Product Catalog Sensing Networks Reliability Flexibility Ve r

Transcription

1 Product Catalog Sensing Networks Low Power Reliability Flexibility Ve r

2 Introduction Applications ROHM Semiconductor, a world leading manufacturer of semiconductor devices is providing a wide line-up of low power products like Sensors, Low Power MCUs and Wireless Communication ICs which are a perfect choice for any kind of battery operated application. Sensors ROHM Semiconductor offers a broad portfolio of sensors like Hall ICs, Ambient Light Sensor ICs, Optical Proximity Sensor ICs, Temperature Sensor ICs, Amplifier for Human Body Detector, Capacitive Switch Control ICs, Touch Screen Control ICs, MEMS Sensors and Optical Sensors (Sensor Modules). In addition Kionix, a member of the ROHM Group, provide MEMS accelerometers with industry-leading performance and quality for consumer electronics, industrial, healthcare and fitness applications. Wrist Watch Fitness Data Logger MCU ROHM Semiconductor and LAPIS Semiconductor offer a large selection of ultra low power MCUs based on proprietary low power technology. The low power consumption and a large set of peripherals like embedded LCD drivers, sound playback or encryption functions make them the perfect choice for any battery operated application. Providing a complete Sensors to Ultra Low Power Wireless Communication ICs ROHM Semiconductor offers a wide range of Wireless RF ICs developed by LAPIS Semiconductor. These products combine the long experience of LAPIS Semiconductor in wireless technology with the latest ultra low power processes. Featured products support Bluetooth LE v4.0 and various sub- GHz Low Power Radio standards 1

3 Content Product Map Portfolio from Sensors like Accelerometers or Light MCUs and Wireless Communication Devices Table of Contents ROHM Sensor IC Overview 03 ROHM Sensors in Development 05 Kionix Accelerometers 05 Low Power MCUs 07 Bluetooth SMART 09 Sub GHz Wireless 11 Wireless Power Delivery 13 2

4 ROHM Sensor Overview Sensing ROHM Semiconductor offers a broad portfolio of sensors, Hall ICs, Ambient Light Sensor ICs, Optical Proximity Sensor ICs, Temperature Sensor ICs, Amplifier for Human Body Detector, Capacitive Switch Control ICs, Touch Screen Control ICs, MEMS Sensors and Optical Sensors (Sensor Modules). Ambient Light Sensors and Proximity Sensors ROHM Ambient Light sensors feature optical characteristics close to the human eye, enabling automatic backlight adjustment in displays for lower power consumption and optimum visibility. Analog and digital interface available Human eye characteristic Small packages Low power consumption 50/60Hz filter to avoid flickering Proximity sensing option available (based on IR light reflection) Type ALS (Analog) ALS (Digital) ALS+PS (Digital) Part Number Output Type Supply Voltage [V] Sensitivity Variations [%] Output Sensitivity Gain Step Illuminance Measurement Range[lx] Temperature Operating Range [ ] Package BH1603FVC current(source) 2.4 to 5.5 ±15 3step 0-100, to +85 WSOF6 BH1620FVC current(source) 2.4 to 5.5 ±15 3step 0-100, to +85 WSOF5 BH1680FVC current(source) 2.4 to 5.5 ±15 3step 0-100, to +85 WSOF5 BH1721FVC I 2 C I/F 2.4 to 3.6 ± , to +85 WSOF5 BH1730FVC I 2 C I/F 2.4 to 3.6 ± to +85 WSOF6 RPR-0521RS I 2 C I/F 2.5 to 3.6 ± , to +85 SON ALS+Color I2C I/F 2.3 to 3.6 BH1745NUC (Digital) ALS: Ambient Light Sensors PS: Proximity Sensors to +85 WSON8 Highlight: RGB Color Sensor IC - BH1745NUC Color Sensor with built-in IR cutoff filter allows high precision color sensing. High infrared removal Rate with high accuracy RGB component measurement Measures color temperature and luminance Works with dark optical windows Maximum Sensitivity : 0.005lx / step Current Consumption : 130µA Applications: Color management during the production process Dimming control for lighting 3

5 Magnetic Sensors Unipolar detection Type Part Number Power Supply Operate Point Hysteresis Supply Current Package Omnipolar BU52011HFV 1.65 to 3.3V +/-3.0mT 0.9mT 5μA HVSOF5 BU52075GWZ 1.65 to 3.3V +/-9.5mT 0.9mT 5μA VCSP50L1 BU52077GWZ 1.65 to 3.6V +/-15mT 0.9mT 5μA UCSP35L1 BU52058GWZ 1.65 to 3.6V +/-24mT 0.9mT 5μA UCSP35L1 BU52177GXZ 1.65 to 3.6V +/-15mT 1.6mT 5μA XCSP30L1 BU52054GWZ 1.65 to 3.6V +/-3mT 0.9mT 5μA UCSP35L1 BU52055GWZ 1.65 to 3.6V +/-4.1mT 0.8mT 5μA UCSP35L1 BU52061NVX 1.65 to 3.6V +/-3.5mT 1.0mT 9μA SSON004X1216 BD7411G 4.5 to 5.5V +/-3.4mT 0.8mT 3mA SSOP5 S pole BU52012HFV 1.65 to 3.3V +3.0mT 0.9mT 3.5μA HVSOF5 N pole BU52013HFV 1.65 to 3.3V -3.0mT 0.9mT 3.5μA HVSOF5 BU52069GWZ 1.65 to 3.6V -43,3mT 1,6mT 3,5µA UCSP35L1 Dual pole detection BU52014HFV 1.65 to 3.3V +/-3.0mT 0.9mT 5μA HVSOF5 Bipolar latch BU52040HFV 1.65 to 3.3V +/-3.0mT 6.0mT 200µA HVSOF5 ROHM Sensor Overview For applications requiring open/close or slide detection (i.e. in mobile phones), ROHM Semiconductor offers magnetic switch and latch Hall ICs. Hall Sensor Ultra small packages (down to 0.8x0.8mm CSP) Low power consumption due to 50ms intermediate operation Digital CMOS output High reliability 8kV ESD resistance Highlight: Geomagnetic Sensor - BM1422AGMV Built-in ultra high precision MI element reaches less than ±1 measurement precision. Less than ±1 detection High speed response: 0.5msec Low power consumption: 150µA Operation: 1.7 to 3.6V Magnetic Sensitivity: 0.042µT / LSB Temperature Sensors Type Applications: Smartphones, Tablet Wearable Devices Games Wristwatch ROHM temperature sensor ICs integrate a temperature detection function and digital signal output on a single chip, reducing mounting area and cost. Thermostat devices for standalone operation Low power consumption (down to 7.5µA) Small footprint Pressure Sensor BM1383GLV Family Supply Voltage (V) Supply current (ua) Temp. Sensitivity (mv/ ) Analog Output voltage (@30 ) (V) Built-in temperature compensation enables high accurate measurement over wide range. Applications: ±0.024hPa (±20cm) relative pressure accuracy Smart Phones / Tablet Built-in temperature compensation function Wearables / Activity Tracker Small package Pressure Range: 300hPa to 1100hPa Absolute Pressure Accuracy: ± 1hPa (Typ.) Current Consumption: 3.7µA Detection Temperature ( ) Package Analog BD1020HFV 2.4 to to 100 HVSOF5 Trigger BDExxxG 2.9 to to 120 SSOP5 Trigger BDJxxxHFV 2.4 to ± to 90 HVSOF5 4

6 Accelerometers from Kionix Sensing Kionix Accelerometers Kionix accelerometers provide industry-leading performance and quality for consumer electronics, industrial, health & fitness and automotive applications. Kionix accelerometers are available in 2x2x0.9 mm, 3x3x0.9 mm, 3x5x0.9 mm and 5x5x1.2 mm packages. MEMS Sense Element Proprietary design, technology and manufacturing Mixed-Signal IC Mixed-signal IC design in standard 0.18µm processes Package Standard LGA and DFN Standard - Product G Range Sensitivity (counts/g) Noise (µg/ Hz) Interface Output Current Consumption FIFO Size, Pins, and Package Type KX User-selectable 2g, 4g, 8g 16384, 8192, 4096 (16-bit) 100 Digital SPI/I²C μa 256byte 2x2x0.9mm, 12-pin, LGA KX User-selectable 2g, 4g, 8g 16384, 8192, 4096 (16-bit) 100 Digital SPI/I²C μa 256byte 3x3x0.9mm, 16-pin, LGA KX User-selectable 2g, 4g, 8g 16384, 8192, 4096 (16-bit) 100 Digital SPI/I²C μa 2048byte 2x2x0.6mm, 12-pin, LGA KX User-selectable 2g, 4g, 8g 16384, 8192, 4096 (16-bit) 100 Digital SPI/I²C μa 2048byte 2x2x0.9mm, 12-pin, LGA KX123 / KX124 User-selectable 2g, 4g, 8g 16384, 8192, 4096 (16-bit) 100 Digital SPI/I²C μa 2048byte 3x3x0.9mm, 12-pin, LGA KX User-selectable 2g, 4g, 8g, 32g 16384, 8192, 4096 (16-bit) 450 Digital SPI/I²C μa 2048byte 2x2x0.9mm, 12-pin, LGA KX User-selectable 2g, 4g, 8g, 32g 16384, 8192, 4096 (16-bit) 450 Digital SPI/I²C μa 2048byte 3x3x0.9mm, 12-pin, LGA KXCNL-1010 User-selectable 2g, 4g, 6g, 8g 1024, 512, 341, 256 (12-bit) 100 Digital (I²C) µa - 3x3x0.9mm, 16-pin, LGA KXTJ2 KXCJK User-selectable 2g, 4g, 8g User-selectable 2g, 4g, 8g KXCJ User-selectable 2g, 4g, 8g, KXCJ User-selectable 2g, 4g, 8g, 16g 1024 (14-bit), 64, 32, 16 (8- bit), 1024, 512, 256 (12-bit) 1024 (14-bit), 64, 32, 16 (8- bit), 1024, 512, 256 (12-bit) 1024 (14-bit), 64, 32, 16 (8- bit), 1024, 512, 256 (12-bit) 32, 16, 8 (8-bit), 512, 256, 128 (12-bit), 512 (14-bit) 350 Digital (I²C) μa - 2x2x0.9mm, 12-pin, LGA - Digital (I²C) μa - 3x3x0.9mm, 16-pin, LGA - Digital (I²C) μa - 3x3x0.9mm, 10-pin, LGA - Digital (I²C) μa - 3x3x0.9mm, 10-pin, LGA KXD94 5g - 10g mV/g 45 Analog μa 5x5x1.2mm, 14-pin, DFN KXR94 1g - 4g mV/g 45 Analog μa 5x5x1.2mm, 14-pin, DFN 5

7 Accelerometers from Kionix 6-axis Accelerometer + Magnetometer Combo Devices Kionix new 6-axis combo devices are the latest additions to our product line and adds high sensitive magnetic sensors to the accelerometers. Kionix newest combination product is the KMX62 which is a 6 Degrees-of- Freedom inertial sensor system that features 14-bit digital outputs accessed through I2C communication. Part Number Axis Current Acceleromet er G-Range Sensitivity counts/g Magnetometer Range Size, Pins, and Package Type FIFO Buffer KMX µa µa (dependent on use) 2g, 4g, 8g,16g (± 2g), 8192 (± 4g), 4096 (± 8g), 2048 (±16g), ±1200 µt 3x3x0.9mm, 16-pin, LGA 384 byte Key Features KMX62: Ultra low power: 1 µa typical in standby, 150 µa typical (accelerometer only), 295 µa typical (magnetometer only), and 395µA (operating, both magnetometer and accelerometer) 384-byte FIFO buffer with watermarking capability Embedded temperature sensor User-selectable ODR from 0.781Hz to 1.6KHz Accelerometer user-selectable ODR from to 25.6kHz Magnetometer algorithms for auto-calibration and MI rejection Outputs with up to 16-bit resolution Excellent bias stability over temperature. User-configurable motion wake-up and magnetic field detection Programmable interrupt engine Accelerometer and Magnetometer self-test function 6-axis Accelerometer + Gyro Combo Devices Kionix new 6-axis accelerometer/gyroscope devices are compelling products that directly address the needs of customers for high-performance parts with a small footprint and low current consumption. The include FlexPower and FlexBuffer capabilities that offer a high degree of configurability and programmability. Part Number Axis Current Acceleromete r G-Range KXG µa 2.1mA (dependent on use) 2g, 4g, 8g,16g KXG07 6 KXG µA (normal mode), max 600µA (high resolution) 200µA (normal mode), max 600µA (high resolution) 2g, 4g, 8g,16g 2g, 4g, 8g,16g Sensitivity counts/g (± 2g), 8192 (± 4g), 4096 (± 8g), 2048 (±16g) (± 2g), 8192 (± 4g), 4096 (± 8g), 2048 (±16g) (± 2g), 8192 (± 4g), 4096 (± 8g), 2048 (±16g) Size, Pins, and Package Type 3x3x0.9mm, 16-pin, LGA 3x3x0.9mm, 16-pin, LGA FIFO Buffer 1024 byte 4096 byte 3x2.5x0.9mm, 16-pin, LGA 4096 byte UNDER DEVELOPMENT UNDER DEVELOPMENT Key Features KXG03: 1024-byte FIFO buffer and auxiliary I2C bus I2C digital outputs with user-programmable gyroscope full-scale ranges of ±256, ±512, ±1024, and ±2048 º/sec and user-programmable ±2g/±4g/±8g/±16g full-scale range for the accelerometer Embedded temperature sensor Accelerometer and gyro outputs with up to 16-bit resolution Wake up and back to sleep functions Independent ODR:OSR control for accelerometer User-configurable wake-up function 6

8 Ultra Low Power MCUs Processing ROHM/LAPIS Semiconductor offers a large selection of ultra low power MCUs based on proprietary low power technology. The low power consumption and a large set of peripherals like embedded LCD drivers, sound playback or encryption functions make them the perfect choice for any battery operated application. ML610Q4xx 8bit MCU Series : Ultra Low Voltage and Power Consumption The ML series is equipped with LAPIS Semiconductor's original RISC 8bit CPU "U8 Core". The CPU core is capable of instruction execution in just one clock cycle by using a 3-stage pipelined architecture. The clock generation circuit enables high/low-speed mode and power-saving mode. The complete series features flash memory which operates down to 1V based on LAPIS Semiconductor's proprietary low power process. Advanced power management, along with a high efficient CPU in the RISC architecture, further reduces the power consumption. With built-in LCD driver this series is suitable for small portable devices with LCD display, such as wrist watch, pedometer, heart rate monitor and thermostat. Part No. Description Derivates Io Halt Features ML610Q4xx Series ML610Q4xx Series ML610Q48x Series Built-in segment LCD driver type Low power Microcontroller Built-in dot matrix LCD driver type Low power Microcontroller Standard type Low power Microcontroller >40 Down-to 0.25µA >20 Down-to 0.5µA >5 Down-to 0.25µA LCD driver: 55 to 185 segment Flash ROM: 6kB to 64kB (incl. self-writing) RAM: 192B to 2kB Interface: I2C; UART,SSIO; RC and SAC type ADC Others: Integrated oscillators, BLD, Timers LCD driver: 400 to 1536 dots Flash ROM: 32kB to 128kB RAM: 2kB to 7kB Interface: I2C; UART,SSIO; RC and SAC type ADC Others: Integrated oscillators, BLD, Timers Flash ROM: 16kB to 64kB (incl. self-writing) RAM: 1kB to 4kB Interface: I2C; UART,SSIO; RC and SAC type ADC Others: Integrated oscillators, BLD, Timers 7

9 Current Current Ultra Low Power MCUs ML620Qxxx 16Bit MCU Series: Low Power consumption and high performance The ML series and ML series are LAPIS's new high performance and ultra low power 16-bit microcontrollers equipped with LAPIS Semiconductor's original 16-bit RISC CPU "U16 Core". These microcontroller series performs ultra low power consumption such as 0.45µA in Halt mode and 250µA/MHz in operating mode up to 16MHz-operating frequency. All MCUs of this series feature embedded Flash memory for storing customer's program and data with self-programming feature. The ML series and ML series Benefit High performance helps to reduce average current consumption in addition to its low power consumption in HALT mode. CPU Operation Halt CPU Operation Average Current Reduce average current CPU Operation Halt Deep Halt CPU Operation Halt-H Average Current Part No. Description Memory Io Halt Peripherals ML620Q504H ML620Q503H Low Power 16bit Microcontroller Flash ROM:32KByte to 64KByte RAM: 2KByte to 7KByte Down-to 0.45uA Interface: I 2 C; UART, SSIO; RC and SAC type ADC Others; Intergrated oscillators, BLD, Timers ML620Q418 ML620Q416 Low Power 16bit Microcontroller Built-in dot matrix CCD driver Flash ROM: 128 KByte to 512 KByte RAM: 12KByte Down-to 0.45uA LCD driver: up to 2048 dots Interface: I 2 C; UART, SSIO; RC and SAC type ADC Others; Intergrated oscillators, BLD, Timers Low Power Consumption: 0.45uA current consumption in Halt mode 250uA/MHz in operating mode Integrated Oscillators Self writing Flash Build-in LCD Driver (The ML series) U16 core has same instruction set und uses same development suite of the U8 core. Though MCU Series: 8/16bit MCUs with High Noise Immunity The ML61(2)0Q1xx series achieves both low power consumption and high noise immunity, ideal for industrial equipment and home appliances. The ML61(2)0Q100 series has excellent noise immunity and some products are qualified for high temperature (up to 105 C). Part No. Description Io Halt Features ML610Q10x Series 8Bit MCU 5V type Flash ROM: up to 6kB RAM: 256B Down-to 1µA 10bit SAC (x6); Interface: I2C; UART,SSIO Operating Frequency: 32kHz to 8MHz Others: Integrated oscillators, BLD, Timers ML610Q17x Series (8bit) 8Bit MCU 5V type with integrated LCD driver Flash ROM: up to 128kB RAM: 4kB Down-to 2µA 10bit SAC (x16); Interface: I2C; UART,SSIO Operating Frequency: 32kHz to 8MHz Others: Integrated oscillators, BLD, Timers, Small LCD driver ML620Q13x Series (16bit) 16Bit MCU 5V type Small package and 105 o C support Flash ROM: up to 24kB RAM: 2kB Dataflash Down-to 1µA 10bit SAC (x8); Interface: I2C; UART,SSIO Operating Frequency: 32kHz to 16MHz Others: Integrated oscillators, BLD, Timers ML620Q15x Series (16bit) 16Bit MCU 5V type 105 o C support Flash ROM: up to 64kB RAM: 2kB Dataflash Down-to 1µA 10bit SAC (x12); Interface: I2C; UART,SSIO Operating Frequency: 32kHz to 16MHz Others: Integrated oscillators, BLD, Timers 8

10 Wireless Communication: Bluetooth SMART Communication ROHM Semiconductor's Bluetooth low energy LSI is a 2.4GHz band wireless communication LSI compatible with Bluetooth low energy (master and slave) with built-in RF and baseband supporting Bluetooth specification version 4.1, general-purpose processor and peripherals. Incorporation of the newly developed "ultra-low power consumption RF" has realized the operating life lasting several years with a button cell battery. ROHM providing LSI and module solutions. What is Bluetooth SMART? wireless communication. The LSI includes the hardware and firmware required for Bluetooth communications as standard feature to help you create a wireless environment for existing system easily by combining with a device-specific profile software. The Bluetooth low energy Module is based on ML x And includes the EEPROM, crystal oscillator, and antenna matching circuit as well. Bluetooth SMART ICs Support Standard Modulation Encryption Control I/F Transmission Rate (Mbps) Transmission Output (dbm) Reception Sensitivity (dbm) PKG ML Bluetooth Core Spec v4.0(single mode) GFSK AES128 (BACI *1) SPI (HCI *2) UART 1 0,-6,-12, WQFN32 ML Bluetooth Core Spec v4.1(single mode) GFSK AES128 (BACI *1) SPI (HCI *2) UART 1 +4,0, 6, 12, WCSP67 ML Bluetooth Core Spec v4.1(single mode) GFSK AES128 UART 1 +4,0, 6, 12, WCSP67 Optimized versions offered to suit application requirements ML Bluetooth Core v4.1 compliant type features Master/Slave functionality that enables connection with up to 2 Slaves simultaneously. SoC enables operation on a single chip. ML is a Slave-only wireless LSI specialized for beacon and serial communication that utilizes ML firmware to maintain low current consumption without an external MCU. 9

11 Wireless Communication: Bluetooth SMART 1Class-leading low current consumption Integrating LAPIS Semiconductor s market-proven low power consumption wireless communication transceiver architecture with RF circuitry, direct modulator, and single-end circuit makes it possible to achieve a class-leading transmission/reception current of 5.8mA. In addition, optimization of the active period results in 60% lower average current consumption compared with conventional products. Bluetooth SMART Modules Support Standard IC Control I/F Dimension (mm) Function MK Bluetooth Core Spec v4.0(single mode) ML7105C-001 (BACI *1) SPI (HCI *2) UART Role: Master/Slave, Connectable device:1 MK Bluetooth Core Spec v4.1(single mode) ML (BACI *1) SPI (HCI *2) UART Role: Master/Slave, Connectable device:1 MK Bluetooth Core Spec v4.1(single mode) ML UART Role: Slave only, Connectable device:1 Blank device MK A Bluetooth Core Spec v4.1(single mode) ML UART Role: Slave only Connectable device:1 for serial communication MK B Bluetooth Core Spec v4.1(single mode) ML UART Role: Slave only, Connectable device:1 for beacon The MK /02 integrates the Bluetooth low energy LSI "ML /002",an EEPROM for program storage, crystal oscillator for the system clock, and a pattern antenna into a single compact module. MK /02 are certified to comply with all applicable radio laws and regulations in Japan, North America, Canada and Europe. And ready to use small communication module that supports Bluetooth low energy. Evaluation kits are available to support easy design-in. 10

12 Wireless Communication: Sub GHz Wireless Communication Lapis provides a wide range of low power sub-ghz RF Communication ICs. They are ideal for data collection and device control applications because they are less sensitive to obstacles like walls. So a single device can cover a larger area compared to 2.4GHz solutions. IEEE g Transceiver - ML7396 family ML7396x is a wireless communication IC meeting the smart meter standard ( IEEE g ). The lineup includes the products for Japan ( ML7396B ), USA ( ML7396A ) and Europe ( ML7396E ). Frequency band possible setting frequency range: 750MHz to 1,000MHz Modulation scheme 2-(G)FSK/(G)MSK Data rate: 50kbps 100kbps 200kbps 400kbps Transmission Power: 20mW 10mW 1mW Rx sensitivity : -102dBm ( 200kbps, m=1, BER=0.1% ) -106dBm ( 100kbps, m=1, BER=0.1% ) -108dBm ( 50kbps, m=1, BER=0.1% ) Current consumption: Transmitting: 20mW>32mA; 10mW>24mA; 1mW>13mA Receiving : 15mA; Sleep mode : 0.9µA 11

13 Data Rate [kbps] Wireless Communication: Sub GHz Wireless Wireless M-BUS Transceiver: ML7406 and ML7345 family Wireless M-BUS Communications ICs are developed for Smart Meter Low Power Radio supporting Smart Meter Standards for Europe, Japan, China and US. With the ML7406 and ML7345 family ROHM covers the full SubGHz frequency range with pin compatible solutions Possible to develop Wireless M-bus systems of whole RF band Wireless M-bus (169MHz) 2 RCR STD-30 (426MHz) ARIB STD-T67 (429MHz) 3 Wireless M-bus (433MHz) 4 Q_GDW347.3 ( MHz) 5 IEEE g ( MHz) 6 Wireless M-bus (868MHz) ML7406 family The ML7406 family supports short range wireless communications in the range of 750MHz~960MHz, which is applicable to the European smart metering (868MHz Wireless M-bus) and Japan smart metering (ARIB STD-T108). Packet handling implemented. Support Wireless M-bus and general packet format; Format A/Format B detection function, 3 out of 6 coding, Preamble/SFD detector, CRC function, whitening function and address filtering function implemented Auto wake-up and auto sleep function High speed carrier checking function Operating Frequency 750MHz to 960MHz Modulation 2-(G)FSK/MSK Data Rate 1,200bps to 500kbps Tx Power 20mW/10mW/1mW Rx Sensitivity -105dBm typ. at 100kbp BER=0.1% Power Consumption: 32/25mA typ. at 20mW/10mW (13mA typ. at 1mW; 15mA typ. at receiving; 0.1uA typ. at Deep SLEEP) ML7345 family The ML7345 family supports short range wireless communications in the range of 169MHz~960MHz, which is applicable to the European smart metering (169/433/868MHz Wireless M-bus) and Japan smart metering (ARIB STD-T108). Packet handling implemented. Support Wireless M-bus and general packet format; Format A/Format B detection function, 3 out of 6 coding, Preamble/SFD detector, CRC function, whitening function and address filtering function implemented Auto wake-up and auto sleep function High speed carrier checking function Operating Frequency 160MHz to 960MHz Modulation 4(G)FSK/2FSK/MSK Data Rate 1,200bps to 100kbps Tx Power 20mW/10mW/1mW Rx Sensitivity -105dBm typ. at 100kbp BER=0.1% Power Consumption: 32/25mA typ. at 20mW/10mW (11mA typ. at 1mW; 8.5mA typ. at receiving; 0.1uA typ. at Deep SLEEP) 12

14 Wireless Power Delivery Power Delivery ROHM provides the full range of products to support wireless charging at low and mid power according Qi standard. The line-up includes Transceiver ICs for 5W and 15W as well as Receiver ICs for 5W and 10W. 5W Solution with 5V input 15W Solution with 19V input ROHM Products: TX: BD57021 & ML610Q772 RX: BD57011 ROHM Products: TX: BD57020 & ML610Q772 RX: BD

15 Wireless Power Delivery Transceivers BD57021MWV - Low Power Transceiver WPC Analog frontend Two chip solution (B57021MWV + MCU) WPC Compliant to Qi v1.1 Support WPC Low Power Coil Type LP-A11 Half-Bridge, Full-Bridge Inverter, I2C Bus interface Standard protection built-in A demodulation circuit built-in A TCXO is used. Package: UQFN040V5050 (5.0mm 5.0mm 1.0mm (Max.), 0.4mm Pitch) BD57020MWV Medium Power Transceiver WPC Analog frontend Two chip solution (B57020MWV + MCU) WPC Compliant to Qi v1.2 with extended power profile WPC Medium power coil type MP A1, A2 und A6 Half-Bridge, Full-Bridge Inverter, I2C Bus interface Standard protection built-in A demodulation circuit built-in A TCXO is used. Package: UQFN040V5050 (5.0mm 5.0mm 1.0mm (Max.), 0.4mm Pitch) Receivers BD57011GWL - Low Power Receiver Low Power Receiver WPC Compliant to Qi v1.1 High efficiency fully synchronous rectifier Maximum Output Current 1.1A Adjustable output voltage (4.3~5.3 VDC) Package: WL-CSP / 7 x 6 array (3.36mm 2.62mm 0.57mm, 0.4mm Pitch) BD57015GWL Medium Power Receiver Dual Mode Receiver Compliant to Qi v1.2 and PMA SR1 Automatic Detection of Qi / PMA or pre-define by external pin High efficiency fully synchronous rectifier Adjustable output voltage: 5V to 10V Maximum Output Current 1.5A UCSP50L Package (4.1mm x 3.2mm x 0.57mm, 0.4mm pitch) For evaluation ROHM provides evaluation kits for each solution as well as comprehensive design-in support. In addition ROHM released a complete Mid. Power Evaluation Kit partnering with Würth Elektronik, a leading supplier of electronic components. Solutions for Battery Charging In addition to Wireless Power Transmission ROHM also supports solutions for battery charging. The available solution depends on the number of battery cells. Discrete Solution using ROHMs - Microcontroller ML620Q133, WQFN20, 16Bit - Adjustable LDO or DCDC LDO, BD00GA3WEJI, 300mA, 3x2 VREG, BD9B100MUV, 1A, VQFN16 VREG, BD9B200MUV, 2A, VQFN16 VREG, BD9331GWZ, 3A, UCSP30 IC based Solution using ROHMs - Boost DCDC Charger BD8664GW, 8.3V, UCSP75, 20Pin BD8665GW, 8.4V, UCSP75, 20Pin BD8668GW, 8.4V, UCSP75, 25Pin IC based Solution using ROHMs - Buck DCDC Charger with I2C BD99950MUV, VQFN20 IC based Solution using ROHMs - Buck/Boost DCDC Charger BD99955MUV, UQFN40 BD99955MUV, UCSP55 UNDER DEVELOPMENT 14

16 The information contained in this document is provided as of 20nd October, The information contained herein is subject to change without notice. Before you use our Products, please contact our sales representative (as listed below) and verify the latest specifications. Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Products beyond the rating specified by ROHM. Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. The Products specified in this document are not designed to be radiation tolerant. For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a ROHM representative: transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. ROHM shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. ROHM has used reasonable care to ensure the accuracy of the information contained in this document. However, ROHM does not warrant that such information is error-free and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office as listed below. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. This document, in part or in whole, may not be reprinted or reproduced without prior consent of ROHM. ROHM Sales Offices Contact us for further information about the products. Santa Clara Atlanta Boston Chicago Denver Detroit San Diego Mexico Brazil Germany Stuttgart France United Kingdom Oulu Spain Hungary Russia Seoul (0) Dalian Shanghai Shenzhen Hong Kong Taiwan Singapore Philippines Thailand Malaysia India Kyoto Yokohama Catalog ROHM ROHM