B C D FR4 (without Copper) FR4 (with Copper) Metal Plastic Table 16 : Antenna Forbidden Zone List 24

25 10. SMT Reflow Solder Guide The reflow solder parameters for the Module shown in below figure and Table. Figure 14 : Reflow Solder Guide Solder Step Temperature Time Ramp Rate / 3 C / Second Pre-Heat T1 : 150 C ~ T2 : 180 C t1 : 60~120 seconds Soaking T3 : 220 C t2 : 30~90 seconds Peak Temp. T4 : 245±5 C Within 20 seconds Ramp Down Rate / 6 C / Second (Maximum) Table 17 : Reflow Solder Temp. List 25

26 11. Document History Revision Date Description/Changes /04/12 First Release 26

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