ICM System Hardware Design Guide. Revision 1.1

Transcription

1 ICM-00 System Hardware Design Guide Revision. This document contains information on a pre-production product. InvenSense Inc. reserves the right to changespecifications and information herein without notice. InvenSense Inc. Technology Drive, San Jose, CA 90 U.S.A +(0) Revision:. Revision Date: 0/0/0

2 ICM-00 TABLE OF CONTENTS. INTRODUCTION.... PURPOSE AND SCOPE.... PRODUCT OVERVIEW AND APPLICATIONS.... ICM-00 SIMPLIFIED BLOCK DIAGRAM... SENSOR HUB APPLICATION SYSTEMS... HARDWARE DESIGN CONSIDERATIONS.... POWER SUPPLIES.... PROGRAM/DEBUG INTERFACE AND EXTERNAL RESET.... CLOCK GENERATION UNIT AND EXTERNAL CLOCK SOURCE...9. SERIAL INTERFACE DIGITAL LINE TERMINATIONS..... SLAVE I C INTERFACE..... SLAVE SPI INTERFACE..... MASTER I C INTERFACE.... GPIO LINES.... PCB DESIGN GUIDELINES.... EXTERNAL CRYSTAL.... I C AND SPI LINES.... POWER AND.... MEMS COMPONENT PLACEMENT.... REFERENCE DESIGN.... SCHEMATICS.... BILL OF MATERIALS... REVISION HISTORY... COMPLIANCE DECLARATION DISCLAIMER... Revision:. Page of

3 ICM-00 TABLE OF FIGURES Figure. ICM-00 Block Diagram and Software Architecture Diagram... Figure. ICM-00 Simplified Block Diagram... Figure. Sensor HUB Solution with ICM Figure. External Power Supply for P... Figure. Internal Power Supply for P... Figure. Programming the ICM-00 Flash Memory through a Total Phase Cheetah System With a Level Shifter... Figure. SWD Programming/Debugging Interface Connection... 9 Figure. External Crystal Oscillator Circuit... 0 Figure 9. ICM-00 Operating in Slave I C Mode... Figure 0. ICM-00 Operating in Slave SPI Mode... Figure. ICM-00 Master I C Bus Connection... Figure. ICM-00 Reference Design Schematics (SDK)... TABLE OF TABLES Table. IC Bus Pullup Resistor Value Reference Table... Table. Reference Design BOM... Revision:. Page of

4 ICM-00. INTRODUCTION. PURPOSE AND SCOPE This application note is intended for system designers who require an overview of hardware design considerations for the ICM-00 sensor built-in MCU/DMP. Topics covered in this app note include how to use the ICM-00 in smart motion detection devices, such as smart phones, tablets, wearable activity monitors, and gaming machines, as well as potential design challenges for such applications, including InvenSense s system reference design called the ICM-00 SDK (Software Development Kit). Please note that this app note does not cover software architecture/development related topics.. PRODUCT OVERVIEW AND APPLICATIONS The ICM-00 is a MotionTracking device that combines a -axis gyroscope, -axis accelerometer, and tri-core processors (an ARM Cortex M0 CPU, a DMP and a DMP Digital Motion Processor ) in a small mm x mm x mm LGA package. The device supports the following features: ARM Cortex M0-based open platform optimized for motion applications with dual-dmp-based motion accelerators Supports Android L and beyond Memory (DMP + FIFO): variable size FIFO based on DMP feature set Runtime Calibration The ICM-00 serves as a sensor hub, supporting the collection and processing of data from internal and external sensors. It can offload data processing from the Application Processor (AP) in a system, helping to save system power and improve performance. The device includes a primary serial interface (I C and -wire SPI) for communication from the host processor. There is an auxiliary master I C interface for external sensor communication. ICM-00 devices, with their -axis integration, ARM Cortex M0 CPU, DMPs, and run-time calibration firmware, enable manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance for consumers. RTOS/ Scheduler + Power Mgmt InvenSense Sensor Framework Framework Engine Command Protocol Sensor Drivers Developer Code InvenSense Motion Algorithms A G M P Figure. ICM-00 Block Diagram and Software Architecture Diagram Revision:. Page of

5 ICM-00. ICM-00 SIMPLIFIED BLOCK DIAGRAM SELF TEST SELF TEST X ACCEL Y ACCEL ADC ADC FIFO/ SRAM FLASH KB SLAVE IC AND SPI SERIAL INTERFACE MASTER IC SERIAL INTERFACE MUX SDA/SDI SCL/ AD0/SDO AUX_DA SELF TEST SELF TEST SELF TEST Z ACCEL X GYRO Y GYRO ADC ADC ADC SIGNAL CONDITIONING ROM KB SENSOR REGISTERS INTERRUPT STATUS REGISTERS GPIO (X) ARM CORTEX M0 GPIO/INT DMP SELF TEST Z GYRO ADC USER & CONFIG REGISTERS DMP TEMP SENSOR ADC COUNTERS & TIMERS CHARGE PUMP SERIAL WIRE DATA PORT OSC BIAS & LDOs SWDIO SWDCLK XTALI XTALO P Figure. ICM-00 Simplified Block Diagram Revision:. Page of

6 SENSOR HUB APPLICATION SYSTEMS ICM-00 A sensor hub is a combination of a low-power MCU and embedded software that provides access to multiple sensors for use in various applications. The hub executes motion sensor fusion, provides sensor drivers, motion algorithms, and provides realtime information to offload the power hungry application processor (AP). Emerging sensor hubs for smart devices enable efficient processing. The ICM-00 serves as an intelligent sensor hub that allows the data collection and processing of such data from internal and external sensors. The multi-cores of ICM-00 are designed to offload computing and processing tasks from the AP, thereby saving system power and streamlining the overall performance. The device also integrates industry leading InvenSense -axis Accel and Gyro MEMS. ICM-00 -Axis Gyro -Axis Accel ecompass ALS AP Slave Digital Serial Interfaces Activities Gestures Environment Sensor Data Sensor Threshold MotionTracking Calibration Sensor Drivers Sensor Fusion Power Mgmt Master Digital Serial Interfaces Pressure Sensor Temp. Sensor Humidity Sensor Other Sensors Figure. Sensor HUB Solution with ICM-00 Revision:. Page of

7 ICM-00 HARDWARE DESIGN CONSIDERATIONS. POWER SUPPLIES ICM-00 has four power blocks: A. V digital power supply that can be applied externally or provided internally. Do not connect P to an external source, if the internal power circuit is used. A core power supply for built-in sensors, MCU and DMPs. The supported voltage level range is. V to.v. A digital supply to make the ICM-00 digital interface compatible with the AP, wireless transceiver, and external sensors I/O levels. allows for a range of. V to. V to be applied. The voltage must be the same as the host AP, wireless transceiver, and external sensor I/O levels. All ICM-00 digital I/O signal voltage levels are referenced to. One of internal LDOs power blocks needs an external decoupling capacitor, applied to. Usually a 0. µf capacitor is sufficient for decoupling purposes. Proper capacitor decoupling can reduce power supply noise, as capacitors act as a supplementing current source during short transient events. InvenSense recommends using separate 0. µf decoupling capacitors for, and. If using external. V supply, a 0. µf decoupling capacitor is also needed. All decoupling capacitors must be placed as close as possible to their respective power and ground pins. Ceramic capacitors with XR material with a change in capacitance of ±% over a - C to + C temperature range are a good choice, covering the entire operating temperature range of the ICM-00 at an acceptable accuracy and at reasonable cost. Power supply connections are displayed in Figure and Figure. U ICM-00 V XTALI XTALO CLOCK SWDP(DATA) PROGRAMMING SWDP0(CLK) DEBUGGING 9 GPIOs FSYNC/GPIO GPIO IC(M) AUX_DA 0.uF 0.uF 0.uF 0.uF C C C C 0 P PWRs SPI/IC(S) SCL/ SDA/SDI 9 SDO/AD0 RESV 0 RESV RESV RESV RESV Figure. External Power Supply for P Revision:. Page of

8 ICM-00 U ICM-00 XTALI XTALO CLOCK SWDP(DATA) PROGRAMMING SWDP0(CLK) DEBUGGING 9 GPIOs FSYNC/GPIO GPIO IC(M) AUX_DA 0.uF 0.uF 0.uF C C C 0 P PWRs SPI/IC(S) SCL/ SDA/SDI 9 SDO/AD0 RESV 0 RESV RESV RESV RESV Figure. Internal Power Supply for P. PROGRAM/DEBUG INTERFACE AND EXTERNAL RESET The RESET signal can be controlled via a host (active low), or can be left pulled high, and the internal POR will provide the reset. For sensor HUB application, we recommend host control the reset. In addition to the hardware RESET input, a soft reset can be provided by the host via a serial interface register write. There are two ways to program the ICM-00 s internal flash memory: Via the SPI / IC host interface: The host AP or a SPI Host Controller tool, such as Total Phase s Cheetah system, can be used to program ICM-00 FLASH. InvenSense will provide Android/Linux supported FLASH programming execution software. When using the Cheetah tool to program FLASH, a digital signal level shifter is required for, as the digital supply voltage level is not the same as Cheetah s I/O level (.V). Figure shows the suggested level shifter circuit incorporated in the ICM-00 SDK board. XTALI XTALO 0 CLOCK SWDP(DATA) PROGRAMMING SWDP0(CLK) DEBUGGING P PWRs U ICM-00 GPIOs FSYNC/GPIO GPIO IC(M) AUX_DA 9 SPI/IC(S) SCL/ SDA/SDI 9 SDO/AD0 RESV 0 RESV RESV RESV RESV 0.uF C9 0.uF C SDI SDO U VL IO-VL IO-VL IO-VL IO-VL NC U VL IO-VL IO-VL IO-VL IO-VL NC MAXEEUD VCC IO-VCC IO-VCC IO-VCC 0 IO-VCC NC 9 /Tri-State MAXEEUD VCC IO-VCC IO-VCC IO-VCC 0 IO-VCC NC 9 /Tri-State V C C -H -H -H SDI-H SDO-H 0.uF 0.uF -H SDO-H -H -H Cheetah Host CNN CN HDR X.mmx.mm 9 SS SS MISO SS V V MOSI 0 SDI-H V Figure. Programming the ICM-00 Flash Memory through a Total Phase Cheetah System With a Level Shifter Revision:. Page of

9 ICM-00 ICM-00 s FLASH can also be programmed through the SWD interface by utilizing SWDCLK and SWDIO signal lines. The same serial-wire debug interface also serves as debug interface port. SWDP0 (pin-) must be connected to in normal operation mode. When in debug/program mode, do not connect the SWDP0 (pin-) to. U ICM-00 FTSH-0-0-L-DV-K-A-P 9 CN J 0 X HEADER SWDIO SWDCLK SWDCLK R0 0K XTALI XTALO 0 CLOCK SWDP(DATA) PROGRAMMING SWDP0(CLK) DEBUGGING P PWRs IC(M) SPI/IC(S) FSYNC/GPIO GPIO 9 AUX_DA SCL/ SDA/SDI 9 SDO/AD0 RESV 0 RESV RESV RESV RESV For normal operation, short J pin- For programming and debugging, open J pin- Figure. SWD Programming/Debugging Interface Connection. CLOCK GENERATION UNIT AND EXTERNAL CLOCK SOURCE The ICM-00 offers three different clock sources:. Built-in high-frequency RC oscillator for the system clock. Built-in low-frequency RC oscillator for periodic wake up. External. khz crystal for accurate time stamping. An external crystal is connected to XTALI and XTALO (Pins and ). There is no need to mount crystal load capacitors on PCB board because they are built in ICM-00.. CMOS external. KHz clock. For the ICM-00, it is recommended to utilize precise external oscillators or crystals/ceramic resonators. The accuracy of an external oscillator or crystals/ceramic resonator must be 0 ppm or better. An external digital level clock input from a. khz source often found on PMICs and other platform devices can be connected to XTALI pin. We recommend this methodology as it allows ICM-00 to be synchronized with other devices (i.e. the host) who are also using the same reference clock. Revision:. Page 9 of

10 ICM-00 U ICM-00 X AH-.KDZF-T XTALI XTALO CLOCK SWDP(DATA) PROGRAMMING SWDP0(CLK) DEBUGGING 9 FSYNC/GPIO GPIO IC(M) AUX_DA 0 P PWRs SPI/IC(S) SCL/ SDA/SDI 9 SDO/AD0 RESV 0 RESV RESV RESV RESV Figure. External Crystal Oscillator Circuit Revision:. Page 0 of

11 ICM-00. SERIAL INTERFACE DIGITAL LINE TERMINATIONS The ICM-00 has one master I C, one slave I C (shared with slave SPI) and one slave SPI (shared with slave I C) serial interface available for sensor and AP communications. I C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). The lines are open-drain and pullup resistors (e.g. 0kΩ) are required... Slave I C interface The ICM-00 always operates as a slave device when communicating with the AP (master). The slave address of the ICM-00 is bits long with the LSB (X) determining the final address. The LSB bit of the -bit address is determined by the logic level on Pin AD0 ( or ). The slave address is 0xA (Pin AD0 is logic low) and 0xB (Pin AD0 is logic high). To use ICM-00 in slave I C mode, Pin () must be set to the same level as. Figure 9 shows the ICM-00 operating in slave I C mode with its -bit device address set to 0xA. The I C open-drain pullup resister value can be adjusted based on how many slave devices are connected and the bus speed. The 0K ohm in the below circuit is just for reference. When the bus in fast and fast-plus mode, please reference the Table for the pullup resisters value. Fscl = 00KHz Fscl = MHz Vddio (V) Rp (min.) KOhm Rp (max.) KOhm Table. IC Bus Pullup Resistor Value Reference Table U ICM-00 XTALI XTALO CLOCK SWDP(DATA) PROGRAMMING SWDP0(CLK) DEBUGGING GPIOs FSYNC/GPIO GPIO IC(M) 9 AUX_DA R 0K R 0K 0 P PWRs SPI/IC(S) SCL/ SDA/SDI 9 SDO/AD0 RESV 0 RESV RESV RESV RESV SCL SDA From From the AP Application Processor Figure 9. ICM-00 Operating in Slave I C Mode Revision:. Page of

12 ICM-00.. Slave SPI interface The ICM-00 always operates as a slave device when communicating with the AP (master). For SPI operation, all logic levels are referenced to. U ICM-00 XTALI XTALO CLOCK SWDP(DATA) PROGRAMMING SWDP0(CLK) DEBUGGING 9 GPIOs FSYNC/GPIO GPIO IC(M) AUX_DA 0 P PWRs SPI/IC(S) SCL/ SDA/SDI 9 SDO/AD0 RESV 0 RESV RESV RESV RESV /CS MOSI MISO From Application From the AP Processor Figure 0. ICM-00 Operating in Slave SPI Mode.. Master I C Interface The ICM-00 offers one master I C interface for communications with external sensors. The I C open-drain pullup resistor value can be adjusted based on the number of external sensors connected to the bus and the overall desired/specified interface speed. The I C open-drain pullup resister value can be adjusted based on how many slave devices are connected and the bus speed. The 0K ohm in the below circuit is just for reference. When the bus is in fast and fast-plus mode, please reference the Table for the pullup resistors value. XTALI XTALO 0 CLOCK SWDP(DATA) PROGRAMMING SWDP0(CLK) DEBUGGING P PWRs U ICM-00 GPIOs FSYNC/GPIO GPIO IC(M) 9 AUX_DA SPI/IC(S) SCL/ SDA/SDI 9 SDO/AD0 RESV 0 RESV RESV RESV RESV R 0K R 0K To External Sensors Compass SCL SDA Pressure SCL SDA... Others SCL SDA Figure. ICM-00 Master I C Bus Connection Revision:. Page of

13 ICM-00. GPIO LINES The ICM-00 supports three bidirectional GPIO lines that can be configured as general purpose I/O, interrupt input, or interrupt output. All GPIO voltage levels are referenced to. We recommend the following GPIO usage assignment: a. Use ICM-00 as output to wakeup host MCU. Connect the to host MCU wake-up interrupt input. b. Use ICM-00 GPIO as output for general (non-wakeup) interrupt of host MCU. Connect the GPIO to host MCU interrupt input. c. ICM-00 GPIO is used as a sensor interrupt input or GPIO. d. Host wakes up ICM-00 with an interrupt write via digital serial interface. Revision:. Page of

14 ICM-00. PCB DESIGN GUIDELINES To achieve maximum ICM-00 performance, the following recommendations should be followed during the board design process:. EXTERNAL CRYSTAL Keep any PCB traces between the crystal and the ICM-00 (Pins and ), as short as possible. Although currents running through the crystal oscillator are very small, any long lines will make it more sensitive to EMI, ESD and crosstalk. Long lines also add parasitic capacitance and some series resistance to the oscillator, which could impact the start-up characteristics of the oscillator. It is recommended to shield the crystal traces with ground traces, and keep other fast switching clock/signal lines as far away from the crystal connections as possible. Placing a ground plane underneath the crystal will reduce interference from other layers.. I C AND SPI LINES Keeping signal speeds, skews, and rise times in mind for high-speed digital bus, all I C and SPI data and clock lines should be length and impedance matched. Keep the bus traces as short as possible to reduce bus capacitance. Avoid routing high-energy traces near digital bus lines.. POWER AND Although the ICM-00 is low-power component, wider power and ground PCB traces are very helpful to reduce system noise. It is recommended to design power and ground traces for PCBs with a least an mil width in mind. Avoid split ground and power planes, as they act as antennas and can radiate with detrimental effects on fast bus and/or sensitive signals.. MEMS COMPONENT PLACEMENT The gyroscope and accelerometer inside the ICM-00 are MEMS-based designs, making the ICM-00 placement sensitive to mechanical strength. Placing MEMS sensors in areas where the board flexes puts unnecessary mechanical stress on the MEMS sensor package, which leads to the possibility of higher offsets and damage to the sensor. For details on proper sensor placement, please refer to InvenSense s application notes MEMS Motion Handling and Assembly Guide, Accelerometer and Gyroscope Design Guidelines and Compass Design Guidelines. Revision:. Page of

15 9 ICM-00. REFERENCE DESIGN. SCHEMATICS Test Pin Header HDR X,.mmx.mm AUX_DA0 0 INT GPIO GPIO VIN CN SDI SDO CN HDR X.mmx.mm 0 9 0R R R R GPIO AUX_DA SDO 0R R GPIO R SDI R CN HDR X.mmx.mm 0 9 CNN for external Sensor Daughter Brd NC NC NC NC VBUS DM CN DP ID USB PWR CNN USB mini ty pe-b C 0.uF VIN C uf 0R R CN HDR X,.mmX.mm R 0 9 R9 AUX_DA SDO 0R R GPIO R SDI R CN HDR X,.mmX.mm 0 9 CNN for external Sensor Daughter Brd D VIN LED00_RED R C K 0.uF TLV0DBVR V VIN TLV0DBVT V SOT U SOT U 0R 0R R R0 CN Vin OUT Vin OUT HDR X,.mmX.mm C C0 EN NC EN NC 0.uF uf R GPIO R0 C AUX_DA SDI 00mA uf 00mA SDO 0 9 R R Local Power Gen. CN HDR X,.mmX.mm 0 9 CNN for external Sensor Daughter Brd PWR Selection and Measurement CNN V V V TP9 HEADER X JP JP SIP-.mm SIP-.mm CN HDR X.mmx.mm 0 9 0R R9 R R AUX_DA SDO 0R R GPIO R SDI R CN HDR X.mmx.mm 0 9 CNN for external Sensor Daughter Brd GPIO SW PTSSMSMTR9 LFS C 0.uF R0 0K R 0K R9 0K U9 SNLVCGDBVR _SWD _SW A Y B VCC _CT C FTSH-0-0-L-DV-K-A-P 9 JP CN 0 X HEADER SWDIO SWDCLK _SWD SWDCLK 0.uF 0.uF 0.uF 0.uF AH-.KDZF-T C C 0.uF C For normal operation, short J pin- For programming and debugging, open J pin- X C0 C XTALI XTALO 0 CLOCK SWDP(DATA) SWDP0(CLK) P U PWRs PROGRAMMING DEBUGGING ICM-00 IC(M) SPI/IC(S) FSYNC/GPIO GPIO AUX_DA SCL/ SDA/SDI SDO/AD0 RESV RESV RESV RESV RESV 0K 0K R R GPIO GPIO AUX_DA SDI SDO C C R 0K C 0.uF R 0R _CT SDI SDO 0.uF 0.uF SW PTSSMSMTR9 LFS LED LED00_GRN U VL IO-VL IO-VL IO-VL IO-VL NC VL IO-VL IO-VL IO-VL IO-VL NC MAXEEUD VCC IO-VCC IO-VCC IO-VCC IO-VCC 0 NC 9 /Tri-State VCC IO-VCC IO-VCC IO-VCC IO-VCC 0 NC 9 /Tri-State V TotalPhase Cheetah Host CNN C 0.uF C9 0.uF -H -H CN HDR X,.mmx.mm SS VIN -H -H SS V -H SDO-H MISO V -H -H 9 MOSI SS 0 SDI-H SDI-H -H SDO-H U MAXEEUD Figure. ICM-00 Reference Design Schematics (SDK) Revision:. Page of

16 ICM-00. BILL OF MATERIALS Table. Reference Design BOM ITEM QTY REFERENCE PART TYPE /VALUE MANUFACTURER CN HDR X,.mmx.mm MANUFACTURER PART NUMBER PCB FOOTPRINT Sullins PREC0DAAN-RC J00\0DF-VRA CN USB mini type-b On Shore Tech USB-MFTR USB_MINI_B_F CN,CN,CN,CN CN,CN,CN,CN HDR X.mmx.mm HDR X,.mmX.mm FCI 99-HLF J00\X FCI 99-0HLF HEADERx CN FTSH-0-0-L-DV-K-A-P Samtec FTSH-0-0-L-DV-K-A-P FTSH-0-0-L-DV-K-A-P CN C,C,C0,C,C,C,C,C9, C,C,C,C,C,C HDR X,.mmx.mm FCI 99-0HLF CONX-00MIL 0.uF Yageo CC00KRXRBB0 C00 C,C0,C uf TDK C00XR0J0K C00 9 D LED00_RED Kingbright Corp APHHS00SURCK LED00 0 JP,JP SIP-.mm FCI 000-0HLF sip-p JP X HEADER Samtec TS-0-T-A sip-p LED LED00_GRN Kingbright Corp APHHS00CGCK LED00 R,R,R9,R,R0,R 0K Yageo RC00JR-00KL R00 R 0R Vishay CRCW000RFKED R00 R,R,R,R,R0,R,R,R9 0R Panasonic ERJ-GE0R00X R00 R K Panasonic ERJ-RKF00X R00 R,R,R,R,R,R,R, R9,R0,R,R,R,R,R, R,R Panasonic ERJ-GE0R00X R00 SW,SW PTSSMSMTR9 LFS C&K PTSSMSMTR9 LFS PTSSMSMTR9 LFS 9 TP9 HEADER X xx xx PAD9 0 U ICM-00 InvenSense Garnet+Ivory LGA_X_REVBE U TLV0DBVR TI TLV0DBVR SOT U TLV0DBVT TI TLV0DBVT SOT U,U MAXEEUD Maxim MAXEEUD+ TSSOP U9 SNLVCGDBVR TI SNLVCGDBVR R-PDSO-G X AH-.KDZF-T TXC CORPORATION AH-.KDZF-T -SMD-.x. Revision:. Page of

17 ICM-00 REVISION HISTORY REVISION DATE REVISION DESCRIPTION //0.0 Initial Release 0/0/0. Added SWDP0 operation and programming/debugging modes selections. Removed external crystal load capacitors Revision:. Page of

18 ICM-00 COMPLIANCE DECLARATION DISCLAIMER InvenSense believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. 0 InvenSense, Inc. All rights reserved. InvenSense, Sensing Everything, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. 0 InvenSense, Inc. All rights reserved. Revision:. Page of